CM1426-04CP

PRELIMINARY CM1426 LCD and Camera EMI Filter Array with ESD Protection Features • • • • • • • • • Four, six and eight channels of EMI filtering with integrated ESD protection 0.5mm pitch, 10-bump, 1.96mm x 1.33mm footprint Chip Scale Package (CM1426-04) 0.5mm pitch, 15-bump, 2.96mm x 1.33mm footprint Chip Scale Package (CM1426-06) 0.5mm pitch, 20-bump, 3.96mm x 1.33mm footprint Chip Scale Package (CM1426-08) Pi-style EMI filters in a capacitor-resistor-capacitor (C-R-C) network ±8kV ESD protection on each channel (IEC 61000-4-2 Level 4, contact discharge) ±15kV ESD protection on each channel (HBM) Greater than 20dB attenuation (typical) at 1 GHz Chip Scale Package features extremely low lead inductance for optimum filter and ESD performance Optiguard™ coated for improved reliability at assembly Lead-free version available Product Description The CM1426 is a family of pi-style EMI filter arrays with ESD protection, which integrates four, six and eight filters (C-R-C) in a Chip Scale Package with 0.50mm pad pitch. The CM1426 has component values of 8.5pF-100Ω-8.5pF per channel. The CM1426 has a cut-off frequency of 230MHz and can be used in applications where the data rates are as high as 92Mbps. The parts include avalanche-type ESD diodes on every pin, which provide a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The ESD protection diodes safely dissipate ESD strikes of ±8kV, well beyond the maximum requirement of the IEC61000-42 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are protected for contact discharges at greater than ±15kV. These devices are particularly well-suited for portable electronics (e.g. wireless handsets, PDAs, notebook computers) because of their small package and easyto-use pin assignments. In particular, the CM1426 is ideal for EMI filtering and protecting data and control lines for the I/O data ports, LCD display and camera interface in mobile handsets. The CM1426 incorporates Optiguard™ which results in improved reliability at assembly. The CM1426 is available in a space-saving, low-profile Chip Scale Package with optional lead-free finishing. • • Applications • • • • • • LCD and Camera data lines in mobile handsets I/O port protection for mobile handsets, notebook computers, PDAs etc. EMI filtering for data ports in cell phones, PDAs or notebook computers. Wireless handsets Handheld PCs/PDAs LCD and camera modules Electrical Schematic 100Ω FILTER+ESDn* (Pins A1-An) FILTER+ESDn* (Pins C1-Cn) 8.5pF 8.5pF GND* (Pins B1-Bm) * See Package/Pinout Diagram for expanded pin information. © 2005 California Micro Devices Corp. All rights reserved. 08/30/05 1 of 4, 6 or 8 EMI/RFI + ESD Channels 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com 1 PRELIMINARY CM1426 PACKAGE / PINOUT DIAGRAMS (Bumps Down View) Orientation Marking (see note 2) TOP VIEW 1 2 3 BOTTOM VIEW (Bumps Up View) 4 FILTER1 FILTER2 FILTER3 FILTER4 A B C C1 C2 GND C3 GND C4 B2 N264 B1 Orientation Marking FILTER1 FILTER2 FILTER3 FILTER4 A1 A1 A2 A3 A4 CM1426-04CS/CP 10 Bump CSP Package Orientation Marking (see note 2) 1 A B C 2 3 4 5 6 FILTER1 FILTER2 FILTER3 FILTER4 FILTER5 FILTER6 C1 C2 GND C3 GND C4 B2 C5 GND C6 B3 N266 B1 Orientation Marking FILTER1 FILTER2 FILTER3 FILTER4 FILTER5 FILTER6 A1 A1 A2 A3 A4 A5 A6 CM1426-06CS/CP 15 Bump CSP Package Orientation Marking (see note 2) 1 A B C 2 3 4 5 6 7 8 FILTER1 FILTER2 FILTER3 FILTER4 FILTER5 FILTER6 FILTER7 FILTER8 C1 C2 GND C3 GND C4 B2 C5 GND C6 B3 C7 GND C8 B4 N268 Orientation Marking B1 FILTER1 FILTER2 FILTER3 FILTER4 FILTER5 FILTER6 FILTER7 FILTER8 A1 A1 A2 A3 A4 A5 A6 A7 A8 CM1426-08CS/CP 20 Bump CSP Package Notes: 1) These drawings are not to scale. 