CM1205

CM1205 ESD Protection Arrays, Chip Scale Package Features • Functionally and pin compatible with CAMD’s PACDN1404C, PACDN1408C and PACDN1416C family of ESD protection devices 4, 8, or 16 transient voltage suppressors in a single package OptiguardTM coated for improved reliability at assembly In-system Electrostatic Discharge (ESD) protection to +25kV contact discharge per IEC 61000-4-2 international standard Compact Chip Scale Package (0.65mm pitch) format saves board space and eases layout in space critical applications compared to discrete solutions and traditional wire bonded packages Lead-free versions available Product Description The CM1205 family of transient voltage suppressor arrays provides a very high level of protection for sensitive electronic components that may be subjected to ESD. These devices are designed and characterized to safely dissipate ESD strikes at levels well beyond the maximum requirements set forth in the IEC 61000-4-2 international standard (Level 4, +8kV contact discharge). All I/Os are rated at +25kV using the IEC 61000-4-2 contact discharge method. Using the MILSTD-883D (Method 3015) specification for Human Body Model (HBM) ESD, all pins are protected for contact discharges to greater than +30kV. The Chip Scale Package format of these devices enable extremely small footprints that are necessary in portable electronics such as cellular phones, PDAs, internet appliances and PCs. The large solder bumps allow for standard attachment to laminate boards without the use of underfill. The CM1205 features OptiGuardTM coating for improved reliability at assembly and is available with optional lead-free finishing. • • • • • Applications • • • • • • • • ESD protection for sensitive electronic equipment I/O port, keypad and button circuitry protection for portable devices Wireless Handsets Handheld PCs / PDAs MP3 Players Digital Cameras and Camcorders Notebooks Desktop PCs Electrical Schematic B1 B2 B3 B1 B2 B3 B4 B5 D1 D2 D3 D4 D5 A1 A2 A3 A1 A2 A3 A4 A5 C1 B1 C2 B2 C3 B3 C4 B4 C5 B5 CM1205-04CS/CP CM1205-08CS/CP A1 A2 A3 A4 A5 CM1205-16CS/CP © 2003 California Micro Devices Corp. All rights reserved. 11/17/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 L Tel: 408.263.3214 L Fax: 408.263.7846 L www.calmicro.com 1 CM1205 PACKAGE / PINOUT DIAGRAMS TOP VIEW (Bumps Down View) Orientation Marking (see note 2) BOTTOM VIEW (Bumps Up View) 1 A B 2 3 B1 A1 B2 A2 B3 A3 L05 CM1405-04 CSP Package TOP VIEW (Bumps Down View) BOTTOM VIEW (Bumps Up View) Orientation Marking (see note 2) 1 A B 2 3 4 5 B1 A1 B2 A2 B3 A3 B4 A4 B5 A5 120508 CM1405-08 CSP Package TOP VIEW (Bumps Down View) BOTTOM VIEW (Bumps Up View) Orientation Marking (see note 2) 1 A B C D 2 3 4 5 D1 D2 C2 B2 A2 D3 C3 B3 A3 D4 C4 B4 A4 D5 C5 B5 A5 120516 CM1405-16 CSP Package C1 B1 A1 Notes: 1) These drawings are not to scale. 2) Lead-free devices are specified by using a "+" character for the top side orientation mark. Ordering Information PART NUMBERING INFORMATION Standard Finish Bumps 6 10 20 Package CSP CSP CSP Ordering Part Number1 CM1205-04CS CM1205-08CS CM1205-16CS Part Marking L05 120508 120516 Lead-free Finish2 Ordering Part Number1 CM1205-04CP CM1205-08CP CM1205-16CP Part Marking L05 120508 120516 Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark. © 2003 California Micro Devices Corp. All rights reserved. 