WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD
www.ti.com
SWRS152F – JULY 2013 – REVISED OCTOBER 2013
WiLink™8 Single-Band Combo Module – Wi-Fi®, Bluetooth® and Bluetooth Low Energy
(BLE), Product Preview Rev. 1.0
Check for Samples: WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD
1.1
Features
• General
– WLAN With Integrated RF Front-End Module
(FEM), Power Amplifier (PA), Crystal, RF
Switches, Filters, Passives, and Power
Management on a Single Module
– Efficient Direct Connection to Battery by
Employing Several Integrated Switched
Mode Power Supplies (DC-DC)
– Dual-Mode Bluetooth and Bluetooth Low
Energy (WL183xMOD Only)
– FCC, IC, and CE Certified With Chip Antenna
– Seamless Integration With TI Sitara™
– Hardware Design Files and Design Guide
Available from TI (COM8)
– HCI Transport for Bluetooth over UART and
SDIO for WLAN
– Temperature Compensation Mechanism to
Ensure Minimal Variation in RF Performance
Over the Entire Temperature Range
– Operating Temperature: –20°C to 70°C
– Small Form Factor: 13.4 × 13.3 × 2 mm
– Land Grid Array (LGA) Package
• Wi-Fi
– WLAN Baseband Processor and RF
Transceiver Supporting IEEE Std 802.11b,
802.11g, and 802.11n
– 2.4-GHz MRC Support for Extended Range
– Fully Calibrated System; Production
Calibration not Required
– Supports 4-Bit SDIO Host Interface,
Including High-Speed (HS) and V3 Modes
– 2x2 MIMO and 40-MHz Channels for High
Throughput
– Wi-Fi Direct Concurrent Operation (MultiChannel, Multi-Role)
– SmartConfig™ technology
space
space
1234567
space
• Bluetooth-BLE (WL183xMOD Only)
– Support of Bluetooth 4.0 as well as CSA2
– Includes Concurrent Operation and Built-In
Coexisting and Prioritization Handling of
Bluetooth-BLE and WLAN
– Dedicated Audio Processor Supporting SBC
Encoding + A2DP
– Royalty-Free Certified Stack From
StoneStreet One
• Key Benefits
– Reduces Design Overhead: Single WiLink8
Module Scales Across Wi-Fi and Bluetooth
(WL183xMOD)
– Bluetooth 4.0 + BLE
– Up to 100-Mbps Throughput and Up to 1.4X
the Range Versus a Single Antenna
Configuration With 2X2 MIMO, 40-MHz
Channel Bandwidth and MRC
– Differentiated Use-Cases by Configuring
WiLink 8 in Two Different Roles (STA and
AP) Simultaneously to Connect Directly With
Other Wi-Fi Devices on Different RF Channel
(Wi-Fi Networks)
– SmartConfig technology, a One-Step Wi-Fi
Setup Process That Allows Multiple In-Home
Devices, Especially Those Without Displays
or Keypads, to Connect to the Wi-Fi Network
Quickly and Easily.
– Lowest Wi-Fi Power Consumption in
Connected Idle (< 800 uA)
– Configurable Wake on WLAN Filters to Only
Wake Up the System
– Wi-Fi-Bluetooth Single Antenna Coexistence
– Available as Easy to Use FCC, ETSI, and
Telec Certified Module
– Lower Manufacturing Costs, Saving Board
Space and Minimizing RF Expertise
– AM335x Linux® and Android™ Reference
Platform Accelerates Customer Development
and Time to Market
1
2
3
4
5
6
7
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
WiLink, Sitara, SmartConfig are trademarks of Texas Instruments.
ARM is a registered trademark of ARM Physical IP, Inc.
Bluetooth is a registered trademark of Bluetooth SIG, Inc..
Android is a trademark of Google Inc.
Linux is a registered trademark of Linus Torvalds.
Wi-Fi is a registered trademark of Wi-Fi Alliance.
PRODUCT PREVIEW information concerns products in the formative or design phase of
development. Characteristic data and other specifications are design goals. Texas
Instruments reserves the right to change or discontinue these products without notice.
Copyright © 2013, Texas Instruments Incorporated
PRODUCT PREVIEW
1 TI Module Summary
WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD
SWRS152F – JULY 2013 – REVISED OCTOBER 2013
1.2
•
•
•
•
www.ti.com
Applications
•
•
•
•
Internet of Things
Multimedia
Home Electronics
Home Appliances and White Goods
1.3
Industrial and Home Automation
Smart Gateway and Metering
Video Conferencing
Video Camera and Security
Description
Easily add Wi-Fi and Bluetooth (WL183x module only) to embedded applications based on TI's Sitara
microprocessors. TI’s WiLink 8 modules are pre-certified and offer high throughput and extended range
along with Wi-Fi and Bluetooth coexistence (WL183x modules only) in a power-optimized design. Drivers
for the Linux and Android high-level operating systems (HLOSs) are available free of charge from TI for
the Sitara AM335x microprocessor (Linux and Android version restrictions apply).
Table 1-1. TI WiLink8 Module Device Variants
PRODUCT PREVIEW
(1)
Device
WLAN 2.4-GHz
SISO (1)
WLAN 2.4-GHz
MIMO (1)
WLAN 2.4-GHz
MRC (1)
Bluetooth
WL1835MOD
√
√
√
√
WL1831MOD
√
WL1805MOD
√
√
√
WL1801MOD
√
√
SISO: single input, single output; MIMO: multiple input, multiple output; MRC: maximum ratio combining.
Table 1-2 lists the WLAN performance parameters.
Table 1-2. WLAN Performance Parameters
WLAN
Maximum TX power
(1)
Minimum TX sensitivity (1)
Specification
Conditions
18.1 dBm
1 Mbps DSSS
–97.1 dBm
1 Mbps DSSS
Sleep current
154 µA
Leakage, firmware retained
Connected IDLE
712 µA
No traffic IDLE connect
RX search
48 mA
Search (SISO20)
RX current (SISO20)
67 mA
MCS7, 2.4 GHz
TX current (SISO20)
238 mA
MCS7, 2.4 GHz, +13.7 dBm
(1)
All RF measurements are preliminary data sheet product preview and can be revised at the module CZ end.
space
Table 1-3 lists the Bluetooth performance parameters.
Table 1-3. Bluetooth Performance Parameters
Bluetooth
Specification
Conditions
Maximum TX power (1)
13.5 dBm
GFSK
Minimum TX sensitivity (1)
–93 dBm
GFSK
Sniff
178 µA
1 attempt, 1.28 s (+4 dBm)
Page or inquiry
253 µA
1.28-s interrupt, 11.25-ms scan window (+4 dBm)
A2DP
7.5 mA
MP3 high quality 192 kbps (+4 dBm)
(1)
All RF measurements are preliminary data sheet product preview and can be revised at the module CZ end.
space
2
TI Module Summary
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1.4
SWRS152F – JULY 2013 – REVISED OCTOBER 2013
Functional Block Diagram
PRODUCT PREVIEW
Figure 1-1 shows a high-level view of the WL1835 module. The flexibility of the device enables easy
integration with various host-system topologies. For more information on TI’s wireless platform solutions,
go to the TI Wiki.
Figure 1-1. WL1835 High-Level System Diagram
Figure 1-2 shows the WL1835 functional block diagram.
Figure 1-2. WL1835 Functional Block Diagram
space
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TI Module Summary
3
WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD
SWRS152F – JULY 2013 – REVISED OCTOBER 2013
www.ti.com
.................................... 1
............................................. 1
1.2
Applications .......................................... 2
1.3
Description ........................................... 2
1.4
Functional Block Diagram ........................... 3
Revision History .............................................. 4
2 Features ................................................... 5
2.1
WLAN ................................................ 5
2.2
Bluetooth ............................................. 5
2.3
BLE .................................................. 5
3 Package Information ................................... 6
3.1
Module Outline ....................................... 6
3.2
Pin Description ....................................... 7
4 Module Specifications ................................ 11
4.1
General Requirements and Operation ............. 11
4.2
Absolute Maximum Ratings ........................ 11
4.3
Recommended Operating Conditions .............. 11
4.4
External Digital Slow Clock Requirements ......... 12
4.5
WLAN Performance ................................ 13
4.6
WLAN 2.4-GHz Receiver Characteristics .......... 13
4.7
WLAN 2.4-GHz Transmitter Power ................. 14
4.8
WLAN Currents ..................................... 15
4.9
Bluetooth Performance ............................. 15
1
........................
