CM1431-04DE

CM1431 LCD and Camera EMI Filter Array with ESD Protection Features • • • • • • Four, six and eight channels of EMI filtering with integrated ESD protection Pi-style EMI filters in a capacitor-resistor-capacitor (C-R-C) network ±15kV ESD protection on each channel (IEC 61000-4-2 Level 4, contact discharge) ±30kV ESD protection on each channel (HBM) Greater than 35dB attenuation (typical) at 1 GHz TDFN package with 0.40mm lead pitch: • 4-ch. = 8-lead TDFN • 6-ch. = 12-lead TDFN • 8-ch. = 16-lead TDFN Tiny TDFN package size: • 8-lead: 1.7mm x 1.35mm • 12-lead: 2.5mm x 1.35mm • 16-lead: 3.3mm x 1.35mm Increased robustness against vertical impacts during manufacturing process Lead-free finishing Product Description The CM1431 is a family of pi-style EMI filter arrays with ESD protection, which integrates four, six and eight filters (C-R-C) in small form factor TDFN 0.40mm pitch packages. The CM1431 has component values of 15pF-100Ω-15pF per channel. The CM1431 has a cutoff frequency of 120MHz and can be used in applications with data rates up to 48Mbps. The parts include ESD diodes on every pin, which provide a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The ESD protection diodes safely dissipate ESD strikes of ±15kV, well beyond the maximum requirement of the IEC61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are protected for contact discharges at greater than ±30kV. These devices are particularly well-suited for portable electronics (e.g. wireless handsets, PDAs, notebook computers) because of their small package and easyto-use pin assignments. In particular, the CM1431 is ideal for EMI filtering and protecting data and control lines for the I/O data ports, LCD display and camera interface in mobile handsets. The CM1431 is housed in space-saving, low-profile 8-, 12- and 16-lead TDFN packages with a 0.40mm pitch and is available with lead-free finishing. This smaller size TDFN package provides up to 42% board space saving vs. the 0.50mm pitch TDFN packages. • • • Applications • • • • • • LCD and Camera data lines in mobile handsets I/O port protection for mobile handsets, notebook computers, PDAs etc. EMI filtering for data ports in cell phones, PDAs or notebook computers. Wireless handsets Handheld PCs/PDAs LCD and camera modules Electrical Schematic 100Ω FILTER+ESDn* 15pF FILTER+ESDn* R 15pF C GND C * See Package/Pinout Diagram for expanded pin information. 1 of 4, 6 or 8 EMI/RFI + ESD Channels © 2006 California Micro Devices Corp. All rights reserved. 02/06/06 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 1 CM1431 PACKAGE / PINOUT DIAGRAMS (Pins Down View) 8765 TOP VIEW BOTTOM VIEW (Pins Up View) 1234 (Pins Down View) 12 11 10 9 8 7 TOP VIEW BOTTOM VIEW (Pins Up View) 123456 Pin 1 Marking XX 1234 GND PAD Pin 1 Marking XXXX 12345 6 GND PAD 8765 12 11 10 9 8 7 CM1431-04DF/DE 8 Lead TDFN Package TOP VIEW (Pins Down View) CM1431-06DF/DE 12 Lead TDFN Package BOTTOM VIEW (Pins Up View) 12345678 16 15 14 13 12 11 10 9 Pin 1 Marking XXXXX 12345 67 8 GND PAD 16 15 14 13 12 11 10 9 Notes: 1) These drawings are not to scale. CM1431-08DF/DE 16 Lead TDFN Package PIN DESCRIPTIONS DEVICE PIN(s) -04 1 2 3 4 -06 1 2 3 4 5 6 -08 1 2 3 4 5 6 7 8 GND PAD NAME FILTER1 FILTER2 FILTER3 FILTER4 FILTER5 FILTER6 FILTER7 FILTER8 GND DESCRIPTION Filter + ESD Channel 1 Filter + ESD Channel 2 Filter + ESD Channel 3 Filter + ESD Channel 4 Filter + ESD Channel 5 Filter + ESD Channel 6 Filter + ESD Channel 7 Filter + ESD Channel 8 Device Ground DEVICE PIN(s) -04 8 7 6 5 -06 12 11 10 9 8 7 -08 16 15 14 13 12 11 10 9 NAME FILTER1 FILTER2 FILTER3 FILTER4 FILTER5 FILTER6 FILTER7 FILTER8 DESCRIPTION Filter + ESD Channel 1 Filter + ESD Channel 2 Filter + ESD Channel 3 Filter + ESD Channel 4 Filter + ESD Channel 5 Filter + ESD Channel 6 Filter + ESD Channel 7 Filter + ESD Channel 8 Ordering Information PART NUMBERING INFORMATION Standard Finish Pins 8 12 16 Package TDFN-8 TDFN-12 TDFN-16 Ordering Part Number1 CM1431-04DF CM1431-06DF CM1431-08DF Part Marking WF N31F N318F Lead-free Finish Ordering Part Number1 CM1431-04DE CM1431-06DE CM1431-08DE Part Marking WE N31E N318E Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. © 2006 California Micro Devices Corp. All rights reserved. 2 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 02/06/06 CM1431 Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER Storage Temperature Range DC Power per Resistor DC Package Power Rating RATING -65 to +150 100 500 UNITS °C mW mW STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range RATING -40 to +85 UNITS °C ELECTRICAL OPERATING CHARACTERISTICS (SEE NOTE1) SYMBOL R CTOTAL C VDIODE ILEAK VSIG PARAMETER Resistance Total Channel Capacitance Capacitance C Standoff Voltage Diode Leakage Current (reverse bias) Signal Clamp Voltage Positive Clamp Negative Clamp In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-42 Level 4 Dynamic Resistance Positive Negative Cut-off Frequency ZSOURCE=50Ω, ZLOAD=50Ω Absolute Attenuation @ 1GHz from 0dB Level 6GHz from 0dB Level Channel R = 100Ω, Channel C = 15pF ZSOURCE = 50Ω, Z LOAD = 50Ω, DC Bias = 0V; Notes 1, 4 and 5 ZSOURCE = 50Ω, Z LOAD = 50Ω, DC Bias = 0V; Notes 1, 4 and 5 At 2.5VDC Reverse Bias, 1MHz, 30mVAC At 2.5VDC Reverse Bias, 1MHz, 30mVAC IDIODE=10μA VDIODE=+3.3V ILOAD = 10mA ILOAD = -10mA Notes 2 and 3 ±30 ±15 kV kV 5.6 -1.5 CONDITIONS MIN 80 24 12 TYP 100 30 15 6.0 0.1 6.8 -0.8 1.0 9.0 -0.4 MAX 120 36 18 UNITS Ω pF pF V μA V V VESD RDYN 2.3 0.9 110 35 30 Ω Ω MHz dB dB fC A1GHz A800MHz - Absolute Attenuation @ 800MHz to 6GHz Note 1: Note 2: Note 3: Note 4: Note 5: TA=25°C unless otherwise specified. ESD applied to input and output pins with respect to GND, one at a time. These parameters are guaranteed by design and characterization. Attenuation / RF curves characterized by a network analyzer using microprobes. These parameters are NOT guaranteed by design, characterization and production. © 2006 California Micro Devices Corp. All rights reserved. 02/06/06 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 3 CM1431 Performance Information Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment) Figure 1. Insertion Loss vs. Frequency (FILTER1 Input to GND) Figure 2. Insertion Loss vs. Frequency (FILTER2 Input to GND) © 2006 California Micro Devices Corp. All rights reserved. 4 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 02/06/06 CM1431 Performance Information (cont’d) Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment) Figure 3. Insertion Loss vs. Frequency (FILTER3 Input to GND) Figure 4. Insertion Loss vs. Frequency (FILTER4 Input to GND) © 2006 California Micro Devices Corp. All rights reserved. 02/06/06 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 5 CM1431 Performance Information (cont’d) Typical Diode Capacitance vs. Input Voltage Capacitance (Normalized) DC Voltage Figure 5. Filter Capacitance vs. Input Voltage (normalized to capacitance at 2.5VDC and 25°C) © 2006 California Micro Devices Corp. All rights reserved. 