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CAT34RC02UITE13

CAT34RC02UITE13

  • 厂商:

    CATALYST

  • 封装:

  • 描述:

    CAT34RC02UITE13 - 2-kb I2C Serial EEPROM, Serial Presence Detect - Catalyst Semiconductor

  • 数据手册
  • 价格&库存
CAT34RC02UITE13 数据手册
CAT34RC02 2-kb I2C Serial EEPROM, Serial Presence Detect FEATURES I 400 kHz I2C bus compatible* I 1.7 to 5.5 volt operation I 16-byte page write buffer I Hardware write protection for entire memory I Permanent and reversible software write I Schmitt trigger on SCL and SDA inputs I Low power CMOS technology I 1,000,000 program/erase cycles I 100 year data retention I 8-pin TSSOP and TDFN packages I Industrial temperature range protection for lower 128 bytes DESCRIPTION The CAT34RC02 is a 2-kb Serial CMOS EEPROM internally organized as 256 words of 8 bits each. Catalyst’s advanced CMOS technology substantially reduces device power requirements. The CAT34RC02 features a 16-byte page write buffer. The device operates via the I2C bus serial interface and is available in 8-pin TSSOP and TDFN packages. PIN CONFIGURATION TDFN Package (SP2, VP2) A0 1 A1 2 A2 3 VSS 4 8 VCC 7 WP 6 SCL 5 SDA TSSOP Package (U, Y, GY) A0 A1 A2 PIN FUNCTIONS Pin Name A0, A1, A2 SDA SCL WP VCC VSS D VSS is 1 2 3 4 o c 8 7 6 5 i t n VCC WP SCL SDA u n FUNCTIONAL SYMBOL VCC d e a P t r SCL A2, A1, A0 WP CAT34RC02 SDA VSS Function Device Address Inputs Serial Data/Address Serial Clock Write Protect 1.7 V to 5.5 V Power Supply Ground * Catalyst Semiconductor is licensed by Philips Corporation to carry the I2C Bus Protocol. © 2005 by Catalyst Semiconductor, Inc. Characteristics subject to change without notice Doc. No. 1052, Rev. O 1 CAT34RC02 ABSOLUTE MAXIMUM RATINGS* Temperature Under Bias .................. -55°C to +125°C Storage Temperature ........................ -65°C to +150°C Voltage on Any Pin with Respect to Ground(1) ............ -2.0 V to VCC + 2.0 V Voltage on A0 .................................................. -2.0 V to +12.0 V VCC with Respect to VSS .............................. -2.0 V to +7.0 V RELIABILITY CHARACTERISTICS(2) Symbol NEND (*) *COMMENT Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions outside of those listed in the operational sections of this specification is not implied. Exposure to any absolute maximum rating for extended periods may affect device performance and reliability. Parameter Endurance Data Retention ESD Susceptibility Latch-up Min 1,000,000 100 4000 100 Program/ Erase Cycles Years Volts mA TDR(*) VZAP(*) ILTH (3) (*) Page Mode, VCC = 5 V, 25°C D.C. OPERATING CHARACTERISTICS VCC = 1.7 V to 5.5 V, unless otherwise specified. Symbol ICC ICC ISB(4) ILI ILO VIL VIH VOL1 VOL2 VHV Parameter Power Supply Current (Read) Power Supply Current (Write) Test Conditions Standby Current (VCC = 5.0 V) Input Leakage Current Output Leakage Current Input Low Voltage Input High Voltage CAPACITANCE TA = 25°C, f = 400 kHz, VCC = 5 V Symbol CI/O(2) CIN (2) ZWPL ZWPH is D Output Low Voltage (VCC = 3.0 V) Output Low Voltage (VCC = 1.7 V) RSWP Set/Clear Overdrive A0 High Voltage o c Test i t n fSCL = 100 kHz fSCL = 100 kHz VIN = GND or VCC VIN = GND to VCC VOUT = GND to VCC u n d e Min –1 7 Min a P Max 1 3 1 1 1 VCC x 0.3 VCC + 1.0 0.4 0.5 10 Units t r Units mA mA µA µA µA V V V V V Typ VCC x 0.7 IOL = 3 mA IOL = 1.5 mA VHV - VCC > 4.8 V Conditions VI/O = 0 V VIN = 0 V VIN < 0.5 V VIN > VCC x 0.7 Typ Max 8 6 Units pF pF kΩ kΩ Input/Output Capacitance (SDA) Input Capacitance (other pins) WP Input Impedance WP Input Impedance 5 500 70 Note: (1) The DC input voltage on any pin should not be lower than -0.5 V or higher than VCC + 0.5 V. During transitions, the voltage on any pin may undershoot to no less than -2.0 V or overshoot to no more than VCC + 2.0 V, for periods of less than 20 