......
Bluetooth BR, EDR Transceiver – Spurs ...........
Bluetooth EDR Transceiver – Spurs ...............
Bluetooth LE Performance .........................
TI Module Summary
4.16
Bluetooth Modulation, EDR
18
1.1
4.17
Bluetooth BR, EDR Transceiver – Emissions
18
Features
PRODUCT PREVIEW
4.10
4.11
4.12
Bluetooth BR, EDR Receiver Characteristics—InBand Signals ....................................... 15
Bluetooth Receiver Characteristics – General
Blocking ............................................ 16
Bluetooth Receiver Characteristics – BR, EDR
Blocking per Band .................................. 17
..........................
........................
..........................
4.13
Bluetooth Transmitter, BR
4.14
Bluetooth Transmitter, EDR
17
17
4.15
Bluetooth Modulation, BR
18
4.18
4.19
4.20
4.21
4.22
5
..........
...........
4.25 Bluetooth-BLE Dynamic Currents ..................
4.26 Bluetooth LE Currents ..............................
4.27 Shutdown and Sleep Currents .....................
Host Interface Timing Characteristics ............
5.1
WLAN SDIO Transport Layer ......................
Bluetooth LE Transmitter Characteristics
4.24
Bluetooth LE Modulation Characteristics
5.3
6
7
8
20
Bluetooth LE Receiver Characteristics – In-Band
Signals .............................................. 20
Bluetooth LE Receiver Characteristics – General
Blocking ............................................. 20
4.23
5.2
19
19
21
21
21
22
22
22
22
HCI UART Shared Transport Layers for All
Functional Blocks (Except WLAN) ................. 25
Bluetooth Codec-PCM (Audio) Timing
Specifications ....................................... 26
....................
...........................
6.2
WLAN Power-Up Sequence ........................
6.3
Bluetooth-BLE Power-Up Sequence ...............
Reference Schematics and Bill of Materials .....
7.1
TI Module Reference Design .......................
7.2
Bill of Materials .....................................
Design Recommendations ..........................
Clocks and Power Management
28
6.1
28
Reset-Power-Up System
8.1
RF Trace and Antenna Layout Recommendations
8.2
Module Layout Recommendations
.................
28
28
29
29
29
30
30
30
9 Mechanical Information .............................. 31
10 Packaging Information ............................... 32
Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision E (September 2013) to Revision F
•
4
Deleted reference to IEEE Std 802.1x compliance
Contents
Page
..............................................................................
5
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SWRS152F – JULY 2013 – REVISED OCTOBER 2013
2 Features
WLAN
The device supports the following WLAN features:
• Integrated 2.4-GHz power amplifiers (PAs) for a complete WLAN solution
• Baseband processor: IEEE Std 802.11b/g data rates and IEEE Std 802.11n data rates with 20- or 40MHz SISO and 20-MHz MIMO
• Fully calibrated system (production calibration not required)
• Medium access controller (MAC)
– Embedded ARM® central processing unit (CPU)
– Hardware-based encryption-decryption using 64-, 128-, and 256-bit WEP, TKIP, or AES keys
– Requirements for Wi-Fi-protected access (WPA and WPA2.0) and IEEE Std 802.11i (includes
hardware-accelerated Advanced Encryption Standard [AES])
• New advanced coexistence scheme with Bluetooth-BLE
• 2.4-GHz radio
– Internal LNA and PA
– IEEE Std 802.11b, 802.11g, and 802.11n
• 4-bit SDIO host interface, including high speed (HS) and V3 modes
2.2
Bluetooth
The device supports the following Bluetooth features:
• Bluetooth 4.0 as well as CSA2
• Concurrent operation and built-in coexisting and prioritization handling of Bluetooth, BLE, audio
processing, and WLAN
• Dedicated audio processor supporting on-chip SBC encoding + A2DP
– Assisted A2DP (A3DP): SBC encoding implemented internally
– Assisted WB-speech (AWBS): modified SBC codec implemented internally
2.3
BLE
The device supports the following BLE features:
• Bluetooth 4.0 BLE dual-mode standard
• All roles and role combinations, mandatory as well as optional
• Up to 10 BLE connections
• Independent buffering for LE allowing a large number of multiple connections without affecting BREDR performance
Copyright © 2013, Texas Instruments Incorporated
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Features
5
PRODUCT PREVIEW
2.1
WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD
SWRS152F – JULY 2013 – REVISED OCTOBER 2013
www.ti.com
3 Package Information
3.1
Module Outline
Figure 3-1 shows the device outline.
PRODUCT PREVIEW
Figure 3-1. Module Outline
6
Package Information
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www.ti.com
3.2
SWRS152F – JULY 2013 – REVISED OCTOBER 2013
Pin Description
PRODUCT PREVIEW
Figure 3-2 shows the device pin designations.
3
Figure 3-2. Pin Designations
Table 3-1 describes the device pins.
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Package Information
7
WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD
SWRS152F – JULY 2013 – REVISED OCTOBER 2013
www.ti.com
Table 3-1. Pin Description
WL183x Pin Name
Pin
Type/
Dir
Shutdown
State
After
Power
Up (1)
Voltage
Level
Connectivity (2)
Description
1801
1805
1831
1835
–
v
v
v
v
PRODUCT PREVIEW
GND
1
GND
GPIO11
2
I/O
PU
PU
–
v
v
v
v
Reserved for future
use. NC if not used.
GPIO9
3
I/O
PU
PU
–
v
v
v
v
Reserved for future
use. NC if not used.
GPIO10
4
I/O
PU
PU
–
v
v
v
v
Reserved for future
use. NC if not used.
GPIO12
5
I/O
PU
PU
–
v
v
v
v
Reserved for future
use. NC if not used.
WL_SDIO_CMD_1V8
6
IN
Hi-Z
Hi-Z
1.8 V
v
v
v
v
WLAN SDIO
command in (3)
GND
7
GND
–
v
v
v
v
WL_SDIO_CLK_1V8
8
IN
1.8 V
v
v
v
v
GND
9
GND
–
v
v
v
v
WL_SDIO_D0_1V8
10
IO
Hi-Z
Hi-Z
1.8 V
v
v
v
v
WLAN SDIO data bit
0 (3)
WL_SDIO_D1_1V8
11
IO
Hi-Z
Hi-Z
1.8 V
v
v
v
v
WLAN SDIO data bit
1 (3)
WL_SDIO_D2_1V8
12
IO
Hi-Z
Hi-Z
1.8 V
v
v
v
v
WLAN SDIO data bit
2 (3)
WL_SDIO_D3_1V8
13
IO
Hi-Z
PU
1.8 V
v
v
v
v
WLAN SDIO data bit
3. Changes state to
PU at WL_EN or
BT_EN assertion for
card detects. Later
disabled by software
during initialization.
(1)
WL_IRQ_1V8
14
OUT
PD
0
1.8 V
v
v
v
v
SDIO available,
interrupt out. Active
high. (For
WL_RS232_TX/RX
pull up is at power
up.)
GND
15
GND
–
v
v
v
v
GND
16
GND
–
v
v
v
v
GND
17
GND
–
v
v
v
v
2G4_ANT2_W
18
ANA
–
x
v
x
v
GND
19
GND
–
v
v
v
v
GND
20
GND
–
v
v
v
v
RESERVED1
21
In
PD
PD
–
x
x
x
x
Reserved for future
use. NC if not used.
RESERVED2
22
In
PD
PD
–
x
x
x
x
Reserved for future
use. NC if not used.
