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110R1103X

110R1103X

  • 厂商:

    CALMIRCO

  • 封装:

  • 描述:

    110R1103X - THIN FILM RESISTOR SERIES - California Micro Devices Corp

  • 数据手册
  • 价格&库存
110R1103X 数据手册
CALIFORNIA MICRO DEVICES 110R THIN FILM RESISTOR SERIES California Micro Devices’ 110R Series multi-terminal resistor chip offers the hybrid designer a component that provides a wide range of resistance values on a single chip. Bonding pads segment the total resistance into ten single elements of resistance and ten 10X elements of resistance enabling the combination of the eight standard parts to cover the resistance range from 1100 ohms to 275K ohms. Parameter TCR Operating Voltage Package ating per re Power RPower(Rating sistor) Thermal Shock High Temperature Exposure Moisture Resistance Life Noise Insulation Resistance ELECTRICAL SPECIFICATIONS Test Condition -55°C to +125°C -55°C to +125°C @ 70°C (D erate linearly to zero @ 150° C ) Method 107 MIL-STD -202F 100 Hrs @ 150° C A m b i e n t Method 106 MIL-STD -202F Method 108 MIL-STD -202F (125° C / 1 0 0 0 h r ) Method 308 MIL-STD -202F @ 25° C ±250ppm/°C 100Vdc 250mw ±0.25% @ ∆R ±0.25% ∆R ±0.5% ∆R ±0.5% ∆R -20dB 1 × 1 0 12 Ω Max Max Max Max Max Max Max Max Min Part Number 110 R 110 R 110 R 110 R 110 R 110 R 110 R 110 R 110 1X 2 7 51X 550 1X 110 2 X 2 7 52 X 550 2 X 110 3 X 2 7 53 X VALUES Total Nominal/Single Resistance Element of Resistance 110 0 Ω 2 7 50 Ω 550 0 Ω 110 0 0 Ω 2 7 500 Ω 550 0 0 Ω 110 0 0 0 Ω 2 7 50 0 0 Ω 10 25 50 10 0 2 50 50 0 10 0 0 2 50 0 Formats Die Size: 34±3 mils square Bonding Pads: 4x4 mils typical ME CHANICAL SP E CIFICATIONS Substrate Isolation Layer Backing Metalization Silicon 10±2 mils thick Si02 100,000Å thick, min Lapped (gold optional) Aluminum 10,000Å thick, min (15,000Å gold optional) PACKAGING Two inch square trays of 400 chips maximum. NOTES 1. The tolerance applies to the total resistance value only. 2. Resistor pattern may vary from one value to another. 110R Series 5502 Value First 3 digits are significant value. Last digit represents number of zeros. R indicates decimal point PART NUMBER DESIGNATION X G Tolerance G = ±2% J = ±5% K = ±10% M = ±20% Bond Pads G = Go l d No Letter = Aluminum Backing W = Go l d L = Lapped No Letter = Either W © 2002 California Micro Devices Corp. All rights reserved. 3/02 C0730400 215 Topaz Street, Milpitas, California 95035 Tel: (408) 263-3214 Fax: (408) 263-7846 www.calmicro.com 
110R1103X 价格&库存

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