2) Lead-free devices are specified by using a "+" character for the top side orientation mark. PIN DESCRIPTIONS PIN(s) A1 A2 A3 A4 A5 A6 A7 A8 B1-B4 NAME FILTER1 FILTER2 FILTER3 FILTER4 FILTER5 FILTER6 FILTER7 FILTER8 GND DESCRIPTION Filter + ESD Channel 1 Filter + ESD Channel 2 Filter + ESD Channel 3 Filter + ESD Channel 4 Filter + ESD Channel 5 Filter + ESD Channel 6 Filter + ESD Channel 7 Filter + ESD Channel 8 Device Ground PIN(s) C1 C2 C3 C4 C5 C6 C7 C8 NAME FILTER1 FILTER2 FILTER3 FILTER4 FILTER5 FILTER6 FILTER7 FILTER8 DESCRIPTION Filter + ESD Channel 1 Filter + ESD Channel 2 Filter + ESD Channel 3 Filter + ESD Channel 4 Filter + ESD Channel 5 Filter + ESD Channel 6 Filter + ESD Channel 7 Filter + ESD Channel 8 © 2005 California Micro Devices Corp. All rights reserved. 2 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com 08/30/05 PRELIMINARY CM1426 Ordering Information PART NUMBERING INFORMATION Standard Finish Bumps 10 15 20 Package CSP CSP CSP Ordering Part Number1 CM1426-04CS CM1426-06CS CM1426-08CS Part Marking N264 N266 N268 Lead-free Finish2 Ordering Part Number1 CM1426-04CP CM1426-06CP CM1426-08CP Part Marking N264 N266 N268 Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark. Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER Storage Temperature Range DC Power per Resistor DC Package Power Rating RATING -65 to +150 100 500 UNITS °C mW mW STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range RATING -40 to +85 UNITS °C ELECTRICAL OPERATING CHARACTERISTICS (SEE NOTE1) SYMBOL R CTOTAL C VDIODE ILEAK VSIG PARAMETER Resistance Total Channel Capacitance Capacitance C1 Standoff Voltage Diode Leakage Current (reverse bias) Signal Clamp Voltage Positive Clamp Negative Clamp In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 At 2.5VDC Reverse Bias, 1MHz, 30mVAC At 2.5VDC Reverse Bias, 1MHz, 30mVAC IDIODE=10μA VDIODE= 3.3V ILOAD = 10mA ILOAD = -10mA Notes 2 and 3 ±15 ±8 kV kV 5.6 -1.5 CONDITIONS MIN 80 13.6 6.8 TYP 100 17 8.5 6.0 0.1 6.8 -0.8 1 9.0 -0.4 MAX 120 20.4 10.2 UNITS Ω pF pF V μA V V VESD © 2005 California Micro Devices Corp. All rights reserved. 08/30/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com 3 PRELIMINARY CM1426 ELECTRICAL OPERATING CHARACTERISTICS (SEE NOTE1) RDYN Dynamic Resistance Positive Negative Cut-off Frequency ZSOURCE=50Ω, ZLOAD=50Ω R=100Ω, C=17pF 2.3 0.9 230 Ω Ω MHz fC Note 1: TA=25°C unless otherwise specified. Note 2: ESD applied to input and output pins with respect to GND, one at a time. Note 3: These parameters are guaranteed by design and characterization. © 2005 California Micro Devices Corp. All rights reserved. 4 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com 08/30/05 PRELIMINARY CM1426 Performance Information Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment) Figure 1. Insertion Loss vs. Frequency (A1-C1 to GND B1) Figure 2. Insertion Loss vs. Frequency (A2-C2 to GND B1) © 2005 California Micro Devices Corp. All rights reserved. 08/30/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com 5 PRELIMINARY CM1426 Performance Information (cont’d) Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment) Figure 3. Insertion Loss vs. Frequency (A3-C3 to GND B2) Figure 4. Insertion Loss vs. Frequency (A4-C4 to GND B2) © 2005 California Micro Devices Corp. All rights reserved. 6 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com 08/30/05 PRELIMINARY CM1426 Performance Information (cont’d) Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment) Figure 5. Insertion Loss vs. Frequency (A5-C5 to GND B3) Figure 6. Insertion Loss vs. Frequency (A6-C6 to GND B3) © 2005 California Micro Devices Corp. All rights reserved. 