CM1220

CM1220 4 and 8-Channel ESD Protection Arrays in CSP Features • • • • • • • • 4 and 8 channels of ESD protection OptiGuard™ coated for improved reliability ±15kV ESD protection on each channel (IEC 61000-4-2 Level 4, contact discharge) ±30kV ESD protection on each channel (HBM) Chip Scale Package features extremely low lead inductance for optimum ESD protection 5 bump, 0.960mm X 1.330mm CSP footprint for CM1220-04 10 bump, 1.960mm X 1.330mm CSP footprint for CM1220-08 Lead-free version available Product Description California Micro Devices' CM1220 ESD protection arrays are available in four and eight channel configurations. Each ESD channel features a nominal capacitance of 14pF making these devices ideal for protecting high speed I/O ports and LCD and camera data lines without significantly affecting signal integrity. The CM1220 integrates avalanche-type ESD diodes on every channel, providing a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). These diodes safely dissipate ESD strikes of ±15kV, exceeding the maximum requirement of the IEC61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, these devices protect for contact discharges at greater than ±30kV. These devices are particularly well-suited for portable electronics (e.g. wireless handsets, PDAs, notebook computers) because of their small package and easyto-use pin assignments. In particular, the CM1220 is ideal for protecting high speed I/O ports and data and control lines for the LCD display and camera interface in mobile handsets. These devices incorporate CMD’s OptiGuard™ coating for improved reliability at assembly. The CM1220 is available in a space-saving, low-profile Chip Scale Packages with optional lead-free finishing. Applications • • • • • • LCD and camera datalines in mobile handsets I/O port protection for mobile handsets, notebook computers, PDAs, etc. Keypads and buttons Wireless handsets Handheld PCs/PDAs LCD and camera modules Electrical Schematic ESD_1 ESD_2 ESD_3 ESD_4 C1 C3 A1 A3 ESD_1 ESD_2 ESD_3 ESD_4 ESD_5 ESD_6 ESD_7 ESD_8 A1 A3 A5 A7 C1 C3 C5 C7 B2 GND B2, B6 GND CM1220-04 CM1220-08 © 2006 California Micro Devices Corp. All rights reserved. 02/03/06 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 1 CM1220 PACKAGE / PINOUT DIAGRAMS TOP VIEW (Bumps Down View) Orientation Marking (see note 2) BOTTOM VIEW (Bumps Up View) 123 A C1 C3 B2 J CM1220-04 567 Orientation Marking A1 B C A3 A1 Orientation Marking(see note 2) 123 A B C 5 Bump CSP Package with OptiGuard™ C1 C3 B2 C5 B6 A3 A5 A7 C7 L208 CM1220-08 Orientation Marking A1 A1 Notes: 1) These drawings are not to scale. 2) Lead-free devices are specified by using a "+" character for the top side orientation mark. 10 Bump CSP Package with OptiGuard™ PIN DESCRIPTIONS CM1220-08 PINS A1 A3 A5 A7 B2 NAME ESD1 ESD2 ESD3 ESD4 GND CM1220-04 PINS A1 A3 NAME ESD1 ESD2 DESCRIPTION ESD Channel ESD Channel ESD Channel ESD Channel Device Ground CM1220-08 PINS C1 C3 C5 C7 B6 NAME ESD5 ESD6 ESD7 ESD8 GND CM1220-04 PINS C1 C3 NAME ESD3 ESD4 DESCRIPTION ESD Channel ESD Channel ESD Channel ESD Channel Device Ground − − B2 − − GND − − − − − − Ordering Information PART NUMBERING INFORMATION Standard Finish Bumps 5 10 Package CSP CSP Ordering Part Number1 CM1220-04CS CM1220-08CS Part Marking J L208 Lead-free Finish2 Ordering Part Number1 CM1220-04CP CM1220-08CP Part Marking J L208 Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark. © 2006 California Micro Devices Corp. All rights reserved. 2 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 02/03/06 CM1220 Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER Storage Temperature Range RATING -65 to +150 UNITS °C STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range RATING -40 to +85 UNITS °C ELECTRICAL OPERATING CHARACTERISTICS (SEE NOTE 1) SYMBOL PARAMETER CDIODE VDIODE ILEAK VSIG Diode (Channel) Capacitance Diode Standoff Voltage Diode Leakage Current Signal Clamp Voltage Positive Clamp Negative Clamp In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Dynamic Resistance Positive Negative CONDITIONS At 2.5VDC Reverse Bias, 1MHz, 30mVAC IDIODE = 10μA VIN = +3.3V (reverse bias voltage) IDIODE = 10mA 5.6 -1.5 ±30 ±15 2.3 0.9 MIN 11 TYP 14 6.0 0.1 1 MAX 17 UNITS pF V μA 6.8 -0.8 9.0 -0.4 V V kV kV Ω Ω VESD Note 2 RDYN Note 1: TA=25°C unless otherwise specified. Note 2: ESD applied to input and output pins with respect to GND, one at a time. Unused pins are left open. These parameters are guaranteed by design and characterization. Performance Information Diode Characteristics (nominal conditions unless specified otherwise) Capacitance (Normalized) DC Voltage Figure 1. Typical Diode Capacitance VS. Input Voltage (normalized to 2.5VDC) © 2006 California Micro Devices Corp. All rights reserved. 