CSPEMI200A

CSPEMI200A 4 Channel Headset EMI Filter with ESD Protection Features • • • • • • • • • • Four channels of EMI filtering Pi-style EMI filters in a capacitor-resistor-capacitor (C-R-C) network Includes 1 channel of ESD-only protection Greater than 30dB attenuation at 1GHz +8kV ESD protection on each channel (IEC 61000-4-2 Level 4, contact discharge) +15kV ESD protection on each channel (HBM) Supports bipolar signals—ideal for audio applications 11-bump, 2.046mm X 1.436mm footprint Chip Scale Package (CSP) Chip Scale Package features extremely low lead inductance for optimum filter and ESD performance Lead-free version available Product Description The CSPEMI200A is a quad low-pass filter array integrating four pi-style filters (C-R-C) that reduce EMI/RFI emissions while at the same time providing ESD protection. This device is custom-designed to interface with the headset port on a cellular telephone, and contains 3 different filter values. Each high quality filter provides more than 20dB attenuation in the 800-2700 MHz range. These pi-style filters support bidirectional filtering, controlling EMI both to and from the microphone and speaker elements. They also support bipolar signals, enabling audio signals to pass through without distortion. In addition, the CSPEMI200A provides a very high level of protection for sensitive electronic components that may be subject to electrostatic discharge (ESD). The CSPEMI200A can safely dissipate ESD strikes of +8kV, the maximum requirement of the IEC 61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the device provides protection for contact discharges to greater than +15kV. The CSPEMI200A is particularly well suited for portable electronics (e.g., cellular telephones, PDAs, notebook computers) because of its small package format and low weight. The CSPEMI200A is available in a space-saving, low-profile Chip Scale Package with optional lead-free finishing. Applications • • • • • • • EMI filtering and ESD protection for audio ports Wireless Handsets Handheld PCs / PDAs MP3 Players Digital Camcorders Notebooks Desktop PCs Electrical Schematic MIC_IN1 B1 100Ω C1 MIC_OUT1 SPKR_IN1 C3 100pF 10Ω A3 SPKR_OUT1 100pF 47pF 47pF MIC_IN2 A2 68Ω C2 MIC_OUT2 SPKR_IN2 C4 100pF 10Ω A4 SPKR_OUT2 100pF GND GND B3 B4 47pF 47pF B2 ESD Channel © 2005 California Micro Devices Corp. All rights reserved. 09/27/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 1 CSPEMI200A PACKAGE / PINOUT DIAGRAMS TOP VIEW (Bumps Down View) Orientation Marking (see note 2) BOTTOM VIEW (Bumps Up View) MIC_OUT1 MIC_OUT2 SPKR_IN1 SPKR_IN2 1 A B C 2 3 4 C1 C2 ESD1 C3 GND C4 GND 200A MIC_IN1 B1 Orientation Marking B2 A2 B3 A3 B4 A4 MIC_IN2 SPKR_OUT1 SPKR_OUT2 A1 CSPEMI200A Notes: CSP Package 1) These drawings are not to scale. 2) Lead-free devices are specified by using a "+" character for the top side orientation mark. PIN DESCRIPTIONS PIN A1 A2 A3 A4 B1 B2 B3 B4 C1 C2 C3 C4 NAME N.B. MIC_IN2 SPKR_OUT1 SPKR_OUT2 MIC_IN1 ESD1 GND GND MIC_OUT1 MIC_OUT2 SPKR_IN1 SPKR_IN2 DESCRIPTION No Bump – used for orientation / alignment Microphone Input 2 (from microphone) Speaker Output 1 (to speaker) Speaker Output 2 (to speaker) Microphone Input 1 (from microphone) ESD Protection Input. Provides a channel specifically for ESD protection purposes. Device Ground Device Ground Microphone Output 1 (to audio circuitry) Microphone Output 2 (to audio circuitry) Speaker Input 1 (from audio circuitry) Speaker Input 2 (from audio circuitry) Ordering Information PART NUMBERING INFORMATION Standard Finish Bumps 11 Package CSP Ordering Part Number1 CSPEMI200A Part Marking 200A Lead-free Finish2 Ordering Part Number1 CSPEMI200AG Part Marking 200A Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark. © 2005 California Micro Devices Corp. All rights reserved. 2 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 09/27/05 CSPEMI200A Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER Storage Temperature Range DC Power per Resistor DC Package Power Rating RATING -65 to +150 100 400 UNITS °C mW mW STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range RATING -40 to +85 UNITS °C ELECTRICAL OPERATING CHARACTERISTICS (NOTE 1) SYMBOL R1 R2 R3 C1 C2 ILEAK VSIG PARAMETER Resistance 1 Resistance 2 Resistance 3 Capacitance 1 Capacitance 2 Diode Leakage Current Signal Voltage Positive Clamp Negative Clamp In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 Clamping Voltage during ESD Discharge MIL-STD-883 (Method 3015), 8kV Positive Transients Negative Transients Cut-off frequency 1; Note 6 Cut-off frequency 2; Note 6 Cut-off frequency 3; Note 6 VIN=5.0V ILOAD = 10mA 5 -5 ±15 ±8 Notes 2,3,4 and 5 +15 -19 R = 100Ω, C = 47pF R = 68Ω, C = 47pF R = 10Ω, C = 100pF 53 61 33 V V MHz MHz MHz 7 -10 CONDITIONS MIN 90 61 9 38 80 TYP 100 68 10 47 100 MAX 110 75 11 57 120 1.0 15 -15 UNITS Ω Ω Ω pF pF μA V V kV kV VESD Notes 2,4 and 5 VCL fC1 fC2 fC3 Note 1: TA=25°C unless otherwise specified. Note 2: ESD applied to input pins with respect to GND, one at a time, pins A2, A3, A4, B1 and B2 only. Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin B1, then clamping voltage is measured at Pin C1. Note 4: Unused pins are left open Note 5: The parameters are guaranteed by design and characterization. Note 6: ZSOURCE=50Ω, ZLOAD=50Ω. © 2005 California Micro Devices Corp. All rights reserved. 09/27/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 3 CSPEMI200A Performance Information Typical Filter Performance (nominal conditions unless specified otherwise) Figure 1. Microphone 1 Circuit (B1-C1) EMI Filter Performance Figure 2. Microphone 2 Circuit (A2-C2) EMI Filter Performance © 2005 California Micro Devices Corp. All rights reserved. 4 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 09/27/05 CSPEMI200A Performance Information (Cont’d) Typical Filter Performance (nominal conditions unless specified otherwise) Figure 3. Speaker 1 Circuit (A3-C3) EMI Filter Performance Figure 4. Speaker 2 Circuit (A4-C4) EMI Filter Performance © 2005 California Micro Devices Corp. All rights reserved. 09/27/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 5 CSPEMI200A Application Information Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages offered by California Micro Devices. PRINTED CIRCUIT BOARD RECOMMENDATIONS PARAMETER Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Flux Ratio Solder Paste Type Pad Protective Finish Tolerance — Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous Maximum Soldering Temperature for Eutectic Devices using a Eutectic Solder Paste Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder Paste Non-Solder Mask Defined Pad 0.275mm DIA. Solder Stencil Opening 0.330mm DIA. Solder Mask Opening 0.325mm DIA. VALUE 0.275mm Round Non-Solder Mask defined pads 0.325mm Round 0.125 - 0.150mm 0.330mm Round 50/50 by volume No Clean OSP (Entek Cu Plus 106A) +50μm +20μm 60 seconds 240°C 260°C Figure 5. Recommended Non-Solder Mask Defined Pad Illustration 250 Temperature (°C) 200 150 100 50 0 1:00.0 2:00.0 3:00.0 Time (minutes) 4:00.0 Figure 6. Eutectic (SnPb) Solder Ball Reflow Profile © 2005 California Micro Devices Corp. All rights reserved. Figure 7. Lead-free (SnAgCu) Solder Ball Reflow Profile 6 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 09/27/05 CSPEMI200A Mechanical Details CSP Mechanical Specifications CSPEMI200A devices are packaged in a custom Chip Scale Package (CSP). Dimensions are presented below. For complete information on CSP packaging, see the California Micro Devices CSP Package Information document. Mechanical Package Diagrams BOTTOM VIEW A1 C1 B1 B2 SIDE VIEW PACKAGE DIMENSIONS Package Bumps Dim A1 A2 B1 B2 C1 C2 D1 D2 Millimeters Min Nom Max Min Custom CSP 11 Inches Nom Max C B A 1 2 3 4 D1 D2 A2 C2 2.001 2.046 2.091 0.0788 0.0806 0.0823 1.391 1.436 1.481 0.0548 0.0565 0.0583 0.495 0.500 0.505 0.0195 0.0197 0.0199 0.495 0.500 0.505 0.0195 0.0197 0.0199 0.223 0.273 0.323 0.0088 0.0107 0.0127 0.168 0.218 0.268 0.0066 0.0086 0.0106 0.562 0.606 0.650 0.0221 0.0239 0.0256 0.356 0.381 0.406 0.0140 0.0150 0.0160 3500 pieces 0.30 DIA. 63/37 Sn/Pb (Eutectic) or 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) SOLDER BUMPS DIMENSIONS IN MILLIMETERS Package Dimensions for CSPEMI200A Chip Scale Package # per tape and reel Controlling dimension: millimeters CSP Tape and Reel Specifications POCKET SIZE (mm) B0 X A0 X K0 2.29 X 1.60 X 0.81 TAPE WIDTH W 8mm REEL DIAMETER 178mm (7") QTY PER REEL 3500 PART NUMBER CSPEMI200A CHIP SIZE (mm) 2.04 X 1.44 X 0.606 P0 4mm P1 4mm Po Top Cover Tape 10 Pitches Cumulative Tolerance On Tape ±0.2 mm Ao W Bo Ko For Tape Feeder Reference Only including Draft. Concentric Around B. Embossment P1 User Direction of Feed Center Lines of Cavity Figure 8. Tape and Reel Mechanical Data © 2005 California Micro Devices Corp. All rights reserved. 09/27/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 7