CM1430-06DE

CM1430 LCD and Camera EMI Filter Array with ESD Protection Features • • • • • • Four, six and eight channels of EMI filtering with integrated ESD protection Pi-style EMI filters in a capacitor-resistor-capacitor (C-R-C) network ±15kV ESD protection on each channel (IEC 61000-4-2 Level 4, contact discharge) ±30kV ESD protection on each channel (HBM) Greater than 20dB attenuation (typical) at 1 GHz TDFN package with 0.40mm lead pitch: • 4-ch. = 8-lead TDFN • 6-ch. = 12-lead TDFN • 8-ch. = 16-lead TDFN Tiny TDFN package size: • 8-lead: 1.7mm x 1.35mm • 12-lead: 2.5mm x 1.35mm • 16-lead: 3.3mm x 1.35mm Increased robustness against vertical impacts during manufacturing process Lead-free version available Product Description The CM1430 is a family of pi-style EMI filter arrays with ESD protection, which integrates four, six and eight filters (C-R-C) in small form factor TDFN 0.40mm pitch packages. The CM1430 has component values of 8.5pF-100Ω-8.5pF per channel. The CM1430 has a cut-off frequency of 200MHz and can be used in applications with data rates up to 80Mbps. The parts include ESD diodes on every pin, which provide a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The ESD protection diodes safely dissipate ESD strikes of ±15kV, well beyond the maximum requirement of the IEC61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are protected for contact discharges at greater than ±30kV. These devices are particularly well-suited for portable electronics (e.g. wireless handsets, PDAs, notebook computers) because of their small package and easyto-use pin assignments. In particular, the CM1430 is ideal for EMI filtering and protecting data and control lines for the I/O data ports, LCD display and camera interface in mobile handsets. The CM1430 is housed in space-saving, low-profile 8-, 12- and 16-lead TDFN packages with a 0.4mm pitch and is available with lead-free finishing. This new small TDFN package provides up to 42% board space savings vs. the 0.50mm pitch TDFN packages. • • • Applications • • • • • • LCD and Camera data lines in mobile handsets I/O port protection for mobile handsets, notebook computers, PDAs etc. EMI filtering for data ports in cell phones, PDAs or notebook computers. Wireless handsets Handheld PCs/PDAs LCD and camera modules Electrical Schematic 100Ω FILTER+ESDn* 8.5pF 8.5pF FILTER+ESDn* GND * See Package/Pinout Diagram for expanded pin information. 1 of 4, 6 or 8 EMI/RFI Filter Channels with Integrated ESD Protection © 2006 California Micro Devices Corp. All rights reserved. 03/02/06 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 1 CM1430 PACKAGE / PINOUT DIAGRAMS (Pins Down View) 8765 TOP VIEW BOTTOM VIEW (Pins Up View) 1234 (Pins Down View) 12 11 10 9 8 7 TOP VIEW BOTTOM VIEW (Pins Up View) 123456 Pin 1 Marking XX GND PAD Pin 1 Marking XXXX GND PAD 1234 8765 12345 6 12 11 10 9 8 7 CM1430-04DF/DE 8 Lead TDFN Package TOP VIEW (Pins Down View) CM1430-06DF/DE 12 Lead TDFN Package BOTTOM VIEW (Pins Up View) 1234567 8 16 15 14 13 12 11 10 9 Pin 1 Marking XXXXX GND PAD Notes: 1) These drawings are not to scale. 