CSPESD304G

CSPESD304 4-Channel ESD Array in CSP Features • • • • • • Four channels of ESD protection +15kV ESD protection on each channel Product Description The CSPESD304 is a quad ESD transient voltage supression diode array. Each diode provides a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). These diodes are designed and characterized to safely dissipate ESD strikes of 15kV, exceeding the maximum requirement of the IEC 61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the device provides protection for contact discharges to greater than 30kV. The CSPESD304 is particularly well suited for portable electronics (e.g., cellular telephones, PDAs, notebook computers) because of its small package format and low weight. The CSPESD304 is available in a space-saving, lowprofile Chip Scale Package with optional lead-free finishing. (IEC 61000-4-2 Level 4, contact discharge) +30kV ESD protection on each channel (HBM) Chip Scale Package features extremely low lead inductance for optimum ESD protection 5-bump, 0.950mm X 1.410mm footprint Chip Scale Package (CSP) Lead-free version available Applications • • • • • • • • • ESD protection for sensitive electronic equipment I/O port and keypad and button circuitry protection for portable devices Can be used for EMI filtering when combined with external series resistance Wireless Handsets Handheld PCs / PDAs MP3 Players Digital Camcorders Notebooks Desktop PCs Electrical Schematic ESD_1 ESD_2 ESD_3 ESD_4 C1 C3 A1 A3 GND B2 © 2003 California Micro Devices Corp. All rights reserved. 10/10/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 L Tel: 408.263.3214 L Fax: 408.263.7846 L www.calmicro.com 1 CSPESD304 PACKAGE / PINOUT DIAGRAMS TOP VIEW (Bumps Down View) Orientation Marking (see note 2) BOTTOM VIEW (Bumps Up View) ESD_3 ESD_4 123 A B C C1 GND C3 B2 E Orientation Marking ESD_1 ESD_2 A1 A3 A1 Notes: 1) These drawings are not to scale. 2) Lead-free devices are specified by using a "+" character for the top side orientation mark. CSPESD304 CSP Package PIN DESCRIPTIONS PIN A1 A3 B2 C1 C3 NAME ESD1 ESD2 GND ESD3 ESD4 DESCRIPTION ESD Channel1 ESD Channel 2 Device Ground ESD Channel 3 ESD Channel 4 Ordering Information PART NUMBERING INFORMATION Standard Finish Ordering Part Bumps 5 Package CSP Number1 CSPESD304 Part Marking E Lead-free Finish 2 Ordering Part Number1 CSPESD304G Part Marking E Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark. © 2003 California Micro Devices Corp. All rights reserved. 2 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 L Tel: 408.263.3214 L Fax: 408.263.7846 L www.calmicro.com 10/10/03 CSPESD304 Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER Storage Temperature Range DC Package Power Rating RATING -65 to +150 200 UNITS °C mW STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range RATING -40 to +85 UNITS °C ELECTRICAL OPERATING CHARACTERISTICS1 SYMBOL VDIODE ILEAK VSIG PARAMETER Diode Reverse Breakdown Voltage Diode Leakage Current Signal Voltage Positive Clamp Negative Clamp In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Clamping Voltage during ESD Discharge MIL-STD-883 (Method 3015), 8kV Positive Transients Negative Transients Diode Capacitance CONDITIONS IDIODE = 10µA VIN=3.3V, TA=25°C IDIODE = 10mA 5.6 -0.4 Notes 2, 3 and 4 +30 +15 Notes 2, 3 and 4 +15 -8 At 2.5VDC Reverse Bias, 1MHz, 30mVAC 22 27 32 V V pF kV kV 6.8 -0.8 9.0 -1.5 V V MIN 5.5 100 TYP MAX UNITS V nA VESD VCL C DIODE Note 1: Note 2: Note 3: Note 4: TA=-40 to +85°C unless otherwise specified. ESD applied to input and output pins with respect to GND, one at a time. Unused pins are left open These parameters are guaranteed by design and characterization. © 2003 California Micro Devices Corp. All rights reserved. 