08/30/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com 7 PRELIMINARY CM1426 Performance Information (cont’d) Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment) Figure 7. Insertion Loss vs. Frequency (A7-C7 to GND B4) Figure 8. Insertion Loss vs. Frequency (A8-C8 to GND B4) © 2005 California Micro Devices Corp. All rights reserved. 8 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com 08/30/05 PRELIMINARY CM1426 Performance Information (cont’d) Typical Diode Capacitance vs. Input Voltage Capacitance (Normalized) DC Voltage Figure 9. Filter Capacitance vs. Input Voltage over Temperature (normalized to capacitance at 2.5VDC and 25°C) © 2005 California Micro Devices Corp. All rights reserved. 08/30/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com 9 PRELIMINARY CM1426 Application Information Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages offered by California Micro Devices. PRINTED CIRCUIT BOARD RECOMMENDATIONS PARAMETER Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Flux Ratio Solder Paste Type Pad Protective Finish Tolerance — Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous (183°C) Maximum Soldering Temperature for Eutectic Devices using a Eutectic Solder Paste Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder Paste VALUE 0.275mm Round Non-Solder Mask defined pads 0.325mm Round 0.125mm - 0.150mm 0.330mm Round 50/50 by volume No Clean OSP (Entek Cu Plus 106A) +50μm +20μm 60 seconds 240°C 260°C Non-Solder Mask Defined Pad 0.275mm DIA. Solder Stencil Opening 0.330mm DIA. Solder Mask Opening 0.325mm DIA. Figure 10. Recommended Non-Solder Mask Defined Pad Illustration 250 Temperature (°C) 200 150 100 50 0 1:00.0 2:00.0 3:00.0 Time (minutes) 4:00.0 Figure 11. Eutectic (SnPb) Solder Ball Reflow Profile © 2005 California Micro Devices Corp. All rights reserved. Figure 12. Lead-free (SnAgCu) Solder Ball Reflow Profile Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com 10 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● ● ● 08/30/05 PRELIMINARY CM1426 Mechanical Details CSP Mechanical Specifications CM1426 devices are supplied in custom Chip Scale Packages (CSP). Dimensions are presented below. For complete information on CSP packaging, see the CM1426-04 Mechanical Specifications The package dimensions for the CM1426-04 are presented below. Mechanical Package Diagrams BOTTOM VIEW A1 B2 B1 C1 B4 B3 OptiGuardTM Coating California Micro Devices CSP Package Information document. PACKAGE DIMENSIONS Package Bumps Dim A1 A2 B1 B2 B3 B4 C1 C2 D1 D2 Millimeters Min 1.915 1.285 0.495 0.245 0.430 0.430 0.180 0.180 0.575 0.368 Nom 1.960 1.330 0.500 0.250 0.435 0.435 0.230 0.230 0.644 0.419 Max 2.005 1.375 0.505 0.255 0.440 0.440 0.280 0.280 0.714 0.470 Min Custom CSP 10 Inches Nom Max 0.0754 0.0772 0.0789 0.0506 0.0524 0.0541 0.0195 0.0197 0.0199 0.0096 0.0098 0.0100 0.0169 0.0171 0.0173 0.0169 0.0171 0.0173 0.0071 0.0091 0.0110 0.0071 0.091 0.0110 0.0226 0.0254 0.0281 0.0145 0.0165 0.0185 C B A 1 2 3 4 C2 D1 D2 A2 0.30 DIA. 63/37 Sn/Pb (Eutectic) or 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) SOLDER BUMPS DIMENSIONS IN MILLIMETERS SIDE VIEW # per tape and reel 3500 pieces Package Dimensions for CM1426-04 Chip Scale Package Controlling dimension: millimeters CSP Tape and Reel Specifications PART NUMBER CM1426-04 CHIP SIZE (mm) 1.96 x 1.33 x 0.644 POCKET SIZE (mm) B0 X A0 X K0 2.08 x 1.45 x 0.71 TAPE WIDTH W 8mm Po Top Cover Tape REEL DIAMETER 178mm (7") 10 Pitches cumulative tolerance on tape ±0.2 mm QTY PER REEL 3500 P0 4mm P1 4mm Ao W Ko Bo For tape feeder reference only including draft. Concentric around B. Embossment P1 User direction of feed Center lines of cavity Figure 13. Tape and Reel Mechanical Data © 2005 California Micro Devices Corp. All rights reserved. 