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Table of Contents
User’s Guide
WL1835MODCOM8B WLAN MIMO and Bluetooth® Module
EVM
ABSTRACT
This user's guide describes how to use the TI WL1835MODCOM8B board to evaluate the performance of the TI
WL18MODGB module.
Table of Contents
Warning.......................................................................................................................................................................................2
1 Introduction.............................................................................................................................................................................3
1.1 Features............................................................................................................................................................................. 4
1.2 Applications........................................................................................................................................................................5
1.3 TI Module Key Benefits...................................................................................................................................................... 5
2 Board Pin Assignment........................................................................................................................................................... 5
2.1 Pin Descriptions................................................................................................................................................................. 6
3 Electrical Characteristics.......................................................................................................................................................8
4 Approved Antenna Types and Maximum Gain Values........................................................................................................ 8
5 On-Board Antenna Configuration......................................................................................................................................... 9
5.1 VSWR.................................................................................................................................................................................9
5.2 Efficiency............................................................................................................................................................................9
5.3 Radio Pattern................................................................................................................................................................... 10
5.4 ANT1................................................................................................................................................................................ 10
5.5 ANT2................................................................................................................................................................................ 12
6 Circuit Design........................................................................................................................................................................14
6.1 Schematic........................................................................................................................................................................ 14
6.2 Bill of Materials (BOM)..................................................................................................................................................... 15
7 Layout Guidelines.................................................................................................................................................................16
7.1 Board Layout....................................................................................................................................................................16
8 Revision History................................................................................................................................................................... 21
List of Figures
Figure 1-1. WL1835MODCOM8B Top View................................................................................................................................ 3
Figure 2-1. Board Top View......................................................................................................................................................... 5
Figure 2-2. Board Bottom View....................................................................................................................................................5
Figure 5-1. Antenna VSWR......................................................................................................................................................... 9
Figure 5-2. Antenna Efficiency.....................................................................................................................................................9
Figure 5-3. Radio Pattern.......................................................................................................................................................... 10
Figure 5-4. ANT1 Polarization................................................................................................................................................... 10
Figure 5-5. ANT1 Polarization....................................................................................................................................................11
Figure 5-6. ANT1 Polarization....................................................................................................................................................11
Figure 5-7. ANT2 Polarization................................................................................................................................................... 12
Figure 5-8. ANT2 Polarization................................................................................................................................................... 12
Figure 5-9. ANT2 Polarization................................................................................................................................................... 13
Figure 6-1. Schematic................................................................................................................................................................14
Figure 7-1. Layer 1.................................................................................................................................................................... 16
Figure 7-2. Layer 2.................................................................................................................................................................... 16
Figure 7-3. Layer 3.................................................................................................................................................................... 17
Figure 7-4. Layer 4.................................................................................................................................................................... 17
Figure 7-5. Module Layout Guidelines (Top Layer)....................................................................................................................18
Figure 7-6. Module Layout Guidelines (Bottom Layer).............................................................................................................. 18
Figure 7-7. Trace Design for the PCB Layout............................................................................................................................19
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Trademarks
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Figure 7-8. Layer 1 Combined With Layer 2..............................................................................................................................19
Figure 7-9. Top Layer – Antenna and RF Trace Routing Layout Guidelines............................................................................. 20
Figure 7-10. Bottom Layer – Antenna and RF Trace Routing Layout Guidelines......................................................................20
Figure 7-11. MIMO Antenna Spacing.........................................................................................................................................21
List of Tables
Table 4-1. Approved Antenna Types and Maximum Gain Values................................................................................................8
Table 6-1. BOM..........................................................................................................................................................................15
Table 7-1. Module Layout Guidelines........................................................................................................................................ 17
Table 7-2. Antenna and RF Trace Routing Layout Guidelines...................................................................................................19
Trademarks
WiLink8™ is a trademark of Texas Instruments.
Android™ is a trademark of Google Inc.
Bluetooth® are registered trademarks of Bluetooth SIG, Inc.
Wi-Fi® is a registered trademark of Wi-Fi Alliance.
