CM1213-06SM

CM1213 1, 2, 4, 6 and 8-Channel Low Capacitance ESD Protection Arrays Features • • • • • • • • • • 1, 2, 4, 6 and 8 channels of ESD protection Provides ESD protection to IEC61000-4-2 Level 4 - 8kV contact discharge - 15kV air discharge Low channel input capacitance of 1.0pF typical Minimal capacitance change with temperature and voltage Channel input capacitance matching of 0.02pF typical is ideal for differential signals Mutual capacitance between signal pin and adjacent signal pin - 0.11pF typical Zener diode protects supply rail and eliminates the need for external by-pass capacitors Each I/O pin can withstand over 1000 ESD strikes Available in SOT, SOIC and MSOP packages Lead-free version available Product Description The CM1213 family of diode arrays has been designed to provide ESD protection for electronic components or sub-systems requiring minimal capacitive loading. These devices are ideal for protecting systems with high data and clock rates or for circuits requiring low capacitive loading. Each ESD channel consists of a pair of diodes in series which steer the positive or negative ESD current pulse to either the positive (VP) or negative (VN) supply rail. A Zener diode is embedded between VP and VN, offering two advantages. First, it protects the VCC rail against ESD strikes, and second, it eliminates the need for a bypass capacitor that would otherwise be needed for absorbing positive ESD strikes to ground. The CM1213 will protect against ESD pulses up to ±8kV per the IEC 61000-4-2 standard and using the MIL-STD-883D (Method 3015) specification for Human Body Model (HBM) ESD, all pins are protected from contact discharges of greater than ±15kV. These devices are particularly well-suited for protecting systems using high-speed ports such as USB2.0, IEEE1394 (Firewire®, iLink™), Serial ATA, DVI, HDMI and corresponding ports in removable storage, digital camcorders, DVD-RW drives and other applications where extremely low loading capacitance with ESD protection are required in a small package footprint. The CM1213 family of devices is available with optional lead-free finishing. Applications • • • • • • USB2.0 ports at 480Mbps in desktop PCs, notebooks and peripherals IEEE1394 Firewire® ports at 400Mbps / 800Mbps DVI ports, HDMI ports in notebooks, set top boxes, digital TVs, LCD displays Serial ATA ports in desktop PCs and hard disk drives PCI Express ports General purpose high-speed data line ESD protection Electrical Schematics VP VP CH4 VP CH3 N.C. N.C. VP N.C. N.C. CH1 CH1 CH2 VN CM1213-01ST/SO CH6 VN CM1213-02ST/SO CM1213-02SS/SR VP CH5 CH4 CH1 VN CH2 CH1 CH2 VN CH3 CH4 CM1213-04ST/SO CM1213-04MS/MR CH8 CH7 VP CM1213-A4MR CH6 CH5 CH1 CH2 VN CH3 CH1 CH2 VN CH3 CH4 CM1213-06MS/MR CM1213-06SN/SM CM1213-08MS/MR © 2006 California Micro Devices Corp. All rights reserved. 