12345 67 8 16 15 14 13 12 11 10 9 CM1430-08DF/DE 16 Lead TDFN Package PIN DESCRIPTIONS DEVICE PIN(s) -04 1 2 3 4 -06 1 2 3 4 5 6 -08 1 2 3 4 5 6 7 8 GND PAD NAME FILTER1 FILTER2 FILTER3 FILTER4 FILTER5 FILTER6 FILTER7 FILTER8 GND DESCRIPTION Filter + ESD Channel 1 Filter + ESD Channel 2 Filter + ESD Channel 3 Filter + ESD Channel 4 Filter + ESD Channel 5 Filter + ESD Channel 6 Filter + ESD Channel 7 Filter + ESD Channel 8 Device Ground DEVICE PIN(s) -04 8 7 6 5 -06 12 11 10 9 8 7 -08 16 15 14 13 12 11 10 9 NAME FILTER1 FILTER2 FILTER3 FILTER4 FILTER5 FILTER6 FILTER7 FILTER8 DESCRIPTION Filter + ESD Channel 1 Filter + ESD Channel 2 Filter + ESD Channel 3 Filter + ESD Channel 4 Filter + ESD Channel 5 Filter + ESD Channel 6 Filter + ESD Channel 7 Filter + ESD Channel 8 Ordering Information PART NUMBERING INFORMATION Standard Finish Pins 8 12 16 Package TDFN-8 TDFN-12 TDFN-16 Ordering Part Number1 CM1430-04DF CM1430-06DF CM1430-08DF Part Marking VF N30F N308F Lead-free Finish Ordering Part Number1 CM1430-04DE CM1430-06DE CM1430-08DE Part Marking VE N30E N308E Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. © 2006 California Micro Devices Corp. All rights reserved. 2 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 03/02/06 CM1430 Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER Storage Temperature Range DC Power per Resistor DC Package Power Rating RATING -65 to +150 100 500 UNITS °C mW mW STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range RATING -40 to +85 UNITS °C ELECTRICAL OPERATING CHARACTERISTICS (SEE NOTE1) SYMBOL R CTOTAL C VDIODE ILEAK VSIG PARAMETER Resistance Total Channel Capacitance Capacitance C1 Standoff Voltage Diode Leakage Current (reverse bias) Signal Clamp Voltage Positive Clamp Negative Clamp In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 Dynamic Resistance Positive Negative Cut-off Frequency ZSOURCE=50Ω, ZLOAD=50Ω Channel R = 100Ω, Channel C = 8.5pF At 2.5VDC Reverse Bias, 1MHz, 30mVAC At 2.5VDC Reverse Bias, 1MHz, 30mVAC IDIODE=10μA VDIODE=+3.3V ILOAD = 10mA ILOAD = -10mA Notes 2 and 3 ±30 ±15 2.3 0.9 200 kV kV Ω Ω MHz 5.6 -1.5 CONDITIONS MIN 80 14 7 TYP 100 17 8.5 6.0 0.1 6.8 -0.8 1.0 9.0 -0.4 MAX 120 22 11 UNITS Ω pF pF V μA V V VESD RDYN fC Note 1: TA=25°C unless otherwise specified. Note 2: ESD applied to input and output pins with respect to GND, one at a time. Note 3: These parameters are guaranteed by design and characterization. © 2006 California Micro Devices Corp. All rights reserved. 03/02/06 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 3 CM1430 Performance Information Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment) Figure 1. Insertion Loss vs. Frequency (FILTER1 Input to GND) Figure 2. Insertion Loss vs. Frequency (FILTER2 Input to GND) © 2006 California Micro Devices Corp. All rights reserved. 4 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 03/02/06 CM1430 Performance Information (cont’d) Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment) Figure 3. Insertion Loss vs. Frequency (FILTER3 Input to GND) Figure 4. Insertion Loss vs. Frequency (FILTER4 Input to GND) © 2006 California Micro Devices Corp. All rights reserved. 03/02/06 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 5 CM1430 Performance Information (cont’d) Typical Diode Capacitance vs. Input Voltage Capacitance (Normalized) DC Voltage Figure 5. Filter Capacitance vs. Input Voltage (normalized to capacitance at 2.5VDC and 25°C) © 2006 California Micro Devices Corp. All rights reserved. 