Linux® is a registered trademark of Linux Foundation.
All trademarks are the property of their respective owners.
Warning
The WL1835MODCOM8B board is tested to comply with ETSI/R&TTE over temperatures from –20°C to 85°C.
This board should not be modified to operate in other frequency bands other than what they are designed for.
FCC Licensing Requirements for the Wi-Fi and Bluetooth Radio Module of the EVM:
For evaluation only; not FCC approved for resale. This kit is designed to allow:
1. Product developers to evaluate electronic components, circuitry, or software associated with the kit to
determine whether to incorporate such items in a finished product
2. Software developers to write software applications for use with the end product. This kit is not a finished
product and when assembled may not be resold or otherwise marketed unless all required FCC equipment
authorizations are first obtained. Operation is subject to the condition that this product not cause harmful
interference to licensed radio stations and that this product accept harmful interference. Unless the
assembled kit is designed to operate under part 15, part 18, or part 95 of this chapter, the operator of the
kit must operate under the authority of an FCC license holder or must secure an experimental authorization
under part 5 of this chapter.
Per TI’s Regulatory Compliance Information located in the WL1835ModCOMB8B User’s Guide’s “Evaluation
Board/Kit/Module (EVM) Additional Terms,” this EVM cannot be used for production purposes and is explicitly
restricted from end-product introduction.
Use of this EVM requires the developer to provide a minimum distance of at least 20 cm from the antenna to all
persons in order to minimize risk of potential radiation hazards.
CAUTION
Do not leave the EVM powered when unattended.
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Introduction
1 Introduction
The WL1835MODCOM8B device is a Wi-Fi® MIMO, Bluetooth, and Bluetooth Low Energy (BLE) module board
with the TI WL18MODGB module. WL18MODGB is built-in TI WL1835 IEEE 802.11 b/g/n and Bluetooth 4.2
solutions (5.1 compliant) to provide the best Wi-Fi and Bluetooth coexistence interoperability and powersaving
technologies from TI.
Figure 1-1. WL1835MODCOM8B Top View
FCC/IC Regulatory Compliance
FCC Part 15 Class A Compliant
IC ICES-003 Class A Compliant
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Introduction
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FCC ID: Z64-WL1835COM
This device complies with part 15 of the
FCC Rules. Operation is subject to the
following two conditions: (1) This device
may not cause harmful interference, and
(2) this device must accept any
interference received, including
interference that may cause undesired
operation.
IC ID: 451I-WL1835COM
This device complies with Industry
Canada licence-exempt RSS
standard(s). Operation is subject to the
following two conditions: (1) this device
may not cause interference, and (2) this
device must accept any interference,
including that may cause undesired
operation of the device.
1.1 Features
•
•
•
•
•
•
•
•
•
•
•
•
•
•
4
WLAN, Bluetooth, BLE on a module board
100-pin board card
Dimension 76.0 mm(L) x 31.0 mm(W)
WLAN 2.4 GHz SISO (20- and 40-MHz channels), 2.4-GHz MIMO (20-MHz channels)
Support for BLE dual mode
Seamless integration with TI Sitara and other application processors
Design for TI AM335X general-purpose EVM
WLAN and Bluetooth, BLE cores are software and hardware compatible with prior WL127x, WL128x and
CC256x offerings, for smooth migration to device.
Shared HCI transport for Bluetooth and BLE over UART and SDIO for WLAN.
Wi-Fi / Bluetooth single antenna co-existence
Built-in chip antenna
Optional U.FL RF connector for external 2.4-GHz band antenna
Direct connection to battery using external switching mode power supply supporting 4.8-V to 2.9-V operation
VIO in the 1.8-V domain
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Introduction
1.2 Applications
•
•
•
•
•
•
•
Internet of Things Multimedia
Home Electronics
Home Appliances and White Goods
Industrial and Home Automation
Smart Gateway and Metering
Video Conferencing
Video Camera and Security
1.3 TI Module Key Benefits
•
•
•
•
•
•
•
•
Reduces Design Overhead: Single WiLink8™ Module Scales Across Wi-Fi and Bluetooth.