ns. The maximum DC voltage on address pin A0 is +12.0 V. (2) These parameters are tested initially and after a design or process change that affects the parameter according to appropriate AEC-Q100 and JEDEC test methods. (3) Latch-up protection is provided for stresses up to 100 mA on I/O pins from -1.0 V to VCC + 1.0 V. (4) Standby Current, ISB = 10 µA max at extended temperature range. Doc. No. 1052, Rev. O 2 © 2005 by Catalyst Semiconductor, Inc. Characteristics subject to change without notice CAT34RC02 A.C. CHARACTERISTICS VCC = 1.7 V to 5.5 V, unless otherwise specified. Read & Write Cycle Limits Symbol Parameter 1.7 V - 5.5 V Min FSCL TI(1) tAA tBUF(1) tHD:STA tLOW tHIGH tSU:STA tHD:DAT tSU:DAT tR(1) tF (1) 2.5 V - 5.5 V Min Max 400 100 Units Max 100 100 3.5 Clock Frequency Noise Suppression Time Constant at SCL, SDA Inputs SCL Low to SDA Data Out and ACK Out Time the Bus Must be Free Before a New Transmission Can Start Start Condition Hold Time Clock Low Period Clock High Period Start Condition Setup Time (for a Repeated Start Condition) Data In Hold Time Data In Setup Time 4.7 4 4.7 4 4.7 1.3 0.6 SDA and SCL Rise Time SDA and SCL Fall Time tSU:STO tDH Stop Condition Setup Time Data Out Hold Time Power-Up Timing(1)(2) Symbol tPUR tPUW Write Cycle Limits Symbol tWR is D Power-up to Read Operation Power-up to Write Operation o c Parameter Parameter i t n u n 0 250 4 100 1 d e 1.3 0.6 0.6 0 100 0.6 100 Typ a P 0.3 300 Max 1 1 0.9 t r ns µs µs µs µs µs µs ns ns µs ns µs ns kHz 300 Min Units ms ms Min Typ Max 5 Units ms Write Cycle Time The write cycle time is the time elapsed between the STOP command (following the write instruction) and the completion of the internal write cycle. During the internal write cycle, SDA is released by the Slave and the device does not acknowledge external commands. Note: (1) This parameter is tested initially and after a design or process change that affects the parameter. (2) tPUR and tPUW are the delays required from the time VCC is stable until the specified operation can be initiated. © 2005 by Catalyst Semiconductor, Inc. Characteristics subject to change without notice 3 Doc No. 1052, Rev. O CAT34RC02 FUNCTIONAL DESCRIPTION The CAT34RC02 supports the I2C (2-wire) Bus data transmission protocol. This Inter-Integrated Circuit Bus protocol defines any device that sends data to the bus to be a transmitter and any device receiving data to be a receiver. Data transfer is controlled by the Master device which generates the serial clock and all START and STOP conditions for bus access. The CAT34RC02 operates as a Slave device. Both the Master and Slave devices can operate as either transmitter or receiver, but the Master alone assigns those roles. A maximum of 8 devices may be connected to the bus as determined by the device address inputs A0, A1, and A2. PIN DESCRIPTIONS SCL: Serial Clock The serial clock input pin is used to clock all data transfers into or out of the device. SDA: Serial Data/Address The bidirectional serial data/address pin is used to transfer data into and out of the device. This pin is an open drain output in transmit mode. A0, A1, A2: Device Address Inputs These inputs set the device address. When left floating, the address pins are internally pulled to ground. WP: Write Protect This input, when grounded or left floating, allows write operations to the entire memory. When this pin is tied to VCC, the entire memory is write protected. Figure 1. Bus Timing tF tLOW SCL tSU:STA tHD:STA tHIGH tLOW tR SDA IN tAA SDA OUT Figure 2. Write Cycle Timing SCL SDA Figure 3. Start/Stop Timing D is SDA SCL o c 8th Bit Byte n i t n tHD:DAT u n tDH tSU:DAT d e a P tSU:STO tBUF t r ACK tWR STOP CONDITION START CONDITION ADDRESS START BIT Doc. No. 1052, Rev. O STOP BIT © 2005 by Catalyst