CM1401-03CP

CM1401-03 4-Channel ESD/EMI Filter Array plus 4-Channel ESD Array for USB Features • • • • • • • • • • • Functionally and pin compatible with CSPEMI307A device Optiguard™ coated for improved reliability at assembly Four channels of combined EMI/RFI filtering + ESD protection Four additional channels of ESD-only protection 40dB absolute attenuation (typical) at 1 GHz 35dB attenuation (typical) at 1 GHz relative to pass band ±15kV ESD protection on all channels (IEC 61000-4-2 Level 4, contact discharge) ±30kV ESD protection on all channels (HBM) 15-bump, 2.960mm X 1.330mm footprint Chip Scale Package (CSP) Chip Scale Package features extremely low lead inductance for optimum filter and ESD performance Lead-free version available Product Description The CM1401-03 is a multichannel array with four lowpass filter + ESD channels and four ESD-only channels. They reduce EMI/RFI emissions on a data port and protect against ESD on a USB port. Each EMI/RFI channel integrates a high quality pi-style filter (C-R-C) which provides greater than 30dB attenuation in the 800-2700 MHz range relative to the pass band attenuation. These pi-style filters are bidirectional, controlling EMI both to and from a data port connector. The CM1401-03 provides a high-level of ESD protection on all eight channels for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The input pins safely dissipate ESD strikes of ±15kV, exceeding the maximum requirement of the IEC 61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the device provides protection for contact discharges to greater than ±30kV. The CM1401-03 is particularly well suited for portable electronics (e.g., cellular telephones, PDAs, notebook computers) because of its small package footprint and low weight. The CM1401-03 incorporates Optiguard™ coating which results in improved reliability at assembly and is available in a space-saving, low-profile chip scale package with optional lead-free finishing. Applications • • • • • • • EMI filtering and ESD protection for both data and I/O ports Outer 4 channels provide ESD protection for USB lines and other I/O port applications Wireless Handsets Handheld PCs / PDAs MP3 Players Notebooks Desktop PCs Electrical Schematic 100Ω FILTER+ESDn* 30pF 30pF FILTER+ESDn* ESDn* 30pF GND (Pins B1-B3) 1 of 4 EMI/RFI + ESD Channels. * See Package/Pinout Diagram for expanded pin information 1 of 4 ESD-only Channels © 2005 California Micro Devices Corp. All rights reserved. 10/04/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 1 CM1401-03 PACKAGE / PINOUT DIAGRAMS (Bumps Down View) Orientation Marking (see note 2) TOP VIEW BOTTOM VIEW (Bumps Up View) FILTER+ESD_2 1 A B C 2 3 4 5 6 ESD_3 FILTER+ESD_4 C1 C2 FILTER+ESD_1 C3 GND C4 FILTER+ESD_3 C5 GND C6 ESD_4 N013 GND B1 A2 FILTER+ESD_1 B2 A4 FILTER+ESD_3 B3 A6 ESD_2 Orientation Marking ESD_1 FILTER+ESD_2 FILTER+ESD_4 A1 A1 A3 A5 Notes: CSP Package 1) These drawings are not to scale. 2) Lead-free devices are specified by using a "+" character for the top side orientation mark. CM1401-03 PIN DESCRIPTIONS PIN(s) A1 A2 A3 A4 A5 A6 B1-B3 C1 C2 C3 C4 C5 C6 NAME ESD_1 FILTER+ESD_1 FILTER+ESD_2 FILTER+ESD_3 FILTER+ESD_4 ESD_2 GND ESD_3 FILTER+ESD_1 FILTER+ESD_2 FILTER+ESD_3 FILTER+ESD_4 ESD_4 DESCRIPTION ESD Channel 1 Filter + ESD Channel 1 Filter + ESD Channel 2 Filter + ESD Channel 3 Filter + ESD Channel 4 ESD Channel 2 Device Ground ESD Channel 3 Filter + ESD Channel 1 Filter + ESD Channel 2 Filter + ESD Channel 3 Filter + ESD Channel 4 ESD Channel 4 Ordering Information PART NUMBERING INFORMATION Standard Finish Pins 15 Package CSP Ordering Part Number1 CM1401-03CS Part Marking N013 Lead-free Finish2 Ordering Part Number1 CM1401-03CP Part Marking N013 Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark. © 2005 California Micro Devices Corp. All rights reserved. 2 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 10/04/05 CM1401-03 Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER Storage Temperature Range DC Power per Resistor DC Package Power Rating RATING -65 to +150 100 600 UNITS °C mW mW STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range RATING -40 to +85 UNITS °C ELECTRICAL OPERATING CHARACTERISTICS (SEE NOTE1) SYMBOL R C TCR TCC VDIODE ILEAK VSIG PARAMETER Resistance Capacitance Temperature Coefficient of Resistance Temperature Coefficient of Capacitance Diode Voltage (reverse bias) Diode Leakage Current (reverse bias) Signal Voltage Positive Clamp Negative Clamp In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 Clamping Voltage during ESD Discharge MIL-STD-883 (Method 3015), 8kV Positive Transients Negative Transients Cut-off Frequency ZSOURCE=50Ω, ZLOAD=50Ω At 2.5V DC IDIODE=10μA VDIODE=3.3V ILOAD = 10mA 5.6 -1.5 ±30 ±15 Notes 2,3 and 4 +10 -5 R=100Ω , C=30pF 58 V V MHz 6.8 -0.8 At 2.5V DC CONDITIONS MIN 80 24 TYP 100 30 1200 -300 6.0 100 9.0 -0.4 MAX 120 36 UNITS Ω pF ppm/°C ppm/°C V nA V V kV kV VESD Notes 2 and 4 VCL fC Note 1: TA=25°C unless otherwise specified. Note 2: ESD applied to input and output pins with respect to GND, one at a time. Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A2, then clamping voltage is measured at Pin C2. Note 4: These parameters are guaranteed by design and characterization. © 2005 California Micro Devices Corp. All rights reserved. 10/04/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 3 CM1401-03 Performance Information Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment) Figure 1. Insertion Loss vs. Frequency (A2-C2 to GND B2) Figure 2. Insertion Loss vs. Frequency (A3-C3 to GND B2) © 2005 California Micro Devices Corp. All rights reserved. 4 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 10/04/05 CM1401-03 Performance Information Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment) Figure 3. Insertion Loss vs. Frequency (A4-C4 to GND B2) Figure 4. Insertion Loss vs. Frequency (A5-C5 to GND B2) © 2005 California Micro Devices Corp. All rights reserved. 10/04/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 5 CM1401-03 Performance Information Typical Filter Performance (TA=25°C, 50 Ohm Environment) Figure 5. Comparison of Filter Response Curves for CM1401-03CS with DC Bias © 2005 California Micro Devices Corp. All rights reserved. 6 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 10/04/05 CM1401-03 Performance Information (cont’d) 1.6 1.5 1.4 Normalized Capacitance 1.3 1.2 T = -40C T = +25C T = +70C 1.1 1.0 0.9 0.8 0.7 0 1 2 3 4 5 DC Input Voltage (V) Figure 6. Filter Capacitance vs. Input Voltage over Temperature (normalized to capacitance at 2.5VDC and 25°C) 1.100 1.080 1.060 Nornalized Resistance 1.040 1.020 1.000 0.980 0.960 0.940 0.920 0.900 -40 -20 0 20 40 60 80 100 Temperature ['C] Figure 7. Resistance vs. Temperature (normalized to resistance at 25°C) © 2005 California Micro Devices Corp. All rights reserved. 10/04/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 7 CM1401-03 Application Information Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages offered by California Micro Devices. PRINTED CIRCUIT BOARD RECOMMENDATIONS PARAMETER Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Flux Ratio Solder Paste Type Pad Protective Finish Tolerance — Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous Maximum Soldering Temperature for Eutectic Devices using a Eutectic Solder Paste Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder Paste VALUE 0.275mm Round Non-Solder Mask defined pads 0.325mm Round 0.125mm - 0.150mm 0.330mm Round 50/50 by volume No Clean OSP (Entek Cu Plus 106A) +50μm +20μm 60 seconds 240°C 260°C Non-Solder Mask Defined Pad 0.275mm DIA. Solder Stencil Opening 0.330mm DIA. Solder Mask Opening 0.325mm DIA. Figure 8. Recommended Non-Solder Mask Defined Pad Illustration 250 Temperature (°C) 200 150 100 50 0 1:00.0 2:00.0 3:00.0 Time (minutes) 4:00.0 Figure 9. Eutectic (SnPb) Solder Ball Reflow Profile © 2005 California Micro Devices Corp. All rights reserved. Figure 10. Lead-free (SnAgCu) Solder Ball Reflow Profile Tel: 408.263.3214 Fax: 408.263.7846 www.cmd.com 8 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● ● ● 10/04/05 CM1401-03 Mechanical Details CSP Mechanical Specifications The CM1401-03 is offered in a custom Chip Scale Package (CSP). Dimensions are presented below. For complete information on the CSP, see the California Micro Devices CSP Package Information document. C1 Mechanical Package Diagrams BOTTOM VIEW A1 B1 C B A B2 B4 B3 OptiGuardTM Coating PACKAGE DIMENSIONS Package Bumps Dim A1 A2 B1 B2 B3 B4 C1 C2 D1 D2 Millimeters Min Nom Max Min Custom CSP 15 Inches Nom Max A2 C2 1 2 3 4 5 6 D1 D2 2.915 2.960 3.005 0.1148 0.1165 0.1183 1.285 1.330 1.375 0.0506 0.0524 0.0541 0.495 0.500 0.505 0.0195 0.0197 0.0199 0.245 0.250 0.255 0.0096 0.0098 0.0100 0.430 0.435 0.440 0.0169 0.0171 0.0173 0.430 0.435 0.440 0.0169 0.0171 0.0173 0.180 0.230 0.280 0.0071 0.0091 0.0110 0.180 0.230 0.280 0.0071 0.0091 0.0110 0.575 0.644 0.714 0.0226 0.0254 0.0281 0.368 0.419 0.470 0.0145 0.0165 0.0185 3500 pieces 0.30 DIA. 63/37 Sn/Pb (Eutectic) or 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) SOLDER BUMPS SIDE VIEW DIMENSIONS IN MILLIMETERS Package Dimensions for CM1401-03 Chip Scale Package # per tape and reel Controlling dimension: millimeters CSP Tape and Reel Specifications PART NUMBER CM1401-03 CHIP SIZE (mm) 2.96 X 1.33 X 0.644 POCKET SIZE (mm) B0 X A0 X K0 3.10 X 1.45 X 0.74 Po Top Cover Tape TAPE WIDTH W 8mm REEL DIAMETER 178mm (7") QTY PER REEL 3500 P0 4mm P1 4mm 10 Pitches Cumulative Tolerance On Tape ±0.2 mm Ao W Bo Ko For Tape Feeder Reference Only including Draft. Concentric Around B. Embossment P1 User Direction of Feed Center Lines of Cavity Figure 11. Tape and Reel Mechanical Data © 2005 California Micro Devices Corp. All rights reserved. 10/04/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 9