GND
23
GND
–
v
v
v
v
GND
24
GND
–
v
v
v
v
GPIO_4
25
I/O
–
v
v
v
v
(1)
(2)
(3)
8
Hi-Z
PD
Hi-Z
PD
WLAN SDIO clock.
Must be driven by the
host.
2.4G ant2 TX, RX
Reserved for future
use. NC if not used.
PU = pull up; PD = pull down.
v = connect; x = no connect.
Host must provide PU using a 10-K resistor for all non-CLK SDIO signals.
Package Information
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SWRS152F – JULY 2013 – REVISED OCTOBER 2013
Table 3-1. Pin Description (continued)
WL183x Pin Name
Pin
Type/
Dir
Shutdown
State
After
Power
Up (1)
Voltage
Level
Connectivity (2)
Description
1801
1805
1831
1835
GPIO_2
26
I/O
PD
PD
–
v
v
v
v
WL_RS232_RX
(when IRQ_WL = 1 at
power up)
GPIO_1
27
I/O
PD
PD
–
v
v
v
v
WL_RS232_TX
(when IRQ_WL = 1 at
power up)
GND
28
GND
–
v
v
v
v
GND
29
GND
–
v
v
v
v
GND
30
GND
–
v
v
v
v
GND
31
GND
–
v
v
v
v
2G4_ANT1_WB
32
ANA
–
v
v
v
v
GND
33
GND
–
v
v
v
v
GND
34
GND
–
v
v
v
v
GND
35
GND
–
v
v
v
v
EXT_32K
36
ANA
–
v
v
v
v
GND
37
GND
VIO_IN
38
POW
GND
39
GND
WLAN_EN
40
In
PD
BT_EN
41
In
WL_UART_DBG
42
BT_UART_DBG
43
GND
44
GND
45
VBAT_IN
2.4G ant1 TX, RX
PRODUCT PREVIEW
Input sleep clock:
32.768 kHz
–
v
v
v
v
1.8 V
v
v
v
v
–
v
v
v
v
PD
–
v
v
v
v
Mode setting: high =
enable
PD
PD
–
x
x
v
v
Mode setting: high =
enable
Out
PU
PU
–
v
v
v
v
Option: WLAN logger
Out
PU
PU
–
x
x
v
v
Option: Bluetooth
logger
GND
–
v
v
v
v
GND
–
v
v
v
v
46
POW
VBAT
v
v
v
v
Power supply input,
2.9 to 4.8 V
VBAT_IN
47
POW
VBAT
v
v
v
v
Power supply input,
2.9 to 4.8 V
GND
48
GND
–
v
v
v
v
GND
49
GND
–
v
v
v
v
BT_HCI_RTS_1V8
50
Out
PU
PU
1.8 V
x
x
v
v
UART RTS to host.
NC if not used.
BT_HCI_CTS_1V8
51
In
PU
PU
1.8 V
x
x
v
v
UART CTS from
host. NC if not used.
BT_HCI_TX_1V8
52
Out
PU
PU
1.8 V
x
x
v
v
UART TX to host. NC
if not used.
BT_HCI_RX_1V8
53
In
PU
PU
1.8 V
x
x
v
v
UART RX from host.
NC if not used.
GND
54
GND
–
v
v
v
v
GND
55
GND
–
v
v
v
v
BT_AUD_IN
56
In
PD
PD
1.8 V
x
x
v
v
Bluetooth PCM/I2S
bus. Data in. NC if
not used.
BT_AUD_OUT
57
Out
PD
PD
1.8 V
x
x
v
v
Bluetooth PCM/I2S
bus. Data out. NC if
not used.
PD
PD
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Connect to 1.8-V
external VIO
Package Information
9
WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD
SWRS152F – JULY 2013 – REVISED OCTOBER 2013
www.ti.com
Table 3-1. Pin Description (continued)
WL183x Pin Name
Pin
Type/
Dir
Shutdown
State
After
Power
Up (1)
Voltage
Level
PD
PD
PD
PD
PD
PD
Connectivity (2)
Description
1801
1805
1831
1835
1.8 V
x
x
v
v
–
v
v
v
v
1.8 V
x
x
v
v
–
v
v
v
v
1.8 V
x
x
x
x
BT_AUD_FSYNC
58
Out
GND
59
GND
BT_AUD_CLK
60
Out
GND
61
GND
RESERVED3
62
Out
GND
63
GND
–
v
v
v
v
GND
64
GND
–
v
v
v
v
GND
G1G36
GND
–
v
v
v
v
Bluetooth PCM/I2S
bus. Frame sync. NC
if not used.
Bluetooth PCM/I2S
bus. NC if not used.
Reserved for future
use. NC if not used.
PRODUCT PREVIEW
10
Package Information
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SWRS152F – JULY 2013 – REVISED OCTOBER 2013
4 Module Specifications
4.1
General Requirements and Operation
All specifications are over temperature and process, unless indicated otherwise.
Absolute Maximum Ratings (1)
4.2
over operating free-air temperature range (unless otherwise noted)
Value
VBAT
–0.5 to 5.5
Unit
(2)
V
VIO
–0.5 to 2.1
V
Input voltage to analog pins
–0.5 to 2.1
V
Input voltage limits (CLK_IN)
–0.5 to VDD_IO
V
Input voltage to all other pins
–0.5 to (VDD_IO + 0.5 V)
V
–20 to +70 (3)
°C
–55 to +125
°C
>1000
V
>250
V
Operating ambient temperature range
Storage temperature range
ESD stress voltage
(4)
Human body model
(5)
Charged device model (6)
(1)
(2)
(3)
(4)
(5)
(6)
4.3
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under “operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
5.5 V up to 10 s cumulative in 7 years, 5 V cumulative to 250 s, 4.8 V cumulative to 2.33 years - all include charging dips and peaks.
Operating free-air temperature range. The device can be reliably operated for 7 years at ambient of 70°C, assuming 25% active mode
and 75% sleep mode (15,400 cumulative active power-on hours).
Electrostatic discharge (ESD) to measure device sensitivity/immunity to damage caused by electrostatic discharges into device.
Level listed is the passing level per ANSI/ESDA/JEDEC JS-001. JEDEC document JEP155 states that 500 V HBM allows safe
manufacturing with a standard ESD control process, and manufacturing with less than 500 V HBM is possible if necessary precautions
are taken. Pins listed as 1000 V may actually have higher performance.
Level listed is the passing level per EIA-JEDEC JESD22-C101E. JEDEC document JEP157 states that 250 V CDM allows safe
manufacturing with a standard ESD control process, and manufacturing with less than 250V CDM is possible if necessary precautions
are taken. Pins listed as 250 V may actually have higher performance.
Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
Parameter
Condition
VBAT (1)
Sym
DC supply range for all modes
1.8-V I/O ring power supply voltage
Min
Max
Unit
2.9
4.8
V
1.62
1.95
V
I/O high-level input voltage
VIH
0.65 x VDD_IO
VDD_IO
V
I/O low-level input voltage
VIL
0
0.35 x VDD_IO
V
VIH_EN
1.365
VDD_IO
V
Enable inputs high-level input voltage
Enable inputs low-level input voltage
High-level output voltage
VIL_EN
0
0.4
V
VOH
VDD_IO –0.45
VDD_IO
V
@ 1 mA
VDD_IO –0.112
VDD_IO
V
@ 0.3 mA
VDD_IO –0.033
VDD_IO
V
@ 4 mA
Low-level output voltage
@ 4 mA
0
0.45
V
@ 1 mA
0
0.112
V
@ 0.09 mA
0
0.01
V
1
10
ns
5.3
ns
Input transitions time Tr,Tf from 10% to
90% (digital I/O) (2)
Output rise time from 10% to 90% (digital
pins) (2)
(1)
(2)
VOL
Tr,Tf
CL < 25 pF
Tr
4.8 V is applicable only for 2.3 years (30% of the time). Otherwise, maximum VBAT must not exceed 4.3 V.
Applies to all digital lines except SDIO, UART, I2C, PCM and slow clock lines
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PRODUCT PREVIEW
Parameter
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SWRS152F – JULY 2013 – REVISED OCTOBER 2013
www.ti.com
Recommended Operating Conditions (continued)
over operating free-air temperature range (unless otherwise noted)
Parameter
Condition
Output fall time from 10% to 90% (digital
pins) (2)
Sym
Max
Unit
4.9
ns
85
ºC
WLAN operation
2.8
W
Bluetooth operation
0.2
W
CL < 25 pF
Ambient operating temperature
–40
Maximum power dissipation
4.4
Min
Tf
External Digital Slow Clock Requirements
The supported digital slow clock is 32.768 kHz digital. All core functions share a single input.
