CM1470-04CP

PRELIMINARY CM1470 Praetorian™ 4-, 6- and 8-Channel Series Inductor Networks Features • • • • • • • • • Ultra-low capacitance filter results in excellent signal integrity 4, 6 and 8 channels of EMI filtering 0.4mm pitch Chip Scale Package (CSP) ±2kV HBM – MIL-STD883 (Method 3015) 10 bump, 2.030mm x 0.836mm footprint CSP for CM1470-04 14 bump, 2.830mm x 0.836mm footprint CSP for CM1470-06 18 bump, 3.630mm x 0.836mm footprint CSP for CM1470-08 OptiGuard™ Coating for improved reliability at assembly Lead-free finishing Product Description CMD’s CM1470 is a family of series inductor networks providing EMI filtering for applications that are sensitive to signal integrity such as high-resolution camera interfaces. The CM1470 is configured in 4, 6 and 8 channel formats. Each channel is implemented as a single inductor element where the component value is 17nH. The CM1470 will help suppress EMI radiation to the external environment. The parts integrate ESD diodes on every pin to provide protection during the manufacturing process when the device is placed on the PCB from a pick-and-place machine. The ESD protection diodes safely dissipate ESD strikes of ±2kV, per the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD. This device is particularly well suited for portable electronics (e.g. wireless handsets, PDAs) because of its small package format and easy-to-use pin assignments. In particular, the CM1470 is ideal for EMI filtering data and control lines in camera modules where it is placed near the transmission source on a flexible PCB. The CM1470 level of performance (i.e. cutoff frequency and attenuation level) can be tuned with external signal trace capacitance. The CM1470 incorporates OptiGuard™ which results in improved reliability at assembly. The CM1470 is available in a space-saving, low-profile Chip Scale Package with lead-free finishing. Applications • • • • Data and control lines for high resolution camera modules in phones LCD modules Mobile handsets High-speed data I/O lines Electrical Schematic 17nH A1 - An 3.2pF 3.2pF B2 - B(n+1) A(n+1) B1 1 of n Channels (n = 4, 6, 8) © 2006 California Micro Devices Corp. All rights reserved. 03/15/06 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 1 PRELIMINARY CM1470 PACKAGE / PINOUT DIAGRAMS TOP VIEW (Bumps Down View) Orientation Marking BOTTOM VIEW (Bumps Up View) 1 A B 2 3 4 5 B1 Orientation Marking A1 A1 B2 A2 B3 A3 B4 A4 B5 A5 N704 CM1470-04CP 10-bump CSP Orientation Marking 1 A B 2 3 4 5 6 7 B1 Orientation Marking A1 A1 B2 A2 B3 A3 B4 A4 B5 A5 B6 A6 B7 A7 N706 CM1470-06CP 14-bump CSP Orientation Marking 1 A B 2 3 4 5 6 7 8 9 B1 B2 A2 B3 A3 B4 A4 B5 A5 B6 A6 B7 A7 B8 A8 B9 A9 147008 Orientation Marking A1 A1 CM1470-08CP 18-bump CSP Notes: 1) These drawings are not to scale. PIN DESCRIPTIONS PIN NUMBER -04 A1 A2 A3 A4 -06 A1 A2 A3 A4 A5 A6 -08 A1 A2 A3 A4 A5 A6 A7 A8 A5 A7 A9 PIN DESCRIPTION Inductor Input #1 Inductor Input #2 Inductor Input #3 Inductor Input #4 Inductor Input #5 Inductor Input #6 Inductor Input #7 Inductor Input #8 GND PIN NUMBER -04 B1 B2 B3 B4 B5 -06 B1 B2 B3 B4 B5 B6 B7 -08 B1 B2 B3 B4 B5 B6 B7 B8 B9 PIN DESCRIPTION GND Inductor Input #1 Inductor Input #2 Inductor Input #3 Inductor Input #4 Inductor Input #5 Inductor Input #6 Inductor Input #7 Inductor Input #8 © 2006 California Micro Devices Corp. All rights reserved. 2 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 03/15/06 PRELIMINARY CM1470 Ordering Information PART NUMBERING INFORMATION Lead-free Finish Bumps 10 14 18 Package CSP CSP CSP Ordering Part Number1 CM1470-04CP CM1470-06CP CM1470-08CP Part Marking N704 N706 147008 Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. © 2006 California Micro Devices Corp. All rights reserved. 