WLP200

CALIFORNIA MICRO DEVICES WLP200 Wafer Level Package Evaluation RC Filter Network Features • 6 Filters per device • Ultra small footprint, 0.5mm pitch • Silicon substrate • 0.30mm Eutectic Solder Bumps Applications • EMI filter for Mobile Equipment (e.g. Cellular Phones) • Evaluation Device Product Description The WLP200 consists of 6 RC filters with different filter characteristics in a wafer level package (WLP). All I/O pins are ESD protected for contact discharges up to 8KV per the IEC1000-4-2 level 4 specification. Two versions with different capacitor values are available. Cellular phone application frequently demands filtering of signals in the 800 to 2,700 MHz band. California Micro Devices’ unique thin film Flip Chip filters provide a minimum of –30 dB of attenuation over this frequency band. The bump size and pitch of these filters are selected such that the device can be placed directly on a FR4 printed circuit board using conventional assembly techniques. Ground-bounce and cross-talk are minimized by a die design that provides eight solder bump contacts to the common supply connection. The solder bump contacts are a 63/37 Sn/Pb alloy and are nominally 0.30 mm in diameter. SCHEMATIC DIAGRAM C1 R 50 Ω C GND D1 R 50 Ω C GND D2 R 90 Ω C GND R 90 Ω C GND R 70 Ω C GND D5 R 70 Ω C GND GND GND A5 R 70 Ω GND A4 R 90 Ω GND A3 GND A2 R 50 Ω GND A1 B1 D3 D4 C3 B3 C2 B2 GND C5 B5 C4 B4 © 2000 California Micro Devices Corp. All rights reserved. 11/10/2000 C1460800 215 Topaz Street, Milpitas, California 95035 Tel: (408) 263-3214 Fax: (408) 263-7846 www.calmicro.com 1 CALIFORNIA MICRO DEVICES WLP200 S TA N D A R D VA L U E S Ab s o l u t e To l e r a n c e R Ab s o l u t e To l e r a n c e C TCR of Resi st or s Op e r a t i n g Te mp e r a t u r e Ra n g e Leakage Cur r ent @ ±6V Powe r Ra t i n g / Re s i s t o r ±10% ±20% ±100ppm –40°C to 85°C