2 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 L Tel: 408.263.3214 L Fax: 408.263.7846 L www.calmicro.com 11/17/03 CM1205 Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER Storage Temperature Range RATING -65 to +150 UNITS °C STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range RATING -40 to +85 UNITS °C ELECTRICAL OPERATING CHARACTERISTICS1 SYMBOL VREV ILEAK VSIG PARAMETER Reverse Standoff Voltage Leakage Current Signal Clamp Voltage Positive Clamp Negative Clamp In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 Clamping Voltage during ESD Discharge MIL-STD-883 (Method 3015), 8kV Positive Transients Negative Transients Channel Capacitance CONDITIONS IDIODE=10µA VIN=3.3V DC ILOAD = 10mA 5.6 -1.2 Notes 2 & 3 +30 +25 Notes 2 & 3 +12 -8 At 2.5V DC, f = 1MHz 39 47 V V pF kV kV 6.8 -0.8 8.0 -0.4 V V MIN 5.5 100 TYP MAX UNITS V nA VESD VCL C Note 1: TA=25°C unless otherwise specified. GND in this document refers to the lower supply voltage. Note 2: ESD applied to channel pins with respect to GND, one at a time. All other channels are open. All GND pins tied to ground. Note 3: These parameters are guaranteed by design and characterization. © 2003 California Micro Devices Corp. All rights reserved. 11/17/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 L Tel: 408.263.3214 L Fax: 408.263.7846 L www.calmicro.com 3 CM1205 Application Information Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages offered by California Micro Devices. PRINTED CIRCUIT BOARD RECOMMENDATIONS PARAMETER Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Flux Ratio Solder Paste Type Pad Protective Finish Tolerance — Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous Soldering Maximum Temperature VALUE 0.300mm Round Non-Solder Mask defined pads 0.350mm Round 0.125 - 0.150mm 0.360mm Round 50/50 by volume No Clean OSP (Entek Cu Plus 106A) +50µm +20µm 60 seconds 260°C Non-Solder Mask Defined Pad 0.300mm DIA. Solder Stencil Opening 0.360mm DIA. Solder Mask Opening 0.350mm DIA. Figure 1. Recommended Non-Solder Mask Defined Pad Illustration 250 Temperature (°C) 200 150 100 50 0 1:00.0 2:00.0 3:00.0 Time (minutes) 4:00.0 Figure 2. Eutectic (SnPb) Solder Ball Reflow Profile © 2003 California Micro Devices Corp. All rights reserved. Figure 3. Lead-free (SnAgCu) Solder Ball Reflow Profile 4 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 L Tel: 408.263.3214 L Fax: 408.263.7846 L www.calmicro.com 11/17/03 CM1205 Mechanical Details The CM1205 devices are packaged in custom Chip Scale Packages (CSP). CM1205-04CS/CP 6-bump CSP Mechanical Specifications The CM1205-04CS/CP devices are packaged in a 6bump custom Chip Scale Package (CSP). Dimensions are presented below. Mechanical Package Diagrams BOTTOM VIEW A1 C1 B1 3 B3 B2 PACKAGE DIMENSIONS Package Bumps Dim A1 A2 B1 B2 B3 C1 C2 D1 D2 Millimeters Min 1.109 1.759 0.645 0.645 0.645 0.202 0.202 0.638 0.394 Nom 1.154 1.804 0.650 0.650 0.650 0.252 0.252 0.707 0.445 Max 1.199 1.849 0.655 0.655 0.655 0.302 0.302 0.776 0.495 Min Custom CSP 6 Inches Nom Max 0.0437 0.0454 0.0472 0.0693 0.0710 0.0728 0.0254 0.0256 0.0258 0.0254 0.0256 0.0258 0.0254 0.0256 0.0258 0.0080 0.0099 0.0119 0.0080 0.0099 0.0119 0.0251 0.0278 0.0306 0.0155 0.0175 0.0195 3500 pieces OptiGuardTM Coating A2 2 1 B A C2 D1 D2 0.35 DIA. 63/37 Sn/Pb (Eutectic) or 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) SOLDER BUMPS SIDE VIEW NOTE: DIMENSIONS IN MILLIMETERS # per tape and reel Package Dimensions for CM1205-04CS/CP 6-bump Chip Scale Package Controlling dimension: millimeters CSP Tape and Reel Specifications POCKET SIZE (mm) B0 X A0 X K0 1.98 X 1.32 X 0.91 TAPE WIDTH W 8mm REEL DIA. 178mm (7") QTY PER REEL 3500 PART NUMBER CM1205-04CS/CP CHIP SIZE (mm) 1.804 X 1.154 X 0.644 P0 4mm P1 4mm Po Top Cover Tape 10 Pitches Cumulative Tolerance On Tape ±0.2 mm Ao W Ko Bo For tape feeder reference only including draft. Concentric around B. Embossment P1 User Direction of Feed Center Lines of Cavity Figure 4. Tape and Reel Mechanical Data © 2003 California Micro Devices Corp. All rights reserved. 