Parameter
Condition
Sym
Min
Input slow clock frequency
Input slow clock accuracy (Initial +
temp + aging)
WLAN
Input transition time Tr,Tf (10% to
90%)
Tr,Tf
Frequency input duty cycle
PRODUCT PREVIEW
Input voltage limits
Input impedance
Typ
15
Square wave, DCcoupled
50
Module Specifications
Unit
Hz
±250
ppm
100
%
85
%
Vih
0.65 x VDD_IO
VDD_IO
Vpeak
Vil
0
0.35 x VDD_IO
1
MΩ
Input capacitance
12
Max
32768
5
pF
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4.5
SWRS152F – JULY 2013 – REVISED OCTOBER 2013
WLAN Performance
All RF measurements refer to module output (preliminary data sheet product preview and can be revised at
module CZ end).
4.6
WLAN 2.4-GHz Receiver Characteristics
over operating free-air temperature range (unless otherwise noted)
Condition
Min
Typ
2400 to 2480
Sensitivity: 20-MHz bandwidth. At < 10%
PER limit
1 Mbps DSSS
–97.1
2 Mbps DSSS
–94.0
5.5 Mbps CCK
–91.4
11 Mbps CCK
–88.7
6 Mbps OFDM
–92.8
9 Mbps OFDM
–91.2
12 Mbps OFDM
–90.3
18 Mbps OFDM
–88.0
24 Mbps OFDM
–84.9
36 Mbps OFDM
–81.5
48 Mbps OFDM
–77.3
54 Mbps OFDM
–75.7
MCS0 MM 4K
–91.2
MCS1 MM 4K
–88.4
MCS2 MM 4K
–86.7
MCS3 MM 4K
–83.6
MCS4 MM 4K
–80.2
MCS5 MM 4K
–76.0
MCS6 MM 4K
–74.3
MCS7 MM 4K
–73.2
Adjacent channel rejection: Sensitivity level
+3 dB for OFDM; Sensitivity level +6 dB for
11b
MCS32 MM 4K
–88.5
MCS0 MM 4K 40 MHz
–87.5
MCS7 MM 4K 40 MHz
–69.6
MCS0 MM 4K MRC
–93.5
MCS7 MM 4K MRC
–76.0
MCS13 MM 4K
–74.5
MCS14 MM 4K
–73.1
dBm
–71.8
OFDM (11g/n)
–19
–9
dBm
CCK
–4
–0
dBm
2 Mbps DSSS
42.7
dBm
11 Mbps CCK
37.9
dBm
54 Mbps OFDM
2.0
LO leakage
dBm
–80
PER floor
1.0
RSSI
Unit
MHz
MCS15 MM 4K
Max Input Level At < 10% PER limit
Max
PRODUCT PREVIEW
Parameter
Operation frequency range
dBm
2.0
%
Sensitivity ÷ –50 dBm
±2
dB
–50 dBm ÷ –20 dBm
±3
dB
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4.7
www.ti.com
WLAN 2.4-GHz Transmitter Power
Parameter
Condition
RF_IO2_BG_WL pin 2.4-GHz SISO
Min
Output Power:
Maximum RMS
output power
measured at 1 dB
from IEEE spectral
mask or EVM
1 Mbps DSSS
18.1
2 Mbps DSSS
18.1
5.5 Mbps CCK
18.1
PRODUCT PREVIEW
11 Mbps CCK
18.1
6 Mbps OFDM
17.9
9 Mbps OFDM
17.9
12 Mbps OFDM
17.9
18 Mbps OFDM
17.9
24 Mbps OFDM
17.0
36 Mbps OFDM
16.1
48 Mbps OFDM
15.4
54 Mbps OFDM
14.6
MCS0 MM
16.9
MCS1 MM
16.9
MCS2 MM
16.9
MCS3 MM
16.9
MCS4 MM
16.1
MCS5 MM
15.4
MCS6 MM
14.6
MCS7 MM
13.4
MCS0 MM 40 MHz
15.6
Unit
Max
dBm
MCS7 MM 40 MHz
13.0
Condition
RF_IO1_BG_WL + RF_IO2_BG_WL 2.4-GHz MIMO
Min
Typ
MCS12 (WL18x5)
19.3
MCS13 (WL18x5)
18.2
MCS14 (WL18x5)
17.3
MCS15 (WL18x5) (1)
16.4
Condition
RF_IO1/2_BG_WL Pins
Min
Output power
accuracy
Typ
–1.5
Output power
resolution
Operation frequency
range
Typ
Max
Unit
Max
+1.5
0.125
dB
dB
2412 to 2484
MHz
Return loss
–10.0
dB
Reference input
impedance
50.0
Ω
(1)
MIMO MCS15 until 65 °C
14
Module Specifications
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WLAN Currents
Specifications Items
Typ (avg) – 25°C
Units
2.4 GHz RX LPM
43
mA
LPM
Receiver
Transmitter
4.9
2.4 GHz RX search SISO20
48
mA
2.4 GHz RX search MIMO20
68
mA
2.4 GHz RX search SISO40
53
mA
5 GHz RX search SISO20
54
mA
5 GHz RX search SISO40
58
mA
2.4 GHz RX 20 M SISO 11 CCK
50
mA
2.4 GHz RX 20 M SISO 6 OFDM
55
mA
2.4 GHz RX 20 M SISO MCS7
59
mA
2.4 GHz RX 20 M MRC 1 DSSS
68
mA
2.4 GHz RX 20 M MRC 6 OFDM
75
mA
2.4 GHz RX 20 M MRC 54 OFDM
79
mA
2.4 GHz RX 40 MHz MCS7
71
mA
5 GHz RX 20 MHz OFDM6
62
mA
5 GHz RX 20 MHz MCS7
67
mA
5 GHz RX 40 MHz MCS7
79
mA
2.4 GHz TX 20 M SISO 6 OFDM 18.2 dBm
285
mA
2.4 GHz TX 20 M SISO 11 CCK 18.2 dBm
273
mA
2.4 GHz TX 20 M SISO 54 OFDM 15.5 dBm
247
mA
2.4 GHz TX 20 M SISO MCS7 14 dBm
238
mA
2.4 GHz TX 20 M MIMO MCS15 11 dBm
420
mA
2.4 GHz TX 40 M SISO MCS7 11 dBm
243
mA
5 GHz TX 20 M SISO 6 OFDM 18.2 dBm
366
mA
5 GHz TX 20 M SISO 54 OFDM 15.5 dBm
329
mA
5 GHz TX 20 M SISO MCS7 14 dBm
324
mA
5 GHz TX 40 M SISO MCS7 11 dBm
332
mA
PRODUCT PREVIEW
4.8
SWRS152F – JULY 2013 – REVISED OCTOBER 2013
Bluetooth Performance
4.10 Bluetooth BR, EDR Receiver Characteristics—In-Band Signals
over operating free-air temperature range (unless otherwise noted)
Parameter
Condition
Bluetooth BR, EDR
operation frequency
range
Min
Typ
2402
Max
Bluetooth
Specification
2480
Unit
MHz
Bluetooth BR, EDR
channel spacing
1
MHz
Bluetooth BR, EDR
input impedance
50
Ω
Bluetooth BR, EDR
sensitivity (1)
Dirty TX on
Bluetooth EDR BER
floor at sensitivity + 10
dB
Dirty TX off (for
1,600,000 bits)
(1)
BR, BER = 0.1%
–93.0
–70.0
dBm
EDR2, BER = 0.01%
–92.5
–70.0
dBm
EDR3, BER = 0.01%
–85.5
–70.0
dBm
EDR2
1e-6
1e-5
EDR3
1e-6
1e-5
Sensitivity degradation up to –3 dB may occur due to fast clock harmonics with dirty TX on.
