CSPEMI400

CSPEMI400 SIM Card EMI Filter Array with ESD Protection Features • • • • • • • Three channels of EMI filtering, each with ESD protection Two additional channels of ESD-only protection ±10kV ESD protection (IEC 61000-4-2, contact discharge) ±25kV ESD protection (HBM) Greater than 30dB of attenuation at 1GHz 10-bump, 1.960mm x 1.330mm footprint Chip Scale Package (CSP) Lead-free version available Product Description CAMD's CSPEMI400 is an EMI filter array with ESD protection, which integrates three pi filters (C-R-C) and two additional channels of ESD protection. The CSPEMI400 has component values of 20pF-47Ω20pF, and 20pF-100Ω-20pF. The parts include avalanche-type ESD diodes on every pin, which provide a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The ESD diodes connected to the filter ports safely dissipate ESD strikes of ±10kV, exceeding the maximum requirement of the IEC 61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are protected for contact discharges at greater than ±25kV. The ESD diodes on pins A4 and C4 ports are designed and characterized to safely dissipate ESD strikes of ±10kV, well beyond the maximum requirement of the IEC 61000-4-2 international standard. This device is particularly well suited for portable electronics (e.g. mobile handsets, PDAs, notebook computers) because of its small package format and easyto-use pin assignments. In particular, the CSPEMI400 is ideal for EMI filtering and protecting data lines from ESD for the SIM card slot in mobile handsets. The CSPEMI400 is available in a space-saving, lowprofile Chip Scale Package with optional lead-free finishing. Applications • • • SIM Card slot in mobile handsets I/O port protection for mobile handsets, notebook computers, PDAs, etc. EMI filtering for data ports in cell phones, PDAs or notebook computers Electrical Schematic R1 A1 C C GND R1 A3 C C C3 A4 C C C4 C1 A2 C C R2 C2 B2,B4 © 2005 California Micro Devices Corp. All rights reserved. 09/28/05 R1=100Ω R2=47Ω 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 1 CSPEMI400 PACKAGE / PINOUT DIAGRAMS TOP VIEW (Bumps Down View) Orientation Marking (see note 2) BOTTOM VIEW (Bumps Up View) 1 A B C 2 3 4 A4 A3 B2 C4 C3 C2 A2 B1 C1 A1 A1 Orientation Marking AG CSPEMI400 CSP Package Notes: 1) These drawings are not to scale. 2) Lead-free devices are specified by using a "+" character for the top side orientation mark. PIN DESCRIPTIONS TYPE EMI Filter EMI Filter Device Ground EMI Filter ESD Channel ESD Channel PIN A1 C1 A2 C2 B1 B2 A3 C3 A4 C4 DESCRIPTION EMI Filter with ESD Protection for RST Signal EMI Filter with ESD Protection for RST Signal EMI Filter with ESD Protection for CLK Signal EMI Filter with ESD Protection for CLK Signal Device Ground Device Ground DAT EMI Filter with ESD Protection DAT EMI Filter with ESD Protection ESD Proection Channel - VCC Supply ESD Proection Channel Ordering Information PART NUMBERING INFORMATION Standard Finish Bumps 10 Package CSP Ordering Part Number1 CSPEMI400 Part Marking AG Lead-free Finish2 Ordering Part Number1 CSPEMI400G Part Marking AG Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark. © 2005 California Micro Devices Corp. All rights reserved. 2 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 09/28/05 CSPEMI400 Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER Storage Temperature Range DC Power per Resistor DC Package Power Rating RATING -65 to +150 100 300 UNITS °C mW mW STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range RATING -40 to +85 UNITS °C ELECTRICAL OPERATING CHARACTERISTICS1 SYMBOL R1 R2 C VSTANDOFF ILEAK VSIG PARAMETER Resistance of R1 Resistance of R2 Capacitance Stand-off Voltage Diode Leakage Current Signal Voltage Positive Clamp Negative Clamp In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Clamping Voltage during ESD Discharge MIL-STD-883 (Method 3015), 8kV Positive Transients Negative Transients Cut-off frequency ZSOURCE = 50Ω, ZLOAD = 50Ω Cut-off frequency ZSOURCE = 50Ω, ZLOAD = 50Ω VIN = 2.5VDC, 1MHz, 30mV ac I = 10μA VBIAS = 3.3V ILOAD = 10mA ILOAD = -10mA Notes 2,4 and 5 ±25 ±10 Notes 2,3,4 and 5 +12 -7 R = 100Ω, C = 20pF R = 47Ω, C = 20pF 77 85 V V MHz MHz kV kV 5.6 -1.5 6.8 -0.8 CONDITIONS MIN 80 38 16 TYP 100 47 20 6.0 300 9.0 -0.4 MAX 120 56 24 UNITS Ω Ω pF V nA V V VESD VCL fC1 fC2 Note 1: TA=25°C unless otherwise specified. Note 2: ESD applied to input and output pins with respect to GND, one at a time. Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1, then clamping voltage is measured at Pin C1. Note 4: Unused pins are left open Note 5: The parameters are guaranteed by design. © 2005 California Micro Devices Corp. All rights reserved. 09/28/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 3 CSPEMI400 Performance Information Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment) Figure 1. A1-C1 EMI Filter Performance Figure 2. A2-C2 EMI Filter Performance © 2005 California Micro Devices Corp. All rights reserved. 