CM1210-08MS

CM1210 1, 2, 4 and 8-Channel Very Low Capacitance ESD Protectors Features • • • • • 1,2,4 and 8 channels of ESD protection Very low loading capacitance (1.0pF typical) +6 kV ESD protection per channel (IEC 61000-4-2 standard) Available in SOT23, SOT143, SC70 and MSOP packages Lead-free versions available Product Description The CM1210 family of diode arrays has been designed to provide ESD protection for electronic components or sub-systems requiring minimal capacitive loading. These devices are ideal for protecting systems with high data and clock rates or for circuits requiring low capacitive loading. Each ESD channel consists of a pair of diodes which will steer the ESD current pulse to either the positive (VP) or negative (VN) supply rail. The CM1210 will protect against ESD pulses up to +6KV per the IEC 61000-4-2 standard. This device is particularly well-suited for systems using high-speed port implementations such as USB2.0, IEEE1394 (Firewire, i.Link), Gigabit Ethernet and corresponding ports in removable storage, digital camcorders, DVD-RW drives and other applications where extremely low loading capacitance with ESD protection are required in a small package footprint. The CM1210 family of devices is optionally available with lead-free finishing. Applications • • • • • • USB2.0 ports at 480Mbps IEEE1394 Firewire ports at 400Mbps Gigabit Ethernet ports Flat panel display interfaces Wireless antennas General purpose high-speed data line ESD protection Electrical Schematics VP VP CH4 VP CH3 CH1 CH1 CH2 VN CM1210-01ST/SO CM1210-01SC/S7 VN CM1210-02ST/SO CM1210-02SC/S7 CH1 VN CH2 CM1210-04ST/SO CH8 CH7 VP CH6 CH5 CH1 CH2 CH3 CM1210-08MS/MR CH4 VN © 2004 California Micro Devices Corp. All rights reserved. 01/14/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 L Tel: 408.263.3214 L Fax: 408.263.7846 L www.calmicro.com 1 CM1210 PACKAGE / PINOUT DIAGRAMS Top View CH1 1 CH1 Top View 1 VN 3 VN CH1 Top View 1 4 VP D10/D102 D10/D111 D10/D101 2 3 VN VP 2 VP 2 3 CH2 3-Pin SOT23-3 3-Pin SC70-3 4-Pin SOT143-4 Top View VN VN VP 1 5 CH2 CH1 VN 4 CH1 CH2 Top View 1 6 CH4 VP CH3 CH1 CH2 CH3 CH4 VN Top View 1 10 CH8 CH7 VP CH6 CH5 D10/D112 D10/D108 2 3 4 5 9 8 7 6 D10/D104 2 3 2 3 5 4 5-pin SC70-5 6-pin SOT23-6 10-pin MSOP-10 Note: These drawings are not to scale. SOT23-3 & SC70-3 PACKAGE PIN DESCRIPTIONS PIN 1 2 3 NAME CH1 VP VN TYPE I/O PWR GND DESCRIPTION ESD Channel Positive voltage supply rail Negative voltage supply rail SOT143-4 PACKAGE PIN DESCRIPTIONS PIN 1 2 3 4 NAME VN CH1 CH2 VP TYPE GND I/O I/O PWR DESCRIPTION Negative voltage supply rail ESD Channel ESD Channel Positive voltage supply rail SC70-5 PACKAGE PIN DESCRIPTIONS PIN 1 2 3 4 5 NAME VN VN VP CH1 CH2 TYPE GND GND PWR I/O I/O DESCRIPTION Negative voltage supply rail Negative voltage supply rail Positive voltage supply rail ESD Channel ESD Channel MSOP-10 PACKAGE PIN DESCRIPTIONS PIN 1 2 3 4 5 6 7 8 9 10 NAME CH1 CH2 CH3 CH4 VN CH5 CH6 VP CH7 CH8 TYPE I/O I/O I/O I/O GND I/O I/O PWR I/O I/O DESCRIPTION ESD Channel ESD Channel ESD Channel ESD Channel Negative voltage supply rail ESD Channel ESD Channel Positive voltage supply rail ESD Channel ESD Channel SOT23-6 PACKAGE PIN DESCRIPTIONS PIN 1 2 3 4 5 6 NAME CH1 VN CH2 CH3 VP CH4 TYPE I/O GND I/O I/O PWR I/O DESCRIPTION ESD Channel Negative voltage supply rail ESD Channel ESD Channel Positive voltage supply rail ESD Channel © 2004 California Micro Devices Corp. All rights reserved. 