User's Guide
SWRU359E – September 2013 – Revised September 2015
WL1835MODCOM8B WLAN MIMO and Bluetooth® Module
EVM
This user's guide describes how to use the TI WL1835MODCOM8B board to evaluate the performance of
the TI WL18MODGB module.
1
2
3
4
5
6
7
Contents
Introduction ................................................................................................................... 3
1.1
Features .............................................................................................................. 4
1.2
Applications .......................................................................................................... 5
1.3
TI Module Key Benefits ............................................................................................ 5
Board Pin Assignment ...................................................................................................... 6
2.1
Pin Descriptions ..................................................................................................... 7
Electrical Characteristics .................................................................................................... 9
Approved Antenna Types and Maximum Gain Values ................................................................. 9
On-Board Antenna Configuration ........................................................................................ 10
5.1
VSWR ............................................................................................................... 10
5.2
Efficiency ........................................................................................................... 11
5.3
Radio Pattern ...................................................................................................... 11
5.4
ANT1 ................................................................................................................ 12
5.5
ANT2 ................................................................................................................ 13
Circuit Design ............................................................................................................... 15
6.1
Schematic .......................................................................................................... 15
6.2
Bill of Materials (BOM) ............................................................................................ 16
Layout Guidelines .......................................................................................................... 17
7.1
Board Layout ....................................................................................................... 17
List of Figures
1
WL1835MODCOM8B Top View ........................................................................................... 3
2
Board Top View .............................................................................................................. 6
3
Board Bottom View .......................................................................................................... 6
4
Antenna VSWR ............................................................................................................. 10
5
Antenna Efficiency
6
7
8
9
10
11
12
13
14
.........................................................................................................
Radio Pattern ...............................................................................................................
ANT1 Polarization ..........................................................................................................
ANT1 Polarization ..........................................................................................................
ANT1 Polarization ..........................................................................................................
ANT2 Polarization ..........................................................................................................
ANT2 Polarization ..........................................................................................................
ANT2 Polarization ..........................................................................................................
Schematic ...................................................................................................................
Layer 1 .......................................................................................................................
11
11
12
12
13
13
14
14
15
17
WiLink8 is a trademark of Texas Instruments.
Bluetooth is a registered trademark of Bluetooth SIG, Inc.
Android is a trademark of Google Inc.
Linux is a registered trademark of Linux Foundation.
Wi-Fi is a registered trademark of Wi-Fi Alliance.
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15
Layer 2 ....................................................................................................................... 17
16
Layer 3 ....................................................................................................................... 18
17
Layer 4 ....................................................................................................................... 18
18
Module Layout Guidelines (Top Layer) .................................................................................. 19
19
Module Layout Guidelines (Bottom Layer) .............................................................................. 19
20
Trace Design for the PCB Layout ........................................................................................ 20
21
Layer 1 Combined With Layer 2.......................................................................................... 20
22
Top Layer – Antenna and RF Trace Routing Layout Guidelines
23
Bottom Layer – Antenna and RF Trace Routing Layout Guidelines................................................. 21
24
MIMO Antenna Spacing ................................................................................................... 22
....................................................
21
List of Tables
1
Approved Antenna Types and Maximum Gain Values ................................................................. 9
2
BOM .......................................................................................................................... 16
3
Module Layout Guidelines
4
Antenna and RF Trace Routing Layout Guidelines .................................................................... 20
................................................................................................
18
Warning
The WL1835MODCOM8B board is tested to comply with ETSI/R&TTE over temperatures from –20°C to
85°C.
This board should not be modified to operate in other frequency bands other than what they are designed
for.
