CSPEMI607

California Micro Devices 430 N.McCarthy Blvd Milpitas, CA 95035 PRELIMINARY CSPEMI607 4-Channel LCD EMI Filter Array with ESD Protection plus 4-Channel of ESD Protection Array Features • • • • • • Four channels of EMI filtering Four channels of ESD Protection ±15kV ESD protection (IEC 61000-4-2, contact discharge) ±30kV ESD protection (HBM) Better than 30dB of attenuation at 1GHz for 15pF100Ω-15pF filter configuration Chip scale packaging features extremely low lead inductance for optimum filter and ESD performance Applications • • • LCD data lines in mobile handsets I/O port protection for mobile handsets, notebook computers, PDAs etc. EMI filtering for data ports in cell phones, PDAs or notebook computers. General Description CAMD’s CSPEMI607 is an EMI filter array with ESD protection, which integrates four Pi- filters (C-RC) and 4 channels of ESD protection. The CSPEMI607 has component values of 15pF-100Ω-15pF ). The parts include avalanche-type ESD diodes on every pin, which provide a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The ESD diodes connected to the filter ports and the standalone ESD diode channels are designed and characterized to safely dissipate ESD strikes of ±15kV, beyond the maximum requirement of the IEC 61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are protected for contact discharges at greater than ±30kV. This device is particularly well suited for portable electronics (e.g. mobile handsets, PDAs, notebook computers) because of its small package format and easy-to-use pin assignments. In particular, the CSPEMI607 is ideal for EMI filtering and protecting data lines from ESD for the LCD display in mobile handsets. The CSPEMI607 is available in a space-saving, low-profile, chip-scale package, and is fabricated with one of California Micro Devices’ semiconductor processes. Package Diagram 11/18/03 Tel: (408) 263-3214 • Fax: (408) 263-7846 • Website: www.calmicro.com 1 California Micro Devices 430 N.McCarthy Blvd Milpitas, CA 95035 PRELIMINARY Figure 1. Dimensions of CSPEMI607. Schematic Diagram Pin Number A1 A2 A3 A4 A5 A6 B1 B2 Pin Description ESD Channel #1 Filter #1 Filter #2 Filter #3 Filter #4 ESD Channel #2 GND GND Pin Number B3 C1 C2 C3 C4 C5 C6 Pin Description GND ESD Channel #3 Filter #1 Filter #2 Filter #3 Filter #4 ESD Channel #4 Specifications: (At 25°C unless specified otherwise) Min. 80 12 5.5 Typ. 100 15 100 Max. 120 18 Unit Ω pF V nA V V kV kV Resistance R1 Capacitance C1 at 2.5V dc; 1MHz, 30mV ac Stand-off Voltage, I = 10µA Diode Leakage at +/-3.3V reverse bias voltage Signal Clamp Voltage: Positive Clamp, 10mA Negative Clamp, -10mA In-system ESD withstand voltage*: Human Body Model (MIL-STD-883, method 3015) IEC 61000-4-2, contact discharge method Clamping voltage during ESD discharge* MIL-STD-883 (Method 3015), 8kV Temperature Range: Operating Storage DC Power per Resistor: DC Package Power Rating: Positive Negative 5.6 -1.5 ±30 ±15 6.8 -0.8 9.0 -0.4 12 -7 -40 -65 85 150 0.1 0.5 V V °C W W * ESD applied to input / output pins with respect to GND, one at a time. Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin (i.e. if ESD is applied to pin A1 then clamping voltage is measured at pin C1). Unused pins are left open. These parameters are guaranteed by design. 11/18/03 Tel: (408) 263-3214 • Fax: (408) 263-7846 • Website: www.calmicro.com 2 California Micro Devices 430 N.McCarthy Blvd Milpitas, CA 95035 PRELIMINARY Typical EMI filter performance (2.5V d.c., 50Ω environment) Cut-off Frequency (MHz) R1 (Ω ) C1 (pF) 20dB Attenuation (MHz) 533 Over 25dB Range (MHz) 738 - 3000 118 100 15 All parameters in the table are typical values. Typical diode capacitance vs. input voltage (normalized to 2.5V d.c.) 11/18/03 Tel: (408) 263-3214 • Fax: (408) 263-7846 • Website: www.calmicro.com 3 California Micro Devices 430 N.McCarthy Blvd Milpitas, CA 95035 PRELIMINARY PRINTED CIRCUIT BOARD RECOMMENDATIONS Pad size in PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (Laser cut, 5% tapered walls) Solder Flux Ratio Solder Paste Type Bond Trace Finish Tolerance – Edge to Corner Ball Solder Ball Side Coplanarity Soldering Minimum Temperature Maximum Dwell Time above Liquidous (183°C) Soldering Maximum Temperature 0.275mm Round Non Solder Mask Defined Pads 0.325mm Round 0.125mm - 0.150mm 0.330mm (round) 50/50 by volume No Clean OSP (Entek Cu Plus 106A) ±50µm ±20µm 205’C for at least 30 seconds 60 seconds 240’C for at less than 2 minutes Solder Reflow Profile 11/18/03 Tel: (408) 263-3214 • Fax: (408) 263-7846 • Website: www.calmicro.com 4 California Micro Devices 430 N.McCarthy Blvd Milpitas, CA 95035 PRELIMINARY Tape & Reel Information CMD PART # CHIP SIZE (mm) CSPEMI607 2.96 x 1.33 x 0.6 POCKET SIZE (mm) Bo x Ao x Ko TBD TAPE WIDTH W 8mm REEL DIAMETER 178mm (7”) QTY PER REEL 3500 P0 4mm P1 4mm 11/18/03 Tel: (408) 263-3214 • Fax: (408) 263-7846 • Website: www.calmicro.com 5