CM1293-02SO

CM1293 2, 4, and 8-Channel Low Capacitance ESD Protection Arrays Features • • • • • • • • • 2, 4, and 8 channels of ESD protection Provides ESD protection to IEC61000-4-2 - 8kV contact discharge - 15kV air discharge Low loading capacitance of 2.0pF max. Low clamping voltage Channel I/O to I/O capacitance 1.5pF typical Zener diode protects supply rail and eliminates the need for external by-pass capacitors Each I/O pin can withstand over 1000 ESD strikes Available in SOT, and MSOP packages Lead-free version available Product Description The CM1293 family of diode arrays has been designed to provide ESD protection for electronic components or sub-systems requiring minimal capacitive loading. These devices are ideal for protecting systems with high data and clock rates or for circuits requiring low capacitive loading. Each ESD channel consists of a pair of diodes in series which steer the positive or negative ESD current pulse to either the positive (VP) or negative (VN) supply rail. A Zener diode is embedded between VP and VN, offering two advantages. First, it protects the VCC rail against ESD strikes, and second, it eliminates the need for a bypass capacitor that would otherwise be needed for absorbing positive ESD strikes to ground. The CM1293 will protect against ESD pulses up to (±15kV air, ±8kV contact discharge) per the IEC 61000-4-2 Level 4 standard. This device is particularly well-suited for protecting systems using high-speed ports such as USB2.0, IEEE1394 (Firewire®, iLink™), Serial ATA, DVI, HDMI and corresponding ports in removable storage, digital camcorders, DVD-RW drives and other applications where extremely low loading capacitance with ESD protection are required in a small package footprint. The CM1293 family of devices is available with optional lead-free finishing. Applications • • • • DVI ports, HDMI ports in notebooks, set top boxes, digital TVs, LCD displays Serial ATA ports in desktop PCs and hard disk drives PCI Express ports General purpose high-speed data line ESD protection Electrical Schematics VP CH4 VP CH3 CH8 CH7 VP CH6 CH5 CH1 CH2 VN CH1 VN CH2 CH1 CH2 VN CH3 CH4 CM1293-02ST/SO CM1293--02SR CM1293-04ST/SO CM1293-04MS/MR CM1293-08MS/MR © 2006 California Micro Devices Corp. All rights reserved. 01/26/06 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 1 CM1293 PACKAGE / PINOUT DIAGRAMS Top View VN 1 4 Top View VP NC VN 1 2 3 5 Top View VP CH1 CH2 CH3 CH4 1 2 3 4 5 10 9 8 7 6 CH8 CH7 VP D032 / D033 D036 D038 / D039 CH1 2 3 CH2 CH1 4 CH6 CH5 CH2 VN 4-Lead SOT143-4 5-Lead SOT23-5 Top View CH1 VN CH2 1 2 3 6 Top View CH4 VP CH3 10-Lead MSOP-10 NC CH4 VN CH1 NC VP 1 2 3 4 5 10 9 8 7 6 6-Lead SOT23-6 Note: These drawings are not to scale. PIN DESCRIPTIONS 2-CHANNEL, 4-LEAD SOT143-4 PACKAGE PIN 1 2 3 4 NAME VN CH1 CH2 VP TYPE GND I/O I/O PWR PIN 1 2 3 4 PIN 1 2 3 4 5 6 7 8 9 10 2-CHANNEL, 5-LEAD SOT23-5 PACKAGE PIN 1 2 3 4 5 NAME NC VN CH1 CH2 VP GND I/O I/O PWR TYPE DESCRIPTION No connect Negative voltage supply rail ESD Channel ESD Channel Positive voltage supply rail 4-CHANNEL, 6-LEAD SOT23-6 PACKAGE PIN 1 2 3 4 5 6 5 6 NAME CH1 VN CH2 CH3 VP CH4 VP CH4 TYPE I/O GND I/O I/O PWR I/O PWR I/O DESCRIPTION ESD Channel Negative voltage supply rail ESD Channel ESD Channel Positive voltage supply rail ESD Channel Positive voltage supply rail ESD Channel © 2006 California Micro Devices Corp. All rights reserved. D034 / D035 D040 / D041 5 4 CH2 NC NC CH3 10-Lead MSOP-10 4-CHANNEL, 10-LEAD MSOP-10 PACKAGE NAME CH1 NC VP CH2 NC CH3 NC VN CH4 NC GND I/O I/O PWR I/O TYPE I/O DESCRIPTION ESD Channel No connect Positive voltage supply rail ESD Channel No connect ESD Channel No connect Negative voltage supply rail ESD Channel No connect 8-CHANNEL, 10-LEAD MSOP-10 PACKAGE PIN 1 2 3 4 5 6 7 8 9 10 NAME CH1 CH2 CH3 CH4 VN CH5 CH6 VN CH7 CH8 TYPE I/O I/O I/O I/O PWR I/O I/O GND I/O I/O DESCRIPTION ESD Channel ESD Channel ESD Channel ESD Channel Positive voltage supply rail ESD Channel ESD Channel Negative voltage supply rail ESD Channel ESD Channel 2 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 01/26/06 CM1293 Ordering Information PART NUMBERING INFORMATION Standard Finish # of Channels 2 2 4 4 8 Leads 4 5 6 10 10 Package SOT143-4 SOT23-5 SOT23-6 MSOP-10 MSOP-10 CM1293-02ST CM1293-04ST CM1293-04MS CM1293-08MS D032 D034 D040 D038 Ordering Part Number1 Part Marking Lead-free Finish Ordering Part Number1 CM1293-02SR CM1293-02SO CM1293-04SO CM1293-04MR CM1293-08MR Part Marking D036 D033 D035 D041 D039 Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER Operating Supply Voltage (VP - VN) Operating Temperature Range Storage Temperature Range DC Voltage at any channel input RATING 6.0 -40 to +85 -65 to +150 (VN - 0.5) to (VP + 0.5) UNITS V °C °C V STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range Package Power Rating SOT143-4 Package (CM1293-02SR) SOT23-5 Package (CM1293-02ST/SO) SOT23-6 Package (CM1293-04ST/SO) MSOP-10 Package (CM1293-04MS/MR) MSOP-10 Package (CM1293-08MS/MR) RATING -40 to +85 225 225 225 400 400 UNITS °C mW mW mW mW mW © 2006 California Micro Devices Corp. All rights reserved. 01/26/06 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 3 CM1293 Specifications (cont’d) ELECTRICAL OPERATING CHARACTERISTICS1 SYMBOL PARAMETER VP IP VF Operating Supply Voltage (VP-VN) Operating Supply Current Diode Forward Voltage Top Diode Bottom Diode Channel Leakage Current Channel Input Capacitance Channel I/O to I/O capacitance ESD Protection Peak Discharge Voltage at any channel input, in system a) Contact discharge per IEC 61000-4-2 standard b) Human Body Model, MIL-STD-883, Method 3015 Channel Clamp Voltage Positive Transients Negative Transients Dynamic Resistance Positive Transients Negative Transients (VP-VN)=3.3V IF = 8mA; TA=25°C 0.60 0.60 0.80 0.80 ±0.1 CONDITIONS MIN TYP 3.3 MAX 5.5 8.0 0.95 0.95 ±1.0 2.0 1.5 UNITS V μA V V μA pF pF ILEAK CIN TA=25°C; VP=5V, VN=0V At 1 MHz, VP=3.3V, VN=0V, VIN=1.65V; Note 2 ΔCIO VESD Notes 2, 4 & 5; TA=25°C Notes 2, 3 & 5; TA=25°C ±8 ±15 kV kV VCL At 8kV ESD HBM; TA=25°C; Notes 2 & 3 +9.0 -9.0 1.2 0.6 V V Ω Ω RDYN TA=25°C; Notes 5 & 6 Note 1: Note 2: Note 3: Note 4: Note 5: Note 6: All parameters specified at TA = -40°C to +85°C unless otherwise noted. These parameters guaranteed by design and characterization. Human Body Model per MIL-STD-883, Method 3015, CDischarge = 100pF, RDischarge = 1.5KΩ, VP = 3.3V, VN grounded. Standard IEC 61000-4-2 with CDischarge = 150pF, RDischarge = 330Ω, VP = 3.3V, VN grounded. These measurements performed with no external capacitor on VP. Measured under pulsed conditions, pulse width = 0.7mS, maximum current = 1.5A. © 2006 California Micro Devices Corp. All rights reserved. 