CM1418-0BCP

PRELIMINARY CM1418 Praetorian™ L-C EMI Filter with ESD Protection for Headset Speaker Applications Features • • • • • • • • 2 channels of EMI filtering ±30kV ESD protection (IEC 61000-4-2, contact discharge) ±30kV ESD protection (HBM) OptiGuard™ Coating for improved reliability at assembly Greater than 35dB of attenuation at 1GHz 6-bump, 1.720mm x 1.220mm footprint Chip Scale Package (CSP) Lead-free version available Product Description California Micro Devices’ CM1418 is an L-C EMI filter array with ESD protection, which integrates two Pifilters (C-L-C) for the headset speaker. The CM1418 has component values of 117pF-3.0nH-117pF. The parts include ESD protection diodes on all input/output pins, which provide a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The ESD diodes connected to the filter ports safely dissipate ESD strikes of ±30kV, beyond the maximum requirement of the IEC61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are protected for contact discharges at greater than ±30kV. This device is particularly well suited for portable electronics (e.g. mobile handsets, PDAs, notebook computers) because of its small package format and easy-to-use pin assignments. In particular, the CM1418 is ideal for EMI filtering and protecting speaker output lines from ESD for the headset speaker in mobile handsets. Most speakers have impedance of 8Ω and in order to maximize the power output, the resistance of an EMI filter needs to be as low as possible and the CM1418 addresses this by having a C-L-C based EMI filter where the inductor has less than 0.35Ω of resistance. The CM1418 is available either uncoated or with OptiGuard™ coating resulting in improved reliability at assembly. The CM1418 is also available in a space saving, low profile Chip Scale Package with optional lead-free finishing. Applications • • • Headset Speaker port in mobile handsets I/O port protection for mobile handsets, notebook computers, PDAs etc. EMI filtering for data ports in cell phones, PDAs or notebook computers. Electrical Schematic FILTER #1 A1 3nH A3 117pF FILTER #1 117pF GND FILTER #2 A2 B1 3nH B3 117pF FILTER #2 117pF GND B2 © 2005 California Micro Devices Corp. All rights reserved. 12/13/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 1 PRELIMINARY CM1418 PACKAGE / PINOUT DIAGRAMS TOP VIEW (Bumps Down View) Orientation Marking (see note 2) BOTTOM VIEW (Bumps Up View) 1 A B 2 3 B1 B2 A2 B3 A3 XX Orientation Marking A1 A1 Notes: 1) These drawings are not to scale. 2) Lead-free devices are specified by using a "+" character for the top side orientation mark. CM1418 CSP Package PIN DESCRIPTIONS PIN A1 A2 A3 B1 B2 B3 NAME Filter #1 GND Filter #1 Filter #2 GND Filter #2 DESCRIPTION Filter #1 Input Device Ground Filter #1 Input Filter #2 Input Device Ground Filter #2 Input Ordering Information PART NUMBERING INFORMATION Standard Finish Pins 6 6 Package CSP CSP OptiGuard™ Coating Y N Ordering Part Number1 CM1418-02CS CM1418-0BCS Part Marking CG AL Lead-free Finish2 Ordering Part Number1 CM1418-02CP CM1418-0BCP Part Marking CG AL Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark. © 2005 California Micro Devices Corp. All rights reserved. 2 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 12/13/05 PRELIMINARY CM1418 Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER Storage Temperature Range DC Current per Inductor DC Package Power Rating RATING -65 to +150 30 0.5 UNITS °C mA W STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range RATING -40 to +85 UNITS °C ELECTRICAL OPERATING CHARACTERISTICS (SEE NOTE 1) SYMBOL L R CTOT C1 VST ILEAK VSIG PARAMETER Inductance DC Channel Resistance Total Channel Capacitance Capacitance C1 Stand-off Voltage Diode Leakage Current Signal Clamp Voltage Positive Clamp Negative Clamp In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 Dynamic Resistance Positive Negative Cut-off frequency ZSOURCE = 50Ω, ZLOAD = 50Ω L = 3nH, C = 117pF 2.5V dc; 1MHz, 30mV ac 2.5V dc; 1MHz, 30mV ac I = 10μA VIN = ±3.3V ILOAD = 10mA ILOAD = -10mA Notes 2 and 3 ±30 ±30 kV kV 5.6 -9.0 187 93 CONDITIONS MIN TYP 3.0 0.28 234 117 6.0 0.1 6.8 -6.8 1.0 9.0 -5.6 0.35 281 140 MAX UNITS nH Ω pF pF V μA V V VESD RDYN 0.95 0.90 22 Ω Ω MHz fC Note 1: TA=25°C unless otherwise specified. Note 2: ESD applied to input and output pins with respect to GND, one at a time. Note 3: These parameters are guaranteed by design and characterization. © 2005 California Micro Devices Corp. All rights reserved. 