2 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 L Tel: 408.263.3214 L Fax: 408.263.7846 L www.calmicro.com 01/14/04 CM1210 Ordering Information PART NUMBERING INFORMATION Standard Finish Ordering Part Pins 3 3 4 5 6 10 Package SOT23-3 SC70-3 SOT143-4 SC70-5 SOT23-6 MSOP-10 Number1 CM1210-01ST CM1210-01SC CM1210-02ST CM1210-02SC CM1210-04ST CM1210-08MS Part Marking D10 D10 D10 D10 D10 D10 Lead-free Finish Ordering Part Number1 CM1210-01SO CM1210-01S7 CM1210-02SO CM1210-02S7 CM1210-04SO CM1210-08MR Part Marking D101 D111 D102 D112 D104 D108 Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER Supply Voltage (VP - VN) Diode Forward DC Current (Note 1) Operating Temperature Range Storage Temperature Range DC Voltage at any channel input Package Power Rating SOT23-3 Package (CM1210-01ST/SO) SC70-3 Package (CM1210-01SC/S7) SOT143 Package (CM1210-02ST/SO) SC70-5 Package (CM1210-02SC/S7) SOT23-6 Package (CM1210-04ST/SO) MSOP10 Package (CM1210-08MS/MR) Note 1: Only one diode conducting at a time. RATING 8.0 8 -40 to +85 -65 to +150 (VN - 0.5) to (VP + 0.5) 225 200 225 200 225 400 UNITS V mA °C °C V mW mW mW mW mW mW STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range Operating Supply Voltage (VP - VN) RATING -40 to +85 0 to 5.5 UNITS °C V © 2004 California Micro Devices Corp. All rights reserved. 01/14/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 L Tel: 408.263.3214 L Fax: 408.263.7846 L www.calmicro.com 3 CM1210 ELECTRICAL OPERATING CHARACTERISTICS (SEE NOTE 1) SYMBOL IP VF PARAMETER Supply Current Diode Forward Voltage Top Diode Bottom Diode Channel Leakage Current Channel Input Capacitance ESD Protection Peak Discharge Voltage at any channel input, in system a) Contact discharge per IEC 61000-4-2 standard Channel Clamp Voltage CM1210-01ST, CM1210-01SC, CM1210-02ST, CM1210-02SC Positive Transients Negative Transients Channel Clamp Voltage CM1210-04ST, CM1210-08MS Positive Transients Negative Transients At 1 MHz, VP=3.3V, VN=0V, VIN=1.65V; Note 2 applies Notes 2,3 and 5; TA=25°C + 6 At 8kV ESD HBM; Notes 2 & 4 CONDITIONS (VP-VN)=3.3V IF = 8mA 0.60 0.60 0.80 0.80 +0.1 1.0 0.95 0.95 +1.0 1.3 V V µA pF MIN TYP MAX 8.0 UNIT S µA ILEAK CIN VESD kV VCL VP + 10.0 VN - 10.0 At 8kV ESD HBM; Notes 2 & 4 VP + 13.0 VN - 13.0 V V V V Note 1: All parameters specified at TA = -40°C to +85°C unless otherwise noted. Note 2: These parameters guaranteed by design and characterization. Note 3: From I/O pins to VP or VN only. VP bypassed to VN with a 0.22µF ceramic capacitor (see Application Information for more details). Note 4: Human Body Model per MIL-STD-883, Method 3015, CDischarge = 100pF, RDischarge = 1.5KΩ, VP = 3.3V, VN grounded. Note 5: Standard IEC 61000-4-2 with CDischarge = 150pF, RDischarge = 330Ω VP = 3.3V, VN grounded. , © 2004 California Micro Devices Corp. All rights reserved. 4 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 L Tel: 408.263.3214 L Fax: 408.263.7846 L www.calmicro.com 01/14/04 CM1210 Performance Information Input Channel Capacitance Performance Curves 2 Input Capacitance (pF) 1.5 1 0.5 0 0 0.5 1 1.5 2 2.5 3 Input Voltage (V) Typical Variation of CIN vs. VIN (f=1MHz, VP = 3.3V, V N = 0V, 0.1 µF chip capacitor between VP and V N, 25°C ) 1.25 1.20 1.15 1.10 1.05 1.00 0.95 0.90 0.85 0.80 0.75 -50 -25 0 25 Input Capacitance (pF) 0V DC Input Bias 1.65V DC Input Bias 50 75 100 Temperature (°C) Typical Variation of CIN vs. Temp (f=1MHz, VIN=30mV, V P = 3.3V, V N = 0V, 0.1 µF chip capacitor between VP and VN) © 2004 California Micro Devices Corp. All rights reserved. 