Not Recommended For New Designs
VSP5000
SLES057 – DECEMBER 2002
12-BIT 30 MSPS DUAL CHANNEL
CCD SIGNAL FRONT END FOR DIGITAL COPIER
FEATURES
D Dual Channel CCD Signal Processing:
–
–
–
–
Correlated Double Sampler (CDS)
Sample Hold Mode
Digital Programmable Amplifier
CCD Offset Correction (OB loop)
D High Performance A/D:
–
–
–
–
12-Bit Resolution
INL: ±2 LSB
DNL: ±0.5 LSB
No Missing Codes
D High-Speed Operation
– Sample Rate: 30 MHz (Minimum)
D 78-dB Signal-To-Noise Ratio (at 0-dB Gain)
D Low Power Consumption:
– Low Voltage: 3 V to 3.6 V
– Low Power: 290 mW (Typ) at 3.3 V
– Standby Mode: 20 mW (Typ)
APPLICATIONS
D Copiers
D Scanners
D Facsimiles
DESCRIPTION
The VSP5000 device is a complete application specific
standard product (ASSP) for charge-coupled device
(CCD) line sensor applications such as copiers, scanners,
and facsimiles. The VSP5000 device provides two
independent channels of processing lines and performs
analog front-end processing and analog-to-digital (A/D)
conversion. Each channel has a correlated double
sampler (CDS)/sample hold (SH) circuit, a 14-bit
analog-to-digital converter (ADC), a digital programmable
gain amplifier (DPGA), and an optical black (OB)
correction loop. Data output is 12 bits in length and the
2-channel A/D data is multiplexed and output.
The VSP5000 is available in a 64-lead LQFP package and
operates from a single 3.3-V supply.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments
semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. Products
conform to specifications per the terms of Texas Instruments standard warranty.
Production processing does not necessarily include testing of all parameters.
Copyright 2002, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
VSP5000PM
NRND
LQFP
PM
64
160
RoHS & Green
SNBI
Level-1-260C-UNLIM
-25 to 85
VSP5000
VSP5000PMG6
NRND
LQFP
PM
64
160
RoHS & Green
SNBI
Level-1-260C-UNLIM
-25 to 85
VSP5000
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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