CM1400-03CS

CM1400-03 6 Channel EMI Filter Array with ESD Protection Features • • • • • • • • • • • Functionally and pin compatible with CSPEMI306A device OptiGuard™ coated for improved reliability at assembly Six channels of EMI filtering for data ports Pi-style EMI filters in a capacitor-resistor-capacitor (C-R-C) network 40dB absolute attenuation (typical) at 1 GHz 35dB attenuation (typical) at 1 GHz relative to pass band ±15kV ESD protection on each channel (IEC 61000-4-2 Level 4, contact discharge) ±30kV ESD protection on each channel (HBM) 15-bump, 2.960mm X 1.330mm footprint Chip Scale Package (CSP) Chip Scale Package features extremely low lead inductance for optimum filter and ESD performance Lead-free version available Product Description The CM1400-03 is a six channel low-pass filter array that reduces EMI/RFI emissions while at the same time providing ESD protection. It is used on data ports on mobile devices. To reduce EMI/RFI emissions, the CM1400-03 integrates a pi-style filter (C-R-C) for each of the 6 channels. Each high quality filter provides greater than 30dB attenuation in the 800-2700 MHz range relative to the pass band attenuation. These pistyle filters also support bidirectional filtering, controlling EMI both to and from a data port connector. In addition, the CM1400-03 provides a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The input pins are designed and characterized to safely dissipate ESD strikes of ±15kV, exceeding the maximum requirement of the IEC 61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the device provides protection for contact discharges to greater than ±30kV. The CM1400-03 is particularly well suited for portable electronics (e.g., cellular telephones, PDAs, notebook computers) because of its small package footprint and low weight. The CM1400-03 incorporates OptiGuard™ coating which results in improved reliability at assembly. The CM1400-03 is available in a space-saving, low-profile chip scale package with optional lead-free finishing. Applications • • • • • • EMI filtering and ESD protection for both data and I/O ports Wireless Handsets Handheld PCs / PDAs MP3 Players Notebooks Desktop PCs Electrical Schematic 100Ω FILTERn* 30pF 30pF FILTERn* GND (Pins B1-B3) 1 of 6 EMI/RFI + ESD Channels * See Package/Pinout Diagram for expanded pin information. © 2005 California Micro Devices Corp. All rights reserved. 10/04/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com 1 CM1400-03 PACKAGE / PINOUT DIAGRAMS (Bumps Down View) Orientation Marking (see note 2) TOP VIEW BOTTOM VIEW (Bumps Up View) FILTER3 FILTER4 1 A B C 2 3 4 5 6 FILTER1 FILTER2 FILTER5 FILTER6 C1 GND C2 B1 C3 GND C4 B2 C5 GND C6 B3 N003 Orientation Marking FILTER1 FILTER2 FILTER3 FILTER4 FILTER5 FILTER6 A1 A1 A2 A3 A4 A5 A6 Notes: CSP Package 1) These drawings are not to scale. 2) Lead-free devices are specified by using a "+" character for the top side orientation mark. CM1400-03CS/CP PIN DESCRIPTIONS PIN(s) A1 A2 A3 A4 A5 A6 B1-B3 C1 C2 C3 C4 C5 C6 NAME FILTER1 FILTER2 FILTER3 FILTER4 FILTER5 FILTER6 GND FILTER1 FILTER2 FILTER3 FILTER4 FILTER5 FILTER6 DESCRIPTION Filter Channel 1 Filter Channel 2 Filter Channel 3 Filter Channel 4 Filter Channel 5 Filter Channel 6 Device Ground Filter Channel 1 Filter Channel 2 Filter Channel 3 Filter Channel 4 Filter Channel 5 Filter Channel 6 Ordering Information PART NUMBERING INFORMATION Standard Finish Pins 15 Package CSP Ordering Part Number1 CM1400-03CS Part Marking N003 Lead-free Finish2 Ordering Part Number1 CM1400-03CP Part Marking N003 Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark. © 2005 California Micro Devices Corp. All rights reserved. 2 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com 10/04/05 CM1400-03 Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER Storage Temperature Range DC Power per Resistor DC Package Power Rating RATING -65 to +150 100 600 UNITS °C mW mW STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range RATING -40 to +85 UNITS °C ELECTRICAL OPERATING CHARACTERISTICS (SEE NOTE1) SYMBOL R C TCR TCC VDIODE ILEAK VSIG PARAMETER Resistance Capacitance Temperature Coefficient of Resistance Temperature Coefficient of Capacitance Diode Voltage (reverse bias) Diode Leakage Current (reverse bias) Signal Voltage Positive Clamp Negative Clamp In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 Clamping Voltage during ESD Discharge MIL-STD-883 (Method 3015), 8kV Positive Transients Negative Transients Cut-off Frequency ZSOURCE=50Ω, ZLOAD=50Ω At 2.5V DC IDIODE=10μA VDIODE=3.3V ILOAD = 10mA 5.6 -1.5 ±30 ±15 Notes 2, 3 and 4 +10 -5 R=100Ω, C=30pF 58 V V MHz 6.8 -0.8 At 2.5V DC CONDITIONS MIN 80 24 TYP 100 30 1200 -300 6.0 100 9.0 -0.4 MAX 120 36 UNITS Ω pF ppm/°C ppm/°C V nA V V kV kV VESD Notes 2 and 4 VCL fC Note 1: TA=25°C unless otherwise specified. Note 2: ESD applied to input and output pins with respect to GND, one at a time. Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1, then clamping voltage is measured at Pin C1. Note 4: These parameters are guaranteed by design and characterization. © 2005 California Micro Devices Corp. All rights reserved. 10/04/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com 3 CM1400-03 Performance Information Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment) Figure 1. Insertion Loss vs. Frequency (A1-C1 to GND B2) Figure 2. Insertion Loss vs. Frequency (A2-C2 to GND B2) © 2005 California Micro Devices Corp. All rights reserved. 4 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com 10/04/05 CM1400-03 Performance Information (cont’d) Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment) Figure 3. Insertion Loss vs. Frequency (A3-C3 to GND B2) Figure 4. Insertion Loss vs. Frequency (A4-C4 to GND B2) © 2005 California Micro Devices Corp. All rights reserved. 10/04/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com 5 CM1400-03 Performance Information (cont’d) Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment) Figure 5. Insertion Loss vs. Frequency (A5-C5 to GND B2) Figure 6. Insertion Loss vs. Frequency (A6-C6 to GND B2) © 2005 California Micro Devices Corp. All rights reserved. 6 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com 10/04/05 CM1400-03 Performance Information (cont’d) Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment) Figure 7. Comparison of Filter Response Curves for CM1400-03 with DC Bias © 2005 California Micro Devices Corp. All rights reserved. 10/04/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com 7 CM1400-03 Performance Information (cont’d) 1.6 1.5 1.4 Normalized Capacitance 1.3 1.2 T = -40C T = +25C T = +70C 1.1 1.0 0.9 0.8 0.7 0 1 2 3 4 5 DC Input Voltage (V) Figure 8. Filter Capacitance vs. Input Voltage over Temperature (normalized to capacitance at 2.5VDC and 25°C) 1.100 1.080 1.060 Nornalized Resistance 1.040 1.020 1.000 0.980 0.960 0.940 0.920 0.900 -40 -20 0 20 40 60 80 100 Temperature ['C] Figure 9. Resistance vs. Temperature (normalized to resistance at 25°C) © 2005 California Micro Devices Corp. All rights reserved. 8 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com 10/04/05 CM1400-03 Application Information Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages offered by California Micro Devices. PRINTED CIRCUIT BOARD RECOMMENDATIONS PARAMETER Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Flux Ratio Solder Paste Type Pad Protective Finish Tolerance — Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous Maximum Soldering Temperature for Eutectic Devices using a Eutectic Solder Paste Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder Paste Non-Solder Mask Defined Pad 0.275mm DIA. Solder Stencil Opening 0.330mm DIA. Solder Mask Opening 0.325mm DIA. VALUE 0.275mm Round Non-Solder Mask defined pads 0.325mm Round 0.125mm - 0.150mm 0.330mm Round 50/50 by volume No Clean OSP (Entek Cu Plus 106A) +50μm +20μm 60 seconds 240°C 260°C Figure 10. Recommended Non-Solder Mask Defined Pad Illustration 250 Temperature (°C) 200 150 100 50 0 1:00.0 2:00.0 3:00.0 Time (minutes) 4:00.0 Figure 11. Eutectic (SnPb) Solder Ball Reflow Profile © 2005 California Micro Devices Corp. All rights reserved. 10/04/05 Figure 12. Lead-free (SnAgCu) Solder Ball Reflow Profile 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com 9 CM1400-03 Mechanical Details CSP Mechanical Specifications The CM1400-03 is supplied in a custom Chip Scale Package (CSP). Dimensions are presented below. For complete information on the CSP, see the California Micro Devices CSP Package Information document. Mechanical Package Diagrams BOTTOM VIEW A1 OptiGuardTM Coating PACKAGE DIMENSIONS Package Bumps Dim A1 A2 B1 B2 B3 B4 C1 C2 D1 D2 Millimeters Min Nom Max Min Custom CSP 15 Inches Nom Max C1 B1 C B A 1 2 3 4 B2 B4 B3 A2 C2 5 6 D1 D2 2.915 2.960 3.005 0.1148 0.1165 0.1183 1.285 1.330 1.375 0.0506 0.0524 0.0541 0.495 0.500 0.505 0.0195 0.0197 0.0199 0.245 0.250 0.255 0.0096 0.0098 0.0100 0.430 0.435 0.440 0.0169 0.0171 0.0173 0.430 0.435 0.440 0.0169 0.0171 0.0173 0.180 0.230 0.280 0.0071 0.0091 0.0110 0.180 0.230 0.280 0.0071 0.0091 0.0110 0.575 0.644 0.714 0.0226 0.0254 0.0281 0.368 0.419 0.470 0.0145 0.0165 0.0185 3500 pieces 0.30 DIA. 63/37 Sn/Pb (Eutectic) or 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) SOLDER BUMPS SIDE VIEW DIMENSIONS IN MILLIMETERS Package Dimensions for CM1400-03 Chip Scale Package # per tape and reel Controlling dimension: millimeters CSP Tape and Reel Specifications PART NUMBER CM1400-03 CHIP SIZE (mm) 2.96 X 1.33 X 0.644 POCKET SIZE (mm) B0 X A0 X K0 3.10 X 1.45 X 0.74 Po Top Cover Tape TAPE WIDTH W 8mm REEL DIAMETER 178mm (7") QTY PER REEL 3500 P0 4mm P1 4mm 10 Pitches Cumulative Tolerance On Tape ±0.2 mm Ao W Bo Ko For Tape Feeder Reference Only including Draft. Concentric Around B. Embossment P1 User Direction of Feed Center Lines of Cavity Figure 13. Tape and Reel Mechanical Data © 2005 California Micro Devices Corp. All rights reserved. 10 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com 10/04/05