WLAN High Throughput: 80 Mbps (TCP), 100 Mbps (UDP)
Bluetooth 4.2 (5.1 compliant) + BLE (Smart Ready)
Wi-Fi-Bluetooth Single Antenna Coexistence
Low Power (30–50% Less than Previous Generation)
Available as Easy-to-Use FCC, ETSI, and Telec Certified Module
Lower Manufacturing Costs, Saving Board Space and Minimizing RF Expertise
AM335x Linux® and Android™ Reference Platform Accelerates Customer Development and Time to Market
2 Board Pin Assignment
U1
WL18MODGB
Figure 2-1. Board Top View
Figure 2-2. Board Bottom View
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Board Pin Assignment
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2.1 Pin Descriptions
6
No.
Name
1
SLOW_CLK
Type
I
Description
Slow clock input
2
GND
G
Ground
3
GND
G
Ground
4
WL_EN
I
WLAN Enable
5
VBAT
P
Power supply input
6
GND
G
Ground
7
VBAT
P
Power supply input
8
VIO
P
Power supply input for I/O pin
9
GND
G
Ground
10
N.C.
11
WL_RS232_TX
12
N.C.
13
WL_RS232_RX
14
N.C.
15
WL_UART_DBG
16
N.C.
No connection
17
N.C.
No connection
18
GND
G
Ground
19
GND
G
Ground
20
SDIO_CLK
I
WLAN SDIO clock
21
N.C.
22
GND
23
N.C.
24
SDIO_CMD
25
N.C.
26
SDIO_D0
27
N.C.
28
SDIO_D1
29
N.C.
30
SDIO_D2
31
N.C.
32
SDIO_D3
33
N.C.
34
WLAN_IRQ
35
N.C.
No connection
36
N.C.
No connection
37
GND
38
N.C.
No connection
39
N.C.
No connection
40
N.C.
No connection
41
N.C.
42
GND
43
N.C.
No connection
44
N.C.
No connection
45
N.C.
No connection
46
N.C.
No connection
No connection
O
WLAN tool RS232 output
No connection
I
WLAN tool RS232 input
No connection
O
WLAN Logger output
No connection
G
Ground
No connection
I/O
WLAN SDIO command
No connection
I/O
WLAN SDIO data bit 0
No connection
I/O
WLAN SDIO data bit 1
No connection
I/O
WLAN SDIO data bit 2
No connection
I/O
WLAN SDIO data bit 3
No connection
O
G
WLAN SDIO interrupt out
Ground
No connection
G
Ground
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Board Pin Assignment
No.
Name
Type
47
GND
48
N.C.
No connection
49
N.C.
No connection
50
N.C.
No connection
51
N.C.
52
PCM_IF_CLK
53
N.C.
54
PCM_IF_FSYNC
55
N.C.
56
PCM_IF_DIN
57
N.C.
58
PCM_IF_DOUT
59
N.C.
60
GND
61
N.C.
62
N.C.
63
GND
G
Ground
64
GND
G
Ground
65
N.C.
66
BT_UART_IF_TX
67
N.C.
68
BT_UART_IF_RX
69
N.C.
70
BT_UART_IF_CTS
71
N.C.
72
BT_UART_IF_RTS
73
N.C.
74
BT_FUNC1
75
N.C.
76
BT_UART_DEBUG
O
Bluetooth Logger UART output
77
GND
G
Ground
78
GPIO9
I/O
General-purpose I/O
79
N.C.
No connection
80
N.C.
No connection
81
N.C.
No connection
82
N.C.
83
GND
84
N.C.
No connection
85
N.C.
No connection
86
N.C.
87
GND
88
N.C.
89
BT_EN
90
N.C.
No connection
91
N.C.
No connection
92
GND
G
Ground
93
BT_FUNC2
I
BT_WAKE_UP Bluetooth wakeup from host
94
N.C.
