CAT34AC02LE

Preliminary Information CAT34AC02 2K-Bit SMBus EEPROM for ACR Card Configuration FEATURES s 400 kHz (5V) and 100 kHz (1.8V) SMBus H GEN FR ALO EE LE A D F R E ETM s Self-timed write cycle with auto-clear s 1,000,000 program/erase cycles s 100 year data retention s 8-pin DIP, 8-pin SOIC and 8-pin TSSOP packages s 256 x 8 memory organization s Hardware write protect compatible s 1.8 to 6.0 volt operation s Low power CMOS technology – zero standby current s 16-byte page write buffer s Industrial, automotive and extended temperature ranges DESCRIPTION The CAT34AC02 is a 2K-bit Serial CMOS EEPROM internally organized as 256 words of 8 bits each. Catalyst’s advanced CMOS technology substantially reduces device power requirements. The CAT34AC02 features a 16-byte page write buffer. The device operates via the SMBus serial interface for ACR card configuration and is available in 8-pin DIP, 8-pin SOIC or 8-pin TSSOP packages. PIN CONFIGURATION DIP Package (P, L) A0 A1 A2 VSS 1 2 3 4 8 7 6 5 VCC WP SCL SDA A0 A1 A2 VSS BLOCK DIAGRAM SOIC Package (J, W) EXTERNAL LOAD 1 2 3 4 8 7 6 5 VCC WP SCL SDA DOUT ACK VCC VSS WORD ADDRESS BUFFERS SENSE AMPS SHIFT REGISTERS COLUMN DECODERS TSSOP Package (U, Y) A0 A1 A2 VSS 1 2 3 4 8 7 6 5 VCC WP SCL SDA MSOP Package (R, Z) 1 2 3 4 8 7 6 5 WP CONTROL LOGIC SDA START/STOP LOGIC XDEC E2PROM PIN FUNCTIONS Pin Name A0, A1, A2 SDA SCL WP VCC VSS Function Device Address Inputs Serial Data/Address Serial Clock Write Protect +1.8V to +6.0V Power Supply Ground SCL A0 A1 A2 STATE COUNTERS SLAVE ADDRESS COMPARATORS HIGH VOLTAGE/ TIMING CONTROL DATA IN STORAGE © 2003 by Catalyst Semiconductor, Inc. Characteristics subject to change without notice 1 Doc No. 1025, Rev. E CAT34AC02 ABSOLUTE MAXIMUM RATINGS* Temperature Under Bias –55°C to +125°C Storage Temperature ....................... –65°C to +150°C Voltage on Any Pin with Respect to Ground(1) ........... –2.0V to +VCC + 2.0V VCC with Respect to Ground ............... –2.0V to +7.0V Package Power Dissipation Capability (TA = 25°C) ................................... 1.0W Lead Soldering Temperature (10 secs) ............ 300°C Output Short Circuit Current(2) ........................ 100mA RELIABILITY CHARACTERISTICS Symbol NEND(3) TDR (3) *COMMENT Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions outside of those listed in the operational sections of this specification is not implied. Exposure to any absolute maximum rating for extended periods may affect device performance and reliability. Parameter Endurance Data Retention ESD Susceptibility Latch-up Reference Test Method Min Typ Max Units Cycles/Byte Years Volts mA MIL-STD-883, Test Method 1033 1,000,000 MIL-STD-883, Test Method 1008 MIL-STD-883, Test Method 3015 JEDEC Standard 17 100 2000 100 VZAP(3) ILTH(3)(4) D.C. OPERATING CHARACTERISTICS VCC = +1.8V to +6.0V, unless otherwise specified. Symbol ICC ICC ISB (5) Parameter Power Supply Current (Read) Power Supply Current (Write) Standby Current (VCC = 5.0V) Input Leakage Current Output Leakage Current Input Low Voltage Input High Voltage Output Low Voltage (VCC = 3.0V) Output Low Voltage (VCC = 1.8V) Test Conditions fSCL = 100 kHz fSCL = 100 kHz VIN = GND or VCC VIN = GND to VCC VOUT = GND to VCC Min Typ Max 1 3 0 10 10 Units mA mA µA µA µA V V V V ILI ILO VIL VIH VOL1 VOL2 –1 VCC x 0.7 IOL = 3 mA IOL = 1.5 mA VCC x 0.3 VCC + 0.5 0.4 0.5 CAPACITANCE TA = 25°C, f = 1.0 MHz, VCC = 5V Symbol CI/O(3) CIN (3) Parameter Input/Output Capacitance (SDA) Input Capacitance (A0, A1, A2, SCL) Test Conditions VI/O = 0V VIN = 0V Min Typ Max 8 6 Units pF pF Note: (1) The minimum DC input voltage is –0.5V. During transitions, inputs may undershoot to –2.0V for periods of less than 20 ns. Maximum DC voltage on output pins is VCC +0.5V, which may overshoot to VCC + 2.0V for periods of less than 20ns. (2) Output shorted for no more than one second. No more than one output shorted at a time. (3) This parameter is tested initially and after a design or process change that affects the parameter. (4) Latch-up protection is provided for stresses up to 100 mA on address and data pins from –1V to VCC +1V. (5) Standby Current (ISB) = 0µA (