FCC Licensing Requirements for the Wi-Fi and Bluetooth Radio Module of the EVM:
For evaluation only; not FCC approved for resale. This kit is designed to allow:
1. Product developers to evaluate electronic components, circuitry, or software associated with the kit to
determine whether to incorporate such items in a finished product
2. Software developers to write software applications for use with the end product. This kit is not a
finished product and when assembled may not be resold or otherwise marketed unless all required
FCC equipment authorizations are first obtained. Operation is subject to the condition that this product
not cause harmful interference to licensed radio stations and that this product accept harmful
interference. Unless the assembled kit is designed to operate under part 15, part 18, or part 95 of this
chapter, the operator of the kit must operate under the authority of an FCC license holder or must
secure an experimental authorization under part 5 of this chapter.
Per TI’s Regulatory Compliance Information located in the WL1835ModCOMB8B User’s Guide’s
“Evaluation Board/Kit/Module (EVM) Additional Terms,” this EVM cannot be used for production purposes
and is explicitly restricted from end-product introduction.
Use of this EVM requires the developer to provide a minimum distance of at least 20 cm from the antenna
to all persons in order to minimize risk of potential radiation hazards.
CAUTION
Do not leave the EVM powered when unattended.
2
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Introduction
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1
Introduction
The WL1835MODCOM8B device is a Wi-Fi® MIMO, Bluetooth, and Bluetooth Low Energy (BLE) module
board with the TI WL18MODGB module. WL18MODGB is built-in TI WL1835 IEEE 802.11 b/g/n and
Bluetooth 4.0 solutions to provide the best Wi-Fi and Bluetooth coexistence interoperability and powersaving technologies from TI.
Figure 1. WL1835MODCOM8B Top View
FCC/IC Regulatory Compliance
FCC Part 15 Class A Compliant
IC ICES-003 Class A Compliant
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Introduction
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(continued)
FCC ID: Z64-WL1835COM
This device complies with part 15 of the
FCC Rules. Operation is subject to the
following two conditions: (1) This device
may not cause harmful interference, and
(2) this device must accept any
interference received, including
interference that may cause undesired
operation.
IC ID: 451I-WL1835COM
This device complies with Industry
Canada licence-exempt RSS
standard(s). Operation is subject to the
following two conditions: (1) this device
may not cause interference, and (2) this
device must accept any interference,
including that may cause undesired
operation of the device.
1.1
Features
•
•
•
•
•
•
•
•
•
•
•
•
•
•
4
WLAN, Bluetooth, BLE on a module board
100-pin board card
Dimension 76.0 mm(L) x 31.0 mm(W)
WLAN 2.4 GHz SISO (20- and 40-MHz channels), 2.4-GHz MIMO (20-MHz channels)
Support for BLE dual mode
Seamless integration with TI Sitara and other application processors
Design for TI AM335X general-purpose EVM
WLAN and Bluetooth, BLE cores are software and hardware compatible with prior WL127x, WL128x
and CC256x offerings, for smooth migration to device.
Shared HCI transport for Bluetooth and BLE over UART and SDIO for WLAN.
Wi-Fi / Bluetooth single antenna co-existence
Built-in chip antenna
Optional U.FL RF connector for external 2.4-GHz band antenna
Direct connection to battery using external switching mode power supply supporting 4.8-V to 2.9-V
operation
VIO in the 1.8-V domain
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Introduction
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1.2
Applications
•
•
•
•
•
•
•
1.3
Internet of Things Multimedia
Home Electronics
Home Appliances and White Goods
Industrial and Home Automation
Smart Gateway and Metering
Video Conferencing
Video Camera and Security
TI Module Key Benefits
•
•
•
•
•
•
•
•
Reduces Design Overhead: Single WiLink8™ Module Scales Across Wi-Fi and Bluetooth.
WLAN High Throughput: 80 Mbps (TCP), 100 Mbps (UDP)
Bluetooth 4.0 + BLE (Smart Ready)
Wi-Fi-Bluetooth Single Antenna Coexistence
Low Power (30–50% Less than Previous Generation)
Available as Easy-to-Use FCC, ETSI, and Telec Certified Module
Lower Manufacturing Costs, Saving Board Space and Minimizing RF Expertise
AM335x Linux® and Android™ Reference Platform Accelerates Customer Development and Time to
Market
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Board Pin Assignment
2
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Board Pin Assignment
U1
WL18MODGB
Figure 2. Board Top View
Figure 3. Board Bottom View
6
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Board Pin Assignment
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2.1
Pin Descriptions
No.