6 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 02/06/06 CM1431 Mechanical Details CM1431-04DF/DE Mechanical Specifications Dimensions for the CM1431-04DF/DE supplied in a 8lead, 0.4mm pitch TDFN package are presented below. For complete information on the TDFN-8, see the California Micro Devices TDFN Package Information document. E Mechanical Package Diagrams D 8765 Pin 1 Marking PACKAGE DIMENSIONS Package JEDEC No. Leads Dim. A A1 A3 b D D2 E E2 e K L # per tape and reel 0.20 0.15 0.25 0.35 0.15 1.65 1.10 1.30 0.30 Millimeters Min 0.70 0.00 Nom 0.75 0.02 0.20 REF 0.20 1.70 1.20 1.35 0.40 0.40 BSC 0.25 1.75 1.30 1.40 0.50 Max 0.80 0.05 Min 0.028 0.000 0.006 0.065 0.043 0.051 0.012 0.008 0.006 0.010 0.014 K TDFN MO-229C✝ 8 Inches Nom 0.030 0.001 0.008 0.067 0.047 0.053 0.016 Max 0.031 0.002 0.010 0.069 0.051 0.055 0.020 Pin 1 Locator e 0.08 C 0.10 C 1234 TOP VIEW 0.008 REF A1 SIDE VIEW A A3 8X 0.10 M CAB b E2 1 2 C0.2 3 4 0.016 BSC 8 GND PAD 6 5 7 D2 3000 pieces L Controlling dimension: millimeters ✝ This package is compliant with JEDEC standard MO-229C with the exception of the "D", "D2", "E", "E2", "K" and "L" dimensions as called out in the table above. BOTTOM VIEW Dimensions for 8-Lead, 0.4mm pitch TDFN package © 2006 California Micro Devices Corp. All rights reserved. 02/06/06 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 7 CM1431 Mechanical Details (cont’d) CM1431-06DF/DE Mechanical Specifications Dimensions for the CM1431-06DF/DE suplied in a 12lead, 0.4mm pitch TDFN package are presented below. For complete information on the TDFN-12, see the California Micro Devices TDFN Package Information document. E Mechanical Package Diagrams D 12 11 10 9 8 7 Pin 1 Marking PACKAGE DIMENSIONS Package JEDEC No. Leads Dim. A A1 A3 b D D2 E E2 e K L # per tape and reel 0.20 0.15 0.25 0.35 0.15 2.45 1.90 1.30 0.25 Millimeters Min 0.70 0.00 Nom 0.75 0.02 0.20 REF 0.20 2.50 2.00 1.35 0.35 0.40 BSC 0.25 2.55 2.10 1.40 0.45 Max 0.80 0.05 Min 0.028 0.000 0.006 0.096 0.075 0.051 0.010 0.008 0.006 0.010 0.014 3000 pieces TDFN MO-229C✝ 12 Inches Nom 0.030 0.001 0.008 0.098 0.079 0.053 0.014 Max 0.031 0.002 0.010 0.100 0.083 0.055 0.018 Pin 1 Locator e 0.08 C 0.10 C 123456 TOP VIEW 0.008 REF A1 SIDE VIEW A A3 8X 0.10 M CAB b 1 2 C0.1 3 4 5 6 E2 0.016 BSC K GND PAD 9 D2 L 12 11 10 8 7 BOTTOM VIEW Controlling dimension: millimeters ✝ This package is compliant with JEDEC standard MO-229C with the exception of the "D", "D2", "E", "E2", "K" and "L" dimensions as called out in the table above. Dimensions for 12-Lead, 0.4mm pitch TDFN package © 2006 California Micro Devices Corp. All rights reserved. 8 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 02/06/06 CM1431 Mechanical Details (cont’d) CM1431-08DF/DE Mechanical Specifications Dimensions for the CM1431-08DF/DE supplied in a 16-lead, 0.4mm pitch TDFN package are presented below. For complete information on the TDFN-16, see the California Micro Devices TDFN Package Information document. E Mechanical Package Diagrams D 16 15 14 13 12 11 10 9 Pin 1 Marking PACKAGE DIMENSIONS Package JEDEC No. Leads Dim. A A1 A3 b D D2 E E2 e K L # per tape and reel 0.20 0.15 0.25 0.35 3.25 2.80 1.30 0.35 Millimeters Min 0.70 0.00 0.40 Nom 0.75 0.02 0.55 0.20 REF 3.30 2.90 1.35 0.40 0.40 BSC 3.35 3.00 1.40 0.45 Max 0.80 0.05 0.70 Min 0.028 0.000 0.016 0.128 0.110 0.051 0.014 0.008 0.006 0.010 0.014 3000 pieces TDFN MO-229C✝ 16 Inches Nom 0.030 0.001 0.022 0.130 0.114 0.053 0.016 Max 0.031 0.002 0.028 0.132 0.118 0.055 0.018 Pin 1 Locator e 0.08 C 0.10 C 12345678 TOP VIEW A1 SIDE VIEW A A3 0.008 REF 8X 0.10 M CAB b 1 2 3 C0.2 4 5 6 7 8 E2 0.016 BSC K GND PAD 9 16 15 14 13 12 11 10 D2 L BOTTOM VIEW Controlling dimension: millimeters ✝ This package is compliant with JEDEC standard MO-229C with the exception of the "D", "D2", "E", "E2", "K" and "L" dimensions as called out in the table above. Dimensions for 16-Lead, 0.4mm pitch TDFN package 08.16.05 © 2006 California Micro Devices Corp. All rights reserved. 02/06/06 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 9