G
Description
Ground
No connection
I/O
Bluetooth PCM clock input or output
No connection
I/O
Bluetooth PCM frame sync input or output
No connection
I
Bluetooth PCM data input
No connection
O
Bluetooth PCM data output
No connection
G
Ground
No connection
No connection
No connection
O
Bluetooth HCI UART transmit output
No connection
I
Bluetooth HCI UART receive input
No connection
I
Bluetooth HCI UART Clear to Send input
No connection
O
Bluetooth HCI UART Request to Send output
No connection
O
BT_HOST_WAKE_UP Signal to wake up the host from Bluetooth
No connection
No connection
G
Ground
No connection
G
Ground
No connection
I
Bluetooth Enable
No connection
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Electrical Characteristics
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No.
Name
Type
Description
95
GND
G
Ground
96
GPIO11
I/O
General-purpose I/O
97
GND
G
Ground
98
GPIO12
I/O
General-purpose I/O
99
N.C.
100
GPIO10
General-purpose I/O
I/O
General-purpose I/O
3 Electrical Characteristics
For electrical characteristics, see the detailed data in the WL18x1MOD, WL18x5MOD WiLink™ 8 Single-Band
Combo Module – Wi-Fi®, Bluetooth ®, and Bluetooth Low Energy (LE) Data Sheet.
4 Approved Antenna Types and Maximum Gain Values
This device is intended only for OEM integrators under the following conditions:
•
•
•
Install the antenna so that 20 cm is maintained between the antenna and user.
Do not co-locate the transmitter module with any other transmitter or antenna.
Operate the radio transmitter using only an antenna of a type and maximum (or lesser) gain approved by TI.
Table 4-1 lists the antennas approved by TI for use with the radio transmitter along with maximum allowable
gain values. Antenna types not included in the list or having a gain greater than the maximum indicated are
strictly prohibited for use with this transmitter
Table 4-1. Approved Antenna Types and Maximum Gain Values
Antenna Type
Brand
2.4–2.5 GHz
PCB
Ethertronics
–0.600
Dipole
LSR
2.00
PCB
Laird
2.00
Chip
Pulse
3.20
PIFA
LSR
2.00
Chip
TDK
2.4
Unit
dBi
Note
If these conditions cannot be met (for example, with certain laptop configurations or co- location
with another transmitter), the FCC/IC authorization will not be considered valid and the FCC ID/IC
ID cannot be used on the final product. In these circumstances, the OEM integrator is responsible
for reevaluating the end product (including the transmitter) and obtaining a separate FCC/IC
authorization.
8
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On-Board Antenna Configuration
5 On-Board Antenna Configuration
5.1 VSWR
Figure 5-1 shows the antenna VSWR.
Figure 5-1. Antenna VSWR
5.2 Efficiency
Figure 5-2 shows the antenna efficiency.
Figure 5-2. Antenna Efficiency
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On-Board Antenna Configuration
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5.3 Radio Pattern
Figure 5-3 shows the radio pattern of the WL1835MODCOM8B device.
Figure 5-3. Radio Pattern
5.4 ANT1
Figure 5-4 shows the ANT1 polarization of the WL1835MODCOM8B device.
Figure 5-4. ANT1 Polarization
10
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On-Board Antenna Configuration
Figure 5-5. ANT1 Polarization
Figure 5-6. ANT1 Polarization
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On-Board Antenna Configuration
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5.5 ANT2
Figure 5-7 shows the ANT2 polarization of the WL1835MODCOM8B device.
Figure 5-7. ANT2 Polarization
Figure 5-8. ANT2 Polarization
12
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On-Board Antenna Configuration
Figure 5-9. ANT2 Polarization
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Circuit Design
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6 Circuit Design
6.1 Schematic
WL_UART_DBG
R1
0R 0402
R2
0R 0402
R4
BT_UART_DBG
R3
J1
HEADER 1x2
H-1X2_2MM
0R 0402
2
1
BT_EN_SOC
TP2
1
TP1
1
0R 0402
VBAT_IN
1
TP8
VIO_IN
C2
10uF
0603
C1
1uF
0402
R32
0R
0402
C3
0.1uF
0402
SLOW_CLK
2
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
31
25
26
30
27
28
29
30
3
SLOW_CLK
R6
0R
0402
2
OUT
GND
EN
VCC
VIO_IN
VBAT_IN
1
4
C4
0.1uF
0402
WL_RS232_TX
WL_RS232_RX
RESERVED3
GND
GND
2G4_ANT2_W
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
2G4_ANT1_WB
29
28
27
R12
26
R13
25
1
0R
0R
1
TP3
1
TP4
0402
0402
These two TPs for test mode
when WL_IRQ pull high.
