WL1837MODCOM8I

www.ti.com Table of Contents User’s Guide WL1837MODCOM8I WLAN MIMO and Bluetooth® Module Evaluation Board for TI Sitara™ Platform ABSTRACT The WL1837MODCOM8I is a Wi-Fi® dual-band, Bluetooth®, and BLE module evaluation board (EVB) with the TI WL1837 module (WL1837MOD, with Bluetooth) or WL1807 module (WL1807MOD, without Bluetooth). The WL18x7MOD is a certified WiLink™ 8 module from TI that offers high throughput and extended range along with Wi-Fi and Bluetooth coexistence in a power-optimized design. The WL1807MOD offers A 2.4- and 5-GHz module solution with two antennas supporting industrial temperature grade. The module is FCC, IC, ETSI/CE, and TELEC certified for AP (with DFS support) and client. TI offers drivers for high-level operating systems, such as Linux®, Android™, WinCE, and RTOS.TI. Table of Contents Warning.......................................................................................................................................................................................2 1 Overview..................................................................................................................................................................................3 1.1 General Features............................................................................................................................................................... 3 1.2 Key Benefits....................................................................................................................................................................... 3 1.3 Applications........................................................................................................................................................................4 2 Board Pin Assignment........................................................................................................................................................... 4 2.1 Pin Description................................................................................................................................................................... 5 2.2 Jumper Connections.......................................................................................................................................................... 7 3 Electrical Characteristics.......................................................................................................................................................7 4 Approved Antenna Types and Maximum Gain Values........................................................................................................ 7 5 Antenna Characteristics........................................................................................................................................................ 8 5.1 VSWR.................................................................................................................................................................................8 5.2 Efficiency............................................................................................................................................................................9 5.3 Radio Pattern..................................................................................................................................................................... 