01/14/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 L Tel: 408.263.3214 L Fax: 408.263.7846 L www.calmicro.com 5 CM1210 Performance Information (Cont’d) Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment) TEST CIRCUIT P1 P2 VP(3.3V) I/On GND Figure 1. Insertion Loss (S21) VS. Frequency (0V DC Bias, VP=3.3V) TEST CIRCUIT P1 P2 VP(3.3V) I/On GND Figure 2. Insertion Loss (S21) VS. Frequency (2.5V DC Bias, VP=3.3V) © 2004 California Micro Devices Corp. All rights reserved. 6 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 L Tel: 408.263.3214 L Fax: 408.263.7846 L www.calmicro.com 01/14/04 CM1210 Application Information Design Considerations In order to realize the maximum protection against ESD pulses, care must be taken in the PCB layout to minimize parasitic series inductances on the Supply/ Ground rails as well as the signal trace segment between the signal input (typically a connector) and the ESD protection device. Refer to Figure 3, which illustrates an example of a positive ESD pulse striking an input channel. The parasitic series inductance back to the power supply is represented by L 1 and L2. The voltage VCL on the line being protected is: VCL = Fwd voltage drop of D1 + VSUPPLY + L1 x d(IESD ) / dt + L2 x d(IESD ) / dt a ROUT of 1 ohm would result in a 10V increment in VCL for a peak IESD of 10A. If the inductances and resistance described above are close to zero, the rail-clamp ESD protection diodes will do a good job of protection. However, since this is not possible in practical situations, a bypass capacitor must be used to absorb the very high frequency ESD energy. So for any brand of rail-clamp ESD protection diodes, a bypass capacitor should be connected between the VP pin of the diodes and the ground plane (VN pin of the diodes) as shown in the Application Circuit diagram below. A value of 0.22µF is adequate. Ceramic chip capacitors mounted with short printed circuit board traces are good choices for this application. Electrolytic capacitors should be avoided as they have poor high frequency characteristics. For extra protection, connect a zener diode in parallel with the bypass capacitor to mitigate the effects of the parasitic series inductance inherent in the capacitor. The breakdown voltage of the zener diode should be slightly higher than the maximum supply voltage. As a general rule, the ESD Protection Array should be located as close as possible to the point of entry of expected electrostatic discharges. The power supply bypass capacitor mentioned above should be as close to the VP pin of the Protection Array as possible, with minimum PCB trace lengths to the power supply, ground planes and between the signal input and the ESD device to minimize stray series inductance. where IESD is the ESD current pulse, and VSUPPLY is the positive supply voltage. An ESD current pulse can rise from zero to its peak value in a very short time. As an example, a level 4 contact discharge per the IEC61000-4-2 standard results in a current pulse that rises from zero to 30 Amps in 1ns. Here d(IESD)/dt can be approximated by ∆IESD/∆t, or 30/(1x10 -9). So just 910nH of series inductance (L1 and L2 combined) will lead to a 300V increment in VCL! Similarly for negative ESD pulses, parasitic series inductance from the VN pin to the ground rail will lead to drastically increased negative voltage on the line