02/03/06 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 3 CM1220 Application Information Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages offered by California Micro Devices. PRINTED CIRCUIT BOARD RECOMMENDATIONS PARAMETER Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Flux Ratio Solder Paste Type Pad Protective Finish Tolerance — Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous Maximum Soldering Temperature for Eutectic Devices using a Eutectic Solder Paste Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder Paste Non-Solder Mask Defined Pad 0.275mm DIA. Solder Stencil Opening 0.330mm DIA. Solder Mask Opening 0.325mm DIA. VALUE 0.275mm Round Non-Solder Mask defined pads 0.325mm Round 0.125mm - 0.150mm 0.330mm Round 50/50 by volume No Clean OSP (Entek Cu Plus 106A) +50μm +20μm 60 seconds 240°C 260°C Figure 2. Recommended Non-Solder Mask Defined Pad Illustration 250 Temperature (°C) 200 150 100 50 0 1:00.0 2:00.0 3:00.0 Time (minutes) 4:00.0 Figure 3. Eutectic (SnPb) Solder Ball Reflow Profile © 2006 California Micro Devices Corp. All rights reserved. Figure 4. Lead-free (SnAgCu) Solder Ball Reflow Profile 4 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 02/03/06 CM1220 Mechanical Details The CM1220 is supplied in custom Chip Scale Packages (CSP) depending on the channel count. Dimensions for these packages are presented in the following pages. CM1220-04CS/CP Mechanical Specifications Mechanical dimensions for the CM1220-04CS/CP are presented below. Mechanical Package Diagrams OptiGuard™ Coated CSP BOTTOM VIEW A1 B2 B1 C B A2 C1 B4 B3 OptiGuardTM Coating PACKAGE DIMENSIONS Package Bumps Dim A1 A2 B1 B2 B3 B4 C1 C2 D1 D2 Millimeters Min Nom Max Min Custom CSP 5 Inches Nom Max A 123 0.915 0.960 1.005 0.0360 0.0378 0.0396 1.285 1.330 1.375 0.0506 0.0524 0.0541 0.495 0.500 0.505 0.0195 0.0197 0.0199 0.245 0.250 0.255 0.0096 0.0098 0.0100 0.430 0.435 0.440 0.0169 0.0171 0.0173 0.430 0.435 0.440 0.0169 0.0171 0.0173 0.180 0.230 0.280 0.0071 0.0091 0.0110 0.180 0.230 0.280 0.0071 0.0091 0.0110 0.575 0.644 0.714 0.0226 0.0254 0.0281 0.368 0.419 0.470 0.0145 0.0165 0.0185 3500 pieces 0.30 DIA. 63/37 Sn/Pb (Eutectic) or 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) SOLDER BUMPS DIMENSIONS IN MILLIMETERS Package Dimensions for CM1220-04CS/CP Chip Scale Package C2 D1 D2 SIDE VIEW # per tape and reel Controlling dimension: millimeters CSP Tape and Reel Specifications PART NUMBER CM1220-04 CHIP SIZE (mm) 1.33 X 0.96 X 0.644 POCKET SIZE (mm) B0 X A0 X K0 1.42 X 1.07 X 0.740 TAPE WIDTH W 8mm REEL DIAMETER 178mm (7") 10 Pitches Cumulative Tolerance On Tape ±0.2 mm QTY PER REEL 3500 P0 4mm P1 4mm Po Top Cover Tape Ao W Bo Ko For tape feeder reference only including draft. Concentric around B. Embossment P1 User Direction of Feed Center Lines of Cavity Figure 5. Tape and Reel Mechanical Data © 2006 California Micro Devices Corp. All rights reserved. 02/03/06 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 5 CM1220 Mechanical Details (cont’d) CM1220-08CS/CP Mechanical Specifications Mechanical dimensions for the CM1220-08CS/CP are presented below. Mechanical Package Diagrams OptiGuard™ Coated CSP BOTTOM VIEW A1 C1 B4 B3 OptiGuardTM Coating PACKAGE DIMENSIONS Package Bumps Dim A1 A2 B1 B2 B3 B4 C1 C2 D1 D2 Millimeters Min Nom Max Min Custom CSP 10 Inches Nom Max B2 B1 1.915 1.960 2.005 0.0754 0.0772 0.0789 1.285 1.330 1.375 0.0506 0.0524 0.0541 0.495 0.500 0.505 0.0195 0.0197 0.0199 0.245 0.250 0.255 0.0096 0.0098 0.0100 0.430 0.435 0.440 0.0169 0.0171 0.0173 0.430 0.435 0.440 0.0169 0.0171 0.0173 0.180 0.230 0.280 0.0071 0.0091 0.0110 0.180 0.230 0.280 0.0071 0.091 0.0110 0.575 0.644 0.714 0.0226 0.0254 0.0281 0.368 0.419 0.470 0.0145 0.0165 0.0185 3500 pieces C B A 123 567 C2 D1 D2 A2 0.30 DIA. 63/37 Sn/Pb (Eutectic) or 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) SOLDER BUMPS SIDE VIEW DIMENSIONS IN MILLIMETERS # per tape and reel Controlling dimension: millimeters Package dimensions for CM1220-08CS/CP Chip Scale Package CSP Tape and Reel Specifications PART NUMBER CM1220-08 CHIP SIZE (mm) 1.96 X 1.33 X 0.644 POCKET SIZE (mm) B0 X A0 X K0 2.08 X 1.45 X 0.740 TAPE WIDTH W 8mm REEL DIAMETER 178mm (7") 10 Pitches Cumulative Tolerance On Tape ±0.2 mm QTY PER REEL 3500 P0 4mm P1 4mm Po Top Cover Tape Ao W Bo Ko For tape feeder reference only including draft. Concentric around B. Embossment P1 User Direction of Feed Center Lines of Cavity Figure 6. Tape and Reel Mechanical Data © 2006 California Micro Devices Corp. All rights reserved. 6 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 02/03/06