9 6 Circuit Design........................................................................................................................................................................10 6.1 EVB Reference Schematics.............................................................................................................................................10 6.2 Bill of Materials (BOM)......................................................................................................................................................11 7 Layout Guidelines.................................................................................................................................................................12 7.1 Board Layout....................................................................................................................................................................12 8 Ordering Information............................................................................................................................................................18 9 Revision History................................................................................................................................................................... 18 List of Figures Figure 1-1. WL1837MODCOM8I EVB (Top View)....................................................................................................................... 3 Figure 2-1. EVB Top View............................................................................................................................................................4 Figure 2-2. EVB (Bottom View)....................................................................................................................................................4 Figure 5-1. Antenna VSWR Characteristics................................................................................................................................ 8 Figure 5-2. Antenna Efficiency.....................................................................................................................................................9 Figure 6-1. EVB Reference Schematics.................................................................................................................................... 10 Figure 7-1. WL1837MODCOM8I Layer 1 Layout...................................................................................................................... 12 Figure 7-2. WL1837MODCOM8I Layer 2 Layout...................................................................................................................... 12 Figure 7-3. WL1837MODCOM8I Layer 3 Layout...................................................................................................................... 13 Figure 7-4. WL1837MODCOM8I Layer 4 Layout...................................................................................................................... 13 Figure 7-5. Module Layout Guidelines (Top Layer)....................................................................................................................14 Figure 7-6. Module Layout Guidelines (Bottom Layer).............................................................................................................. 14 Figure 7-7. Trace Design for the PCB Layout............................................................................................................................15 Figure 7-8. Layer 1 Combined With Layer 2..............................................................................................................................15 SWRU382D – JULY 2014 – REVISED FEBRUARY 2022 WL1837MODCOM8I WLAN MIMO and Bluetooth® Module Evaluation Board Submit Document Feedback for TI Sitara™ Platform Copyright © 2022 Texas Instruments Incorporated 1 Trademarks www.ti.com Figure 7-9. Top Layer – Antenna and RF Trace Routing Layout Guidelines............................................................................. 