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Bluetooth BR, EDR Receiver Characteristics—In-Band Signals (continued)
over operating free-air temperature range (unless otherwise noted)
Parameter
Bluetooth BR, EDR
maximum useable input
power
Condition
Min
Typ
Max
Bluetooth
Specification
Unit
BR, BER = 0.1%
–5.0
–20.0
dBm
EDR2, BER = 0.1%
–10.0
–20.0
dBm
EDR3, BER = 0.1%
–10.0
Bluetooth BR
intermodulation
Level of interferers for n = 3, 4, and 5
–36.0
Bluetooth BR, EDR C/I
performance
Numbers show wanted
signal-to-interferingsignal ratio. Smaller
numbers indicate better
C/I performances
(Image frequency = –1
MHz)
BR, co-channel
EDR, co-channel
PRODUCT PREVIEW
11.0
dB
9.5
13.0
dB
EDR3
16.5
21.0
dB
–10.0
0.0
dB
EDR2
–10.0
0.0
dB
EDR3
–5.0
5.0
dB
–38.0
–30.0
dB
EDR2
–38.0
–30.0
dB
EDR3
–38.0
–25.0
dB
–28.0
–20.0
dB
EDR2
–28.0
–20.0
dB
EDR3
–22.0
–13.0
dB
–45.0
–40.0
dB
EDR2
–45.0
–40.0
dB
EDR3
–44.0
–33.0
dB
BR, adjacent –2 MHz
EDR, adjacent –2 MHz
BR, adjacent ≥Ι±3Ι MHz
EDR, adjacent ≥Ι±3Ι MHz
dBm
8.0
BR, adjacent +2 MHz
EDR, adjacent +2 MHz
dBm
–39.0
EDR2
BR, adjacent ±1 MHz
EDR, adjacent ±1 MHz, (image)
–20.0
–30.0
Bluetooth BR, EDR RF
return loss
–10.0
dB
4.11 Bluetooth Receiver Characteristics – General Blocking
over operating free-air temperature range (unless otherwise noted)
Parameter
Condition
Blocking performance over full range,
according to Bluetooth specification (1)
(1)
16
Min
Typ
Bluetooth
Specification
Unit
30 to 2000 MHz
–6
–10
dBm
2000 to 2399 MHz
–6
–27
dBm
2484 to 3000 MHz
–6
–27
dBm
3 to 12.75 GHz
–6
–10
dBm
Exceptions taken out of the total 24 allowed in the Bluetooth specification.
Module Specifications
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SWRS152F – JULY 2013 – REVISED OCTOBER 2013
4.12 Bluetooth Receiver Characteristics – BR, EDR Blocking per Band
over operating free-air temperature range (unless otherwise noted)
(1)
Typ
Unit
776 to 794 MHz (CDMA)
Band
Min
–12
dBm
824 to 849 MHz (GMSK) (1)
–3
824 to 849 MHz (EDGE)
(1)
–11
824 to 849 MHz (CDMA,
QPSK) (1)
–12
880 to 915 MHz (GMSK)
–14
880 to 915 MHz (EDGE)
–15
1710 to 1785 MHz (GMSK)
–4
1710 to 1785 MHz (EDGE)
–18
1850 to 1910 MHz (GMSK)
–18
1850 to 1910 MHz (EDGE)
–20
1850 to 1910 MHz (CDMA,
QPSK)
–20
1850 to 1910 MHz (WCDMA,
QPSK)
–16
1920 to 1980 MHz (WCDMA,
QPSK)
–17
PRODUCT PREVIEW
Parameter
Blocking performance for various cellular bands
Hopping on.
Wanted signal: –3 dB from sensitivity, with
modulated continuous blocking signal.
BER = 0.1% for Bluetooth BR, 0.01% for Bluetooth
EDR. PER = 1%
Except for frequencies in which [3 × F_BLOCKER] falls within the Bluetooth band (2400 to 2483.5 MHz)
4.13 Bluetooth Transmitter, BR
over operating free-air temperature range (unless otherwise noted)
Parameter
BR RF output power (1)
Min
Typ
Max
Bluetooth
Specification
Unit
VBAT ≥ 3 V
13.5
dBm
VBAT < 3 V
8.0
dBm
BR gain control range
30.0
BR power control step
5.0
2 to 8
dB
BR adjacent channel power |M-N| = 2 (2)
–43.0
≤ –20
dBm
BR adjacent channel power |M-N| > 2 (2)
–48.0
≤ –40
dBm
(1)
(2)
dB
Values reflect maximum power. Reduced power is available using a vendor-specific (VS) command.
Assumes 3-dB insertion loss on external filter and traces
4.14 Bluetooth Transmitter, EDR
over operating free-air temperature range (unless otherwise noted)
Parameter
EDR output power (1)
Min
Vbat ≥ 3 V
Bluetooth
Specificatio
n
dBm
1
–4 to +1
30
EDR power control step
Unit
6
–2
EDR gain control range
Max
8
Vbat < 3 V
EDR relative power
Typ
dB
dB
5
2 to 8
dB
EDR adjacent channel power |M-N| = 1 (2)
–36
≤ –26
dBc
EDR adjacent channel power |M-N| = 2 (2)
–30
–
≤ –20
dBm
(2)
–42
–
≤ –40
dBm
EDR adjacent channel power |M-N| > 2
(1)
(2)
Values reflect default maximum power. Max power can be changed using a VS command.
Assumes 3-dB insertion loss on external filter and traces
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4.15 Bluetooth Modulation, BR
over operating free-air temperature range (unless otherwise noted)
Condition (1)
Characteristics
Performances
Min
Max
925
995
≤1000
kHz
Mod data = 4
1s, 4 0s:
111100001111..
.
160
140 to 175
kHz
∆f2max ≥ limit
for at least
99.9% of all
Δf2max
Mod data =
1010101...
130
> 115
kHz
88
> 80
%
∆f2avg/∆f1avg
BR carrier frequency drift
One slot packet
–25
25
< ±25
kHz
Three and five
slot packet
–35
35
< ±40
kHz
15
< 20
kHz/50 µs
25
< ±75
kHz
BR drift rate
lfk+5 – fkl , k =
0 …. max
BR initial carrier frequency
tolerance (2)
f0–fTX
PRODUCT PREVIEW
(1)
(2)
Units
∆f1avg
BR –20 dB Bandwidth
BR modulation characteristics
Typ
Bluetooth
Specification
–25
Performance values reflect maximum power.
This number is added on top of the reference clock frequency accuracy.
4.16 Bluetooth Modulation, EDR
over operating free-air temperature range (unless otherwise noted)
Parameter (1)
Condition
Min
Typ
Max
Bluetooth
Specification
Unit
EDR carrier frequency stability
–5
5
≤10
kHz
EDR initial carrier frequency
tolerance (2)
–25
25
±75
kHz
EDR RMS DEVM
EDR 99% DEVM
EDR2
4
20
%
EDR3
4
13
%
EDR2
30
EDR3
EDR peak DEVM
(1)
(2)
%
20
%
EDR2
9
35
%
EDR3
9
25
%
Performance values reflect maximum power.
This number is added on top of the reference clock frequency accuracy.