31
32
WL_RS232_TX
33
34
WL_RS232_RX
35
36
37
38
39
40
TP5
24
41
42
22
R17
0R
0402
BT_FUNC2
43
44
21
R19
0R
0402
BT_FUNC1
45
46
20
47
48
19
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
23
18
2G4_ANT2_W
17
G1
G2
G3
G4
G5
G6
G7
G8
G9
G10
G11
G12
G13
G14
G15
G16
G17
G18
J4
HEADER 1x2
H-1X2_2MM
1
2
34
35
33
GND
GND
GND
36
37
38
VIO
GND
EXT_32K
41
40
39
GND
BT_EN_SOC
WLAN_EN_SOC
42
43
BT_UART_DBG
WL_UART_DBG
46
44
GND
45
GND
VBAT
GND
1
G19
G20
G21
G22
G23
G24
G25
G26
G27
G28
G29
G30
G31
G32
G33
G34
G35
G36
GND
GND
64
RESERVED1
GND
63
RESERVED2
WLAN_IRQ
62
1
GND
32
Short PIN Header (1-2)
for entering test mode.
Open for function mode.
WLAN_EN_SOC
VIO_IN
SDIO_CLK_WL
SDIO_CMD_WL
SDIO_D0_WL
SDIO_D1_WL
SDIO_D2_WL
SDIO_D3_WL
R10
0R
0402
WLAN_IRQ
BT_AUD_CLK
BT_AUD_FSYNC
BT_AUD_IN
BT_AUD_OUT
BT_HCI_TX
BT_HCI_RX
BT_HCI_CTS
BT_HCI_RTS
BT_FUNC1
BT_UART_DBG
GPIO9
16
TP6
GND
BT_AUD_CLK
15
61
GPIO_4
GND
14
60
0R 0402
WL_SDIO_D3
R18
BT_AUD_FSYNC
WL_SDIO_D2
BT_AUD_CLK
U1
WL1835MODGB
E-13.4X13.3-N100_0.75-TOP
BT_AUD_OUT
WL_SDIO_D1
59
13
58
12
57
0R 0402
11
0R 0402
R16
WL_SDIO_D0
R15
BT_AUD_FSYNC
GPIO_2
BT_AUD_IN
GND
BT_AUD_OUT
GND
WL_SDIO_CLK
56
GPIO_1
9
0R 0402
GND
10
R14
GND
GND
55
BT_AUD_IN
BT_HCI_RX
WL_SDIO_CMD
54
8
53
0402
GND
7
0R
BT_HCI_TX
6
R11
GND
GPIO12
BT_HCI_RX
BT_HCI_CTS
5
52
GPIO10
0R 0402
GND
GPIO9
R9
2G4_ANT1_WB
BT_HCI_RTS
GPIO11
BT_HCI_TX
GND
4
51
3
50
0R 0402
2
0R 0402
R8
GND
R7
BT_HCI_CTS
VBAT
GND
48
47
WL_UART_DBG
BT_HCI_RTS
NU_0R
0402
3
OSC1
1V8 / 32.768kHz
OSC-3.2X2.5
J3
HEADER 1x2
H-1X2_2MM
49
R5
1
R31
0R
0402
2
1
WLAN_EN_SOC
VIO_IN
83
84
GPIO11
R21
0R 0402
WLAN_IRQ
85
86
GPIO9
R22
0R 0402
R23
0R
0402
SDIO_D3_WL
87
88
GPIO10
R24
0R 0402
R25
0R
0402
SDIO_D2_WL
89
90
GPIO12
R26
0R 0402
R27
0R
0402
SDIO_D1_WL
91
92
93
94
R20
10k
0402
BT_EN_SOC
BT_FUNC2
SDIO_D0_WL
R29
0R
0402
R30
0R
0402
SDIO_CLK_WL
95
R28
0R
0402
SDIO_CMD_WL
97
98
99
100
96
GPIO11
GPIO12
GPIO10
J2
NU_100pin Micro Edge MEC6
SD-100P
EDGE CONNECTOR - MALE
WL_BG ANT2
L1
1.1nH
0402
2
1
3
C14
4pF
0402
ANT2
ANT016008LCD2442MA1