16 Figure 7-10. Bottom Layer – Antenna and RF Trace Routing Layout Guidelines......................................................................16 Figure 7-11. MIMO Antenna Spacing.........................................................................................................................................17 List of Tables Table 2-1. Pin Description............................................................................................................................................................5 Table 4-1. Approved Antenna Types and Maximum Gain Values................................................................................................7 Table 6-1. BOM.......................................................................................................................................................................... 11 Table 7-1. Module Layout Guidelines........................................................................................................................................ 14 Table 7-2. Antenna and RF Trace Routing Layout Guidelines...................................................................................................17 Trademarks Sitara™ and WiLink™ are trademarks of TI. Android™ is a trademark of Google, Inc. Bluetooth® is a registered trademark of Bluetooth SIG, Inc. Wi-Fi® is a registered trademark of Wi-Fi Alliance. Linux® is a registered trademark of Linus Torvalds. All trademarks are the property of their respective owners. Warning The WL1837MODCOM8I board is tested to comply with ETSI/R&TTE over temperatures from –40°C to +85°C. This board should not be modified to operate in other frequency bands other than what they are designed for. FCC Licensing Requirements for the Wi-Fi and Bluetooth Radio Module of the EVM: For evaluation only; not FCC approved for resale. This kit is designed to allow: 1. Product developers to evaluate electronic components, circuitry, or software associated with the kit to determine whether to incorporate such items in a finished product 2. Software developers to write software applications for use with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit is designed to operate under part 15, part 18, or part 95 of this chapter, the operator of the kit must operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter. Per TI’s Regulatory Compliance Information located in the WL1837MODCOM8I User’s Guide’s “Evaluation Board/Kit/Module (EVM) Additional Terms,” this EVM cannot be used for production purposes and is explicitly restricted from end-product introduction. Use of this EVM requires the developer to provide a minimum distance of at least 20 cm from the antenna to all persons in order to minimize risk of potential radiation hazards. CAUTION Do not leave the EVM powered when unattended. 2 WL1837MODCOM8I WLAN MIMO and Bluetooth® Module Evaluation Board SWRU382D – JULY 2014 – REVISED FEBRUARY 2022 for TI Sitara™ Platform Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated www.ti.com Overview 1 Overview Figure 1-1 shows the WL1837MODCOM8I EVB. U1 WL1837MODGI Figure 1-1. WL1837MODCOM8I EVB (Top View) 1.1 General Features The WL1837MODCOM8I EVB includes the following features: • • • • • • • • • • • • • • WLAN, Bluetooth, and BLE on a single module board 100-pin board card Dimensions: 76.0 mm (L) x 31.0 mm (W) WLAN 2.4- and 5-GHz SISO (20- and 40-MHz channels), 2.4-GHz MIMO (20-MHz channels) Support for BLE dual mode Seamless integration with TI Sitara and other application processors Design for the TI AM335X general-purpose evaluation module (EVM) WLAN and Bluetooth, BLE, and ANT cores that are software- and hardware-compatible with prior WL127x, WL128x, and BL6450 offerings for smooth migration to device Shared host-controller-interface (HCI) transport for Bluetooth, BLE, and ANT using UART and SDIO for WLAN Wi-Fi and Bluetooth single-antenna coexistence Built-in chip antenna Optional U.FL RF connector for external antenna Direct connection to the battery using an external switched-mode power