CSPEMI205

CSPEMI205 3 Channel Headset EMI Filter with ESD Protection Features • • • • • • • • Three channels of EMI filtering, two for earpiece speakers and one for a microphone Pi-style EMI filters in a capacitor-resistor-capacitor (C-R-C) network Chip Scale Package features extremely low parasitic inductance for optimum filter performance Greater than 30dB relative attenuation in the 8002700MHz range +8kV ESD protection on each channel (IEC 61000-4-2 Level 4, contact discharge) +15kV ESD protection on each channel (HBM) 8-bump, 1.41mm X 1.45mm footprint Chip Scale Package (CSP) Lead-free version available Product Description The CSPEMI205 is a low-pass filter array integrating three pi-style filters (C-R-C) that reduce EMI/RFI emissions while at the same time providing ESD protection. This device is custom-designed to interface with the headset port on a cellular telephone, and contains two different filter values. Each high quality filter provides more than 30dB attenuation in the 800-2700 MHz range. These pi-style filters support bidirectional filtering, controlling EMI both to and from the microphone and speaker elements. They also support bipolar signals, enabling audio signals to pass through without distortion. In addition, the CSPEMI205 provides a very high level of protection for sensitive electronic components that may be subject to electrostatic discharge (ESD). The input pins are designed and characterized to safely dissipate ESD strikes of +8kV, the maximum requirement of the IEC 61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the device provides protection for contact discharges to greater than +15kV. The CSPEMI205 is particularly well suited for portable electronics (e.g., cellular telephones, PDAs, notebook computers) because of its small package format and low weight. The CSPEMI205 is available in a spacesaving, low-profile Chip Scale Package with optional lead-free finishing. Applications • • • • • • EMI filtering and ESD protection for headset microphone and speaker Cellular / Mobile Phones Notebooks and Personal Computers Handheld PCs / PDAs / Tablets Wireless Handsets Digital Camcorders Electrical Schematic 10 Ω Earpiece 1 A1 Input 100pF 100pF C1 Earpiece 1 Output Microphone A5 Input 47pF 47pF 68 Ω C5 Microphone Output 10 Ω Earpiece 2 A3 Input 100pF 100pF C3 Earpiece 2 Output GND GND B2 B4 © 2003 California Micro Devices Corp. All rights reserved. 10/09/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 L Tel: 408.263.3214 L Fax: 408.263.7846 L www.calmicro.com 1 CSPEMI205 PACKAGE / PINOUT DIAGRAMS TOP VIEW (Bumps Down View) Orientation Marking (se note 2) BOTTOM VIEW (Bumps Up View) MIC_IN EAR2_IN EAR1_IN 12345 A B C CSPEMI205 CSP Package A5 A3 GND GND A1 B2 A1 Orientation Marking AF B4 C5 C3 MIC_OUT EAR2_OUT EAR1_OUT C1 Note: 1) These drawings are not to scale. 2) Lead-free devices are specified by using a "+" character for the top side orientation mark. PIN DESCRIPTIONS PIN A1 A3 A5 B2 B4 C1 C3 C5 NAME EAR1_IN EAR2_IN MIC_IN GND GND EAR1_OUT EAR2_OUT MIC_OUT DESCRIPTION Earpiece Input 1 (from audio circuitry) Earpiece Input 2 (from audio circuitry) Microphone Input (from microphone) Device Ground Device Ground Earpiece Output 1 (to earpiece) Earpiece Output 2 (to earpiece) Microphone Output (to audio circuitry) Ordering Information PART NUMBERING INFORMATION Standard Finish Ordering Part Bumps 8 Package CSP Number1 CSPEMI205 Part Marking AF Lead-free Finish 2 Ordering Part Number1 CSPEMI205G Part Marking AF Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark. © 2003 California Micro Devices Corp. All rights reserved. 2 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 L Tel: 408.263.3214 L Fax: 408.263.7846 L www.calmicro.com 10/09/03 CSPEMI205 Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER Storage Temperature Range DC Power per Resistor DC Package Power Rating RATING -65 to +150 100 300 UNITS °C mW mW STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range RATING -40 to +85 UNITS °C ELECTRICAL OPERATING CHARACTERISTICS1 SYMBOL R1 R2 C1 C2 ILEAK VSIG PARAMETER Resistance Resistance Capacitance Capacitance Diode Leakage Current Signal Voltage Positive Clamp Negative Clamp In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 Clamping Voltage during ESD Discharge MIL-STD-883 (Method 3015), 8kV Positive Transients Negative Transients Cut-off frequency 1; Note 6 Cut-off frequency 2; Note 6 VIN=5.0V ILOAD = 10mA 5 -5 Notes 2,4 and 5 ±15 ±8 Notes 2,3,4 and 5 +15 -19 R = 10Ω, C = 100pF R = 68Ω, C = 47pF 34 63 V V MHz MHz kV kV 7 -10 15 -15 V V CONDITIONS MIN 9 54 80 38 TYP 10 68 100 47 MAX 11 75 120 57 1.0 UNITS Ω Ω pF pF µA VESD VCL fC1 fC2 Note 1: TA=25°C unless otherwise specified. Note 2: ESD applied to input and output pins with respect to GND, one at a time. Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1, then clamping voltage is measured at Pin C1. Note 4: Unused pins are left open Note 5: The parameters are guaranteed by design. Note 6: ZSOURCE=50Ω, ZLOAD =50Ω © 2003 California Micro Devices Corp. All rights reserved. 10/09/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 L Tel: 408.263.3214 L Fax: 408.263.7846 L www.calmicro.com 3 CSPEMI205 Performance Information Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment) Figure 1. Earpiece Circuit (A1-C1) EMI Filter Performance Figure 2. Earpiece Circuit (A3-C3) EMI Filter Performance © 2003 California Micro Devices Corp. All rights reserved. 4 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 L Tel: 408.263.3214 L Fax: 408.263.7846 L www.calmicro.com 10/09/03 CSPEMI205 Performance Information (cont’d) Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment) Figure 3. Microphone Circuit (A5-C5) EMI Filter Performance © 2003 California Micro Devices Corp. All rights reserved. 10/09/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 L Tel: 408.263.3214 L Fax: 408.263.7846 L www.calmicro.com 5 CSPEMI205 Application Information Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages offered by California Micro Devices. PRINTED CIRCUIT BOARD RECOMMENDATIONS PARAMETER Pad Size on PCB Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Flux Ratio Solder Paste Type Pad Protective Finish Tolerance — Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous Soldering Maximum Temperature VALUE 0.275mm Round Non-Solder Mask defined pads 0.325mm Round 0.125 - 0.150mm 0.330mm Round 50/50 by volume No Clean OSP (Entek Cu Plus 106A) +50µm +20µm 60 seconds 260°C Non-Solder Mask Defined Pad 0.275mm DIA. Solder Stencil Opening 0.330mm DIA. Solder Mask Opening 0.325mm DIA. Figure 4. Recommended Non-Solder Mask Defined Pad Illustration 250 Temperature (°C) 200 150 100 50 0 1:00.0 2:00.0 3:00.0 Time (minutes) 4:00.0 Figure 5. Eutectic (SnPb) Solder Ball Reflow Profile © 2003 California Micro Devices Corp. All rights reserved. Figure 6. Lead-free (SnAgCu) Solder Ball Reflow Profile L Fax: 408.263.7846 L 6 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 L Tel: 408.263.3214 www.calmicro.com 10/09/03 CSPEMI205 Mechanical Details CSP Mechanical Specifications CSPEMI205 devices are packaged in a custom Chip Scale Package (CSP). Dimensions are presented below. For complete information on CSP packaging, see the California Micro Devices CSP Package Information document. Mechanical Package Diagrams BOTTOM VIEW A1 C1 B1 C B4 B3 SIDE VIEW PACKAGE DIMENSIONS Package Bumps Dim A1 A2 B1 B2 B3 B4 C1 C2 D1 D2 Millimeters Min 1.405 1.365 0.495 0.245 0.430 0.430 0.175 0.220 0.561 0.355 Nom 1.450 1.410 0.500 0.250 0.435 0.435 0.225 0.270 0.605 0.380 Max 1.495 1.455 0.505 0.255 0.440 0.440 0.275 0.320 0.649 0.405 Min Custom CSP 8 Inches Nom Max 0.0553 0.0571 0.0589 0.0537 0.0555 0.0573 0.0195 0.0197 0.0199 0.0096 0.0098 0.0100 0.0169 0.0171 0.0173 0.0169 0.0171 0.0173 0.0069 0.0089 0.0108 0.0087 0.0106 0.0126 0.0221 0.0238 0.0255 0.0140 0.0150 0.0159 3500 pieces A2 B A 12345 C2 0.30 DIA. 63/37 Sn/Pb (Eutectic) or 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) SOLDER BUMPS D1 D2 DIMENSIONS IN MILLIMETERS Package Dimensions for CSPEMI205 Chip Scale Package # per tape and reel Controlling dimension: millimeters CSP Tape and Reel Specifications POCKET SIZE (mm) B0 X A0 X K0 1.55 X 1.52 X 0.71 Po Top Cover Tape PART NUMBER CSPEMI205 CHIP SIZE (mm) 1.45 X 1.41 X 0.6 TAPE WIDTH W 8mm REEL DIAMETER 178mm (7") QTY PER REEL 3500 P0 4mm P1 4mm 10 Pitches cumulative tolerance on tape ±0.2 mm Ao W Bo Ko For tape feeder reference only including draft. Concentric around B. Embossment P1 User direction of feed Center lines of cavity Figure 7. Tape and Reel Mechanical Data © 2003 California Micro Devices Corp. All rights reserved. 10/09/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 L Tel: 408.263.3214 L Fax: 408.263.7846 L www.calmicro.com 7