4 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 09/28/05 CSPEMI400 Performance Information (cont’d) Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment) Figure 3. A3-C3 EMI Filter Performance Figure 4. Typical Diode Capacitance vs. Input Voltage (normalized to 2.5VDC) © 2005 California Micro Devices Corp. All rights reserved. 09/28/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 5 CSPEMI400 Application Information The CSPEMI400 provides a bidirectional filter and protector for all the signals and the power line on the SIM (subscriber identity module) card connector. SIM cards are found in all GSM cellular phones and in some other handheld devices or card readers. The ESD diodes protect the controller against possible ESD strikes that may occur when the connector pins are exposed during direct contact, or during insertion of the SIM card into the card slot. The EMI filter suppresses all high-frequency noise, preventing the unwanted EMI signals from both entering and exiting the main board. The signals that interface with the SIM card are the Reset, the Clock and the bidirectional data I/O, as shown in Figure 5. CSPEMI400 100ohm SIM Card Connector RST Reset 47ohm CLK Clock Controller with logic level translator 100ohm I/O Data I/O VCC supply (5V, 3.3V or 1.8V) GND Note: One channel of the CSPEMI400 with a zener diode is not shown on the diagram. VCC 5V/3V/1.8V 1uF GND Figure 5. Typical Application Diagram for the SIM Card Interface For best filter and ESD performance, both GND bumps (B1, B2) of the CSPEMI400 should be directly connected to the Ground plane. A small capacitor of about 1μF is required next to the VCC pin of the SIM connector in order to improve stability of the SIM card supply rail. For information on the assembly of the CSPEMI400 to the PCB (printed circuit board), please refer to the Chip Scale Package (CSP) Application Note AP217, or contact factory at 800-325-4966 for technical support. © 2005 California Micro Devices Corp. All rights reserved. 6 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 09/28/05 CSPEMI400 Application Information (cont’d) Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages offered by California Micro Devices. PRINTED CIRCUIT BOARD RECOMMENDATIONS PARAMETER Pad Size on PCB Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Flux Ratio Solder Paste Type Pad Protective Finish Tolerance — Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous Maximum Soldering Temperature for Eutectic Devices using Eutectic Solder Paste Maximum Soldering Temperature for Lead-free Devices using Lead-free Solder Paste VALUE 0.275mm Round Non-Solder Mask defined pads 0.325mm Round 0.125 - 0.150mm 0.330mm Round 50/50 by volume No Clean OSP (Entek Cu Plus 106A) +50μm +20μm 60 seconds 240°C 260°C Non-Solder Mask Defined Pad 0.275mm DIA. Solder Stencil Opening 0.330mm DIA. Solder Mask Opening 0.325mm DIA. Figure 6. Recommended Non-Solder Mask Defined Pad Illustration 250 Temperature (°C) 200 150 100 50 0 1:00.0 2:00.0 3:00.0 Time (minutes) 4:00.0 Figure 7. Eutectic (SnPb) Solder Ball Reflow Profile © 2005 California Micro Devices Corp. All rights reserved. 09/28/05 Figure 8. Lead-free (SnAgCu) Solder Ball Reflow Profile 7 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com CSPEMI400 CSP Mechanical Specifications The CSPEMI400 is supplied in a custom Chip Scale Package (CSP). Dimensions are presented below. For complete information on CSP, see the California Micro Devices CSP Package Information document. B2 B1 Mechanical Package Diagrams BOTTOM VIEW A1 C1 B4 B3 SIDE VIEW PACKAGE DIMENSIONS Package Bumps Dim A1 A2 B1 B2 B3 B4 C1 C2 D1 D2 Millimeters Min 1.915 1.285 0.495 0.245 0.430 0.430 0.180 0.180 0.562 0.356 Nom 1.960 1.330 0.500 0.250 0.435 0.435 0.230 0.230 0.606 0.381 Max Min Custom CSP 10 Inches Nom Max C B A 1 2 3 4 C2 D1 D2 A2 2.005 0.0754 0.0772 0.0789 1.375 0.0506 0.0524 0.0541 0.505 0.0195 0.0197 0.0199 0.255 0.0096 0.0098 0.0100 0.440 0.0169 0.0171 0.0173 0.440 0.0169 0.0171 0.0173 0.280 0.0071 0.0091 0.0110 0.280 0.0071 0.091 0.0110 0.650 0.0221 0.0239 0.0256 0.406 0.0140 0.0150 0.0160 3500 pieces 0.30 DIA. 63/37 Sn/Pb (Eutectic) or 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) SOLDER BUMPS DIMENSIONS IN MILLIMETERS Package Dimensions for CSPEMI400 Chip Scale Package # per tape and reel Controlling dimension: millimeters CSP Tape and Reel Specifications POCKET SIZE (mm) B 0 X A0 X K0 2.08 X 1.45 X 0.71 TAPE WIDTH W 8mm REEL DIAMETER 178mm (7") 10 Pitches cumulative tolerance on tape ±0.2 mm PART NUMBER CSPEMI400 CHIP SIZE (mm) 1.96 X 1.33 X 0.606 QTY PER REEL 3500 P0 4mm P1 4mm Po Top Cover Tape Ao W Bo Ko For tape feeder reference only including draft. Concentric around B. Embossment P1 User direction of feed Center lines of cavity Figure 9. Tape and Reel Mechanical Data © 2005 California Micro Devices Corp. All rights reserved. 8 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 09/28/05