supply (SMPS) supporting 2.9- to 4.8-V operation VIO in the 1.8-V domain 1.2 Key Benefits The WL18x7MOD offers the following benefits: • • • • • • • • Reduces design overhead: Single WiLink 8 module scales across Wi-Fi and Bluetooth WLAN high throughput: 80 Mbps (TCP), 100 Mbps (UDP) Bluetooth 4.2 (5.1 compliant) + BLE (Smart Ready) Wi-Fi and Bluetooth single-antenna coexistence Low power at 30% to 50% less than the previous generation Available as an easy-to-use FCC-, ETSI-, and Telec-certified module Lower manufacturing costs saves board space and minimizes RF expertise. AM335x Linux and Android reference platform accelerates customer development and time to market. SWRU382D – JULY 2014 – REVISED FEBRUARY 2022 WL1837MODCOM8I WLAN MIMO and Bluetooth® Module Evaluation Board Submit Document Feedback for TI Sitara™ Platform Copyright © 2022 Texas Instruments Incorporated 3 Overview www.ti.com 1.3 Applications The WL1837MODCOM8I device is designed for the following applications: • • • • • • • Portable consumer devices Home electronics Home appliances and white goods Industrial and home automation Smart gateway and metering Video conferencing Video camera and security 2 Board Pin Assignment Figure 2-1 shows the top view of the EVB. Figure 2-1. EVB Top View Figure 2-2 shows the bottom view of the EVB. Figure 2-2. EVB (Bottom View) 4 WL1837MODCOM8I WLAN MIMO and Bluetooth® Module Evaluation Board SWRU382D – JULY 2014 – REVISED FEBRUARY 2022 for TI Sitara™ Platform Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated www.ti.com Board Pin Assignment 2.1 Pin Description Table 2-1 describes the board pins. Table 2-1. Pin Description No. Name Type Description 1 SLOW_CLK I Slow clock input option (default: NU) 2 GND G Ground 3 GND G Ground 4 WL_EN I WLAN enable 5 VBAT P 3.6-V typical voltage input 6 GND G Ground 7 VBAT P 3.6-V typical voltage input 8 VIO P VIO 1.8-V (I/O voltage) input G Ground 9 GND 10 N.C. No connection 11 WL_RS232_TX 12 N.C. O WLAN tool RS232 output 13 WL_RS232_RX 14 N.C. 15 WL_UART_DBG 16 N.C. 17 N.C. 18 GND G Ground 19 GND G Ground 20 SDIO_CLK I WLAN SDIO clock 21 N.C. 22 GND 23 N.C. 24 SDIO_CMD 25 N.C. 26 SDIO_D0 27 N.C. 28 SDIO_D1 29 N.C. 30 SDIO_D2 31 N.C. 32 SDIO_D3 33 N.C. 34 WLAN_IRQ 35 N.C. 36 N.C. 37 GND 38 N.C. No connection 39 N.C. No connection 40 N.C. No connection 41 N.C. No connection 42 GND 43 N.C. No connection 44 N.C. No connection No connection I WLAN tool RS232 input No connection O WLAN Logger output No connection No connection No connection G Ground No connection I/O WLAN SDIO command No connection I/O WLAN SDIO data bit 0 No connection I/O WLAN SDIO data bit 1 No connection I/O WLAN SDIO data bit 2 No connection I/O WLAN SDIO data bit 3 No connection O WLAN SDIO interrupt out No connection No connection G G Ground Ground SWRU382D – JULY 2014 – REVISED FEBRUARY 2022 WL1837MODCOM8I WLAN MIMO and Bluetooth® Module Evaluation Board Submit Document Feedback for TI Sitara™ Platform Copyright © 2022 Texas Instruments Incorporated 5 Board Pin Assignment www.ti.com Table 2-1. Pin Description (continued) No. 6 Name Type Description 45 N.C. No connection 46 N.C. No connection 47 GND 48 N.C. No connection 49 N.C. No connection 50 N.C. No connection 51 N.C. 52 PCM_IF_CLK 53 N.C. 54 PCM_IF_FSYNC 55 N.C. 56 PCM_IF_DIN 57 N.C. 58 PCM_IF_DOUT 59 N.C. 60 GND 61 N.C. No connection 62 N.C. No connection 63 GND G Ground 64 GND G Ground 65 N.C. 66 BT_UART_IF_TX 67 N.C. 68 BT_UART_IF_RX 69 N.C. 70 BT_UART_IF_CTS 71 N.C. 72 BT_UART_IF_RTS 73 N.C. 74 RESERVED1 75 N.C. 76 BT_UART_DEBUG O Bluetooth Logger UART output 77 GND G Ground 78 GPIO9 I/O General-purpose I/O 79 N.C. No connection 80 N.C. No connection 81 N.C. No connection 82 N.C. 83 GND 84 N.C. No connection 85 N.C. No connection 86 N.C. 87 GND 88 N.C. 89 BT_EN 90 N.C. No connection 91 N.C. No