ANT-N3-1.6X0.8MM-B
A
FEED
C9
2pF
0402
2.4G
5G
B2
C7
NU_10pF
0402
C6
10pF
0402
2G4_ANT2_W
A
C8
NU_10pF
0402
C10
NU_0.3pF
0402
J5
U.FL-R-SMT(10)
U.FL
L2
1.5nH
0402
2
1
3
C11
1.2pF
0402
FEED
2.4G
5G
B2
ANT1
ANT016008LCD2442MA1
ANT-N3-1.6X0.8MM-A
C13
8pF
0402
B1
C5
10pF
0402
2G4_ANT1_WB
B1
WL_BG/BT ANT1
C12
NU
0402
J6
U.FL-R-SMT(10)
U.FL
Figure 6-1. Schematic
14
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Circuit Design
6.2 Bill of Materials (BOM)
Table 6-1 lists the bill of materials.
Table 6-1. BOM
1
TI WL1835 Wi-Fi/Bluetooth Module
WL18MODGB
U1
2
XOSC 3225 / 32.768 kHz / 1.8 V / ±50 ppm
7XZ3200005
OSC1
3
ANT / Chip / 2.4 GHz, 5 GHz / Peak Gain >5 dBi
ANT016008LCD2442MA1
ANT1, ANT2
4
CON Male 1x2 / Pitch
P301-SGP-040/028-02
J1, J3, J4
5
DC JUMPER / PITCH 2.0 mm
CMJ-20BB
J1, J3
6
Mini RF Header Receptacle
U.FL-R-SMT-1(10)
J5, J6
7
IND 0402 / 1.1 nH / ±0.05 nH / SMD
LQP15MN1N1W02
L1
8
IND 0402 / 1.5 nH / ±0.05 nH / SMD
LQP15MN1N5W02
L2
9
CAP 0402 / 1.2 pF / 50 V / C0G / ±0.1 pF
GJM1555C1H1R2BB01
C11
10
CAP 0402 / 2.2 pF / 50 V / C0G / ±0.1 pF
GJM1555C1H2R2BB01
C9
11
CAP 0402 / 4 pF / 50 V / C0G / ±0.1 pF
GJM1555C1H4R0BB01
C14
12
CAP 0402 / 8 pF / 50 V / C0G / ±0.1 pF
GJM1555C1H8R0BB01
C13
13
CAP 0402 / 10 pF / 50 V / NPO / ±5%
0402N100J500LT
C7, C8
14
CAP 0402 / 0.1 µF / 6.3 V / X7R / ±10%
0402B104K100CT
C3, C4
15
CAP 0402 / 1 µF / 6.3 V / X5R / ±10% / HF
GRM155R60J105KE19D
C1
16
CAP 0603 / 10 µF / 6.3 V / X5R / ±20%
C1608X5R0J106M
C2
17
RES 0402 / 0R / ±5%
WR04X000 PTL
R1, R2, R3, R4, R5, R6, R7, R8, R9,
R10, R11, R12, R13, R14, R15, R16,
R17, R18, R19, R21, R22, R23, R24,
R25, R26, R27, R28, R29, R30, R31,
R32
18
RES 0402 / 10K / ±5%
WR04X103 JTL
R20
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Layout Guidelines
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7 Layout Guidelines
7.1 Board Layout
Figure 7-1 shows the WL1835MODCOM8B 4-layer board. Table 7-1, Figure 7-2, Figure 7-3, Figure 7-4, Figure
7-5, and Figure 7-6 show instances of good layout practices.
