CM1240-04DE

CM1240 Dual-Voltage ESD Protection Array for USB Port Features • • • • • • • • 4 channels of ESD Protection 8kV ESD protection (IEC 61000-4-2, contact discharge) 16kV ESD protection (HBM) SOT-563 TDFN-8, 1.70mm x 1.35mm, 0.4mm pitch TDFN-8, 2mm x 2mm, 0.5mm pitch Lead free 16V clamp on Vcc channel of the CM1240 is a high voltage (HV) diode which has a capacitance of 25pF enabling it to protect power supply inputs or OLED power rails, etc. The parts integrate avalanche-type ESD diodes, which provide a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The ESD protection diodes are designed and characterized to safely dissipate ESD strikes of 8kV, the maximum requirement of the IEC61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are protected for contact discharges of greater than 16kV. This device is particularly well suited for portable electronics (e.g. wireless handsets, PDAs, notebook computers) because of its small package format and easy-to-use pin assignments. In particular, the CM1240 is ideal for protecting USB or mini USB ports operating at full speed (12Mbps). The CM1240 is available in a space saving, low profile, lead-free TDFN-8 or SOT-563 package. Applications • • • USB and Mini-USB applications I/O port protection for mobile handsets Wireless handsets Product Description California Micro Devices’ CM1240 is a four channel ESD protection array. Three channels of the CM1240 are low voltage (LV) diodes, which have a capacitance of 7pF enabling them to protect high speed I/O ports while providing robust ESD protection. The other PACKAGE / PINOUT DIAGRAMS SOT-563 D1 1 6 GND 5 D3 4 GND D2 TDFN-8 D1 1 5 NC NC DAP 6 7 NC 8 NC 2 D2 2 VCC 3 D3 3 VCC 4 Ordering Information PART NUMBERING INFORMATION Lead-free Finish Leads 6 8 8 Package SOT-563 TDFN-0.5mm TDFN-0.4mm Ordering Part Number CM1240-F4SE CM1240-04DE CM1240-04D4 Part Marking L40 L40 4E L4 PIN DESCRIPTIONS © 2007 California Micro Devices Corp. All rights reserved. 5/16/07 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 l Tel: 408.263.3214 l Fax: 408.263.7846 l www.cmd.com 1 CM1240 Specifications SOT-563 PIN# 1 2 5 3 – – – – 4 6 TDFN PIN# 1 2 3 4 5 6 7 8 DAP – NAME D1 D2 D3 Vcc NC NC NC NC GND GND DESCRIPTION Cathode connection for Low Voltage ESD diode Cathode connection for Low Voltage ESD diode Cathode connection for Low Voltage ESD diode Cathode connection for High Voltage ESD diode No connect No connect No connect No connect Anode-side connection for all ESD diodes Anode-side connection for all ESD diodes ABSOLUTE MAXIMUM RATINGS PARAMETER ESD Protection (HBM) Pin Voltages Vcc to GND All other pins to GND Storage Temperature Range Lead Temperature (soldering, 10sec) [GND - 0.3] to +13 [GND - 0.3] to +5.5 –65 to +150 300 V V °C °C RATING ±16 UNITS kV STANDARD OPERATING CONDITIONS PARAMETER Operating temperature range RATING –40 to +85 UNITS °C © 2007 California Micro Devices Corp. All rights reserved. 2 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 l Tel: 408.263.3214 l Fax: 408.263.7846 l www.cmd.com 5/16/07 CM1240 Specifications ELECTRICAL OPERATING CHARACTERISTICS (NOTE 1) Symbol CLV CHV ILV IHV VCL(LV) Parameter LV diode Capacitance at 3Vdc; 1MHz, 30mVac HV diode Capacitance at 3Vdc; 1MHz, 30mVac LV Diode Leakage at +3.3V reverse bias voltage HV Diode Leakage at +11V reverse bias voltage LV Diode Signal Clamp Voltage: Positive Clamp, 10mA Negative Clamp, –10mA HV Diode Signal Clamp Voltage: Positive Clamp, 10mA Negative Clamp, –10mA In-system ESD withstand voltage: Human Body Model (MIL-STD-883, method 3015) IEC 61000-4-2, contact discharge method LV Diode Dynamic Resistance: Positive Negative HV Diode Dynamic Resistance: Positive Negative Note 2 ±25 ±12 2.8 1.2 1 0.7 kV kV Ω Ω Ω Ω 5.6 –1.5 13 –1.5 Conditions Min Typ 6 25 0.01 0.01 6.8 –0.8 16 –0.8 0.4 0.4 9 –0.4 19 –0.4 Max Units pF pF μA μA V V V V VCL(HV) VESD RDYN(LV) RDYN(HV) Note 1: Guaranteed at 25°C only Note 2: ESD applied to input/output pins with respect to GND, one at a time. These parameters are guaranteed by design. © 2007 California Micro Devices Corp. All rights reserved. 