12/13/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 3 PRELIMINARY CM1418 Performance Information Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment) Figure 1. Insertion Loss vs. Frequency (Filter #1 to GND B2) To be determined Figure 2. Insertion Loss vs. Frequency (Filter #2 to GND B2) © 2005 California Micro Devices Corp. All rights reserved. 4 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 12/13/05 PRELIMINARY CM1418 Capacitance (Normalized) 1.2 1 0.8 0.6 0.4 0.2 0 -6 -5 -4 -3 -2 -1 0 Voltage 1 2 3 4 5 6 Figure 3. Typical Diode Capacitance vs. Input Voltage (normalized to 2.5VDC) © 2005 California Micro Devices Corp. All rights reserved. 12/13/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 5 PRELIMINARY CM1418 Application Information Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages offered by California Micro Devices. PRINTED CIRCUIT BOARD RECOMMENDATIONS PARAMETER Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Flux Ratio Solder Paste Type Pad Protective Finish Tolerance — Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous Maximum Soldering Temperature for Eutectic Devices using a Eutectic Solder Paste Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder Paste Non-Solder Mask Defined Pad 0.275mm DIA. Solder Stencil Opening 0.330mm DIA. Solder Mask Opening 0.325mm DIA. VALUE 0.275mm Round Non-Solder Mask defined pads 0.325mm Round 0.125 - 0.150mm 0.330mm Round 50/50 by volume No Clean OSP (Entek Cu Plus 106A) +50μm +20μm 60 seconds 240°C 260°C Figure 4. Recommended Non-Solder Mask Defined Pad Illustration 250 Temperature (°C) 200 150 100 50 0 1:00.0 2:00.0 3:00.0 Time (minutes) 4:00.0 Figure 5. Eutectic (SnPb) Solder Ball Reflow Profile © 2005 California Micro Devices Corp. All rights reserved. Figure 6. Lead-free (SnAgCu) Solder Ball Reflow Profile 6 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 12/13/05 PRELIMINARY CM1418 Mechanical Details CM1418 CSP Mechanical Specifications The CM1418 is supplied in 6-bump Chip Scale Package (CSP). Dimensions are presented below. Mechanical Package Diagrams Non-Coated CSP BOTTOM VIEW A1 C1 B1 B2 PACKAGE DIMENSIONS Package Bumps Dim A1 A2 B1 B2 C1 C2 D1 D2 D3 D4 Millimeters Min Nom Max Min Custom CSP 6 Inches Nom Max 3 2 1 1.175 1.220 1.265 0.0463 0.0480 0.0498 1.675 1.720 1.765 0.0659 0.0677 0.0695 0.495 0.500 0.505 0.0195 0.0197 0.0199 0.495 0.500 0.505 0.0195 0.0197 0.0199 0.310 0.360 0.410 0.0122 0.0142 0.0161 0.310 0.360 0.410 0.0122 0.0142 0.0161 0.562 0.606 0.650 0.0221 0.0239 0.0256 0.356 0.381 0.406 0.0140 0.0150 0.0160 0.575 0.644 0.714 0.0226 0.0254 0.0281 0.368 0.419 0.470 0.0145 0.0165 0.0185 3500 pieces A2 B A C2 D1 D2 0.30 DIA. 63/37 Sn/Pb (Eutectic) or 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) SOLDER BUMPS SIDE VIEW OptiGuard™ Coated CSP BOTTOM VIEW A1 C1 B1 3 2 1 B A C2 D3 A2 B2 # per tape and reel Controlling dimension: millimeters OptiGuardTM Coating D4 0.30 DIA. 63/37 Sn/Pb (Eutectic) or 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) SOLDER BUMPS SIDE VIEW NOTE: DIMENSIONS IN MILLIMETERS Package Dimensions for CM1418-0xCS/CP 6-bump Chip Scale Package © 2005 California Micro Devices Corp. All rights reserved. 12/13/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 7 PRELIMINARY CM1418 Mechanical Details (cont’d) CSP Tape and Reel Specifications POCKET SIZE (mm) B0 X A0 X K0 2.08 x 1.45 x 0.71 2.08 x 1.45 x 0.71 Po Top Cover Tape PART NUMBER CM1418-02CS/CP CM1418-02CS/CP CHIP SIZE (mm) 1.72 X 1.22 X 0.67 1.72 X 1.22 X 0.61 TAPE WIDTH W 8mm 8mm REEL DIA. 178mm (7") 178mm (7") QTY PER REEL 3500 3500 P0 4mm 4mm P1 4mm 4mm 10 Pitches Cumulative Tolerance On Tape ±0.2 mm Ao W Bo Ko For tape feeder reference only including draft. Concentric around B. Embossment P1 User Direction of Feed Center Lines of Cavity Figure 7. Tape and Reel Mechanical DataTape and Reel Mechanical Data © 2005 California Micro Devices Corp. All rights reserved. 8 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 12/13/05