03/02/06 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 1 CM1213 PACKAGE / PINOUT DIAGRAMS Top View CH1 1 VN Top View 1 4 Top View VP NC VN CH2 CH1 1 2 3 5 Top View VP CH1 VN CH2 CH2 1 2 3 6 CH4 VP CH3 Top View CH1 CH2 VN 1 8 CH6 VP D121 / D131 VP 2 D123 / D133 D124 / D134 D122 / D132 D126 / D136 3 VN CH1 2 5 4 2 3 4 7 6 5 CH5 CH4 3 4 CH3 3-Lead SOT23-3 4-Lead SOT143-4 5-Lead SOT23-5 6-Lead SOT23-6 8-Lead SOIC-8 Top View Top View CH1 CH2 VN Top View NC CH4 VN Top View NC NC VP CH1 CH6 VP 1 2 3 4 5 10 9 8 7 6 CH1 CH2 VN 1 2 3 4 5 10 9 8 7 6 CH1 CH2 CH3 CH4 VN 1 2 3 4 5 10 9 8 7 6 CH8 CH7 VP 1 8 NC VP S134 D124 / D134 D128 / D138 D127 / D137 2 3 4 7 6 5 CH5 CH4 CH2 NC NC CH3 CH3 CH4 NC NC CH6 CH5 CH3 8-Lead MSOP-8 10-Lead MSOP-10 10-Lead MSOP-10 10-Lead MSOP-10 Note: These drawings are not to scale. Pin Discriptions PIN 1 2 3 1-CHANNEL, 3-LEAD SOT23-3 PACKAGES NAME TYPE DESCRIPTION CH1 I/O ESD Channel VP PWR Positive voltage supply rail VN GND Negative voltage supply rail 4-CHANNEL, 6-LEAD SOT23-6 PACKAGE TYPE DESCRIPTION I/O ESD Channel GND Negative voltage supply rail CH2 I/O ESD Channel CH3 I/O ESD Channel VP PWR Positive voltage supply rail CH4 I/O ESD Channel PIN 1 2 3 4 2-CHANNEL, 4-LEAD SOT143-4 PACKAGE NAME TYPE DESCRIPTION VN GND Negative voltage supply rail CH1 I/O ESD Channel CH2 I/O ESD Channel VP PWR Positive voltage supply rail 2-CHANNEL, 5-LEAD SOT23-5 PACKAGE NAME TYPE DESCRIPTION NC VN CH1 CH2 VP GND I/O I/O PWR No Connect Negative voltage supply rail ESD Channel ESD Channel Positive voltage supply rail PIN 1 2 3 4 5 6 NAME CH1 VN PIN 1 2 3 4 5 PIN 1 2 3 4 5 6 7 8 4-CHANNEL, 10-LEAD MSOP-10 PACKAGE (CM1213-04MS/MR) PIN NAME TYPE DESCRIPTION 1 CH1 I/O ESD Channel 2 NC No Connect VP 3 PWR Positive voltage supply rail 4 CH2 I/O ESD Channel 5 NC No Connect 6 CH3 I/O ESD Channel 7 NC No Connect VN 8 GND Negative voltage supply rail 9 CH4 I/O ESD Channel 10 NC No Connect PIN 1 2 3 4 5 6 7 8 9 10 4-CHANNEL, 10-LEAD MSOP-10 PACKAGE (CM1213-A4MR) NAME TYPE DESCRIPTION CH1 I/O ESD Channel CH2 I/O ESD Channel VN GND Negative voltage supply rail CH3 I/O ESD Channel CH4 I/O ESD Channel NC No Connect NC No Connect VP PWR Positive voltage supply rail NC No Connect NC No Connect 6-CHANNEL, 8-LEAD MSOP-8/SOIC-8 PACKAGE NAME TYPE DESCRIPTION CH1 I/O ESD Channel CH2 I/O ESD Channel VN GND Negative voltage supply rail CH3 I/O ESD Channel CH4 I/O ESD Channel CH5 I/O ESD Channel VP PWR Positive voltage supply rail CH6 I/O ESD Channel 8-CHANNEL, 10-LEAD MSOP-10 PACKAGE (CM1213-08MS/MR) PIN NAME TYPE DESCRIPTION 1 CH1 I/O ESD Channel 2 CH2 I/O ESD Channel 3 CH3 I/O ESD Channel 4 CH4 I/O ESD Channel VN 5 GND Negative voltage supply rail 6 CH5 I/O ESD Channel 7 CH6 I/O ESD Channel VP PWR Positive voltage supply rail 8 9 CH7 I/O ESD Channel 10 CH8 I/O ESD Channel © 2006 California Micro Devices Corp. All rights reserved. 2 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 03/02/06 CM1213 Ordering Information PART NUMBERING INFORMATION Standard Finish # of Channels 1 2 2 4 4 4 6 6 8 Leads 3 4 5 6 10 10 8 8 10 Package SOT23-3 SOT143-4 SOT23-5 SOT23-6 MSOP-10 MSOP-10 SOIC-8 MSOP-8 MSOP-10 Ordering Part Number1 CM1213-01ST CM1213-02SS CM1213-02ST CM1213-04ST CM1213-04MS ⎯ CM1213-06SN CM1213-06MS CM1213-08MS Part Marking D121 D122 D123 D124 D124 ⎯ D126 D127 D128 Lead-free Finish Ordering Part Number1 CM1213-01SO CM1213-02SR CM1213-02SO CM1213-04SO CM1213-04MR CM1213-A4MR CM1213-06SM CM1213-06MR CM1213-08MR Part Marking D131 D132 D133 D134 D134 S134 D136 D137 D138 Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER Operating Supply Voltage (VP - VN) Operating