Name
1
SLOW_CLK
Type
I
Description
Slow clock input
2
GND
G
Ground
3
GND
G
Ground
4
WL_EN
I
WLAN Enable
5
VBAT
P
Power supply input
6
GND
G
Ground
7
VBAT
P
Power supply input
8
VIO
P
Power supply input for I/O pin
9
GND
G
Ground
10
N.C.
11
WL_RS232_TX
12
N.C.
13
WL_RS232_RX
14
N.C.
15
WL_UART_DBG
16
N.C.
17
N.C.
18
GND
G
Ground
19
GND
G
Ground
20
SDIO_CLK
I
WLAN SDIO clock
21
N.C.
22
GND
23
N.C.
24
SDIO_CMD
25
N.C.
26
SDIO_D0
27
N.C.
28
SDIO_D1
29
N.C.
30
SDIO_D2
31
N.C.
32
SDIO_D3
33
N.C.
34
WLAN_IRQ
35
N.C.
36
N.C.
37
GND
38
N.C.
No connection
39
N.C.
No connection
40
N.C.
No connection
41
N.C.
42
GND
43
N.C.
No connection
44
N.C.
No connection
45
N.C.
No connection
46
N.C.
47
GND
No connection
O
WLAN tool RS232 output
No connection
I
WLAN tool RS232 input
No connection
O
WLAN Logger output
No connection
No connection
No connection
G
Ground
No connection
I/O
WLAN SDIO command
No connection
I/O
WLAN SDIO data bit 0
No connection
I/O
WLAN SDIO data bit 1
No connection
I/O
WLAN SDIO data bit 2
No connection
I/O
WLAN SDIO data bit 3
No connection
O
WLAN SDIO interrupt out
No connection
No connection
G
Ground
No connection
G
Ground
No connection
G
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Ground
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Board Pin Assignment
8
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No.
Name
Type
48
N.C.
No connection
49
N.C.
No connection
50
N.C.
No connection
51
N.C.
No connection
52
PCM_IF_CLK
53
N.C.
54
PCM_IF_FSYNC
55
N.C.
56
PCM_IF_DIN
57
N.C.
58
PCM_IF_DOUT
59
N.C.
60
GND
61
N.C.
62
N.C.
63
GND
G
Ground
64
GND
G
Ground
65
N.C.
66
BT_UART_IF_TX
67
N.C.
68
BT_UART_IF_RX
69
N.C.
70
BT_UART_IF_CTS
71
N.C.
72
BT_UART_IF_RTS
73
N.C.
74
BT_FUNC1
75
N.C.
76
BT_UART_DEBUG
O
Bluetooth Logger UART output
77
GND
G
Ground
78
GPIO9
I/O
General-purpose I/O
79
N.C.
No connection
80
N.C.
No connection
81
N.C.
No connection
82
N.C.
83
GND
84
N.C.
No connection
85
N.C.
No connection
86
N.C.
87
GND
88
N.C.
89
BT_EN
90
N.C.
No connection
91
N.C.
No connection
92
GND
G
Ground
93
BT_FUNC2
I
BT_WAKE_UP Bluetooth wakeup from host
94
N.C.
95
GND
G
Ground
96
GPIO11
I/O
General-purpose I/O
I/O
Description
Bluetooth PCM clock input or output
No connection
I/O
Bluetooth PCM frame sync input or output
No connection
I
Bluetooth PCM data input
No connection
O
Bluetooth PCM data output
No connection
G
Ground
No connection
No connection
No connection
O
Bluetooth HCI UART transmit output
No connection
I
Bluetooth HCI UART receive input
No connection
I
Bluetooth HCI UART Clear to Send input
No connection
O
Bluetooth HCI UART Request to Send output
No connection
O
BT_HOST_WAKE_UP Signal to wake up the host from Bluetooth
No connection
No connection
G
Ground
No connection
G
Ground
No connection
I
Bluetooth Enable
No connection
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Electrical Characteristics
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3
No.