connection G Ground No connection I/O Bluetooth PCM clock input or output No connection I/O Bluetooth PCM frame sync input or output No connection I Bluetooth PCM data input No connection O Bluetooth PCM data output No connection G Ground No connection O Bluetooth HCI UART transmit output No connection I Bluetooth HCI UART receive input No connection I Bluetooth HCI UART Clear-to-Send input No connection O Bluetooth HCI UART Request-to-Send output No connection O Reserved No connection No connection G Ground No connection G Ground No connection I Bluetooth enable WL1837MODCOM8I WLAN MIMO and Bluetooth® Module Evaluation Board SWRU382D – JULY 2014 – REVISED FEBRUARY 2022 for TI Sitara™ Platform Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated www.ti.com Board Pin Assignment Table 2-1. Pin Description (continued) No. Name Type Description 92 GND G Ground 93 RESERVED2 I Reserved 94 N.C. 95 GND G Ground 96 GPIO11 I/O General-purpose I/O 97 GND G Ground 98 GPIO12 I/O General-purpose I/O 99 TCXO_CLK_COM 100 GPIO10 No connection I I/O Option to supply 26 MHz externally General-purpose I/O 2.2 Jumper Connections The WL1837MODCOM8I EVB includes the following jumper connections: • • • • J1: Jumper connector for VIO power input J3: Jumper connector for VBAT power input J5: RF connector for 2.4- and 5-GHz WLAN and Bluetooth J6: Second RF connector for 2.4-GHz WLAN 3 Electrical Characteristics For electrical characteristics, see the (WL18xxMOD WiLink™ Single-Band Combo Module – Wi-Fi®, Bluetooth®, and Bluetooth Low Energy (BLE) Data Sheet). 4 Approved Antenna Types and Maximum Gain Values This device is intended only for OEM integrators under the following conditions: • • • The antenna must be installed so that 20 cm is maintained between the antenna and users. The transmitter module cannot be co-located with any other transmitter or antenna. The radio transmitter can operate only using an antenna of a type and maximum (or lesser) gain approved by TI. Table 4-1 lists the antennas approved by TI for use with the radio transmitter along with maximum allowable gain values. Antenna types not included in the list or having a gain greater than the maximum indicated are strictly prohibited for use with this transmitter. Table 4-1. Approved Antenna Types and Maximum Gain Values Brand Ethetronics (2) Antenna Type Model 2.4 GHz 4.9 to 5.9 GHz (1) PCB 1000423 -0.6 dBi 4.5 dBi Pulse Dipole W1039B030 1 dBi 2 dBi LSR Rubber Antenna/Dipole 001-0012 2 dBi 2 dBi 080-0013 2 dBi 2 dBi 080-0014 2 dBi 2 dBi 001-0016 2.5 dBi 3 dBi 001-0021 2.5 dBi 3 dBi CAF94504 2 dBi 4 dBi PIFA Laird PCB CAF94505 2 dBi 4 dBi Pulse Chip W3006 3.2 dBi 4.2 dBi TDK Chip ANT016008 2.4 dBi 3.96 dBi (1) (2) Range is approximate. Not approved for KCC. SWRU382D – JULY 2014 – REVISED FEBRUARY 2022 WL1837MODCOM8I WLAN MIMO and Bluetooth® Module Evaluation Board Submit Document Feedback for TI Sitara™ Platform Copyright © 2022 Texas Instruments Incorporated 7 Antenna Characteristics www.ti.com Note If these conditions cannot be met (for example, with certain laptop configurations or co-location with another transmitter), the FCC/IC authorization will not be considered valid and the FCC ID/IC ID cannot be used on the final product. In these circumstances, the OEM integrator is responsible for reevaluating the end product (including the transmitter) and obtaining a separate FCC/IC authorization. 