Temperature Range Storage Temperature Range DC Voltage at any channel input RATING 6.0 -40 to +85 -65 to +150 (VN - 0.5) to (VP + 0.5) UNITS V °C °C V STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range Package Power Rating SOT23-3 Package (CM1213-01ST/SO) SOT143-4 Package (CM1213-02SS/SR) SOT23-5 Package (CM1213-02ST/SO) SOT23-6 Package (CM1213-04ST/SO) MSOP-8 Package (CM1213-06MS/MR) MSOP-10 Package (CM1213-08MS/MR, CM1213-04MS/MR, CM1213-A4MR) SOIC-8 Package (CM1213-06SN/SM) RATING -40 to +85 225 225 225 225 400 400 600 UNITS °C mW mW mW mW mW mW mW © 2006 California Micro Devices Corp. All rights reserved. 03/02/06 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 3 CM1213 ELECTRICAL OPERATING CHARACTERISTICS(SEE NOTE 1) SYMBOL PARAMETER VP IP VF Operating Supply Voltage (VP-VN) Operating Supply Current Diode Forward Voltage Top Diode Bottom Diode Channel Leakage Current Channel Input Capacitance Channel Input Capacitance Matching Mutual Capacitance between signal pin and adjacent signal pin ESD Protection Peak Discharge Voltage at any channel input, in system a) Contact discharge per IEC 61000-4-2 standard b) Human Body Model, MIL-STD-883, Method 3015 Channel Clamp Voltage Positive Transients Negative Transients Dynamic Resistance Positive Transients Negative Transients (VP-VN)=3.3V IF = 8mA; TA=25°C 0.60 0.60 0.80 0.80 ±0.1 1.0 0.02 0.11 CONDITIONS MIN TYP 3.3 MAX 5.5 8.0 0.95 0.95 ±1.0 1.5 UNITS V μA V V μA pF pF pF ILEAK CIN TA=25°C; VP=5V, VN=0V At 1 MHz, VP=3.3V, VN=0V, VIN=1.65V; Note 2 applies At 1 MHz, VP=3.3V, VN=0V, VIN=1.65V; Note 2 applies At 1 MHz, VP=3.3V, VN=0V, VIN=1.65V; Note 2 applies ΔCIN CMUTUAL VESD Notes 2, 4 & 5; TA=25°C Notes 2, 3 & 5; TA=25°C ±8 ±15 kV kV VCL TA=25°C, IPP = 1A, tP = 8/20uS; Notes 2, & 5 IPP = 1A, tP = 8/20uS Any I/O pin to Ground; Note 2 and 5 +8.8 -1.4 0.7 0.4 V V Ω Ω RDYN Note 1: Note 2: Note 3: Note 4: Note 5: All parameters specified at TA = -40°C to +85°C unless otherwise noted. These parameters guaranteed by design and characterization. Human Body Model per MIL-STD-883, Method 3015, CDischarge = 100pF, RDischarge = 1.5KΩ, VP = 3.3V, VN grounded. Standard IEC 61000-4-2 with CDischarge = 150pF, RDischarge = 330Ω, VP = 3.3V, VN grounded. These measurements performed with no external capacitor on VP (VP floating). © 2006 California Micro Devices Corp. All rights reserved. 4 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 03/02/06 CM1213 Performance Information Input Channel Capacitance Performance Curves 2 Input Capacitance (pF) 1.5 1 0.5 0 0 0.5 1 1.5 2 2.5 3 Input Voltage (V) Typical Variation of CIN vs. VIN (f=1MHz, VP = 3.3V, VN = 0V, 0.1 μF chip capacitor between VP and VN, 25°C) 1.25 1.20 1.15 1.10 1.05 1.00 0.95 0.90 0.85 0.80 0.75 -50 -25 0 25 Input Capacitance (pF) 0V DC Input Bias 1.65V DC Input Bias 50 75 100 Temperature (°C) Typical Variation of CIN vs. Temp (f=1MHz, VIN=30mV, VP = 3.3V, VN = 0V, 0.1 μF chip capacitor between VP and VN) © 2006 California Micro Devices Corp. All rights reserved. 03/02/06 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 5 CM1213 Performance Information (Cont’d) Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment) Figure 1. Insertion Loss (S21) VS. Frequency (0V DC Bias, VP=3.3V) Figure 2. Insertion Loss (S21) VS. Frequency (2.5V DC Bias, VP=3.3V) © 2006 California Micro Devices Corp. All rights reserved. 