Name
Type
Description
97
GND
G
Ground
98
GPIO12
I/O
General-purpose I/O
99
N.C.
100
GPIO10
General-purpose I/O
I/O
General-purpose I/O
Electrical Characteristics
Refer to the detailed data in the WL18MODGB data sheet (SWRS152) for electrical characteristics.
4
Approved Antenna Types and Maximum Gain Values
This device is intended only for OEM integrators under the following conditions:
• Install the antenna so that 20 cm is maintained between the antenna and user.
• Do not co-locate the transmitter module with any other transmitter or antenna.
• Operate the radio transmitter using only an antenna of a type and maximum (or lesser) gain approved
by TI. Table 1 lists the antennas approved by TI for use with the radio transmitter along with maximum
allowable gain values. Antenna types not included in the list or having a gain greater than the
maximum indicated are strictly prohibited for use with this transmitter
Table 1. Approved Antenna Types and Maximum Gain Values
Antenna Type
Brand
2.4–2.5 GHz
PCB
Ethertronics
–0.600
Dipole
LSR
2.00
PCB
Laird
2.00
Chip
Pulse
3.20
PIFA
LSR
2.00
Chip
TDK
2.4
Unit
dBi
NOTE: If these conditions cannot be met (for example, with certain laptop configurations or colocation with another transmitter), the FCC/IC authorization will not be considered valid and
the FCC ID/IC ID cannot be used on the final product. In these circumstances, the OEM
integrator is responsible for reevaluating the end product (including the transmitter) and
obtaining a separate FCC/IC authorization.
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On-Board Antenna Configuration
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5
On-Board Antenna Configuration
5.1
VSWR
Figure 4 shows the antenna VSWR.
Figure 4. Antenna VSWR
10
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5.2
Efficiency
Figure 5 shows the antenna efficiency.
Figure 5. Antenna Efficiency
5.3
Radio Pattern
Figure 6 shows the radio pattern of the WL1835MODCOM8B device.
Figure 6. Radio Pattern
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On-Board Antenna Configuration
5.4
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ANT1
Figure 7 shows the ANT1 polarization of the WL1835MODCOM8B device.
Figure 7. ANT1 Polarization
Figure 8. ANT1 Polarization
12
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Figure 9. ANT1 Polarization
5.5
ANT2
Figure 10 shows the ANT2 polarization of the WL1835MODCOM8B device.
Figure 10. ANT2 Polarization
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On-Board Antenna Configuration
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Figure 11. ANT2 Polarization
Figure 12. ANT2 Polarization
14
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Circuit Design
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6.1
Schematic
WLAN_EN_SOC
BT_EN_SOC
WL_UART_DBG
R1
0R 0402
R2
0R 0402
R4
BT_UART_DBG
R3
J1
HEADER 1x2
H-1X2_2MM
0R 0402
2
1
Circuit Design
TP2
1
TP1
1
0R 0402
VBAT_IN
1
TP8
VIO_IN
C2
10uF
0603
C1
1uF
0402
R32
0R
0402
C3
0.1uF
0402
SLOW_CLK
2
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
31
25
26
30
27
28
29
1
TP3
29
30
28
1
TP4
31
32
34
3
SLOW_CLK
R6
0R
0402
2
OUT
GND
EN
VCC
VIO_IN
VBAT_IN
1
4
C4
0.1uF
0402
WL_RS232_TX
WL_RS232_RX
GND
2G4_ANT2_W
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
2G4_ANT1_WB
These two TPs for test mode
when WL_IRQ pull high.