being protected. Another consideration is the output impedance of the power supply for fast transient currents. Most power supplies exhibit a much higher output impedance to fast transient current spikes. In the VCL equation above, the VSUPPLY term, in reality, is given by (VDC + IESD x ROUT), where VDC and ROUT are the nominal supply DC output voltage and effective output impedance of the power supply respectively. As an example, VP Additional Information See also California Micro Devices Application Notes AP209, “Design Considerations for ESD Protection” and APxxx, "ESD Protection for USB 2.0 Systems". L2 POSITIVE SUPPLY RAIL PATH OF ESD CURRENT PULSE IESD 0.22µF D1 ONE CHANNEL OF CM1210 L1 CHANNEL INPUT 20A LINE BEING PROTECTED D2 SYSTEM OR CIRCUITRY BEING PROTECTED VCL GROUND RAIL 0A VN Figure 3. Application of Positive ESD Pulse between Input Channel and Ground © 2004 California Micro Devices Corp. All rights reserved. 01/14/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 L Tel: 408.263.3214 L Fax: 408.263.7846 L www.calmicro.com 7 CM1210 Mechanical Details The CM1210 is available in SOT23-3, SC70-3, SC705, SOT23-6, SOT143-4 and MSOP-10 packages.The various package drawings are presented below. SOT23-3 Mechanical Specifications Dimensions for CM1210 devices packaged in 3-pin SOT23 packages are presented below. For complete information on the SOT23-3 package, see the California Micro Devices SOT23 Package Information document. Mechanical Package Diagrams TOP VIEW b 3 PACKAGE DIMENSIONS Package Pins Dimensions A A1 b c D E E1 e e1 L L1 # per tape and reel Millimeters Min 0.89 0.01 0.30 0.08 2.80 2.10 1.20 Max 1.12 0.10 0.50 0.20 3.04 2.64 1.40 Min 0.0350 0.0004 0.0118 0.0031 0.1102 0.0827 0.0472 SOT23-3 (JEDEC name is TO-236) 3 Inches Max 0.0441 0.0039 0.0197 0.0079 0.1197 0.1039 0.0551 D SIDE VIEW 1 2 E1 E e1 e A1 A 0.95 BSC 1.90 BSC 0.40 0.60 0.54 REF 0.0374 BSC 0.0748 BSC 0.0157 0.0236 0.0213 REF 3000 pieces c L1 L END VIEW Controlling dimension: millimeters Package Dimensions for SOT23-3. © 2004 California Micro Devices Corp. All rights reserved. 8 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 L Tel: 408.263.3214 L Fax: 408.263.7846 L www.calmicro.com 01/14/04 CM1210 Mechanical Details (cont’d) SOT23-6 Mechanical Specifications CM1210 devices are packaged in 6-pin SOT23 packages. Dimensions are presented below. For complete information on the SOT23-6 package, see the California Micro Devices SOT23 Package Information document. Mechanical Package Diagrams TOP VIEW e1 e 6 5 4 PACKAGE DIMENSIONS Package Pins Dimensions A A1 b c D E E1 e e1 L L1 # per tape and reel Millimeters Min -0.00 0.30 0.08 2.75 2.60 1.45 Max 1.45 0.15 0.50 0.22 3.05 3.00 1.75 Min -0.0000 0.0118 0.0031 0.1083 0.1024 0.0571 SOT23-6 (JEDEC name is MO-178) 6 Inches Max 0.0571 0.0059 0.0197 0.0087 0.1201 0.1181 0.0689 Pin 1 Marking E1 E 1 2 3 b SIDE VIEW D A A1 END VIEW 0.95 BSC 1.90 BSC 0.30 0.60 0.60 REF 0.0374 BSC 0.0748 BSC 0.0118 0.0236 c L1 L 0.0236 REF 3000 pieces Controlling dimension: millimeters Package Dimensions for SOT23-6. © 2004 California Micro Devices Corp. All rights reserved. 