FCRN303

CALIFORNIA MICRO DEVICES FCRN303 0805 Precision Thin Film Resistor CSP (Chip Scale Package) Features • Standard 0805 Format • SMD chips • Absolute tolerance of 0.1% • Temperaure Coefficient (TCR) of 25ppm/°C Applications • Voltage dividers • Current sensing • Current limiting • Precision gain setting Product Description California Micro Devices’ resistors offer a high degree of stability and low noise as well as the proven reliability characteristics of Tantalum Nitride. FCRN303 series offers these advantages in a CSP (Chip Scale Package). FCRN303 devices are built on ceramic with solder bumps for direct placement onto printed circuit boards. They are compatible with 0805 footprint. SCHEMATIC CONFIGURATION R 1 2 Package Diagram 2.032mm 1.514mm 0.259mm 1.135mm 0.636mm 1.272mm 0.381mm 0.508mm O R D E R I N G I N F O R M AT I O N Part Series FCRN303 Resistive Value (XXXX) 1003 F i r s t 3 d i g i t s a r e s i g n i f i c a n t va l u e ( R i n d i c a t e s d e c i ma l p o i n t ) . Fo u r t h d i g i t r e p r e s e n t s n u m b e r o f ze r o s t o fo l l ow. ( e. g . 1 0 0 K = 1 0 0 3 ) Tolerance J J = ±5% G = ±2% F = ±1% D = ±0.5% B = 0.1% TCR A No Letter = ±100ppm A = ±50ppm B = ±25ppm © 2000 California Micro Devices Corp. All rights reserved. 7/11/2000 C1240700 215 Topaz Street, Milpitas, California 95035 Tel: (408) 263-3214 Fax: (408) 263-7846 www.calmicro.com 1 CALIFORNIA MICRO DEVICES FCRN303 R E S I S TA N C E R A N G E 40KΩ to 150KΩ E L E C T R I C A L S P E C I F I C AT I O N S Parameter TCR O p e r a t i n g Vo l t a g e Po w e r R a t i n g A b s o l u t e To l e r a n c e O p e r a t i n g Te m p e r a t u r e R a n g e S t o r a g e Te m p e r a t u r e –55°C to +125°C –55°C to +125°C @ 70°C +25°C Test Condition ±25ppm/ °C 100Vdc 200mW ±0.1% –55°C to +125°C –65°C to +150°C Max Max Max Max C S P S P E C I F I C AT I O N S Fi nal Di e Si ze Di e T h i ck n e s s ( Di e & B u mp ) Pa d S i z e Pa d P i t c h Bump Hei ght Die Substrate 2. 032 x 1. 272mm (±0. 125mm) 0. 500mm (±0. 075mm) 0. 381 x 1. 135mm 1. 514mm nomi nal 0. 125mm (±0. 025mm) Cerami c 80 x 50 mi l (±5 mi l ) 20 mi l (±3 mi l ) 15 x 44. 6 mi l 59. 6 mi l nomi nal 5 mi l (±1 mi l ) Cerami c P R I N T E D C I R C U I T B OA R D R E C O M M E N D AT I O N S Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening Solder Flux Ratio Solder Paste Bond Trace Finish 0.300mm Round Non Solder Mask Defined Pads (NSMD) 0.350mm 0.152mm 0.360mm (sq.) 50/50 No Clean OSP (Entek Cu Plus 106A) ©2000 California Micro Devices Corp. All rights reserved. 2 215 Topaz Street, Milpitas, California 95035 Tel: (408) 263-3214 Fax: (408) 263-7846 www.calmicro.com 7/11/2000