03/15/06 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 3 PRELIMINARY CM1470 Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER Storage Temperature Range DC current per Inductor RATING -65 to +150 30 UNITS °C mA STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range RATING -40 to +85 UNITS °C ELECTRICAL OPERATING CHARACTERISTICS (NOTE 1) SYMBOL LTOT R CTOT C1 VSIG PARAMETER Total Channel Inductance DC Channel Resistance Total Channel Capacitance (C1 x 2) Capacitance Signal Voltage Positive Clamp Negative Clamp Stand-off Voltage Diode Leakage Current Signal Clamp Voltage Positive Clamp Negative Clamp In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 Cut-off frequency ZSOURCE = 50Ω, ZLOAD = 50Ω 2.5V dc; 1MHz, 30mV ac 2.5V dc; 1MHz, 30mV ac ILOAD = 10mA 5 -15 CONDITIONS MIN TYP 17 10 6.4 3.2 7 -10 6.0 0.1 5.6 -1.5 ±4 ±2 850 6.8 -0.8 1.0 9.0 -0.4 15 -5 MAX UNITS nH Ω pF pF V V V μA V V kV kV MHz VST ILEAK VSIG I = 10μA VIN = +3.3V ILOAD = 10mA ILOAD = -10mA Notes 2, 3, 4 and 5 VESD fC Note 1: TA=25°C unless otherwise specified. Note 2: ESD applied to input and output pins with respect to GND, one at a time. Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1, then clamping voltage is measured at Pin B2. Note 4: Unused pins are left open. Note 5: These parameters are guaranteed by design and characterization. © 2006 California Micro Devices Corp. All rights reserved. 4 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 03/15/06 PRELIMINARY CM1470 Performance Information Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment) Figure 1. Insertion Loss VS. Frequency (A1-B2 to GND) Figure 2. Typical Diode Capacitance vs. Input Voltage (normalized to 2.5V d.c) © 2006 California Micro Devices Corp. All rights reserved. 03/15/06 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 5 PRELIMINARY CM1470 Performance Information (cont’d) Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment) 25MHz 50MHz 75MHz Figure 3. 2ns Rise and Fall Times of Clocked Signals at 25MHz, 50MHz and 100MHz through CM1470 Inductor Array (Simulation) © 2006 California Micro Devices Corp. All rights reserved. 6 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 03/15/06 PRELIMINARY CM1470 Application Information Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages offered by California Micro Devices. PRINTED CIRCUIT BOARD RECOMMENDATIONS PARAMETER Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Flux Ratio Solder Paste Type Pad Protective Finish Tolerance — Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous Maximum Soldering Temperature for Eutectic Devices using a Eutectic Solder Paste Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder Paste Non-Solder Mask Defined Pad 0.240mm DIA. Solder Stencil Opening 0.300mm DIA. Solder Mask Opening 0.290mm DIA. VALUE 0.240mm Round Non-Solder Mask defined pads 0.290mm Round 0.125 - 0.150mm 0.300mm Round 50/50 by volume No Clean OSP (Entek Cu Plus 106A) +50μm +20μm 60 seconds 240°C 260°C Figure 4. Recommended Non-Solder Mask Defined Pad Illustration 250 Temperature (°C) 200 150 100 50 0 1:00.0 2:00.0 3:00.0 Time (minutes) 4:00.0 Figure 5. Eutectic (SnPb) Solder Ball Reflow Profile © 2006 California Micro Devices Corp. All rights reserved. 03/15/06 Figure 6. Lead-free (SnAgCu) Solder Ball Reflow Profile 7 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com PRELIMINARY CM1470 Mechanical Details CM1470-04CP Mechanical Specifications Dimensions for the CM1470-04CP supplied in a 10bump, 0.4mm pitch chip scale package (CSP) are presented below. For complete information on the CSP-10, see the California Micro Devices CSP Package Information document. B1 Mechanical Package Diagrams OptiGuardTM Coated CSP BOTTOM VIEW A1 C1 B2 OptiGuardTM Coating PACKAGE DIMENSIONS Package Bumps Dim A1 A2 B1 B2 C1 C2 D1 D2 Millimeters Min Nom Max Min Custom CSP 10 Inches Nom Max 5 4 A2 3 2 1 B A D1 B A C2 0.791 0.836 0.881 0.0311 0.0329 0.0347 1.985 2.030 2.075 0.0781 0.0799 0.0817 0.395 0.400 0.405 0.0156 0.0157 0.0159 0.395 0.400 0.405 0.0156 0.0157 0.0159 0.168 0.218 0.268 0.0066 0.0086 0.0106 0.165 0.215 0.265 0.0065 0.0085 0.0104 0.537 0.607 0.676 0.0211 0.0239 0.0266 0.368 0.419 0.470 0.0145 0.0165 0.0185 3500 pieces 0.25 DIA. D2 63/37 Sn/Pb (Eutectic) or 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) SOLDER BUMPS NOTE: DIMENSIONS IN MILLIMETERS SIDE VIEW # per tape and reel Package Dimensions for CM1470-04CP Chip Scale Package Controlling dimension: millimeters © 2006 California Micro Devices Corp. All rights reserved. 