XTR
XTR
XTR115
XTR116
116
115
SBOS124A – JANUARY 2000 – REVISED NOVEMBER 2003
4-20mA CURRENT LOOP TRANSMITTERS
FEATURES
APPLICATIONS
● LOW QUIESCENT CURRENT: 200µA
● 5V REGULATOR FOR EXTERNAL CIRCUITS
● VREF FOR SENSOR EXCITATION:
XTR115: 2.5V
XTR116: 4.096V
● LOW SPAN ERROR: 0.05%
● LOW NONLINEARITY ERROR: 0.003%
● WIDE LOOP SUPPLY RANGE: 7.5V to 36V
● SO-8 PACKAGE
● 2-WIRE, 4-20mA CURRENT LOOP
TRANSMITTER
● SMART TRANSMITTER
● INDUSTRIAL PROCESS CONTROL
● TEST SYSTEMS
● COMPATIBLE WITH HART MODEM
● CURRENT AMPLIFIER
● VOLTAGE-TO-CURRENT AMPLIFIER
DESCRIPTION
used for offsetting or to excite transducers. A current
return pin (IRET) senses any current used in external
circuitry to assure an accurate control of the output
current.
The XTR115 is a fundamental building block of
smart sensors using 4-to-20mA current transmission.
The XTR115 and XTR116 are specified for operation over the extended industrial temperature range,
–40°C to +85°C.
The XTR115 and XTR116 are precision current output converters designed to transmit analog 4-to-20mA
signals over an industry standard current loop. They
provide accurate current scaling and output current
limit functions.
The on-chip voltage regulator (5V) can be used to
power external circuitry. A precision on-chip VREF
(2.5V for XTR115 and 4.096V for XTR116) can be
XTR115
XTR116
VREG
+5V
+5V
Regulator
8
VREF
XTR115: 2.5V
XTR116: 4.096V
V+
7
Voltage
Reference
1
VLOOP
RIN
B
6
IIN
2
RL
A1
+
E
5
VIN
–
RLIM
3
IRET
R1
2.475kΩ
R2
25Ω
IO =
100 VIN
RIN
4
I = 100 • IIN
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
Copyright © 2000-2003, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
www.ti.com
SPECIFICATIONS
At TA = +25°C, V+ = 24V, RIN = 20kΩ, and TIP29C external transistor, unless otherwise noted.
XTR115U
XTR116U
PARAMETER
OUTPUT
Output Current Equation
Output Current, Linear Range
Over-Scale Limit
Under-Scale Limit
SPAN
Span (Current Gain)
Error (1)
vs Temperature
Nonlinearity
INPUT
Offset Voltage (Op Amp)
vs Temperature
vs Supply Voltage, V+
Bias Current
vs Temperature
Noise: 0.1Hz to 10Hz
CONDITIONS
IO
ILIM
IMIN
VOS
IREG = 0, IREF = 0
32
0.2
IIN = 250µA to 25mA
TA = –40°C to +85°C
IIN = 250µA to 25mA
100
±0.05
±3
±0.003
MIN
25
✻
TYP
MAX
UNITS
✻
✻
0.25
✻
✻
✻
mA
mA
mA
±0.2
±20
±0.01
✻
✻
✻
✻
±0.4
✻
±0.02
A/A
%
ppm/°C
%
IIN = 40µA
TA = –40°C to +85°C
V+ = 7.5V to 36V
±100
±0.7
±0.1
–35
150
0.6
CLOOP = 0, RL = 0
380
3.2
✻
✻
kHz
mA/µs
2.5
4.096
±0.05
±20
±1
±100
10
16
✻
✻
✻
✻
✻
✻
✻
✻
V
V
%
ppm/°C
ppm/V
ppm/mA
µVp-p
mA
IB
en
IREF = 0
TA = –40°C to +85°C
V+ = 7.5V to 36V
IREF = 0mA to 2.5mA
VREG(2)
Voltage
Voltage Accuracy
vs Temperature
vs Supply Voltage, V+
vs Output Current
Short-Circuit Current
MAX
IO = IIN • 100
S
VREF(2)
XTR115
XTR116
Voltage Accuracy
vs Temperature
vs Supply Voltage, V+
vs Load
Noise: 0.1Hz to 10Hz
Short-Circuit Current
TEMPERATURE RANGE
Specification
Operating
Storage
Thermal Resistance
TYP
0.25
DYNAMIC RESPONSE
Small Signal Bandwidth
Slew Rate
POWER SUPPLY
Specified
Voltage Range
Quiescent Current
Over Temperature, –40°C to +85°C
MIN
XTR115UA
XTR116UA
IREG = 0
TA = –40°C to +85°C
V+ = 7.5V to 36V
±250
±3
±2
✻
✻
✻
✻
✻
✻
±0.25
±35
±10
✻
✻
✻
✻
5
±0.05
±0.1
±0.1
1
See Typical Curves
12
±500
±6
✻
±0.5
±75
✻
✻
µV
µV/°C
µV/V
nA
pA/°C
µVp-p
V
V
mV/°C
mV/V
✻
mA
V+
✻
+24
+7.5
200
240
–40
–55
–55
θJA
150
+36
250
300
✻
+85
+125
+125
✻
✻
✻
✻
✻
✻
✻
✻
✻
V
V
µA
µA
✻
✻
✻
°C
°C
°C
°C/W
✻ Specifications the same as XTR115U and XTR116U.
