CM1412

CM1412 2 Channel Headset Microphone EMI Filter with ESD Protection Features • • • • • • • • • • • Functionally and pin compatible with CMD’s CSPEMI202A OptiGuard™ coated for improved reliability at assembly Two channels of EMI filtering Pi-style EMI filters in a capacitor-resistor-capacitor (C-R-C) network Greater than 40dB attenuation at 1GHz +8kV ESD protection on each channel (IEC 61000-4-2 Level 4, contact discharge) +15kV ESD protection on each channel (HBM) Supports AC signals—ideal for audio applications Chip Scale Package features extremely low lead inductance for optimum filter and ESD performance 5-bump, 0.930mm X 1.410mm footprint Chip Scale Package (CSP) Lead-free version available Product Description The CM1412 is a dual low-pass filter array integrating two pi-style filters (C-R-C) that reduce EMI/RFI emissions while at the same time providing ESD protection. This part is custom-designed to interface with a microphone port on a cellular telephone or similar device. Each high quality filter provides more than 35dB attenuation in the 800-2700 MHz range. These pi-style filters support bidirectional filtering, controlling EMI both to and from a microphone element. They also support AC signals, enabling audio signals to pass through without distortion. In addition, the CM1412 provides a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The input pins safely dissipate ESD strikes of +8kV, the maximum requirement of the IEC 61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the device provides protection for contact discharges to greater than +15kV. The CM1412 is particularly well suited for portable electronics (e.g., cellular telephones, PDAs, notebook computers) because of its small package format and low weight. The CM1412 incorporates OptiGuard™ coating which results in improved reliability at assembly and is available in a space-saving, low-profile Chip Scale Package with optional lead-free finishing. Applications • • • • • • • EMI filtering and ESD protection for headset microphone ports Wireless Handsets Handheld PCs / PDAs MP3 Players Digital Camcorders Notebooks Desktop PCs Electrical Schematic MIC_IN1 A1 47pF 68Ω 47pF C1 MIC_OUT1 MIC_IN2 A3 47pF 68Ω C3 47pF MIC_OUT2 GND B2 © 2005 California Micro Devices Corp. All rights reserved. 11/03/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com 1 CM1412 PACKAGE / PINOUT DIAGRAMS TOP VIEW (Bumps Down View) Orientation Marking (see note 2) BOTTOM VIEW (Bumps Up View) MIC_OUT1 MIC_OUT2 123 A B C C1 C3 GND CB B2 Orientation Marking MIC_IN1 MIC_IN2 A1 A3 A1 Notes: 1) These drawings are not to scale. 2) Lead-free devices are specified by using a "+" character for the top side orientation mark. CM1412 CSP Package PIN DESCRIPTIONS PIN A1 A3 B2 C1 C3 NAME MIC_IN1 MIC_IN2 GND MIC_OUT1 MIC_OUT2 DESCRIPTION Microphone Input 1 (from microphone) Microphone Input 2 (from microphone) Device Ground Microphone Output 1 (to audio circuitry) Microphone Output 2 (to audio circuitry) Ordering Information PART NUMBERING INFORMATION Standard Finish Bumps 5 Package CSP Ordering Part Number1 CM1412-03CS Part Marking CB Lead-free Finish2 Ordering Part Number1 CM1412-03CP Part Marking CB Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark. © 2005 California Micro Devices Corp. All rights reserved. 2 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com 11/03/05 CM1412 Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER Storage Temperature Range DC Power per Resistor DC Package Power Rating RATING -65 to +150 100 200 UNITS °C mW mW STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range RATING -40 to +85 UNITS °C ELECTRICAL OPERATING CHARACTERISTICS (NOTE 1) SYMBOL R1 C1 ILEAK VSIG PARAMETER Resistance Capacitance Diode Leakage Current Signal Voltage Positive Clamp Negative Clamp In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 Clamping Voltage during ESD Discharge MIL-STD-883 (Method 3015), 8kV Positive Transients Negative Transients Cut-off frequency ZSOURCE = 50Ω, ZLOAD = 50Ω VIN=5.0V ILOAD = 10mA 5 -15 ±15 ±8 Notes 2,3,4 and 5 +15 -19 R = 68Ω, C = 47pF 60 V V MHz 7 -10 CONDITIONS MIN 61 38 TYP 68 47 MAX 75 56 1.0 15 -5 UNITS Ω pF μA V V kV kV VESD Notes 2,4 and 5 VCL fC Note 1: TA=25°C unless otherwise specified. Note 2: ESD applied to input and output pins with respect to GND, one at a time. Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1, then clamping voltage is measured at Pin C1. Note 4: Unused pins are left open. Note 5: These parameters are guaranteed by design and characterization. © 2005 California Micro Devices Corp. All rights reserved. 11/03/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com 3 CM1412 Performance Information Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment) Figure 1. Insertion Loss VS. Frequency (A1-C1 to GND B2) Figure 2. Insertion Loss VS. Frequency (A3-C3 to GND B2) © 2005 California Micro Devices Corp. All rights reserved. 4 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com 11/03/05 CM1412 Application Information Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages offered by California Micro Devices. PRINTED CIRCUIT BOARD RECOMMENDATIONS PARAMETER Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Flux Ratio Solder Paste Type Pad Protective Finish Tolerance — Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous Maximum Soldering Temperature for Eutectic Devices using a Eutectic Solder Paste Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder Paste Non-Solder Mask Defined Pad 0.275mm DIA. Solder Stencil Opening 0.330mm DIA. Solder Mask Opening 0.325mm DIA. VALUE 0.275mm Round Non-Solder Mask defined pads 0.325mm Round 0.125 - 0.150mm 0.330mm Round 50/50 by volume No Clean OSP (Entek Cu Plus 106A) +50μm +20μm 60 seconds 240°C 260°C Figure 3. Recommended Non-Solder Mask Defined Pad Illustration 250 Temperature (°C) 200 150 100 50 0 1:00.0 2:00.0 3:00.0 Time (minutes) 4:00.0 Figure 4. Eutectic (SnPb) Solder Ball Reflow Profile © 2005 California Micro Devices Corp. All rights reserved. 11/03/05 Figure 5. Lead-free (SnAgCu) Solder Ball Reflow Profile 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com 5 CM1412 Mechanical Details CSP Mechanical Specifications CM1412 devices are packaged in a custom Chip Scale Package (CSP). Dimensions are presented below. For complete information on CSP packaging, see the California Micro Devices CSP Package Information document. Mechanical Package Diagrams BOTTOM VIEW A1 B2 B1 C B A2 C1 B4 B3 OptiGuardTM Coating PACKAGE DIMENSIONS Package Bumps Dim A1 A2 B1 B2 B3 B4 C1 C2 D1 D2 Millimeters Min Nom Max Min Custom CSP 5 Inches Nom Max A 123 C2 0.885 0.930 0.975 0.0348 0.0366 0.0384 1.365 1.410 1.455 0.0537 0.0555 0.0573 0.495 0.500 0.505 0.0195 0.0197 0.0199 0.245 0.250 0.255 0.0096 0.0098 0.0100 0.430 0.435 0.440 0.0169 0.0171 0.0173 0.430 0.435 0.440 0.0169 0.0171 0.0173 0.165 0.215 0.265 0.0065 0.0085 0.0104 0.220 0.270 0.320 0.0087 0.0106 0.0126 0.575 0.644 0.714 0.0226 0.0254 0.0281 0.368 0.419 0.470 0.0145 0.0165 0.0185 3500 pieces 0.30 DIA. 63/37 Sn/Pb (Eutectic) or 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) SOLDER BUMPS DIMENSIONS IN MILLIMETERS D1 D2 SIDE VIEW Package Dimensions for CM1412 Chip Scale Package # per tape and reel Controlling dimension: millimeters CSP Tape and Reel Specifications PART NUMBER CM1412 CHIP SIZE (mm) 1.41 X 0.95 X 0.644 POCKET SIZE (mm) B0 X A0 X K0 1.52 X 1.07 X 0.720 TAPE WIDTH W 8mm REEL DIAMETER 178mm (7") 10 Pitches Cumulative Tolerance On Tape ±0.2 mm QTY PER REEL 3500 P0 4mm P1 4mm Po Top Cover Tape Ao W Bo Ko For Tape Feeder Reference Only including Draft. Concentric Around B. Embossment P1 User Direction of Feed Center Lines of Cavity Figure 6. Tape and Reel Mechanical Data © 2005 California Micro Devices Corp. All rights reserved. 6 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com 11/03/05