5/16/07 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 l Tel: 408.263.3214 l Fax: 408.263.7846 l www.cmd.com 3 CM1240 Mechanical Details SOT-563 Mechanical Specifications The CM1240 is supplied in a 6-pin SOT-563 package. Dimensions are presented below. Mechanical Package Diagrams Mechanical Package Diagrams TOP VIEW D e1 Inches Max 0.60 0.27 0.18 1.60 BSC 1.50 1.60 1.20 BSC 0.50 BSC 1.00 BSC 0.20 BSC 5000 pieces 1.70 Min 0.020 0.007 0.003 0.059 0.063 Nom 0.022 0.009 Max 0.024 0.011 0.007 0.067 SIDE VIEW A 2X 0.20 0.20 PACKAGE DIMENSIONS Package Leads Dim. A b c D E E1 e e1 L # per tape and reel Millimeters Min 0.50 0.17 0.08 Nom 0.55 0.22 SOT-563 6 6 C A-B 2X D 4 5 E1 CD 1 2 3 E 0.063 BSC 0.047 BSC 0.020 BSC 0.040 BSC 0.008 BSC Pin 1 Marking e b 0.20 c 2X C 0.10 C SEATING PLANE Controlling dimension: millimeters c END VIEW L * For best results, both grounds should be connected Package Dimensions for SOT-563. © 2007 California Micro Devices Corp. All rights reserved. 4 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 l Tel: 408.263.3214 l Fax: 408.263.7846 l www.cmd.com 5/16/07 CM1240 Mechanical Details (cont’d) TDFN-08 Mechanical Specifications The CM1240 is supplied in an 8-lead 0.5mm TDFN package. Dimensions are presented below. For complete information on the TDFN-08, see the California Micro Devices TDFN Package Information document. Mechanical Package Diagrams D 8765 PACKAGE DIMENSIONS Package JEDEC No. Leads Dim. A A3 b D D2 E E2 e K L # per tape and reel 0.20 0.20 0.30 0.40 0.20 1.90 1.50 1.90 0.80 Millimeters Min 0.70 Nom 0.75 0.20 REF 0.25 2.00 1.60 2.00 0.90 0.50 BSC 0.30 2.10 1.70 2.10 1.00 Max 0.80 Min 0.028 0.008 0.075 0.059 0.075 0.031 0.008 0.008 0.012 0.016 3000 pieces TDFN MO-229 (Var. VCCD-3)* 8 Inches Nom 0.030 0.010 0.079 0.063 0.079 0.035 0.008 REF 0.012 0.083 0.067 0.083 0.039 A A3 0.10 C E Pin 1 Marking Max 0.031 1234 TOP VIEW 0.020 BSC SIDE VIEW 1234 Controlling dimension: millimeters D2 *This package is compliant with JEDEC standard MO-229, variation VCCD-3 with exception of the D2 and E2 dimensions as called out in the table above and the r1 dimension which is not specified in the MO-229 standard. GND PAD E2 C0.25 R L K e 8765 b 8X BOTTOM VIEW 0.10 M CAB Package Dimensions for 8-Lead, 0.5mm pitch TDFN package © 2007 California Micro Devices Corp. All rights reserved. 5/16/07 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 l Tel: 408.263.3214 l Fax: 408.263.7846 l www.cmd.com 5 CM1240 Mechanical Details (cont’d) TDFN-08 Mechanical Specifications Dimensions for the CM1240 supplied in a 8-lead, 0.4mm pitch TDFN package are presented below. Mechanical Package Diagrams PACKAGE DIMENSIONS Package JEDEC No. Leads Dim. A A1 A3 b D D2 E E2 e K L # per tape and reel 0.20 0.15 0.25 0.35 0.15 1.60 1.10 1.25 0.30 Millimeters Min 0.70 0.00 Nom 0.75 0.02 0.200 REF 0.20 1.70 1.20 1.35 0.40 0.40 BSC 0.25 1.80 1.30 1.45 0.50 Max 0.80 0.05 Min 0.028 0.000 0.006 0.063 0.043 0.049 0.012 0.008 0.006 0.010 0.014 Pin 1 Locator e D TDFN MO-229C* 8 Inches Nom 0.030 0.001 0.008 0.067 0.047 0.053 0.016 Max 0.031 0.002 0.010 0.071 0.051 0.057 0.020 A1 0.10 C 8765 Pin 1 Marking E 1234 TOP VIEW 0.008 REF 0.08 C SIDE VIEW A A3 0.016 BSC 8X 0.10 M CAB b E2 3000 pieces 1 2 C0.2 3 4 GND PAD 6 5 Controlling dimension: millimeters K 8 7 D2 *This package is compliant with JEDEC standard MO-229C with the exception of the D, D2, E, E2, K and L dimensions as called out in the table above. L BOTTOM VIEW Dimensions for 8-Lead, 0.4mm pitch TDFN package Recommend PCB Land Pattern 0.40 0.30 1.66 0.55 0.70 Note: Dimensions in millimeters. Drawing not to scale. © 2007 California Micro Devices Corp. All rights reserved. 6 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 0.25 l Tel: 408.263.3214 l Fax: 408.263.7846 l www.cmd.com 5/16/07