8 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 03/15/06 PRELIMINARY CM1470 Mechanical Details CM1470-06CP Mechanical Specifications Dimensions for the CM1470-04CP supplied in a 14bump, 0.4mm pitch chip scale package (CSP) are presented below. For complete information on the CSP-14, see the California Micro Devices CSP Package Information document. B1 Mechanical Package Diagrams OptiGuardTM Coated CSP BOTTOM VIEW A1 C1 B2 OptiGuardTM Coating PACKAGE DIMENSIONS Package Bumps Dim A1 A2 B1 B2 C1 C2 D1 D2 Millimeters Min Nom Max Min Custom CSP 14 Inches Nom Max 7 6 5 A2 4 3 2 1 B A D1 B A C2 B A 0.791 0.836 0.881 0.0311 0.0329 0.0347 2.785 2.830 2.875 0.1096 0.1114 0.1132 0.395 0.400 0.405 0.0156 0.0157 0.0159 0.395 0.400 0.405 0.0156 0.0157 0.0159 0.168 0.218 0.268 0.0066 0.0086 0.0106 0.165 0.215 0.265 0.0065 0.0085 0.0104 0.537 0.607 0.676 0.0211 0.0239 0.0266 0.368 0.419 0.470 0.0145 0.0165 0.0185 3500 pieces 0.25 DIA. D2 63/37 Sn/Pb (Eutectic) or 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) SOLDER BUMPS NOTE: DIMENSIONS IN MILLIMETERS SIDE VIEW # per tape and reel Controlling dimension: millimeters Package Dimensions for CM1470-06CP Chip Scale Package © 2006 California Micro Devices Corp. All rights reserved. 03/15/06 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 9 PRELIMINARY CM1470 Mechanical Details CM1470-08CP Mechanical Specifications Dimensions for the CM1470-08CP supplied in an 18bump, 0.4mm pitch chip scale package (CSP) are presented below. For complete information on the CSP-18, see the California Micro Devices CSP Package Information document. B1 Mechanical Package Diagrams OptiGuardTM Coated CSP BOTTOM VIEW A1 C1 B2 OptiGuardTM Coating PACKAGE DIMENSIONS Package Bumps Dim A1 A2 B1 B2 C1 C2 D1 D2 Millimeters Min Nom Max Min Custom CSP 18 Inches Nom Max 9 8 7 6 5 4 3 2 1 B A D1 C2 B A B A A2 0.791 0.836 0.881 0.0311 0.0329 0.0347 3.585 3.630 3.675 0.1411 0.1429 0.1447 0.395 0.400 0.405 0.0156 0.0157 0.0159 0.395 0.400 0.405 0.0156 0.0157 0.0159 0.168 0.218 0.268 0.0066 0.0086 0.0106 0.165 0.215 0.265 0.0065 0.0085 0.0104 0.537 0.607 0.676 0.0211 0.0239 0.0266 0.368 0.419 0.470 0.0145 0.0165 0.0185 3500 pieces # per tape and reel Controlling dimension: millimeters 0.25 DIA. D2 63/37 Sn/Pb (Eutectic) or 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) SOLDER BUMPS NOTE: DIMENSIONS IN MILLIMETERS SIDE VIEW Package Dimensions for CM1470-08CP Chip Scale Package © 2006 California Micro Devices Corp. All rights reserved. 10 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 03/15/06 PRELIMINARY CM1470 CSP Tape and Reel Specifications PART NUMBER CM1470-04CP CM1470-06CP CM1470-08CP CHIP SIZE (mm) 2.03 X 0.836 X 0.644 2.83 X 0.836 X 0.644 3.63 X 0.836 X 0.644 POCKET SIZE (mm) B0 X A0 X K0 2.17 x 1.12 x 0.71 2.97 x 0.97 x 0.74 3.76 x 0.97 x 0.74 TAPE WIDTH W 8mm 8mm 8mm REEL QTY PER DIAMETER REEL 178mm (7") 178mm (7") 178mm (7") 3500 3500 3500 P0 4mm 4mm 4mm P1 4mm 4mm 4mm Po Top Cover Tape 10 Pitches Cumulative Tolerance On Tape ±0.2 mm Ao W Bo Ko For Tape Feeder Reference Only including Draft. Concentric Around B. Embossment P1 User Direction of Feed Center Lines of Cavity Figure 7. Tape and Reel Mechanical Data © 2006 California Micro Devices Corp. All rights reserved. 03/15/06 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 11