4.17 Bluetooth BR, EDR Transceiver – Emissions
over operating free-air temperature range (unless otherwise noted)
Characteristics (1)
Condition (2)
Performances
Min
Bluetooth out-of-band
emission
(1)
(2)
18
746 to 768 MHz (CDMA)
BR, EDR
Typ
Units
Max
–151
dBm/Hz
869 to 894 MHz (WCDMA,
GSM)
–149
dBm/Hz
925 to 960 MHz (E-GSM)
–148
dBm/Hz
1570 to 1580 MHz (GPS)
–145
dBm/Hz
Meets FCC and ETSI requirements with a suitable external filter
Performance values reflect maximum power.
Module Specifications
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SWRS152F – JULY 2013 – REVISED OCTOBER 2013
Bluetooth BR, EDR Transceiver – Emissions (continued)
over operating free-air temperature range (unless otherwise noted)
Characteristics (1)
Condition (2)
Performances
Min
(3)
Units
Max
1598 to 1607 MHz
(GLONASS) (3)
–145
dBm/Hz
1805 to 1880 MHz (DCS,
WCDMA)
–141
dBm/Hz
1930 to 1990 MHz (PCS)
–139
dBm/Hz
BR
–134
dBm/Hz
EDR
–129
dBm/Hz
1.5
dBm
Third harmonic
–4
dBm
Fourth harmonic
–10
dBm
2110 to 2170 MHz
(WCDMA)
Bluetooth harmonics
Typ
Second harmonic
Except for frequencies that correspond to 2 × RF_FREQ / 3
4.18 Bluetooth BR, EDR Transceiver – Spurs
Characteristics (1)
Condition (2)
Performances
Min
Bluetooth out-of-band spurs
(1)
(2)
(3)
76 to 108 MHz (FM)
BR
Typ
PRODUCT PREVIEW
over operating free-air temperature range (unless otherwise noted)
Units
Max
–77
dBm
746 to 768 MHz (WCDMA)
–79
dBm
869 to 894 MHz (WCDMA,
GSM)
–77
dBm
925 to 960 MHz (E to GSM)
–77
dBm
1570 to 1580 MHz (GPS)
–72
dBm
1598 to 1607 MHz
(GLONASS) (3)
–74
dBm
1805 to 1880 MHz (DCS,
WCDMA)
–72
dBm
1930 to 1990 MHz (PCS)
–70
dBm
2110 to 2170 MHz (WCDMA)
–59
dBm
Meets FCC and ETSI requirements with a suitable external filter
Performance values reflect maximum power.
Except for frequencies corresponding to 2 × RF_FREQ/3
4.19 Bluetooth EDR Transceiver – Spurs
over operating free-air temperature range (unless otherwise noted)
Characteristics (1)
Condition (2)
Performances
Min
Bluetooth out-of-band spurs
(1)
(2)
(3)
76 to 108 MHz (FM)
EDR
Typ
Units
Max
–82
dBm
746 to 768 MHz (WCDMA)
–87
dBm
869 to 894 MHz (WCDMA,
GSM)
–85
dBm
925 to 960 MHz (E to GSM)
–84
dBm
1570 to 1580 MHz (GPS)
–79
dBm
1598 to 1607 MHz
(GLONASS) (3)
–78
dBm
Meets FCC and ETSI requirements with a suitable external filter
Performance values reflect maximum power.
Except for frequencies corresponding to 2 × RF_FREQ/3
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Bluetooth EDR Transceiver – Spurs (continued)
over operating free-air temperature range (unless otherwise noted)
Characteristics (1)
Condition (2)
Performances
Min
Units
Typ
Max
1805 to 1880 MHz (DCS,
WCDMA)
–76
dBm
1930 to 1990 MHz (PCS)
–74
dBm
2110 to 2170 MHz (WCDMA)
–63
dBm
4.20 Bluetooth LE Performance
4.21 Bluetooth LE Receiver Characteristics – In-Band Signals
over operating free-air temperature range (unless otherwise noted)
Condition (1)
Parameter
Bluetooth LE operation frequency
range
Min
Typ
2402
Bluetooth LE channel spacing
PRODUCT PREVIEW
50
–94
Bluetooth LE maximum usable input
power
MHz
Ω
–5
Bluetooth LE intermodulation
characteristics
Level of interferers. For
n = 3, 4, 5
Bluetooth LE C/I performance.
Note: Numbers show wanted signalto-interfering-signal ratio. Smaller
numbers indicate better C/I
performance.
LE, co-channel
–36
Unit
MHz
2
Bluetooth LE sensitivity (2)
Dirty TX on
(1)
(2)
BLE
Specification
2480
Bluetooth LE input impedance
Image = –1 MHz
Max
–30
8
12
≤ –70
dBm
≥ –10
dBm
≥ –50
dBm
≤ 21
dB
LE, adjacent ±1 MHz
–5
0
≤ 15
LE, adjacent +2 MHz
–45
–38
≤ –17
LE, adjacent –2 MHz
–22
–15
≤ –15
LE, adjacent ≥ |±3|MHz
–47
–40
≤ –27
BER of 0.1% corresponds to PER of 30.8% for a minimum of 1500 transmitted packets, according to the Bluetooth LE test specification.
Sensitivity degradation of up to –3 dB can occur due to fast clock harmonics.
4.22 Bluetooth LE Receiver Characteristics – General Blocking
over operating free-air temperature range (unless otherwise noted)
Parameter
Bluetooth LE blocking performance
over full range, according to the LE
specification (1)
(1)
Condition
Min
Typ
Max
BLE
Specification
Unit
dBm
30 to 2000 MHz
–15
≥ –30
2000 to 2399 MHz
–15
≥ –35
2484 to 3000 MHz
–15
≥ –35
3 to 12.75 GHz
–15
≥ –30
Exceptions taken out of the total 10 allowed for fbf_1, according to the Bluetooth LE specification
4.22.1 Bluetooth LE Receiver Characteristics – Blocking per Band
The characteristics for the Bluetooth LE receiver are the same as for Bluetooth BR (see Section 4.12, Bluetooth
Receiver Characteristics – BR, EDR Blocking per Band), with the following conditions:
• Hopping off
• Desired signal –3 dB from sensitivity, with modulated continuous blocking signal. PER = 30.8%
20
Module Specifications
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4.23 Bluetooth LE Transmitter Characteristics
over operating free-air temperature range (unless otherwise noted)
Parameter
Min
Bluetooth LE RF output power (1)
Typ
Max
Bluetooth LE
Specification
Unit
VBAT ≥ 3 V
13.5
≤10
dBm
VBAT < 3 V
8.0
≤10
dBm
Bluetooth LE adjacent channel power |M-N| =
2 (2)
–51.0
≤ –20
dBm
Bluetooth LE adjacent channel power |M-N| >
2 (2)
–54.0
≤ –30
dBm
(1)
(2)
To reduce the maximum BLE power, use a VS command. The optional extra margin is offered to compensate for design losses, such as
trace and filter losses, and to achieve the maximum allowed output power at system level.
Assumes 3-dB insertion loss on external filter and traces
4.24 Bluetooth LE Modulation Characteristics
Condition (1)
Characteristics
Performances
Min
Bluetooth LE modulation
characteristics
Max
Bluetooth
Specification
Units
∆f1avg
Mod data = 4
1s, 4 0s:
111100001111..
.
250
225 to 275
kHz
∆f2max ≥ limit
for at least
99.9% of all
Δf2max
Mod data =
1010101...
215
≥185
kHz
90
≥80
%
25
≤±50
kHz
15
≤20
kHz/50 μs
25
≤±100
kHz
∆f2avg/∆f1avg
Bluetooth LE carrier frequency
drift
lf0 – fnl , n = 2,3 …. K
Bluetooth LE drift rate
lf1 – f0l and lfn – fn-5l ,n = 6,7….
K
LE initial carrier frequency
tolerance (2)
fn – fTX
(1)
(2)
Typ
–25
–25
Performance values reflect maximum power.
This number is added on top of the reference clock frequency accuracy.
4.24.1 Bluetooth LE Transceiver – Emissions
See Section 4.17, Bluetooth BR, EDR Transceiver – Emissions.
4.24.2 Bluetooth LE Transceiver – Spurs
See Section 4.18, Bluetooth BR, EDR Transceiver – Spurs.