NOTES: (1) Does not include initial error or TCR of RIN. (2) Voltage measured with respect to IRET pin.
2
XTR115, XTR116
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SBOS124A
ABSOLUTE MAXIMUM RATINGS(1)
PIN CONFIGURATION
Top View
SO-8
VREF
1
8
VREG
IIN
2
7
V+
IRET
3
6
B (Base)
IO
4
5
E (Emitter)
Power Supply, V+ (referenced to IO pin) .......................................... 40V
Input Voltage (referenced to IRET pin) ........................................ 0V to V+
Output Current Limit ............................................................... Continuous
VREG, Short-Circuit .................................................................. Continuous
VREF, Short-Circuit .................................................................. Continuous
Operating Temperature ................................................ –55°C to +125°C
Storage Temperature Range ....................................... –55°C to +125°C
Lead Temperature (soldering, 10s) .............................................. +300°C
Junction Temperature ................................................................... +165°C
NOTE: (1) Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods may degrade
device reliability.
ELECTROSTATIC
DISCHARGE SENSITIVITY
PACKAGE/ORDERING INFORMATION
For the most current package and ordering information, see
the Package Option Addendum located at the end of this
data sheet.
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits
may be more susceptible to damage because very small
parametric changes could cause the device not to meet its
published specifications.
XTR115, XTR116
SBOS124A
www.ti.com
3
TYPICAL PERFORMANCE CURVES
At TA = +25°C, V+ = 24V, RIN = 20kΩ, and TIP29C external transistor, unless otherwise noted.
CURRENT GAIN vs FREQUENCY
QUIESCENT CURRENT vs TEMPERATURE
260
Quiescent Current (µA)
Gain (dB)
40
COUT = 0
RL = 0Ω
30
COUT = 10nF
RL = 250Ω
20
10
240
(V+) = 36V
220
(V+) = 24V
200
(V+) = 7.5V
180
160
10k
1M
100k
–75
–50
–25
Frequency (Hz)
0
25
50
75
100
125
Temperature (°C)
REFERENCE VOLTAGE vs TEMPERATURE
OVER-SCALE CURRENT vs TEMPERATURE
0.1
34
Over-Scale Current (mA)
∆ Reference Voltage (%)
With External Transistor
0
–0.1
–0.2
33
32
V+ = 36V
31
V+ = 7.5V
30
V+ = 24V
29
–0.3
28
–75
–50
–25
0
25
50
75
100
125
–75
Temperature (°C)
–50
–25
0
25
50
75
100
125
Temperature (°C)
VREG VOLTAGE vs VREG CURRENT
5.5
+125°C
VREG Voltage (V)
–55°C
+25°C
–55°C
5.0
+25°C
Sinking
Current
Sourcing
Current
+125°C
4.5
–1
0
1
2
3
4
IREG Current (mA)
4
XTR115, XTR116
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SBOS124A
APPLICATIONS INFORMATION
The XTR115 and XTR116 are identical devices except for
the reference voltage output, pin 1. This voltage is available
for external circuitry and is not used internally. Further
discussions that apply to both devices will refer to the
“XTR115/6.”
Figure 1 shows basic circuit connections with representative
simplified input circuitry. The XTR115/6 is a two-wire
current transmitter. Its input signal (pin 2) controls the output
current. A portion of this current flows into the V+ power
supply, pin 7. The remaining current flows in Q1. External
input circuitry connected to the XTR115/6 can be powered
from VREG or VREF. Current drawn from these terminals
must be returned to IRET, pin 3. This IRET pin is a “local
ground” for input circuitry driving the XTR115/6.
The XTR115/6 is a current-input device with a gain of 100.