10/10/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 L Tel: 408.263.3214 L Fax: 408.263.7846 L www.calmicro.com 3 CSPESD304 Performance Information Diode Characteristics (nominal conditions unless specified otherwise) Capacitance (Normalized) DC Voltage Figure 1. Typical Diode Capacitance VS. Input Voltage (normalized to 2.5VDC) Figure 2. Frequency Response (single channel vs. GND, in 50 Ω system) © 2003 California Micro Devices Corp. All rights reserved. 4 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 L Tel: 408.263.3214 L Fax: 408.263.7846 L www.calmicro.com 10/10/03 CSPESD304 Application Information Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages offered by California Micro Devices. PRINTED CIRCUIT BOARD RECOMMENDATIONS PARAMETER Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Flux Ratio Solder Paste Type Pad Protective Finish Tolerance — Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous Soldering Maximum Temperature VALUE 0.275mm Round Non-Solder Mask defined pads 0.325mm Round 0.125 - 0.150mm 0.330mm Round 50/50 by volume No Clean OSP (Entek Cu Plus 106A) +50µm +20µm 60 seconds 260°C Non-Solder Mask Defined Pad 0.275mm DIA. Solder Stencil Opening 0.330mm DIA. Solder Mask Opening 0.325mm DIA. Figure 3. Recommended Non-Solder Mask Defined Pad Illustration 250 Temperature (°C) 200 150 100 50 0 1:00.0 2:00.0 3:00.0 Time (minutes) 4:00.0 Figure 4. Eutectic (SnPb) Solder Ball Reflow Profile © 2003 California Micro Devices Corp. All rights reserved. 10/10/03 Figure 5. Lead-free (SnAgCu) Solder Ball Reflow Profile 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 L Tel: 408.263.3214 L Fax: 408.263.7846 L www.calmicro.com 5 CSPESD304 Mechanical Details CSP Mechanical Specifications CSPESD304 devices are packaged in a custom Chip Scale Package (CSP). Dimensions are presented below. For complete information on CSP packaging, see the California Micro Devices CSP Package Information document. Mechanical Package Diagrams BOTTOM VIEW A1 C1 B2 B1 B4 B3 SIDE VIEW PACKAGE DIMENSIONS Package Bumps Dim A1 A2 B1 B2 B3 B4 C1 C2 D1 D2 Millimeters Min 0.915 1.285 0.495 0.245 0.430 0.430 0.180 0.180 0.561 0.355 Nom 0.960 1.330 0.500 0.250 0.435 0.435 0.230 0.230 0.605 0.380 Max 1.005 1.375 0.505 0.255 0.440 0.440 0.280 0.280 0.649 0.405 Min Custom CSP 5 Inches Nom Max 0.0360 0.0378 0.0396 0.0506 0.0524 0.0541 0.0195 0.0197 0.0199 0.0096 0.0098 0.0100 0.0169 0.0171 0.0173 0.0169 0.0171 0.0173 0.0071 0.0091 0.0110 0.0071 0.0091 0.0110 0.0221 0.0238 0.0255 0.0140 0.0150 0.0159 3500 pieces C A2 B A 123 0.30 DIA. D2 63/37 Sn/Pb (Eutectic) or 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) SOLDER BUMPS DIMENSIONS IN MILLIMETERS Package Dimensions for CSPESD304 Chip Scale Package C2 D1 # per tape and reel Controlling dimension: millimeters CSP Tape and Reel Specifications PART NUMBER CSPESD304 CHIP SIZE (mm) 1.33 X 0.96 X 0.6 POCKET SIZE (mm) B0 X A0 X K0 1.42 X 1.07 X 0.74 Po Top Cover Tape TAPE WIDTH W 8mm REEL DIAMETER 178mm (7") QTY PER REEL 3500 P0 4mm P1 4mm 10 Pitches Cumulative Tolerance On Tape ±0.2 mm Ao W Ko Bo For tape feeder reference only including draft. Concentric around B. Embossment P1 User Direction of Feed Center Lines of Cavity Figure 6. Tape and Reel Mechanical Data © 2003 California Micro Devices Corp. All rights reserved. 6 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 L Tel: 408.263.3214 L Fax: 408.263.7846 L www.calmicro.com 10/10/03