4 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 01/26/06 CM1293 Performance Information (Cont’d) Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment) Figure 1. Insertion Loss (S21) VS. Frequency (0V DC Bias, VP=3.3V) Figure 2. Insertion Loss (S21) VS. Frequency (2.5V DC Bias, VP=3.3V) © 2006 California Micro Devices Corp. All rights reserved. 01/26/06 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 5 CM1293 Application Information Design Considerations In order to realize the maximum protection against ESD pulses, care must be taken in the PCB layout to minimize parasitic series inductances on the Supply/ Ground rails as well as the signal trace segment between the signal input (typically a connector) and the ESD protection device. Refer to Figure 3, which illustrates an example of a positive ESD pulse striking an input channel. The parasitic series inductance back to the power supply is represented by L1 and L2. The voltage VCL on the line being protected is: VCL = Fwd voltage drop of D1 + VSUPPLY + L1 x d(IESD) / dt + L2 x d(IESD) / dt inductance L2 on VCL by clamping VP at the breakdown voltage of the Zener diode. However, for the lowest possible VCL, especially when VP is biased at a voltage significantly below the Zener breakdown voltage, it is recommended that a 0.22μF ceramic chip capacitor be connected between VP and the ground plane. As a general rule, the ESD Protection Array should be located as close as possible to the point of entry of expected electrostatic discharges. The power supply bypass capacitor mentioned above should be as close to the VP pin of the Protection Array as possible, with minimum PCB trace lengths to the power supply, ground planes and between the signal input and the ESD device to minimize stray series inductance. where IESD is the ESD current pulse, and VSUPPLY is the positive supply voltage. An ESD current pulse can rise from zero to its peak value in a very short time. As an example, a level 4 contact discharge per the IEC61000-4-2 standard results in a current pulse that rises from zero to 30 Amps in 1ns. Here d(IESD)/dt can be approximated by ΔIESD/Δt, or 30/(1x10-9). So just 10nH of series inductance (L1 and L2 combined) will lead to a 300V increment in VCL! Additional Information See also California Micro Devices Application Note AP209, “Design Considerations for ESD Protection”, in the Applications section at www.calmicro.com. Similarly for negative ESD pulses, parasitic series inductance from the VN pin to the ground rail will lead to drastically increased negative voltage on the line being protected. The CM1293 has an integrated Zener diode between VP and VN. This greatly reduces the effect of supply rail L2 VP POSITIVE SUPPLY RAIL VCC PATH OF ESD CURRENT PULSE IESD 0.22μF D1 ONE CHANNEL L1 CHANNEL INPUT 25A LINE BEING PROTECTED SYSTEM OR CIRCUITRY BEING PROTECTED D2 OF CM1213 0A VCL GROUND RAIL VN CHASSIS GROUND Figure 3. Application of Positive ESD Pulse between Input Channel and Ground © 2006 California Micro Devices Corp. All rights reserved. 6 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 01/26/06 CM1293 Mechanical Details SOT143 Mechanical Specifications Dimensions for CM1293-02SR devices supplied in 4pin SOT143 packages are presented below. For complete information on the SOT143, see the California Micro Devices SOT143 Package Information document. 