A current flowing into pin 2 produces IO = 100 • IIN. The
input voltage at the IIN pin is zero (referred to the IRET pin).
A voltage input is created with an external input resistor, as
shown. Common full-scale input voltages range from 1V
and upward. Full-scale inputs greater than 0.5V are recommend to minimize the effect of offset voltage and drift of A1.
EXTERNAL TRANSISTOR
The external transistor, Q1, conducts the majority of the fullscale output current. Power dissipation in this transistor can
approach 0.8W with high loop voltage (40V) and 20mA
output current. The XTR115/6 is designed to use an external
transistor to avoid on-chip thermal-induced errors. Heat
produced by Q1 will still cause ambient temperature changes
that can affect the XTR115/6. To minimize these effects,
locate Q1 away from sensitive analog circuitry, including
XTR115/6. Mount Q1 so that heat is conducted to the
outside of the transducer housing.
The XTR115/6 is designed to use virtually any NPN transistor with sufficient voltage, current and power rating. Case
style and thermal mounting considerations often influence
the choice for any given application. Several possible choices
are listed in Figure 1. A MOSFET transistor will not improve
the accuracy of the XTR115/6 and is not recommended.
XTR115
XTR116
IREG
5V
XTR115: 2.5V
XTR116: 4.096V
IO
VREG
+5V
Regulator
8
IREF
VREF(1)
V+
7
Voltage
Reference
1
VLOOP
Input
Circuitry
VIN
RIN
20kΩ
IIN
B
IIN
6
2
Q1
10nF
RL
A1
E
5
RLIM
3
All return current
from IREG and IREF
IRET
R1
2.475kΩ
R2
25Ω
IO
4
I = 100 • IIN
For IO = 4mA to 20mA
IIN = 40µA to 200µA
With RIN = 20kΩ
VIN = 0.8V to 4V
NOTE: (1) See also Figure 5.
Possible choices for Q1 (see text).
TYPE
PACKAGE
2N4922
TIP29C
TIP31B
TO-225
TO-220
TO-220
FIGURE 1. Basic Circuit Connections.
XTR115, XTR116
SBOS124A
www.ti.com
5
MINIMUM-SCALE CURRENT
The quiescent current of the XTR115/6 (typically 200µA)
is the lower limit of its output current. Zero input current
(IIN = 0) will produce an IO equal to the quiescent current.
Output current will not begin to increase until IIN > IQ /100.
Current drawn from VREF or VREG will add to this minimum
output current. This means that more than 3.7mA is available to power external circuitry while still allowing the
output current to go below 4mA.
OFFSETTING THE INPUT
A low scale of 4mA is produced by creating a 40µA input
current. This can be created with the proper value resistor
from VREF (Figure 2), or by generating offset in the input
drive circuitry.
MAXIMUM OUTPUT CURRENT
The XTR115/6 provides accurate, linear output up to 25mA.
Internal circuitry limits the output current to approximately
32mA to protect the transmitter and loop power/measurement circuitry.
It is possible to extend the output current range of the
XTR115/6 by connecting an external resistor from pin 3 to
pin 5, to change the current limit value. Since all output
current must flow through internal resistors, it is possible to
damage with excessive current. Output currents greater than
45mA may cause permanent damage.
VREG
XTR115
XTR116
VREF
RIN
VO
D/A
XTR115
VREG
VREG
VREF
Voltage
Reference
40µA
XTR115
XTR116
VREF
R0
62.5kΩ
Digital
Control
IIN
IO
D/A
≈
2.5V
Optical
Isolation
IIN
IRET
A1
0 to 160µA
IRET
R1
2.475kΩ
Digital
Control
≈
5V
µC
PWM
Out
VREG
Filter
XTR115
XTR116
RIN
Optical
Isolation
IRET
FIGURE 2. Creating Low-Scale Offset.
6
FIGURE 3. Digital Control Methods.
XTR115, XTR116
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SBOS124A
REVERSE-VOLTAGE PROTECTION
The XTR115/6 low compliance voltage rating (7.5V) permits the use of various voltage protection methods without
compromising operating range. Figure 4 shows a diode
bridge circuit which allows normal operation even when the
voltage connection lines are reversed. The bridge causes a
two diode drop (approximately 1.4V) loss in loop supply
voltage. This results in a compliance voltage of approximately 9V—satisfactory for most applications. A diode can
be inserted in series with the loop supply voltage and the V+
pin to protect against reverse output connection lines with
only a 0.7V loss in loop supply voltage.