01/14/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 L Tel: 408.263.3214 L Fax: 408.263.7846 L www.calmicro.com 9 CM1210 Mechanical Details (cont’d) SOT143 Mechanical Specifications Dimensions for CM1210 devices packaged in 4-pin SOT143 packages are presented below. For complete information on the SOT143 package, see the California Micro Devices SOT143 Package Information document. Mechanical Package Diagrams TOP VIEW e 4 3 PACKAGE DIMENSIONS Package Pins Dimensions A A1 b b2 c D E E1 e e1 L L1 # per tape and reel Millimeters Min 0.80 0.05 0.30 0.76 0.08 2.80 2.10 1.20 Max 1.22 0.15 0.50 0.89 0.20 3.04 2.64 1.40 Min 0.031 0.002 0.012 0.030 0.003 0.110 0.082 0.047 SOT143 4 Inches Max 0.048 0.006 0.019 0.035 0.008 0.119 0.103 0.055 END VIEW b2 b D SIDE VIEW e1 1 2 E1 E A A1 1.92 BSC 0.20 BSC 0.4 0.6 0.54 REF 0.075 BSC 0.008 BSC 0.016 0.024 c 0.021 REF 3000 pieces L Controlling dimension: millimeters L1 Package Dimensions for SOT143. © 2004 California Micro Devices Corp. All rights reserved. 10 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 L Tel: 408.263.3214 L Fax: 408.263.7846 L www.calmicro.com 01/14/04 CM1210 Mechanical Details (cont’d) SC70-3 Mechanical Specifications Dimensions for CM1210 devices packaged in 3-pin SC70 packages are presented below. For complete information on the SC70-3 package, see the California Micro Devices SC70 Package Information document. Mechanical Package Diagrams TOP VIEW B 3 PACKAGE DIMENSIONS 1 2 E1 E Package Pins Dimensions A A1 A2 B c D E1 e E L # / tape and reel SC70-3 (JEDEC name is MO-203 Issue A) 3 Millimeters Min 0.80 0.00 0.70 0.15 0.08 1.85 1.15 0.65 BSC 2.00 0.26 3000 pieces 2.40 0.46 c Max 1.10 0.10 1.00 0.30 0.25 2.25 1.35 END VIEW A1 A2 A SIDE VIEW D e e L Package Dimensions for SC70-3. © 2004 California Micro Devices Corp. All rights reserved. 01/14/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 L Tel: 408.263.3214 L Fax: 408.263.7846 L www.calmicro.com 11 CM1210 Mechanical Details (cont’d) SC70-5 Mechanical Specifications: Dimensions for CM1210 devices packaged in 5-pin SC70 packages are presented below. For complete information on the SC70-5 package, see the California Micro Devices SC70 Package Information document. Mechanical Package Diagrams TOP VIEW e e 5 4 PACKAGE DIMENSIONS Package Pins Dimensions A A1 A2 B c D E1 e E L # / tape and reel 2.00 0.26 3000 pieces Min 0.80 0.00 0.70 0.15 0.08 1.85 1.15 0.65 BSC 2.40 0.46 c SC70-5 (JEDEC name is MO-203 Issue A) 5 Millimeters Max 1.10 0.10 1.00 0.30 0.25 2.25 1.35 E1 E 1 2 3 B SIDE VIEW D A2 A A1 END VIEW L Package Dimensions for SC70-5. © 2004 California Micro Devices Corp. All rights reserved. 12 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 L Tel: 408.263.3214 L Fax: 408.263.7846 L www.calmicro.com 01/14/04 CM1210 Mechanical Details (cont’d) MSOP Mechanical Specifications CM1210 devices are packaged in 10-pin MSOP packages. Dimensions are presented below. For complete information on the MSOP-10 package, see the California Micro Devices MSOP Package Information document. 10 Mechanical Package Diagrams TOP VIEW D 9 8 7 6 PACKAGE DIMENSIONS Package Pins Dimensions A A1 B C D E e H L # per tube # per tape and reel 2.90 2.90 4.76 0.40 Millimeters Min 0.75 0.05 0.18 0.18 3.10 3.10 5.00 0.70 0.114 0.114 0.187 0.0137 4000 Controlling dimension: inches * This is an approximate number which may vary. MSOP 10 Inches Min 0.028 0.002 0.006 Max 0.038 0.006 0.016 0.007 0.122 0.122 0.197 0.029 END VIEW SIDE VIEW 1 2 3 4 5 H Pin 1 Marking E Max 0.95 0.15 0.40 A SEATING PLANE 0.50 BSC 0.0196 BSC A1 B e 80 pieces* C L Package Dimensions for MSOP-10 © 2004 California Micro Devices Corp. All rights reserved. 01/14/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 L Tel: 408.263.3214 L Fax: 408.263.7846 L www.calmicro.com 13