5 Antenna Characteristics 5.1 VSWR Figure 5-1 shows the antenna VSWR characteristics. Figure 5-1. Antenna VSWR Characteristics 8 WL1837MODCOM8I WLAN MIMO and Bluetooth® Module Evaluation Board SWRU382D – JULY 2014 – REVISED FEBRUARY 2022 for TI Sitara™ Platform Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated www.ti.com Antenna Characteristics 5.2 Efficiency Figure 5-2 shows the antenna efficiency. Figure 5-2. Antenna Efficiency 5.3 Radio Pattern For information on the antenna radio pattern and other related information, see productfinder.pulseeng.com/ product/W3006. SWRU382D – JULY 2014 – REVISED FEBRUARY 2022 WL1837MODCOM8I WLAN MIMO and Bluetooth® Module Evaluation Board Submit Document Feedback for TI Sitara™ Platform Copyright © 2022 Texas Instruments Incorporated 9 Circuit Design www.ti.com 6 Circuit Design 6.1 EVB Reference Schematics Figure 6-1 shows the reference schematics for the EVB. WL_UART_DBG R1 0R 0402 R2 0R 0402 R4 BT_UART_DBG J1 NU_HEADER 1x2 H-1X2_2MM 0R 0402 R3 2 1 BT_EN_SOC TP2 1 TP1 1 C2 10uF 0603 C1 1uF 0402 R32 0R 0603 VBAT_IN 1 TP7 VIO_IN 0R 0402 R31 0R 0603 C3 0.1uF 0402 SLOW_CLK OSC1 1V8 / 32.768kHz OSC-3.2X2.5 SLOW_CLK 2 1 WLAN_EN_SOC 3 R6 0R 0402 2 OUT GND VIO_IN VBAT_IN 1 EN 4 VCC C4 0.1uF 0402 J3 NU_HEADER 1x2 H-1X2_2MM WL_RS232_TX WL_RS232_RX 64 R35 NU 0402 2 R33 0R 0402 VBAT_IN U4 NU_TLV70518 C32 XBGA-N4_0.8X0.8_0.4 NU_0.1uF 0402 B2 B1 VIN VOUT A2 EN GND VIO_CLK A1 34 35 33 GND GND GND 36 37 38 VIO GND EXT_32K 41 39 GND 42 43 46 40 WLAN_EN_SOC BT_EN_SOC BT_UART_DBG WL_UART_DBG GND 47 44 45 GND VBAT GND RESERVED3 GND GND RF_ANT2 RESERVED GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND 1 EXT_CLK_REQ_OUT G19 G20 G21 G22 G23 G24 G25 G26 G27 G28 G29 G30 G31 G32 G33 G34 G35 G36 GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND 63 RESERVED1 GND NC NU 0402 BT_AUD_CLK WLAN_IRQ 1 TCXO_CLK_COM R36 62 R34 NU 0402 GND RF_ANT1 32 31 1 TP8 29 1 TP3 28 1 TP4 30 These two TPs for test mode when WL_IRQ pull high. 0R 0402 R22 0R 0402 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 0R 0402 WL_RS232_TX 33 34 26 R13 0R 0402 WL_RS232_RX 35 36 37 38 39 40 25 1 TP5 24 41 42 RESERVED2 43 44 RESERVED1 45 46 20 47 48 19 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 90 23 22 R17 21 0R 0402 R19 0R 0402 RF_ANT2 18 17 G1 G2 G3 G4 G5 G6 G7 G8 G9 G10 G11 G12 G13 G14 G15 G16 G17 G18 R20 R21 2 3 R12 VIO_IN GPIO9 1 27 R20 for test mode. GPIO11 NU 0402 WLAN_EN_SOC VIO_IN SDIO_CLK_WL SDIO_CMD_WL SDIO_D0_WL SDIO_D1_WL SDIO_D2_WL SDIO_D3_WL R10 0R 0402 WLAN_IRQ BT_AUD_CLK BT_AUD_FSYNC BT_AUD_IN BT_AUD_OUT BT_HCI_TX BT_HCI_RX BT_HCI_CTS BT_HCI_RTS RESERVED1 BT_UART_DBG GPIO9 16 EXT_CLK_REQ_OUT TCXO1 NU_TCXO 26MHz 2.0x1.6x0.73mm 4 3 VCC OUT C15 NU_1uF 0402 61 GND RESERVED2 15 1 TP6 VIO_CLK 60 0R 0402 GPIO_4 GND 14 R18 BT_AUD_FSYNC WL_SDIO_D3 BT_AUD_CLK BT_AUD_OUT WL_SDIO_D2 59 WL_SDIO_D1 58 13 57 0R 0402 12 0R 0402 R16 11 R15 BT_AUD_FSYNC GPIO_2 U1 WL1837MODGI E-13.4X13.3-N100_0.75-TOP BT_AUD_IN WL_SDIO_D0 BT_AUD_OUT GND 10 56 GND 0R 0402 WL_SDIO_CLK R14 GPIO_1 GND BT_AUD_IN GND WL_SDIO_CMD 55 GND 9 54 BT_HCI_RX 8 53 0402 7 0R GND 6 R11 GND BT_HCI_TX GPIO12 BT_HCI_RX BT_HCI_CTS GPIO10 52 GPIO9 51 0R 0402 GPIO11 0R 0402 R9 GND 5 R8 BT_HCI_TX RF_ANT1 BT_HCI_RTS 4 50 0R 0402 3 R7 BT_HCI_CTS 2 BT_HCI_RTS GND GND 49 VBAT GND 48 WL_UART_DBG R5 R23 0R 10k 0402 WLAN_IRQ SDIO_D3_WL 0402 BT_EN_SOC GPIO10 R24 0R 0402 R25 0R 0402 SDIO_D2_WL 89 GPIO12 R26 0R 0402 R27 0R 0402 SDIO_D1_WL 91 92 R29 0R 0402 SDIO_D0_WL 93 94 R30 0R 0402 SDIO_CLK_WL 95 0402 SDIO_CMD_WL 97 98 99 100 R28 0R RESERVED2 TCXO_CLK_COM 96 GPIO11 GPIO12 GPIO10 J2 NU_100pin Micro Edge MEC6 SD-100P ANT1 - WL_2.4_IO2/BT/WL_5GHz ANT2 - WL_2.4_IO1/WL_5GHz C5 0R 0402 RF_ANT1 ANT1 W3006 ANT-10.0X3.2MM_B C13 1pF 0402 1 C7 NU_0R 0402 L2 NU 0402 2 1 3 J5 U.FL-R-SMT(10) U.FL L1 1.3nH 0402 FEED NC 2 C6 0R 0402 RF_ANT2 C14 2.4pF 0402 C8 NU_0R 0402 L4 2.2nH 0402 2 1 3 EDGE CONNECTOR - MALE ANT2 W3006 ANT-10.0X3.2MM_A 1 FEED NC 2 L3 1.8nH 0402 J6 U.FL-R-SMT(10) U.FL Figure 6-1. EVB Reference Schematics 10 WL1837MODCOM8I WLAN MIMO and Bluetooth® Module Evaluation Board SWRU382D – JULY 2014 – REVISED FEBRUARY 2022 for TI Sitara™ Platform Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated www.ti.com Circuit Design 