11/17/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 L Tel: 408.263.3214 L Fax: 408.263.7846 L www.calmicro.com 5 CM1205 Mechanical Details (cont’d) CM1205-08CS/CP 10-bump CSP Mechanical Specifications The CM1205-08CS/CP devices are packaged in a 10bump custom Chip Scale Package (CSP). Dimensions are presented below. Mechanical Package Diagrams BOTTOM VIEW A1 C1 B1 5 B2 PACKAGE DIMENSIONS Package Bumps Dim A1 A2 B1 B2 C1 C2 D1 D2 Millimeters Min 1.109 3.059 0.645 0.645 0.202 0.202 0.638 0.394 Nom 1.154 3.104 0.650 0.650 0.252 0.252 0.707 0.445 Max 1.199 3.149 0.655 0.655 0.302 0.302 0.776 0.495 Min Custom CSP 10 Inches Nom Max 0.0437 0.0454 0.0472 0.1204 0.1222 0.1240 0.0254 0.0256 0.0258 0.0254 0.0256 0.0258 0.0080 0.0099 0.0119 0.0080 0.0099 0.0119 0.0251 0.0278 0.0306 0.0155 0.0175 0.0195 3500 pieces OptiGuardTM Coating 4 3 2 1 B A D1 B A C2 A2 0.35 DIA. D2 63/37 Sn/Pb (Eutectic) or 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) SOLDER BUMPS SIDE VIEW # per tape and reel NOTE: DIMENSIONS IN MILLIMETERS Controlling dimension: millimeters Package Dimensions for CM1205-08CS/CP 10-bump Chip Scale Package CSP Tape and Reel Specifications POCKET SIZE (mm) B0 X A0 X K0 3.28 X 1.32 X 0.81 Po Top Cover Tape PART NUMBER CM1205-08CS/CP CHIP SIZE (mm) 3.104 X 1.154 X 0.644 TAPE WIDTH W 8mm REEL DIAMETER 178mm (7") QTY PER REEL 3500 P0 4mm P1 4mm 10 Pitches Cumulative Tolerance On Tape ±0.2 mm Ao W Ko Bo For tape feeder reference only including draft. Concentric around B. Embossment P1 User Direction of Feed Center Lines of Cavity Figure 5. Tape and Reel Mechanical Data © 2003 California Micro Devices Corp. All rights reserved. 6 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 L Tel: 408.263.3214 L Fax: 408.263.7846 L www.calmicro.com 11/17/03 CM1205 Mechanical Details (cont’d) CM1205-16CS/CP 20-bump CSP Mechanical Specifications The CM1205-16CS/CP devices are packaged in a 20bump custom Chip Scale Package (CSP). Dimensions are presented below. Mechanical Package Diagrams BOTTOM VIEW A1 C1 B1 5 PACKAGE DIMENSIONS Package Bumps Dim A1 A2 B1 B2 C1 C2 D1 D2 Millimeters Min 2.409 3.059 0.645 0.645 0.202 0.202 0.638 0.394 Nom 2.454 3.104 0.650 0.650 0.252 0.252 0.707 0.445 Max 2.499 3.149 0.655 0.655 0.302 0.302 0.776 0.495 Min Custom CSP 20 Inches Nom Max 0.0948 0.0966 0.0984 0.1204 0.1222 0.1240 0.0254 0.0256 0.0258 0.0254 0.0256 0.0258 0.0080 0.0099 0.0119 0.0080 0.0099 0.0119 0.0251 0.0278 0.0306 0.0155 0.0175 0.0195 3500 pieces 2 1 OptiGuardTM Coating B2 4 A2 3 B A C2 D C B A D1 D2 0.35 DIA. 63/37 Sn/Pb (Eutectic) or 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) SOLDER BUMPS SIDE VIEW # per tape and reel DIMENSIONS IN MILLIMETERS Controlling dimension: millimeters Package Dimensions for CM1205-16CS/CP 20-bump Chip Scale Package CSP Tape and Reel Specifications POCKET SIZE (mm) B0 X A0 X K0 3.28 X 2.64 X 0.86 Po Top Cover Tape PART NUMBER CM1205-16CS/CP CHIP SIZE (mm) 3.104 X 2.454 X 0.644 TAPE WIDTH W 8mm REEL DIAMETER 178mm (7") QTY PER REEL 3500 P0 4mm P1 4mm 10 Pitches Cumulative Tolerance On Tape ±0.2 mm Ao W Ko Bo For tape feeder reference only including draft. Concentric around B. Embossment P1 User Direction of Feed Center Lines of Cavity Figure 6. Tape and Reel Mechanical Data © 2003 California Micro Devices Corp. All rights reserved. 11/17/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 L Tel: 408.263.3214 L Fax: 408.263.7846 L www.calmicro.com 7