R12
0R
0402
WL_RS232_TX
33
R13
0R
0402
WL_RS232_RX
35
36
37
38
24
39
40
23
41
42
22
R17
0R
0402
BT_FUNC2
43
44
21
R19
0R
0402
BT_FUNC1
45
46
20
47
48
19
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
27
26
25
1
TP5
18
2G4_ANT2_W
17
G1
G2
G3
G4
G5
G6
G7
G8
G9
G10
G11
G12
G13
G14
G15
G16
G17
G18
J4
HEADER 1x2
H-1X2_2MM
Short PIN Header (1-2)
for entering test mode.
Open for function mode.
WLAN_EN_SOC
VIO_IN
SDIO_CLK_WL
SDIO_CMD_WL
SDIO_D0_WL
SDIO_D1_WL
SDIO_D2_WL
SDIO_D3_WL
R10
0R
0402
WLAN_IRQ
BT_AUD_CLK
BT_AUD_FSYNC
BT_AUD_IN
BT_AUD_OUT
BT_HCI_TX
BT_HCI_RX
BT_HCI_CTS
BT_HCI_RTS
BT_FUNC1
BT_UART_DBG
GPIO9
16
15
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
WLAN_IRQ
GND
32
1
2
34
35
33
GND
GND
GND
36
37
38
VIO
GND
EXT_32K
41
40
43
42
39
GND
WLAN_EN_SOC
BT_EN_SOC
BT_UART_DBG
WL_UART_DBG
46
44
GND
GND
45
GND
1
G19
G20
G21
G22
G23
G24
G25
G26
G27
G28
G29
G30
G31
G32
G33
G34
G35
G36
GND
RESERVED3
14
64
GND
WL_SDIO_D3
63
RESERVED1
WL_SDIO_D2
62
1
GND
RESERVED2
WL_SDIO_D1
TP6
GND
BT_AUD_CLK
13
61
GPIO_4
GND
12
60
0R 0402
BT_AUD_FSYNC
11
R18
BT_AUD_OUT
WL_SDIO_D0
59
BT_AUD_CLK
U1
WL1835MODGB
E-13.4X13.3-N100_0.75-TOP
BT_AUD_IN
GND
58
9
57
0R 0402
GPIO_2
10
0R 0402
R16
GND
WL_SDIO_CLK
R15
BT_AUD_FSYNC
GPIO_1
GND
BT_AUD_OUT
GND
WL_SDIO_CMD
56
GND
8
0R 0402
BT_HCI_RX
7
R14
GND
6
55
BT_AUD_IN
BT_HCI_TX
GPIO12
54
GND
GPIO10
53
0402
BT_HCI_CTS
5
52
0R
VBAT
GND
0R 0402
R11
GND
GPIO9
R9
BT_HCI_RX
2G4_ANT1_WB
BT_HCI_RTS
GPIO11
BT_HCI_TX
GND
GND
51
4
50
0R 0402
3
0R 0402
R8
2
R7
BT_HCI_CTS
VBAT
48
47
WL_UART_DBG
BT_HCI_RTS
NU_0R
0402
3
OSC1
1V8 / 32.768kHz
OSC-3.2X2.5
J3
HEADER 1x2
H-1X2_2MM
49
R5
1
R31
0R
0402
2
1
6
VIO_IN
83
84
GPIO11
R21
0R 0402
WLAN_IRQ
85
86
GPIO9
R22
0R 0402
R23
0R
0402
SDIO_D3_WL
87
88
GPIO10
R24
0R 0402
R25
0R
0402
SDIO_D2_WL
89
90
GPIO12
R26
0R 0402
R27
0R
0402
SDIO_D1_WL
91
92
R29
0R
0402
SDIO_D0_WL
93
94
R30
0R
0402
SDIO_CLK_WL
95
96
R28
0R
0402
SDIO_CMD_WL
97
98
99
100
R20
10k
0402
BT_EN_SOC
BT_FUNC2
GPIO11
GPIO12
GPIO10
J2
NU_100pin Micro Edge MEC6
SD-100P
EDGE CONNECTOR - MALE
WL_BG ANT2
L1
1.1nH
0402
2
1
3
C14
4pF
0402