6 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 03/02/06 CM1213 Application Information Design Considerations In order to realize the maximum protection against ESD pulses, care must be taken in the PCB layout to minimize parasitic series inductances on the Supply/ Ground rails as well as the signal trace segment between the signal input (typically a connector) and the ESD protection device. Refer to Figure 3, which illustrates an example of a positive ESD pulse striking an input channel. The parasitic series inductance back to the power supply is represented by L1 and L2. The voltage VCL on the line being protected is: VCL = Fwd voltage drop of D1 + VSUPPLY + L1 x d(IESD ) / dt + L2 x d(IESD ) / dt inductance L2 on VCL by clamping VP at the breakdown voltage of the Zener diode. However, for the lowest possible VCL, especially when VP is biased at a voltage significantly below the Zener breakdown voltage, it is recommended that a 0.22μF ceramic chip capacitor be connected between VP and the ground plane. As a general rule, the ESD Protection Array should be located as close as possible to the point of entry of expected electrostatic discharges. The power supply bypass capacitor mentioned above should be as close to the VP pin of the Protection Array as possible, with minimum PCB trace lengths to the power supply, ground planes and between the signal input and the ESD device to minimize stray series inductance. where IESD is the ESD current pulse, and VSUPPLY is the positive supply voltage. An ESD current pulse can rise from zero to its peak value in a very short time. As an example, a level 4 contact discharge per the IEC61000-4-2 standard results in a current pulse that rises from zero to 30 Amps in 1ns. Here d(IESD)/dt can be approximated by ΔIESD/Δt, or 30/(1x10-9). So just 10nH of series inductance (L1 and L2 combined) will lead to a 300V increment in VCL! Additional Information See also California Micro Devices Application Note AP209, “Design Considerations for ESD Protection”, in the Applications section at www.calmicro.com. Similarly for negative ESD pulses, parasitic series inductance from the VN pin to the ground rail will lead to drastically increased negative voltage on the line being protected. The CM1213 has an integrated Zener diode between VP and VN. This greatly reduces the effect of supply rail L2 VP POSITIVE SUPPLY RAIL VCC PATH OF ESD CURRENT PULSE IESD 0.22μF D1 ONE CHANNEL L1 CHANNEL INPUT 25A LINE BEING PROTECTED SYSTEM OR CIRCUITRY BEING PROTECTED D2 OF CM1213 0A VCL GROUND RAIL VN CHASSIS GROUND Figure 3. Application of Positive ESD Pulse between Input Channel and Ground © 2006 California Micro Devices Corp. All rights reserved. 