BVS-166UG2-12

BRIGHT VIEW ELECTRONICS CO.,LTD SUPER BRIGHTNESS SMD LED PACKAGE CONFIGURATION BVS-166UG2-12 Cathode mark LED die 0.8 0.6 Cathode line Soldering terminal Soldering Pattem 1.6 1.0 1.0 0.8 0.8 0.4 0.3 Resin P C .board P olarity 0.4 Soldering terminal 0.8 0.7 0.8 Tolerance ± 0.1 DESCRIPTION Dice Material : AlGaInP/GaAs Yellow Green Light Color : Yellow Green Color Lens Color : Milky Diffused ABSOLUTE MAXIMUM RATINGS AT Ta = 25 PARAMETER Power Dissipation Continuous Forward Current Peak Forward Current ( 1/10 Duty Cycle , 0.1ms Pulse Width ) Reverse Voltage Derating Linear From 25 Operating Temperature Range Storage Temperature Range Infrared Soldering Condition 260 for 5 seconds Reflow Soldering Condition 230 for 10 seconds MAX. 55 20 100 5 0.35 30 to 80 40 to 85 UNIT mW mA mA V mA/oC o C o C ELECTRICAL / OPTICAL CHARACTERISTICS AT Ta = 25 SYMBOL VF IR p d 2 1/2 PARAMETER Forward Voltage Reverse Current Peak Emission Wavelength Dominant Wavelength Viewing Angle TEST COND. I F = 20 mA V R = 5V I F = 20 mA I F = 20 mA I F = 20 mA MIN. TYP. 2.1 575 570 130 MAX. 2.6 100 UNIT V A nm nm Deg BIN GRADE LIMITS ( I F = 20 mA ) LUMINOUS INTENSITY / mcd Bin Min. Max. x 35 42 y 42 50 z 50 60 A B C 60 70 84 70 84 100 Tolerance ± 15%mcd *Bright View reserves the rights to alter specifications and remove availability of products at any time without notice. *Dominant Wavelength, d is according to CIE Chromaticity Diagram base on color of lamps. * 1/2 is the off-axis angle where the luminous intensity is one half the on-axis intensity. 2004/9/8 – A BRIGHT VIEW ELECTRONICS CO.,LTD SMD APPLICATION ( PB FREE SOLDERING ) 1XX series. Apply to BVS-3XX Description: (1) Manual soldering (We do not recommend this method strongly.) (1.1) To prevent cracking,please bake (65 ,24hrs)before soldering. (1.2) Temperature at tip of iron: 250 Max.(25W) (1.3) It's banned to load any stress on the resin during soldering. (1.4) Soldering time: 3 sec. Max.(one time only) (2) Reflow Soldering (2.1) To prevent cracking,please bake (65 ,24hrs)before soldering. (2.2) When soldering,do not put stress on the LEDs during heating. (2.3) Never take next process until the component is cooled down to room temperature after reflow. (2.4) After soldering,do not warp the circuit board. (2.5) The recommended reflow soldering profile(measuring on the surface of the LED resin)is following: 10 SEC. MAX. 245 C MAX. 0.5 217 217 150 1 /SEC. MAX. 50 SEC. MAX. /SEC MAX. TEMPERATURE ~75 ~25 210 SEC. MIN. 100 SEC. MAX. TIME The reflow temperature 240 ~245 is recommended and the soldering temperature should be not higher than 245 (one time only) 2005 / 10 / 20 - B BRIGHT VIEW ELECTRONICS CO.,LTD CHIP LEDS PACKING BVS-166/167 Series 2.0 Cathode mark 0.05 4.0 0.10 4.0 0.10 1.5 0.10 0.23 0.05 1.75 0.10 3.5 0.05 1.80 0.10 8.0 0.20 Feeding direction UNIT : mm 0.75 0.10 - B VS-166 0.60 0.10 - BVS-167 178 1.0 60 0.5 Reel : 4,000PCS 12 0.5 UNIT : mm Label 2 Label 1 Bright View PART NO.: Electronics Co.,Ltd. Electronics Co.,Ltd. Bright View PART NO.: LOT NO.: GRADE: Q'ty Xpcs LOT NO.: GRADE: Q'ty pcs QA BVS-16XXXX QA ELECTROSTATIC SENSITIVE DEVICES DO NOT OPEN OR HANDLE EXCEPT AT A STATIC-FREE WORKSTATION Normal X: Bin grade : Wavelength : Vf Anti-electrostatic bag 24 39 RE Y CARTON Dimension(cm): 39*24*22 22 ITEM NO. DEVICE: Q'TY N. W.: G. W.: PCS. KGS. KGS. Carton : 30 Reels Total : 120,000PCS 2003 / 11 / 12 - A