Figure 7-1. Layer 1
Figure 7-2. Layer 2
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Layout Guidelines
Figure 7-3. Layer 3
Figure 7-4. Layer 4
Table 7-1. Module Layout Guidelines
Reference
Guideline Description
1
The proximity of ground vias must be close to the pad.
2
Signal traces must not be run underneath the module on the layer where the module is mounted.
3
Have a complete ground pour in layer 2 for thermal dissipation.
4
Have a solid ground plane and ground vias under the module for stable system and thermal dissipation.
5
Increase the ground pour in the first layer and have all of the traces from the first layer on the inner layers, if possible.
6
Signal traces can be run on a third layer under the solid ground layer, which is below the module mounting layer.
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Layout Guidelines
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Figure 7-5. Module Layout Guidelines (Top Layer)
Figure 7-6. Module Layout Guidelines (Bottom Layer)
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Layout Guidelines
Figure 7-7 shows the trace design for the PCB. A 50-Ω impedance match on the trace to the antenna should be
used. Also, 50-Ω traces are recommended for the PCB layout.
Figure 7-7. Trace Design for the PCB Layout
Figure 7-8 shows layer 1 with the trace to the antenna over ground layer 2.
Figure 7-8. Layer 1 Combined With Layer 2
Table 7-2, Figure 7-9, and Figure 7-10 describe instances of good layout practices for the antenna and RF trace
routing.
Table 7-2. Antenna and RF Trace Routing Layout Guidelines
Reference
Guideline Description
1
The RF trace antenna feed must be as short as possible beyond the ground reference. At this point, the trace starts to
radiate.
2
The RF trace bends must be gradual with an approximate maximum bend of 45 degrees with trace mitered. RF traces
must not have sharp corners.
3
RF traces must have via stitching on the ground plane beside the RF trace on both sides
4
RF traces must have constant impedance (microstrip transmission line).
5
For best results, the RF trace ground layer must be the ground layer immediately below the RF trace. The ground layer
must be solid.
6
There must be no traces or ground under the antenna section.
7
RF traces must be as short as possible. The antenna, RF traces, and modules must be on the edge of the PCB product.
The proximity of the antenna to the enclosure and the enclosure material must also be considered.
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Layout Guidelines
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Figure 7-9. Top Layer – Antenna and RF Trace Routing Layout Guidelines
Figure 7-10. Bottom Layer – Antenna and RF Trace Routing Layout Guidelines
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Revision History
Figure 7-11 describes the MIMO antenna spacing. The distance of ANT1 and ANT2 must be greater than half of
wavelength (62.5 mm at 2.4 GHz).
Figure 7-11. MIMO Antenna Spacing
The supply routing guidelines are as follows:
•
•
•
•
For power supply routing, the power trace for VBAT must be at least 40-mil wide.
The 1.8-V trace must be at least 18-mil wide.
Make VBAT traces as wide as possible to ensure reduced inductance and trace resistance.
If possible, shield VBAT traces with ground above, below, and beside the traces.
The digital-signal routing guidelines are as follows:
•
•
Route SDIO signal traces (CLK, CMD, D0, D1, D2, and D3) in parallel to each other and as short as possible
(less than 12 cm). In addition, each trace must be the same length. Ensure enough space between traces
(greater than 1.5 times the trace width or ground) to ensure signal quality, especially for the SDIO_CLK trace.
Remember to keep these traces away from the other digital or analog signal traces. TI recommends adding
ground shielding around these buses.
Digital clock signals (SDIO clock, PCM clock, and so on) are a source of noise. Keep the traces of these
signals as short as possible. Whenever possible, maintain a clearance around these signals.
8 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision E (March 2015) to Revision F (December 2021)
Page
• Updated language to reflect Bluetooth 5.1 certification...................................................................................... 3
• Updated the numbering format for tables, figures and cross-references throughout the document...................3
• Update was made in Section 1.3........................................................................................................................ 5
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