ANT2
ANT016008LCD2442MA1
ANT-N3-1.6X0.8MM-B
A
FEED
C9
2pF
0402
J5
U.FL-R-SMT(10)
U.FL
2.4G
5G
B2
C7
NU_10pF
0402
C6
10pF
0402
2G4_ANT2_W
A
2G4_ANT1_WB
C8
NU_10pF
0402
C10
NU_0.3pF
0402
L2
1.5nH
0402
2
1
3
FEED
2.4G
5G
B2
ANT1
ANT016008LCD2442MA1
ANT-N3-1.6X0.8MM-A
C13
8pF
0402
B1
C5
10pF
0402
B1
WL_BG/BT ANT1
C11
1.2pF
0402
C12
NU
0402
J6
U.FL-R-SMT(10)
U.FL
Figure 13. Schematic
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15
Circuit Design
6.2
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Bill of Materials (BOM)
Table 2 lists the bill of materials.
Table 2. BOM
16
1
TI WL1835 Wi-Fi/Bluetooth Module
WL18MODGB
U1
2
XOSC 3225 / 32.768 kHz / 1.8 V / ±50 ppm
7XZ3200005
OSC1
3
ANT / Chip / 2.4 GHz, 5 GHz / Peak Gain >5 dBi
ANT016008LCD2442MA1
ANT1, ANT2
4
CON Male 1x2 / Pitch
P301-SGP-040/028-02
J1, J3, J4
5
DC JUMPER / PITCH 2.0 mm
CMJ-20BB
J1, J3
6
Mini RF Header Receptacle
U.FL-R-SMT-1(10)
J5, J6
7
IND 0402 / 1.1 nH / ±0.05 nH / SMD
LQP15MN1N1W02
L1
8
IND 0402 / 1.5 nH / ±0.05 nH / SMD
LQP15MN1N5W02
L2
9
CAP 0402 / 1.2 pF / 50 V / C0G / ±0.1 pF
GJM1555C1H1R2BB01
C11
10
CAP 0402 / 2.2 pF / 50 V / C0G / ±0.1 pF
GJM1555C1H2R2BB01
C9
11
CAP 0402 / 4 pF / 50 V / C0G / ±0.1 pF
GJM1555C1H4R0BB01
C14
12
CAP 0402 / 8 pF / 50 V / C0G / ±0.1 pF
GJM1555C1H8R0BB01
C13
13
CAP 0402 / 10 pF / 50 V / NPO / ±5%
0402N100J500LT
C7, C8
14
CAP 0402 / 0.1 µF / 6.3 V / X7R / ±10%
0402B104K100CT
C3, C4
15
CAP 0402 / 1 µF / 6.3 V / X5R / ±10% / HF
GRM155R60J105KE19D
C1
16
CAP 0603 / 10 µF / 6.3 V / X5R / ±20%
C1608X5R0J106M
C2
17
RES 0402 / 0R / ±5%
WR04X000 PTL
R1, R2, R3, R4, R5, R6, R7, R8, R9,
R10, R11, R12, R13, R14, R15,
R16, R17, R18, R19, R21, R22,
R23, R24, R25, R26, R27, R28,
R29, R30, R31, R32
18
RES 0402 / 10K / ±5%
WR04X103 JTL
R20
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Layout Guidelines
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7
Layout Guidelines
7.1
Board Layout
Figure 14 shows the WL1835MODCOM8B 4-layer board. Table 3, Figure 15, Figure 16, Figure 17,
Figure 18, and Figure 19 show instances of good layout practices.