4.25 Bluetooth-BLE Dynamic Currents
Current is measured at output power as follows:
• BR at 14.5 dBm
• EDR at 10 dBm
Use Case (1)
(2)
Typ
Units
BR voice HV3 + sniff
11.6
mA
EDR voice 2-EV3 no retransmission + sniff
5.9
mA
Sniff 1 attempt 1.28 s
178.0
uA
EDR A2DP EDR2 (master). SBC high quality – 345 Kbs
10.4
mA
(1)
(2)
The role of Bluetooth in all scenarios except A2DP is slave.
CL1P5 PA is connected to VBAT, 3.7 V.
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21
PRODUCT PREVIEW
over operating free-air temperature range (unless otherwise noted)
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Use Case (1)
www.ti.com
(2)
Typ
Units
7.5
mA
(3) (4)
18.0
mA
Full throughput BR ACL TX: TX-DH5 (4)
50.0
mA
Full throughput EDR ACL TX: TX-2DH5 (4)
33.0
mA
Page or inquiry 1.28 s/11.25 ms
253.0
mA
P&I scan (P = 1.28/I = 2.56)
332.0
mA
Output
[dBm]
Typ
Units
Advertising, not connectable (2)
10
131
µA
Advertising, discoverable (2)
10
143
µA
10
266
µA
10
124
µA
10
132
µA
EDR A2DP EDR2 (master). MP3 high quality – 192 Kbs
Full throughput ACL RX: RX-2DH5
(3)
(4)
ACL RX has the same current in all modulations.
Full throughput assumes data transfer in one direction.
4.26 Bluetooth LE Currents
All current is measured at output power of 10 dBm.
Use Case (1)
Scanning
(3)
Connected, master role, 1.28-s connect interval (4)
PRODUCT PREVIEW
Connected, slave role, 1.28-s connect interval
(1)
(2)
(3)
(4)
(4)
CL1p% PA is connected to VBAT, 3.7 V.
Advertising in all three channels, 1.28-s advertising interval, 15 bytes advertise data
Listening to a single frequency per window, 1.28-s scan interval, 11.25-ms scan window
Zero slave connection latency, empty TX and RX LL packets
4.27 Shutdown and Sleep Currents
Power Supply Current
Typ
Unit
Shutdown mode
All functions shut down
Parameter
VBAT
10
µA
VIO
2
µA
WLAN sleep mode
VBAT
154
µA
Bluetooth sleep mode
VBAT
110
µA
5 Host Interface Timing Characteristics
The device incorporates a UART module dedicated to the Bluetooth shared-transport, host controller
interface (HCI) transport layer. The HCI interface transports commands, events, and ACL between the
Bluetooth device and its host using HCI data packets, acting as a shared transport for all functional blocks
except WLAN.
WLAN
Shared HCI for All Functional Blocks
Except WLAN
Bluetooth Voice-Audio
WLAN HS SDIO
Over UART
Bluetooth PCM
5.1
WLAN SDIO Transport Layer
The SDIO is the host interface for WLAN. The interface between the host and the WL18xx module uses
an SDIO interface and supports a maximum clock rate of 50 MHz.
The device SDIO also supports the following features of the SDIO V3 specification:
• 4-bit data bus
• Synchronous and asynchronous in-band interrupt
• Default and high-speed (HS, 50 MHz) timing
• Sleep and wake commands
22
Host Interface Timing Characteristics
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SDIO Timing Specifications
Figure 5-1 and Figure 5-2 show the SDIO switching characteristics over recommended operating
conditions and with the default rate for input and output.
PRODUCT PREVIEW
Figure 5-1. SDIO Default Input Timing
Figure 5-2. SDIO Default Output Timing
Table 5-1 lists the SDIO default timing characteristics.
Table 5-1. SDIO Default Timing Characteristics (1)
Parameter (2)
Min
Max
Unit
fclock
Clock frequency, CLK
0.0
26.0
MHz
DC
Low, high duty cycle
40.0
60.0
%
tTLH
Rise time, CLK
10.0
ns
tTHL
Fall time, CLK
10.0
ns
tISU
Setup time, input valid before CLK ↑
3.0
tIH
Hold time, input valid after CLK ↑
2.0
tODLY
Delay time, CLK ↓ to output valid
2.5
Cl
Capacitive load on outputs
(1)
(2)
ns
ns
14.8
ns
15.0
pF
To change the data out clock edge from the falling edge (default) to the rising edge, set the configuration bit.
Parameter values reflect maximum clock frequency.
Host Interface Timing Characteristics
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5.1.2
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SDIO Switching Characteristics – High Rate
Figure 5-3 and Figure 5-4 show the parameters for maximum clock frequency.
Figure 5-3. SDIO HS Input Timing
PRODUCT PREVIEW
Figure 5-4. SDIO HS Output Timing
Table 5-2 lists the SDIO high-rate timing characteristics.
Table 5-2. SDIO HS Timing Characteristics
Parameter
Min
Max
Unit
MHz
fclock
Clock frequency, CLK
0.0
50.0
DC
Low, high duty cycle
40.0
60.0
%
tTLH
Rise time, CLK
3.0
ns
tTHL
Fall time, CLK
3.0
ns
tISU
Setup time, input valid before CLK ↑
3.0
ns
tIH
Hold time, input valid after CLK ↑
2.0
ns
tODLY
Delay time, CLK ↑ to output valid
2.5
Cl
Capacitive load on outputs
24
Host Interface Timing Characteristics
14.0
ns
10.0
pF
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5.2
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HCI UART Shared Transport Layers for All Functional Blocks (Except WLAN)
The HCI UART supports most baud rates (including all PC rates) for all fast-clock frequencies up to a
maximum of 4 Mbps. After power up, the baud rate is set for 115.2 kbps, regardless of the fast-clock
frequency. The baud rate can then be changed using a VS command. The device responds with a
Command Complete Event (still at 115.2 kbps), after which the baud rate change occurs.
HCI hardware includes the following features:
• Receiver detection of break, idle, framing, FIFO overflow, and parity error conditions
• Receiver-transmitter underflow detection
• CTS, RTS hardware flow control
• 4 wire (H4)
Table 5-3 lists the UART default settings.
Table 5-3. UART Default Setting
Value
115.2 kbps
Data length
8 bits
Stop bit
1
Parity
None
5.2.1
PRODUCT PREVIEW
Parameter
Bit rate
UART 4-Wire Interface – H4
The interface includes four signals:
• TXD
• RXD
• CTS
• RTS
Flow control between the host and the device is byte-wise by hardware (see Figure 5-5).
Figure 5-5. HCI UART Connection
When the UART RX buffer of the device passes the flow-control threshold, the buffer sets the UART_RTS
signal high to stop transmission from the host. When the UART_CTS signal is set high, the device stops
transmitting on the interface. If HCI_CTS is set high in the middle of transmitting a byte, the device
finishes transmitting the byte and stops the transmission.
Figure 5-6 shows the UART timing.
Host Interface Timing Characteristics
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PRODUCT PREVIEW
Figure 5-6. UART Timing Diagram
Table 5-4 lists the UART timing characteristics.
Table 5-4. UART Timing Characteristics
Parameter
Condition
Symbol
Min
Baud rate
Baud rate accuracy per byte
Receive-transmit
Baud rate accuracy per bit
Receive-transmit
Max
Unit
37.5
4364
Kbps
–2.5
+1.5
%
–12.5
CTS low to TX_DATA on
t3
CTS high to TX_DATA off
Hardware flow control
CTS high pulse width
RTS low to RX_DATA on
RTS high to RX_DATA off
Typ
Interrupt set to 1/4 FIFO
+12.5
0.0
2.0
t4
1.0
t6
1.0
t1
0.0
%
µs
Byte
Bit
2.0
t2
µs
16.0
Bytes
Figure 5-7 shows the UART data frame.
tb
TX
STR
STR-Start bit;
D0
D1
D2
D0..Dn - Data bits (LSB first);
Dn
PAR
STP
PAR - Parity bit (if used); STP - Stop bit
Figure 5-7. UART Data Frame
5.3
Bluetooth Codec-PCM (Audio) Timing Specifications
Figure 5-8 shows the Bluetooth codec-PCM (audio) timing diagram.