4 Mechanical Package Diagrams TOP VIEW e 3 PACKAGE DIMENSIONS Package Pins Dimensions A A1 b b2 c D E E1 e e1 L L1 # per tape and reel Millimeters Min 0.80 0.05 0.30 0.76 0.08 2.80 2.10 1.20 Max 1.22 0.15 0.50 0.89 0.20 3.04 2.64 1.40 Min 0.031 0.002 0.012 0.030 0.003 0.110 0.082 0.047 SOT143 4 Inches Max 0.048 0.006 0.019 0.035 0.008 0.119 0.103 0.055 END VIEW b2 b SIDE VIEW D e1 1 2 E1 E A A1 1.92 BSC 0.20 BSC 0.4 0.6 0.54 REF 0.075 BSC 0.008 BSC 0.016 0.024 c 0.021 REF 3000 pieces Controlling dimension: millimeters L1 L Package Dimensions for SOT143. © 2006 California Micro Devices Corp. All rights reserved. 01/26/06 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 7 CM1293 Mechanical Details (cont’d) SOT23-5 Mechanical Specifications Dimensions for CM1293-02ST/SO devices packaged in 5-pin SOT23 packages are presented below. For complete information on the SOT23-5 package, see the California Micro Devices SOT23 Package Information document. 5 Mechanical Package Diagrams TOP VIEW e1 e 4 PACKAGE DIMENSIONS Package Pins Dimensions A A1 b c D E E1 e e1 L L1 # per tape and reel Millimeters Min -0.00 0.30 0.08 2.75 2.60 1.45 Max 1.45 0.15 0.50 0.22 3.05 3.00 1.75 Min -0.0000 0.0118 0.0031 0.1083 0.1024 0.0571 SOT23-5 (JEDEC name is MO-178) 5 Inches Max 0.0571 0.0059 0.0197 0.0087 0.1201 0.1181 0.0689 END VIEW SIDE VIEW D 1 2 3 E1 E b A A1 0.95 BSC 1.90 BSC 0.30 0.60 0.60 REF 0.0374 BSC 0.0748 BSC 0.0118 0.0236 c L1 L 0.0236 REF 3000 pieces Controlling dimension: millimeters © 2006 California Micro Devices Corp. All rights reserved. 8 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 01/26/06 CM1293 Mechanical Details (cont’d) SOT23-6 Mechanical Specifications CM1293-04ST/SO devices are packaged in 6-pin SOT23 packages. Dimensions are presented below. For complete information on the SOT23-6 package, see the California Micro Devices SOT23 Package Information document. 6 Mechanical Package Diagrams TOP VIEW e1 5 e 4 PACKAGE DIMENSIONS Package Pins Dimensions A A1 b c D E E1 e e1 L L1 # per tape and reel Millimeters Min -0.00 0.30 0.08 2.75 2.60 1.45 Max 1.45 0.15 0.50 0.22 3.05 3.00 1.75 Min -0.0000 0.0118 0.0031 0.1083 0.1024 0.0571 SOT23-6 (JEDEC name is MO-178) 6 Inches Max 0.0571 0.0059 0.0197 0.0087 0.1201 0.1181 0.0689 Pin 1 Marking E1 E 1 2 3 b SIDE VIEW D A A1 END VIEW 0.95 BSC 1.90 BSC 0.30 0.60 0.60 REF 0.0374 BSC 0.0748 BSC 0.0118 0.0236 c L1 L 0.0236 REF 3000 pieces Controlling dimension: millimeters Package Dimensions for SOT23-6. © 2006 California Micro Devices Corp. All rights reserved. 01/26/06 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 9 CM1293 Mechanical Details (cont’d) MSOP-10 Mechanical Specifications CM1293-04MS/MR and CM1293-08MS/MR devices are packaged in 10-pin MSOP packages. Dimensions are presented below. For complete information on the MSOP-10 package, see the California Micro Devices MSOP Package Information document. Mechanical Package Diagrams TOP VIEW D 10 9 8 7 6 PACKAGE DIMENSIONS Package Pins Dimensions A A1 B C D E e H L # per tape and reel 2.90 2.90 4.76 0.40 Millimeters Min 0.75 0.05 0.18 0.18 3.10 3.10 5.00 0.70 4000 Controlling dimension: inches 0.114 0.114 0.187 0.0137 Max 0.95 0.15 0.40 Min 0.028 0.002 0.006 MSOP 10 Inches Max 0.038 0.006 0.016 0.007 0.122 0.122 0.197 0.029 END VIEW 1 2 3 4 5 H E Pin 1 Marking SIDE VIEW A SEATING PLANE 0.50 BSC 0.0196 BSC A1 B e C L Package Dimensions for MSOP-10 © 2006 California Micro Devices Corp. All rights reserved. 10 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 01/26/06