6.2 Bill of Materials (BOM) Table 6-1 lists the BOM for the EVB. Table 6-1. BOM Item Description Part Number Package Reference Qty Mfr 13.4 mm x 13.3 mm x 2.0 mm U1 1 Jorjin 1 TI WL1837 Wi-Fi / Bluetooth module WL1837MODGI 2 XOSC 3225 / 32.768KHZ / 1.8 V / ±50 ppm 7XZ3200005 3.2 mm × 2.5 mm × 1.0 mm OSC1 1 TXC 3 Antenna / Chip / 2.4 and 5 GHz W3006 10.0 mm × 3.2 mm × 1.5 mm ANT1, ANT2 2 Pulse 4 Mini RF header receptacle U.FL-R-SMT-1(10) 3.0 mm × 2.6 mm × 1.25 mm J5, J6 2 Hirose 5 Inductor 0402 / 1.3 nH / ±0.1 nH / SMD LQP15MN1N3B02 0402 L1 1 Murata 6 Inductor 0402 / 1.8 nH / ±0.1 nH / SMD LQP15MN1N8B02 0402 L3 1 Murata 7 Inductor 0402 / 2.2 nH / ±0.1 nH / SMD LQP15MN2N2B02 0402 L4 1 Murata 8 Capacitor 0402 / 1 pF / 50 V / C0G / ±0.1 pF GJM1555C1H1R0BB01 0402 C13 1 Murata 9 Capacitor 0402 / 2.4 pF / 50 V / C0G / ±0.1 pF GJM1555C1H2R4BB01 0402 C14 1 Murata 10 Capacitor 0402 / 0.1 µF / 10 V / X7R / 0402B104K100CT ±10% 0402 C3, C4 2 Walsin 11 Capacitor 0402 / 1 µF / 6.3 V / X5R / ±10% / HF 0402 C1 1 Murata 12 Capacitor 0603 / 10 µF / 6.3 V / X5R / C1608X5R0J106M ±20% 0603 C2 1 TDK 13 Resistor 0402 / 0R / ±5% WR04X000 PTL 0402 R1 to R4, R6 to R19, R21 to R30, R33, C5, C6(1) 31 Walsin 14 Resistor 0402 / 10K / ±5% WR04X103 JTL 0402 R20 1 Walsin 15 Resistor 0603 / 0R / ±5% WR06X000 PTL 0603 R31, R32 2 Walsin (1) GRM155R60J105KE19D C5 and C6 are mounted with a 0-Ω resistor by default. SWRU382D – JULY 2014 – REVISED FEBRUARY 2022 WL1837MODCOM8I WLAN MIMO and Bluetooth® Module Evaluation Board Submit Document Feedback for TI Sitara™ Platform Copyright © 2022 Texas Instruments Incorporated 11 Layout Guidelines www.ti.com 7 Layout Guidelines 7.1 Board Layout Figure 7-1 through Figure 7-4 show the four layers of the WL1837MODCOM8I EVB. Figure 7-1. WL1837MODCOM8I Layer 1 Layout Figure 7-2. WL1837MODCOM8I Layer 2 Layout 12 WL1837MODCOM8I WLAN MIMO and Bluetooth® Module Evaluation Board SWRU382D – JULY 2014 – REVISED FEBRUARY 2022 for TI Sitara™ Platform Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated www.ti.com Layout Guidelines Figure 7-3. WL1837MODCOM8I Layer 3 Layout Figure 7-4. WL1837MODCOM8I Layer 4 Layout SWRU382D – JULY 2014 – REVISED FEBRUARY 2022 WL1837MODCOM8I WLAN MIMO and Bluetooth® Module Evaluation Board Submit Document Feedback for TI Sitara™ Platform Copyright © 2022 Texas Instruments Incorporated 13 Layout Guidelines www.ti.com Figure 7-5 and Figure 7-6 show instances of good layout practices. Figure 7-5. Module Layout Guidelines (Top Layer) Figure 7-6. Module Layout Guidelines (Bottom Layer) Table 7-1 describes the guidelines corresponding to the reference numbers in Figure 7-5 and Figure 7-6. Table 7-1. Module Layout Guidelines Reference 14 Guideline Description 1 Keep the proximity of ground vias close to the pad. 2 Do not run signal traces underneath the module on the layer where the module is mounted. 3 Have a complete ground pour in layer 2 for thermal dissipation. 4 Ensure a solid ground plane and ground vias under the module for stable system and thermal dissipation. 5 Increase ground pour in the first layer and have all traces from the first layer on the inner layers, if possible. 6 Signal traces can be run on a third layer under the solid ground layer and the module mounting layer. WL1837MODCOM8I WLAN MIMO and Bluetooth® Module Evaluation Board SWRU382D – JULY 2014 – REVISED FEBRUARY 2022 for TI Sitara™ Platform Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated www.ti.com Layout Guidelines Figure 7-7 shows the trace design for the PCB. TI recommends using a 50-Ω impedance match on the trace to the antenna and 50-Ω traces for the PCB layout. Figure 7-7. Trace Design for the PCB Layout Figure 7-8 shows layer 1 with the trace to the antenna over ground layer 2. Figure 7-8. Layer 1 Combined With Layer 2 SWRU382D – JULY 2014 – REVISED FEBRUARY 