CSPST08-560J

CALIFORNIA MICRO DEVICES CSPST Chip Scale Series Termination Array Features • 8 or 16 integrated high frequency series terminations • Ultra small footprint Chip Scale Package • Ceramic substrate • 0.35mm Eutectic Solder Bumps, 0.65mm pitch Applications • Series resistive bus termination • Isolated resistor array Product Description The CSPST is a high performance Integrated Passive Device (IPD) which provides series terminations suitable for use in high speed bus applications. Eight (8) or sixteen (16) series termination versions are provided. These resistors provide excellent high frequency performance in excess of 3GHz and are manufactured to an absolute tolerance as low as ±1%. The Chip Scale Package provides an ultra small footprint for this IPD and provides minimal parasitics compared to conventional packaging. Typical bump inductance is less than 25pH. The large solder bumps and ceramic substrate allow for standard attachment to laminate printed circuit boards without the use of underfill. SCHEMATIC DIAGRAMS D R1 R1 R1 R1 D R1 R1 R1 R1 R1 R1 R1 R1 C C B R1 A 1 2 3 4 R1 R1 R1 B R1 A 1 2 3 4 5 6 7 8 R1 R1 R1 R1 R1 R1 R1 CSPST08 CSPST16 S TA N D A R D VA L U E S Re s i s t o r Va l u e Ab s o l u t e To l e r a n c e R TCR of Resi st or s Powe r Ra t i n g / Re s i s t o r Op e r a t i n g Te mp e r a t u r e Ra n g e R1 = 22Ω, 33Ω, 39Ω, 4 7 Ω, 51Ω, 56Ω, ± 1 %, ± 5 % ±100ppm 1 0 0 mW –40°C to 85°C © 2000 California Micro Devices Corp. All rights reserved. 11/10/2000 C1300700 215 Topaz Street, Milpitas, California 95035 Tel: (408) 263-3214 Fax: (408) 263-7846 www.calmicro.com 1 CALIFORNIA MICRO DEVICES CSPST Package Diagram (Bumps Up View) 2.3968mmmm 0.65 mm 0.2234mm D C B A 0.35mm Dia. Bumps 1 2 3 4 0.381mm 0.643mm 0.65 mm 2.3968mm CSPST08 4.9968mm 0.2234mm 0.65 mm D C B A 0.35mm Dia. Bumps 1 2 3 4 5 6 7 8 0.381mm 0.643mm 0.65 mm 2.3968mm CSPST16 P R I N T E D C I R C U I T B OA R D R E C O M M E N D AT I O N S Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening Solder Flux Ratio Solder Paste Bond Trace Finish 0.300mm Round Non Solder Mask Defined Pads (NSMD) 0.350mm 0.152mm 0.360mm (sq.) 50/50 No Clean OSP (Entek Cu Plus 106A) ©2000 California Micro Devices Corp. All rights reserved. 2 215 Topaz Street, Milpitas, California 95035 Tel: (408) 263-3214 Fax: (408) 263-7846 www.calmicro.com 11/10/2000 CALIFORNIA MICRO DEVICES CSPST Typical PCB Routing Diagram (Bumps Down View) 1 8 A B C D Typical Solder Reflow Thermal Profile (No Clean Flux) 250 EXH 225 200 PH Z2 Z3 Z4 Z5 RF CD EXH Temperature (oC) 175 150 125 100 75 50 25 0 48 97 145 194 Time (s) 242 290 339 387 435 © 2000 California Micro Devices Corp. All rights reserved. 11/10/2000 215 Topaz Street, Milpitas, California 95035 Tel: (408) 263-3214 Fax: (408) 263-7846 www.calmicro.com 3 CALIFORNIA MICRO DEVICES CSPST S TA N D A R D PA R T O R D E R I N G I N F O R M AT I O N Package Style Chip Scale Chip Scale Chip Scale Chip Scale Chip Scale Chip Scale Chip Scale Chip Scale Chip Scale Chip Scale Chip Scale Chip Scale Chip Scale Chip Scale Chip Scale Chip Scale Chip Scale Chip Scale Chip Scale Chip Scale Chip Scale Chip Scale Chip Scale Chip Scale Terminations 8 8 8 8 8 8 8 8 8 8 8 8 16 16 16 16 16 16 16 16 16 16 16 16 Tape & Reel CSPST08-220F CSPST08-220J CSPST08-330F CSPST08-330J CSPST08-390F CSPST08-390J CSPST08-470F CSPST08-470J CSPST08-510F CSPST08-510J CSPST08-560F CSPST08-560J CSPST16-220F CSPST16-220J CSPST16-330F CSPST16-330J CSPST16-390F CSPST16-390J CSPST16-470F CSPST16-470J CSPST16-510F CSPST16-510J CSPST16-560F CSPST16-560J Ordering Part Number Part Marking None None None None None None None None None None None None None None None None None None None None None None None None PA C K AG E Part Series Terminations N O N - S TA N D A R D PA R T O R D E R I N G I N F O R M AT I O N Value Code: R1 (XXX) Tolerance Example (CSPST) CSPST CSPST (8) 8 16 (201) First 2 digits are significant value. Third digit represents number of zeros to follow PART NUMBER KEY CSP ST YY XXX T (J) F = ±1% J = ±5% PACKAGE TYPE CSP = Chip Scale Package APPLICATION Series Termination Number of Terminations 08 = 8 16 = 16 Resistor Value Code R1 Value First 2 digits are significant value. 3rd digit represents number of zeros Tolerance F = ±1% J = ±5% ©2000 California Micro Devices Corp. All rights reserved. 4 215 Topaz Street, Milpitas, California 95035 Tel: (408) 263-3214 Fax: (408) 263-7846 www.calmicro.com 11/10/2000