6 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 03/02/06 CM1430 Mechanical Details CM1430-04DF/DE Mechanical Specifications Dimensions for the CM1430-04DF/DE suplied in a 8lead, 0.4mm pitch TDFN package are presented below. For complete information on the TDFN-8, see the California Micro Devices TDFN Package Information document. E Mechanical Package Diagrams D 8765 Pin 1 Marking PACKAGE DIMENSIONS Package JEDEC No. Leads Dim. A A1 A3 b D D2 E E2 e K L # per tape and reel 0.20 0.15 0.25 0.35 0.15 1.60 1.10 1.25 0.30 Millimeters Min 0.70 0.00 Nom 0.75 0.02 0.20 REF 0.20 1.70 1.20 1.35 0.40 0.40 BSC 0.25 1.80 1.30 1.45 0.50 Max 0.80 0.05 Min 0.028 0.000 0.006 0.063 0.043 0.049 0.012 0.008 0.006 0.010 0.014 K TDFN MO-229C✝ 8 Inches Nom 0.030 0.001 0.008 0.067 0.047 0.053 0.016 Max 0.031 0.002 0.010 0.071 0.051 0.057 0.020 Pin 1 Locator e 0.08 C 0.10 C 1234 TOP VIEW 0.008 REF A1 SIDE VIEW A A3 8X 0.10 M CAB b E2 1 2 C0.2 3 4 0.016 BSC 8 GND PAD 6 5 7 D2 3000 pieces L Controlling dimension: millimeters ✝ This package is compliant with JEDEC standard MO-229C with the exception of the "D", "D2", "E", "E2", "K" and "L" dimensions as called out in the table above. BOTTOM VIEW Dimensions for 8-Lead, 0.4mm pitch TDFN package © 2006 California Micro Devices Corp. All rights reserved. 03/02/06 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 7 CM1430 Mechanical Details (cont’d) CM1430-06DF/DE Mechanical Specifications Dimensions for the CM1430-06DF/DE suplied in a 12lead, 0.4mm pitch TDFN package are presented below. For complete information on the TDFN-12, see the California Micro Devices TDFN Package Information document. E Mechanical Package Diagrams D 12 11 10 9 8 7 Pin 1 Marking PACKAGE DIMENSIONS Package JEDEC No. Leads Dim. A A1 A3 b D D2 E E2 e K L # per tape and reel 0.20 0.15 0.25 0.35 0.15 2.40 1.90 1.25 0.30 Millimeters Min 0.70 0.00 Nom 0.75 0.02 0.20 REF 0.20 2.50 2.00 1.35 0.40 0.40 BSC 0.25 2.60 2.10 1.45 0.50 Max 0.80 0.05 Min 0.028 0.000 0.006 0.094 0.075 0.049 0.012 0.008 0.006 0.010 0.014 3000 pieces TDFN MO-229C✝ 12 Inches Nom 0.030 0.001 0.008 0.098 0.079 0.053 0.016 Max 0.031 0.002 0.010 0.102 0.083 0.057 0.020 Pin 1 Locator e 0.08 C 0.10 C 123456 TOP VIEW 0.008 REF A1 SIDE VIEW A A3 8X 0.10 M CAB b 1 2 C0.1 3 4 5 6 E2 0.016 BSC K GND PAD 9 D2 L 12 11 10 8 7 BOTTOM VIEW Controlling dimension: millimeters ✝ This package is compliant with JEDEC standard MO-229C with the exception of the "D", "D2", "E", "E2", "K" and "L" dimensions as called out in the table above. Dimensions for 12-Lead, 0.4mm pitch TDFN package © 2006 California Micro Devices Corp. All rights reserved. 8 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 03/02/06 CM1430 Mechanical Details (cont’d) CM1430-08DF/DE Mechanical Specifications Dimensions for the CM1430-08DF/DE supplied in a 16-lead, 0.4mm pitch TDFN package are presented below. For complete information on the TDFN-16, see the California Micro Devices TDFN Package Information document. E Mechanical Package Diagrams D 16 15 14 13 12 11 10 9 Pin 1 Marking PACKAGE DIMENSIONS Package JEDEC No. Leads Dim. A A1 A3 b D D2 E E2 e K L # per tape and reel 0.20 0.15 0.25 0.35 0.15 3.20 2.70 1.25 0.30 Millimeters Min 0.70 0.00 Nom 0.75 0.02 0.200 REF 0.20 3.30 2.80 1.35 0.40 0.40 BSC 0.25 3.40 2.90 1.45 0.50 Max 0.80 0.05 Min 0.028 0.000 0.006 0.126 0.106 0.049 0.012 0.008 0.006 0.010 0.014 3000 pieces TDFN MO-229C✝ 16 Inches Nom 0.030 0.001 0.008 0.130 0.110 0.053 0.016 Max 0.031 0.002 0.010 0.134 0.114 0.057 0.020 Pin 1 Locator e 0.08 C 0.10 C 12345678 TOP VIEW 0.008 REF A1 SIDE VIEW A A3 8X 0.10 M CAB b 1 2 3 C0.2 4 5 6 7 8 E2 0.016 BSC K GND PAD 9 16 15 14 13 12 11 10 D2 L BOTTOM VIEW Controlling dimension: millimeters ✝ This package is compliant with JEDEC standard MO-229C with the exception of the "D", "D2", "E", "E2", "K" and "L" dimensions as called out in the table above. Dimensions for 16-Lead, 0.4mm pitch TDFN package © 2006 California Micro Devices Corp. All rights reserved. 03/02/06 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 9