OVER-VOLTAGE SURGE PROTECTION
Remote connections to current transmitters can sometimes be
subjected to voltage surges. It is prudent to limit the maximum
surge voltage applied to the XTR115/6 to as low as practical.
Various zener diode and surge clamping diodes are specially
designed for this purpose. Select a clamp diode with as low a
voltage rating as possible for best protection. For example, a
36V protection diode will assure proper transmitter operation
at normal loop voltages, yet will provide an appropriate level
of protection against voltage surges. Characterization tests on
several production lots showed no damage with loop supply
voltages up to 65V.
8
V+
VREG
1
RIN
2
RADIO FREQUENCY INTERFERENCE
The long wire lengths of current loops invite radio frequency
interference. RF can be rectified by the input circuitry of the
XTR115/6 or preceding circuitry. This generally appears as
an unstable output current that varies with the position of
loop supply or input wiring.
Interference may also enter at the input terminals. For
integrated transmitter assemblies with short connection to
the sensor, the interference more likely comes from the
current loop connections.
Maximum VPS must be
less than minimum
voltage rating of zener
diode.
7
VREF
IIN
VIN
XTR115
XTR116
B
E
3
Most surge protection zener diodes have a diode characteristic in the forward direction that will conduct excessive
current, possibly damaging receiving-side circuitry if the
loop connections are reversed. If a surge protection diode is
used, a series diode or diode bridge should be used for
protection against reversed connections.
IRET
IO
6
Q1
0.01µF
D1(1)
1N4148
Diodes
RL
5
VPS
The diode bridge causes
a 1.4V loss in loop supply
voltage.
4
NOTE: (1) Zener Diode 36V: 1N4753A or Motorola
P6KE39A. Use lower voltage zener diodes with loop
power supply voltages less than 30V for increased
protection. See “Over-Voltage Surge Protection.”
FIGURE 4. Reverse Voltage Operation and Over-Voltage Surge Protection.
XTR115, XTR116
SBOS124A
www.ti.com
7
If capacitive loading must be placed on the VREF pin, one of the compensation schemes shown below must be used to ensure stable operation.
Values of capacitance must remain within the given ranges.
RISO(1)
10Ω
ILOAD
(0-2.5mA)
+
CHF
(10pF to 0.5µF)
XTR115
XTR116
IO
VREG
+5V
Regulator
8
CLF
(2.2µF to 22µF)
VREF
V+
7
Voltage
Reference
1
VLOOP
OR
B
IIN
6
2
+
ILOAD
(0-2.5mA)
CHF
(10pF to 0.5µF)
CLF(1)
(2.2µF to 22µF)
E
5
RLIM
3
IRET
RCOMP(1)
50Ω
RL
A1
R1
2.475kΩ
R2
25Ω
IO =
100 VIN
RIN
4
I = 100 • IIN
NOTE: (1) Required compensation components.
FIGURE 5. Stable Operation with Capacitive Load on VREF.
8
XTR115, XTR116
www.ti.com
SBOS124A
PACKAGE OPTION ADDENDUM
www.ti.com
14-Oct-2022
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
Samples
(4/5)
(6)
XTR115U
ACTIVE
SOIC
D
8
75
RoHS & Green
Call TI
Level-3-260C-168 HR
-40 to 85
XTR
115U
Samples
XTR115U/2K5
ACTIVE
SOIC
D
8
2500
RoHS & Green
Call TI
Level-3-260C-168 HR
-40 to 85
XTR
115U
Samples
XTR115UA
ACTIVE
SOIC
D
8
75
RoHS & Green
NIPDAU
Level-3-260C-168 HR
-40 to 85
XTR
115U
A
XTR115UA/2K5
ACTIVE
SOIC
D
8
2500
RoHS & Green
NIPDAU
Level-3-260C-168 HR
-40 to 85
XTR
115U
A
XTR116U
ACTIVE
SOIC
D
8
75
RoHS & Green
Call TI
Level-3-260C-168 HR
-40 to 85
XTR
116U
Samples
XTR116U/2K5
ACTIVE
SOIC
D
8
2500
RoHS & Green
Call TI
Level-3-260C-168 HR
-40 to 85
XTR
116U
Samples
XTR116UA
ACTIVE
SOIC
D
8
75
RoHS & Green
Call TI
Level-3-260C-168 HR
-40 to 85
XTR
116U
A
XTR116UA/2K5
ACTIVE
SOIC
D
8
2500
RoHS & Green
NIPDAU
Level-3-260C-168 HR
-40 to 85
XTR
116U
A
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of