2022 WL1837MODCOM8I WLAN MIMO and Bluetooth® Module Evaluation Board Submit Document Feedback for TI Sitara™ Platform Copyright © 2022 Texas Instruments Incorporated 15 Layout Guidelines www.ti.com Figure 7-9 and Figure 7-10 show instances of good layout practices for the antenna and RF trace routing. Note RF traces must be as short as possible. The antenna, RF traces, and modules must be on the edge of the PCB product. The proximity of the antenna to the enclosure and the enclosure material must also be considered. Figure 7-9. Top Layer – Antenna and RF Trace Routing Layout Guidelines Figure 7-10. Bottom Layer – Antenna and RF Trace Routing Layout Guidelines 16 WL1837MODCOM8I WLAN MIMO and Bluetooth® Module Evaluation Board SWRU382D – JULY 2014 – REVISED FEBRUARY 2022 for TI Sitara™ Platform Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated www.ti.com Layout Guidelines Table 7-2 describes the guidelines corresponding to the reference numbers in Figure 7-9 and Figure 7-10. Table 7-2. Antenna and RF Trace Routing Layout Guidelines Reference Guideline Description 1 The RF trace antenna feed must be as short as possible beyond the ground reference. At this point, the trace starts to radiate. 2 RF trace bends must be gradual with an approximate maximum bend of 45 degrees with trace mitered. RF traces must not have sharp corners. 3 RF traces must have via stitching on the ground plane beside the RF trace on both sides. 4 RF traces must have constant impedance (microstrip transmission line). 5 For best results, the RF trace ground layer must be the ground layer immediately below the RF trace. The ground layer must be solid. 6 There must be no traces or ground under the antenna section. Figure 7-11 shows the MIMO antenna spacing. The distance between ANT1 and ANT2 must be greater than half the wavelength (62.5 mm at 2.4 GHz). Figure 7-11. MIMO Antenna Spacing Follow these supply routing guidelines: • • • • For power supply routing, the power trace for VBAT must be at least 40-mil wide. The 1.8-V trace must be at least 18-mil wide. Make VBAT traces as wide as possible to ensure reduced inductance and trace resistance. If possible, shield VBAT traces with ground above, below, and beside the traces. Follow these digital-signal routing guidelines: • • Route SDIO signal traces (CLK, CMD, D0, D1, D2, and D3) in parallel to each other and as short as possible (less than 12 cm). In addition, each trace must be the same length. Ensure enough space between traces (greater than 1.5 times the trace width or ground) to ensure signal quality, especially for the SDIO_CLK trace. Remember to keep these traces away from the other digital or analog signal traces. TI recommends adding ground shielding around these buses. Digital clock signals (SDIO clock, PCM clock, and so on) are a source of noise. Keep the traces of these signals as short as possible. Whenever possible, maintain a clearance around these signals. SWRU382D – JULY 2014 – REVISED FEBRUARY 2022 WL1837MODCOM8I WLAN MIMO and Bluetooth® Module Evaluation Board Submit Document Feedback for TI Sitara™ Platform Copyright © 2022 Texas Instruments Incorporated 17 Ordering Information www.ti.com 8 Ordering Information Part number: WL1837MODCOM8I 9 Revision History Changes from Revision C (December 2021) to Revision D (February 2022) Page • Updated Section 4 ............................................................................................................................................. 7 18 WL1837MODCOM8I WLAN MIMO and Bluetooth® Module Evaluation Board SWRU382D – JULY 2014 – REVISED FEBRUARY 2022 for TI Sitara™ Platform Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated IMPORTANT NOTICE AND DISCLAIMER TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. 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