Figure 14. Layer 1
Figure 15. Layer 2
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Layout Guidelines
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Figure 16. Layer 3
Figure 17. Layer 4
Table 3. Module Layout Guidelines
Reference
18
Guideline Description
1
The proximity of ground vias must be close to the pad.
2
Signal traces must not be run underneath the module on the layer where the module is mounted.
3
Have a complete ground pour in layer 2 for thermal dissipation.
4
Have a solid ground plane and ground vias under the module for stable system and thermal dissipation.
5
Increase the ground pour in the first layer and have all of the traces from the first layer on the inner layers, if
possible.
6
Signal traces can be run on a third layer under the solid ground layer, which is below the module mounting
layer.
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Layout Guidelines
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Figure 18. Module Layout Guidelines (Top Layer)
Figure 19. Module Layout Guidelines (Bottom Layer)
Figure 20 shows the trace design for the PCB. A 50-Ω impedance match on the trace to the antenna
should be used. Also, 50-Ω traces are recommended for the PCB layout.
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Layout Guidelines
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Figure 20. Trace Design for the PCB Layout
Figure 21 shows layer 1 with the trace to the antenna over ground layer 2.
Figure 21. Layer 1 Combined With Layer 2
Table 4, Figure 22, and Figure 23 describe instances of good layout practices for the antenna and RF
trace routing.
Table 4. Antenna and RF Trace Routing Layout Guidelines
Reference
20
Guideline Description
1
The RF trace antenna feed must be as short as possible beyond the ground reference. At this point, the trace
starts to radiate.
2
The RF trace bends must be gradual with an approximate maximum bend of 45 degrees with trace mitered. RF
traces must not have sharp corners.
3
RF traces must have via stitching on the ground plane beside the RF trace on both sides
4
RF traces must have constant impedance (microstrip transmission line).
5
For best results, the RF trace ground layer must be the ground layer immediately below the RF trace. The
ground layer must be solid.
6
There must be no traces or ground under the antenna section.
7
RF traces must be as short as possible. The antenna, RF traces, and modules must be on the edge of the PCB
product. The proximity of the antenna to the enclosure and the enclosure material must also be considered.
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Figure 22. Top Layer – Antenna and RF Trace Routing Layout Guidelines
Figure 23. Bottom Layer – Antenna and RF Trace Routing Layout Guidelines
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Layout Guidelines
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Figure 24 describes the MIMO antenna spacing. The distance of ANT1 and ANT2 must be greater than
half of wavelength (62.5 mm at 2.4 GHz).
Figure 24. MIMO Antenna Spacing
The supply routing guidelines are as follows:
• For power supply routing, the power trace for VBAT must be at least 40-mil wide.
• The 1.8-V trace must be at least 18-mil wide.
• Make VBAT traces as wide as possible to ensure reduced inductance and trace resistance.
• If possible, shield VBAT traces with ground above, below, and beside the traces.
The digital-signal routing guidelines are as follows:
• Route SDIO signal traces (CLK, CMD, D0, D1, D2, and D3) in parallel to each other and as short as
possible (less than 12 cm). In addition, each trace must be the same length. Ensure enough space
between traces (greater than 1.5 times the trace width or ground) to ensure signal quality, especially
for the SDIO_CLK trace. Remember to keep these traces away from the other digital or analog signal
traces. TI recommends adding ground shielding around these buses.
• Digital clock signals (SDIO clock, PCM clock, and so on) are a source of noise. Keep the traces of
these signals as short as possible. Whenever possible, maintain a clearance around these signals.
22
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Revision History
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Revision History
Changes from C Revision (March 2015) to E Revision .................................................................................................. Page
•
•
•
•
Changed from –40° ....................................................................................................................... 2
Added "Approved Antenna Types and Maximum Gain Values" section from SWRU382A. ..................................... 9
Changed section title from "Antenna Characteristics"............................................................................... 10
Replaced digital-signal routing guidelines. .......................................................................................... 22
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
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Revision History
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