03/02/06 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 7 CM1213 Mechanical Details The CM1213 is available in SOT23-3, SOT143-4, SOT23-5, SOT23-6, MSOP-8, SOIC-8 and MSOP-10 packages with a lead-free finishing option.The various package drawings are presented below. SOT23-3 Mechanical Specifications Dimensions for CM1213-01ST/SO devices supplied in 3-pin SOT23 packages are presented below. For complete information on the SOT23-3, see the California Micro Devices SOT23 Package Information document. Mechanical Package Diagrams TOP VIEW b 3 PACKAGE DIMENSIONS Package Pins Dimensions A A1 b c D E E1 e e1 L L1 # per tape and reel Millimeters Min 0.89 0.01 0.30 0.08 2.80 2.10 1.20 Max 1.12 0.10 0.50 0.20 3.04 2.64 1.40 Min 0.0350 0.0004 0.0118 0.0031 0.1102 0.0827 0.0472 SOT23-3 (JEDEC name is TO-236) 3 Inches Max 0.0441 0.0039 0.0197 0.0079 0.1197 0.1039 0.0551 END VIEW 1 2 E1 E e e1 SIDE VIEW D A1 A 0.95 BSC 1.90 BSC 0.40 0.60 0.54 REF 0.0374 BSC 0.0748 BSC 0.0157 0.0236 c L1 L 0.0213 REF 3000 pieces Controlling dimension: millimeters Package Dimensions for SOT23-3. © 2006 California Micro Devices Corp. All rights reserved. 8 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 03/02/06 CM1213 Mechanical Details (cont’d) SOT143 Mechanical Specifications Dimensions for CM1213-02SS/SR devices supplied in 4-pin SOT143 packages are presented below. For complete information on the SOT143, see the California Micro Devices SOT143 Package Information document. 4 Mechanical Package Diagrams TOP VIEW e 3 PACKAGE DIMENSIONS Package Pins Dimensions A A1 b b2 c D E E1 e e1 L L1 # per tape and reel Millimeters Min 0.80 0.05 0.30 0.76 0.08 2.80 2.10 1.20 Max 1.22 0.15 0.50 0.89 0.20 3.04 2.64 1.40 Min 0.031 0.002 0.012 0.030 0.003 0.110 0.082 0.047 SOT143 4 Inches Max 0.048 0.006 0.019 0.035 0.008 0.119 0.103 0.055 END VIEW b2 b SIDE VIEW D e1 1 2 E1 E A A1 1.92 BSC 0.20 BSC 0.4 0.6 0.54 REF 0.075 BSC 0.008 BSC 0.016 0.024 c 0.021 REF 3000 pieces Controlling dimension: millimeters L1 L Package Dimensions for SOT143. © 2006 California Micro Devices Corp. All rights reserved. 03/02/06 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 9 CM1213 Mechanical Details (cont’d) SOT23-5 Mechanical Specifications Dimensions for CM1213-02ST/SO devices supplied in 5-pin SOT23 packages are presented below. For complete information on the SOT23-5, see the California Micro Devices SOT23 Package Information document. 5 Mechanical Package Diagrams TOP VIEW e1 e 4 PACKAGE DIMENSIONS Package Pins Dimensions A A1 b c D E E1 e e1 L L1 # per tape and reel Millimeters Min -0.00 0.30 0.08 2.75 2.60 1.45 Max 1.45 0.15 0.50 0.22 3.05 3.00 1.75 Min -0.0000 0.0118 0.0031 0.1083 0.1024 0.0571 SOT23-5 (JEDEC name is MO-178) 5 Inches Max 0.0571 0.0059 0.0197 0.0087 0.1201 0.1181 0.0689 END VIEW SIDE VIEW D 1 2 3 E1 E b A A1 0.95 BSC 1.90 BSC 0.30 0.60 0.60 REF 0.0374 BSC 0.0748 BSC 0.0118 0.0236 c L1 L 0.0236 REF 3000 pieces Controlling dimension: millimeters Package Dimensions for SOT23-5. © 2006 California Micro Devices Corp. All rights reserved. 10 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 03/02/06 CM1213 Mechanical Details (cont’d) SOT23-6 Mechanical Specifications CM1213-04ST/SO devices are supplied in 6-pin SOT23 packages. Dimensions are presented below. For complete information on the SOT23-6, see the California Micro Devices SOT23 Package Information document. 