BRIGHT VIEW ELECTRONICS CO.,LTD
SUPER BRIGHTNESS SMD LED
PACKAGE CONFIGURATION
BVS-301YA4
DESCRIPTION
Dice Material : AlGaInP Yellow Light Color : Yellow Color Lens Color : Water Transparent
3.60 2.40
1.9 2.70
RADIATION PATTERN
-30° 0° 30°
INFRARED/VAPOR PHASE REFLOW SOLDERING 4.45 3.20 0.15 2.41 1.65
-60°
60°
1.90 0.80 3.60
100 75 50 25 0 25 50 75 100 Relative Luminous Intensity ( Iv % )
Tolerance ± 0.25
ABSOLUTE MAXIMUM RATINGS AT Ta = 25
PARAMETER Power Dissipation Continuous Forward Current Peak Forward Current ( 1/10 Duty Cycle , 0.1ms Pulse Width ) Reverse Voltage Derating Linear From 50 Operating Temperature Range Storage Temperature Range Reflow Soldering Condition 230 for 10 seconds MAX. 95 35 80 5 0.35 40 to 100 40 to 100 UNIT mW mA mA V mA/oC o C o C
ELECTRICAL / OPTICAL CHARACTERISTICS AT Ta = 25
SYMBOL VF IR p d 2 1/2 PARAMETER Forward Voltage Reverse Current Peak Emission Wavelength Dominant Wavelength Viewing Angle TEST COND. I F = 20 mA V R = 5V I F = 20 mA I F = 20 mA I F = 20 mA MIN. TYP. 2.1 591 589 110 MAX. 2.7 100 UNIT V A nm nm Deg
BIN GRADE LIMITS ( I F = 20 mA ) LUMINOUS INTENSITY / mcd
Bin Min. Max. E 280 360 F 360 465 G 465 600 H I J 600 780 1000 780 1000 1300 Tolerance ± 15%mcd
*Bright View reserves the rights to alter specifications and remove availability of products at any time without notice. *Dominant Wavelength, d is according to CIE Chromaticity Diagram base on color of lamps. * 1/2 is the off-axis angle where the luminous intensity is one half the on-axis intensity.
2004/10/1 – A
BRIGHT VIEW ELECTRONICS CO.,LTD
SMD APPLICATION ( PB FREE SOLDERING )
1XX series.
Apply to BVS-3XX
Description:
(1) Manual soldering (We do not recommend this method strongly.)
(1.1) To prevent cracking,please bake (65 ,24hrs)before soldering. (1.2) Temperature at tip of iron: 250 Max.(25W) (1.3) It's banned to load any stress on the resin during soldering. (1.4) Soldering time: 3 sec. Max.(one time only)
(2) Reflow Soldering
(2.1) To prevent cracking,please bake (65 ,24hrs)before soldering. (2.2) When soldering,do not put stress on the LEDs during heating. (2.3) Never take next process until the component is cooled down to room temperature after reflow. (2.4) After soldering,do not warp the circuit board. (2.5) The recommended reflow soldering profile(measuring on the surface of the LED resin)is following:
10 SEC. MAX. 245 C MAX. 0.5 217 217 150 1 /SEC. MAX.
50 SEC. MAX.
/SEC MAX.
TEMPERATURE
~75 ~25 210 SEC. MIN.
100 SEC. MAX.
TIME The reflow temperature 240 ~245 is recommended and the soldering temperature should be not higher than 245 (one time only)
2005 / 10 / 20 - B
BRIGHT VIEW ELECTRONICS CO.,LTD
TOP LEDS PACKING (A)
2.0 0.05
Gap : Left Side
4.0 0.10
4.0 0.10
1.5 0.10 1.75 0.10 5.5 0.05 12.0 0.3
0.3 MAX.
BVS-301 +
+
BVS-312 + + + + +
9.3 BVS-313
BVS-301-B + + + BVS-311 + BVS-311-B
+
BVS-313
Feeding direction
Blue / Green / White : Black tape Others : Transparent tape
2.6 MAX.
UNIT : mm
50 MIN. 178 2.0 13 TYP.
Reel : 1,500PCS UNIT : mm
Label 2
Label 1
Bright View
PART NO.:
Electronics Co.,Ltd.
Electronics Co.,Ltd.
Bright View
PART NO.: LOT NO.: GRADE: Q'ty Xpcs
LOT NO.: GRADE: Q'ty pcs QA
BVS-30XXXX
QA
ELECTROSTATIC SENSITIVE DEVICES DO NOT OPEN OR HANDLE EXCEPT AT A STATIC-FREE WORKSTATION
Normal X: Bin grade : Wavelength : Vf
Anti-electrostatic bag
24
39
RE
Y
CARTON Dimension(cm): 39*24*22
22
ITEM NO. DEVICE: Q'TY N. W.: G. W.:
PCS. KGS. KGS.
Carton : 20 Reels Total : 30,000PCS
2003 / 10 / 24 - B
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