26
Host Interface Timing Characteristics
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Figure 5-8. Bluetooth Codec-PCM (Audio) Master Timing Diagram
Table 5-5 lists the Bluetooth codec-PCM master timing characteristics.
Symbol
Min
Max
Unit
Cycle time
Parameter
Tclk
166.67 (6.144 MHz)
15625 (64 kHz)
ns
High or low pulse width
Ts
35% of Tclk min
AUD_IN setup time
tis
10.6
AUD_IN hold time
tih
0
AUD_OUT propagation time
top
0
15
FSYNC_OUT propagation time
top
0
15
Capacitive loading on outputs
Cl
40
PRODUCT PREVIEW
Table 5-5. Bluetooth Codec-PCM Master Timing Characteristics
pF
Table 5-6 lists the Bluetooth codec-PCM slave timing characteristics.
Table 5-6. Bluetooth Codec-PCM Slave Timing Characteristics
Symbol
Min
Cycle time
Parameter
Tclk
81 (12.288 MHz)
High or low pulse width
Tw
35% of Tclk min
AUD_IN setup time
tis
5
AUD_IN hold time
tih
0
AUD_FSYNC setup time
tis
5
AUD_FSYNC hold time
tih
0
AUD_OUT propagation time
top
0
Capacitive loading on outputs
Cl
Max
Unit
ns
19
40
pF
Host Interface Timing Characteristics
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6 Clocks and Power Management
The slow clock is a free-running, 32.768 kHz clock supplied from an external clock source. The clock is
connected to the RTC_CLK pin and is a digital square-wave signal in the range of 0 to 1.8 V nominal.
6.1
Reset-Power-Up System
After VBAT and VIO are fed to the device and while BT_EN and WL_EN are deasserted (low), the device
is in SHUTDOWN state, during which functional blocks, internal DC-DCs, and LDOs are disabled. The
power supplied to the functional blocks is cut off. When one of the signals (BT_EN or WL_EN) are
asserted (high), a power-on reset (POR) is performed. Stable slow clock, VIO, and VBAT are prerequisites
for a successful POR.
6.2
WLAN Power-Up Sequence
Figure 6-1 shows the WLAN power-up sequence.
PRODUCT PREVIEW
Indicates completion of FW download
and Internal initialization
Wake-up time
Figure 6-1. WLAN Power-Up Sequence
6.3
Bluetooth-BLE Power-Up Sequence
Figure 6-2 shows the Bluetooth-BLE power-up sequence.
VBAT
input
VIO(1.8V) - VDDS
input
SLOWCLK
input
BT_EN
input
Completion of BT FW init
HCI_RTS
output
100mS max
Figure 6-2. Bluetooth-BLE Power-Up Sequence
28
Clocks and Power Management
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7 Reference Schematics and Bill of Materials
7.1
TI Module Reference Design
PRODUCT PREVIEW
Figure 7-1 shows the TI module reference design.
Figure 7-1. TI Module Reference Schematics
7.2
Bill of Materials
Table 7-1 lists the bill materials (BOM).
Table 7-1. Bill of Materials
Description
Part Number
Package
Reference
Qty
Manufacturer
(X)WL1835MOD
13.4x13.3x2.0mm
U1
1
Texas
Instruments
ANT016008LCD2442MA1
1.6 mm x 0.8 mm
ANT1, ANT2
2
TDK
IND 0402/1.2
nH/±0.3/0.12 Ω/300 mA
Hl1005-1C1N2SMT
0402
L1, L2
2
ACX
CAP 0402/2.0 pF/50
V/C0G/±0.25 pF
C1005C0G1H020C
0402
C8, C10
2
Walsin
CAP 0402/8.2 pF/50
V/NPO/±0.5 pF
0402N8R2D500
0402
C15, C17
2
Walsin
0402N100J500LT
0402
C4, C6
2
Walsin
WR04X103 JTL
0402
R13
1
Walsin
TI WL 1835 WiFi/BT Module
ANT/Chip/2.4, 5 GHz/Peak Gain
> 5 dBi
CAP 0402/10 pF/50 V/NPO/±5%
RES 0402/10K/±5% (for debug
only)
Reference Schematics and Bill of Materials
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8 Design Recommendations
This section describes the layout recommendations for the (X)WL1835 module, RF trace, and antenna.
8.1
RF Trace and Antenna Layout Recommendations
Figure 8-1 shows the location of the antenna on the TMDXWL1835COM8T board as well as the RF trace
routing from the (X)WL1835 module (TI reference design). The TDK chip multilayer antennas are mounted
on the board with a specific layout and matching circuit for the radiation test conducted in FCC, CE, and
IC certifications.
PRODUCT PREVIEW
Figure 8-1. Location of Antenna and RF Trace Routing on the TMDXWL1835COM8T Board
Follow these following RF trace routing recommendations:
• RF traces must have 50-Ω impedance.
• RF traces must not have sharp corners.
• RF traces must have via stitching on the ground plane beside the RF trace on both sides.
• RF traces must be as short as possible. The antenna, RF traces, and module must be on the edge of
the PCB product in consideration of the product enclosure material and proximity.
8.2
Module Layout Recommendations
Follow these module layout recommendations:
• Ensure a solid ground plane and ground vias under the module for stable system and thermal
dissipation.
• Do not run signal traces underneath the module on a layer where the module is mounted.
• Signal traces can be run on a third layer under the solid ground layer and beneath the module
mounting.
• Run the host interfaces with ground on the adjacent layer to improve the return path.
• TI recommends routing the signals as short as possible to the host.
Figure 8-2 shows layer 1 and layer 2 of the TI module layout:
30
Design Recommendations
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Layer 1
Layer 2 (Solid GND)
Figure 8-2. TI Module Layout
9 Mechanical Information
2.00 Max
13.40
13.30
Top View
PRODUCT PREVIEW
Figure 9-1 shows the mechanical outline for the device.
13.30
Side View
Figure 9-1. TI Module Mechanical Outline
Mechanical Information
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10 Packaging Information
Table 10-1 lists the available TI module part numbers.
Table 10-1. TI Module Part Numbers
(1)
(2)
Part Number (1)
Status (2)
Package Type
XWL1835MODGAMOCT
Preview
LGA
XWL1805MODGAMOCT
Preview
LGA
XWL1831MODGAMOCT
Preview
LGA
XWL1801MODGAMOCT
Preview
LGA
Minimum Orderable Quantity
250
Part number marking key:
• X – experimental (before qualification)
• WL18xx – module variant (see Table 1-1)
• MODGx – module marking (26-MHz commercial revision A or B)
• MOCx – module package designator (R: tape/reel; T: small reel)
For example, XWL1835MODGAMOCT = experimental WL1835 module, revision A, small reel.
This device has been announced but is not in production. Samples may not be available. Contact your TI representative.
To minimize delivery time to customer for small quantities, TI may ship the device ordered or an equivalent device currently available
that contains at least the functions of the part ordered. From all aspects, this device will behave exactly the same as the part ordered.
For example, if a customer orders device XWL1801MODGA, the part shipped may be XWL1801MODGA, XWL1805MODGA,
XWL1831MODGA, or XWL1835MODGA.
PRODUCT PREVIEW
32
Packaging Information
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4-Dec-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
XWL1801MODGAMOCT
PREVIEW
100
250
TBD
Call TI
Call TI
-20 to 70
XWL1805MODGAMOCT
PREVIEW
100
250
TBD
Call TI
Call TI
-20 to 70
XWL1831MODGAMOCT
PREVIEW
100
250
TBD
Call TI
Call TI
-20 to 70
XWL1835MODGAMOCT
PREVIEW
100
250
TBD
Call TI
Call TI
-20 to 70
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
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In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
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