6 Mechanical Package Diagrams TOP VIEW e1 5 e 4 PACKAGE DIMENSIONS Package Pins Dimensions A A1 b c D E E1 e e1 L L1 # per tape and reel Millimeters Min -0.00 0.30 0.08 2.75 2.60 1.45 Max 1.45 0.15 0.50 0.22 3.05 3.00 1.75 Min -0.0000 0.0118 0.0031 0.1083 0.1024 0.0571 SOT23-6 (JEDEC name is MO-178) 6 Inches Max 0.0571 0.0059 0.0197 0.0087 0.1201 0.1181 0.0689 Pin 1 Marking E1 E 1 2 3 b SIDE VIEW D A A1 END VIEW 0.95 BSC 1.90 BSC 0.30 0.60 0.60 REF 0.0374 BSC 0.0748 BSC 0.0118 0.0236 c L1 L 0.0236 REF 3000 pieces Controlling dimension: millimeters Package Dimensions for SOT23-6. © 2006 California Micro Devices Corp. All rights reserved. 03/02/06 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 11 CM1213 Mechanical Details SOIC-8 Mechanical Specifications Dimensions for CM1213-06SN/SM devices supplied in 8-pin SOIC packages are presented below. For complete information on the SOIC-8, see the California Micro Devices SOIC Package Information document. * Mechanical Package Diagrams TOP VIEW D 8 7 6 5 PACKAGE DIMENSIONS Package Pins Dimensions A A1 B C D E e H L # per tape and reel Millimeters Min 1.35 0.10 0.33 0.19 4.80 3.80 5.80 0.40 Max 1.75 0.25 0.51 0.25 5.00 4.19 6.20 1.27 Min 0.053 0.004 0.013 0.007 0.189 0.150 0.228 0.016 SOIC 8 Inches Max 0.069 0.010 0.020 0.010 0.197 0.165 0.244 0.050 C END VIEW SEATING PLANE SIDE VIEW 1 2 3 4 H Pin 1 Marking E A B e A1 1.27 BSC 0.050 BSC 2500 pieces Controlling dimension: inches L Package Dimensions for SOIC-8 © 2006 California Micro Devices Corp. All rights reserved. 12 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 03/02/06 CM1213 Mechanical Details MSOP-8 Mechanical Specifications: CM1213-06MS/MR devices are supplied in 8-pin MSOP packages. Dimensions are presented below. For complete information on the MSOP-8, see the California Micro Devices MSOP Package Information document. Mechanical Package Diagrams TOP VIEW D 8 7 6 5 PACKAGE DIMENSIONS Package Pins Dimensions A A1 B C D E e H L # per tape and reel 2.90 2.90 Millimeters Min 0.87 0.05 0.18 3.10 3.10 0.114 0.114 Max 1.17 0.25 Min 0.034 0.002 MSOP 8 Inches Max 0.046 0.010 0.007 0.122 0.122 H E Pin 1 Marking 1 2 3 4 SIDE VIEW 0.30 (typ) 0.012 (typ) A SEATING PLANE A1 B e END VIEW 0.65 BSC 4.90 BSC 0.52 0.54 0.025 BSC 0.193 BSC 0.017 0.025 4000 pieces C Controlling dimension: inches L Package Dimensions for MSOP-8 © 2006 California Micro Devices Corp. All rights reserved. 03/02/06 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 13 CM1213 Mechanical Details (cont’d) MSOP-10 Mechanical Specifications The CM1213-08MS/MR, CM1213-A4MR and CM121304MS/MR devices are supplied in 10-pin MSOP packages. Dimensions are presented below. For complete information on the MSOP-10, see the California Micro Devices MSOP Package Information document. * Mechanical Package Diagrams TOP VIEW D 10 9 8 7 6 PACKAGE DIMENSIONS Package Pins Dimensions A A1 B C D E e H L # per tape and reel 2.90 2.90 Millimeters Min 0.75 0.05 0.17 0.18 3.10 3.10 0.114 0.114 Max 0.95 0.15 0.33 Min 0.028 0.002 0.007 MSOP 10 Inches Max 0.038 0.006 0.013 0.007 0.122 0.122 1 2 3 4 5 H E Pin 1 Marking SIDE VIEW A SEATING PLANE 0.50 BSC 4.90 BSC 0.40 0.70 4000 0.0196 BSC 0.193 BSC 0.0137 0.029 A1 B e END VIEW Controlling dimension: inches C L Package Dimensions for MSOP-10 © 2006 California Micro Devices Corp. All rights reserved. 14 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 03/02/06