08/30/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com 11 PRELIMINARY CM1426 Mechanical Details (cont’d) CM1426-06 Mechanical Specifications The package dimensions for the CM1426-06 are presented below. Mechanical Package Diagrams PACKAGE DIMENSIONS Package Bumps Dim A1 A2 B1 B2 B3 B4 C1 C2 D1 D2 Millimeters Min 2.915 1.285 0.495 0.245 0.430 0.430 0.180 0.180 0.575 0.368 Nom 2.960 1.330 0.500 0.250 0.435 0.435 0.230 0.230 0.644 0.419 Max 3.005 1.375 0.505 0.255 0.440 0.440 0.280 0.280 0.714 0.470 Min Custom CSP 15 Inches Nom Max 0.1148 0.1165 0.1183 0.0506 0.0524 0.0541 0.0195 0.0197 0.0199 0.0096 0.0098 0.0100 0.0169 0.0171 0.0173 0.0169 0.0171 0.0173 0.0071 0.0091 0.0110 0.0071 0.091 0.0110 0.0226 0.0254 0.0281 0.0145 0.0165 0.0185 C1 BOTTOM VIEW A1 B1 C B A 1 2 3 4 5 6 D1 D2 B2 B4 B3 OptiGuardTM Coating A2 C2 0.30 DIA. 63/37 Sn/Pb (Eutectic) or 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) SOLDER BUMPS SIDE VIEW DIMENSIONS IN MILLIMETERS Package Dimensions for CM1426-06 Chip Scale Package # per tape and reel 3500 pieces Controlling dimension: millimeters CSP Tape and Reel Specifications POCKET SIZE (mm) B0 X A0 X K0 3.10 x 1.45 x 0.74 Po Top Cover Tape PART NUMBER CM1426-06 CHIP SIZE (mm) 2.96 x 1.33 x 0.644 TAPE WIDTH W 8mm REEL DIAMETER 178mm (7") QTY PER REEL 3500 P0 4mm P1 4mm 10 Pitches cumulative tolerance on tape ±0.2 mm Ao W Ko Bo For tape feeder reference only including draft. Concentric around B. Embossment P1 User direction of feed Center lines of cavity Figure 14. Tape and Reel Mechanical Data © 2005 California Micro Devices Corp. All rights reserved. 12 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com 08/30/05 PRELIMINARY CM1426 Mechanical Details (cont’d) CM1426-08 Mechanical Specifications The package dimensions for the CM1426-08 are presented below. Mechanical Package Diagrams BOTTOM VIEW A1 C1 B1 C B2 B4 B3 PACKAGE DIMENSIONS Package Bumps Dim A1 A2 B1 B2 B3 B4 C1 C2 D1 D2 Millimeters Min 3.915 1.285 0.495 0.245 0.430 0.430 0.180 0.180 0.575 0.368 Nom 3.960 1.330 0.500 0.250 0.435 0.435 0.230 0.230 0.644 0.419 Max 4.005 1.375 0.505 0.255 0.440 0.440 0.280 0.280 0.714 0.470 Min Custom CSP 20 Inches Nom Max 0.1541 0.1559 0.1577 0.0506 0.0524 0.0541 0.0195 0.0197 0.0199 0.0096 0.0098 0.0100 0.0169 0.0171 0.0173 0.0169 0.0171 0.0173 0.0071 0.0091 0.0110 0.0071 0.091 0.0110 0.0226 0.0254 0.0281 0.0145 0.0165 0.0185 OptiGuardTM Coating B A 1 A 2 3 4 5 6 7 8 A2 C2 D1 D2 0.30 DIA. 63/37 Sn/Pb (Eutectic) or 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) SOLDER BUMPS SIDE VIEW DIMENSIONS IN MILLIMETERS Package Dimensions for CM1426-08 Chip Scale Package # per tape and reel 3500 pieces Controlling dimension: millimeters CSP Tape and Reel Specifications PART NUMBER CM1426-08 CHIP SIZE (mm) 3.96 x 1.33 x 0.644 POCKET SIZE (mm) B0 X A0 X K0 4.11 x 1.57 x 0.76 TAPE WIDTH W 8mm Po Top Cover Tape REEL DIAMETER 178mm (7") QTY PER REEL 3500 P0 4mm P1 4mm 10 Pitches cumulative tolerance on tape ±0.2 mm Ao W Ko Bo For tape feeder reference only including draft. Concentric around B. Embossment P1 User direction of feed Center lines of cavity Figure 15. Tape and Reel Mechanical Data © 2005 California Micro Devices Corp. All rights reserved. 08/30/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com 13