Semiconductor, Inc. Characteristics subject to change without notice 4 CAT34RC02 I2C BUS PROTOCOL The I2C bus consists of two ‘wires’, SCL and SDA. The two ‘wires’ are connected to the supply (VCC) via pull-up resistors. Master and Slave devices connect to the bus via their respective SCL and SDA pins. The transmitting device pulls down the SDA line to ‘transmit’ a ‘0’ and releases it to ‘transmit’ a ‘1’. (1) Data transfer may be initiated only when the bus is not busy (see A.C. Characteristics). (2) During a data transfer, the data line must remain stable whenever the SCL line is high. An SDA transition while SCL is high will be interpreted as a START or STOP condition. START Condition The START Condition precedes all commands. It consists of a HIGH to LOW transition on SDA while SCL is HIGH. The START condition acts as a ‘wake-up’ call for the Slave devices. A Slave will not respond to commands unless the MASTER generates a START condition. STOP Condition The STOP condition completes all commands. It consists of a LOW to HIGH transition on SDA while SCL is HIGH. The STOP condition starts the internal write cycle, when following a WRITE command and sends the Slave into standby mode, when following a READ command. Device Addressing The Master initiates a data transfer by creating a START condition on the bus. The Master then broadcasts an 8bit serial Slave address. The four most significant bits of the Slave address (the ‘preamble’) are fixed to 1010 (Ah), for normal read/write operations and 0110 (6h) for Software Write Protect (SWP) operations (Fig. 5). The next three bits, A2, A1 and A0, select one of eight possible Slave devices. The last bit, R/W, specifies whether a Read (1) or Write (0) operation is to be performed. Acknowledge Figure 4. Acknowledge Timing Figure 5. Slave Address Bits is D DATA OUTPUT FROM TRANSMITTER DATA OUTPUT FROM RECEIVER o c SCL FROM MASTER i t n 1 u n After processing the Slave address, the Slave responds with an acknowledge (ACK) by pulling down the SDA line during the 9th clock cycle. The Slave will aslo acknowledge the 8-bit byte address and every data byte presented in WRITE mode. In READ mode the Slave shifts out eight bits of data, and then ‘releases’ the SDA line durng the 9th clock cycle. If the Master acknowledges in the 9th clock cycle (by pulling down the SDA line), then the Slave continues transmitting. When data transfer is complete, the Master responds with a NoACK (it does not acknowledge the last data byte) and the Slave stops transmitting and waits for a STOP condition. d e 8 a P 9 t r START ACKNOWLEDGE 1 0 1 0 A2 A1 A0 R/W Normal Read and Write DEVICE ADDRESS 0 1 1 0 A2 A1 A0 R/W Programming the Write Protect Register © 2005 by Catalyst Semiconductor, Inc. Characteristics subject to change without notice 5 Doc No. 1052, Rev. O CAT34RC02 WRITE OPERATIONS Byte Write In Byte Write mode the Master creates a START condition, and then broadcasts the Slave address, byte address and data to be written. The Slave acknowledges the three bytes by pulling down the SDA line during the 9th clock cycle following each byte. The Master creates a STOP condition after the last ACK from the Slave, which then starts the internal write operation (Fig. 6). During internal write, the Slave will ignore any read/write request from the Master. Page Write The CAT34RC02 contains 256 bytes of data, arranged in 16 pages of 16 bytes each. The page is selected by the four most significant bits of the address byte presented to the device after the Slave address, while the four least significant bits point to the byte within the page. By ‘loading’ more than one data byte into the device, up to an entire page can be written in one write cycle (Fig. 7). The internal byte address counter will increment after each data byte. If the Master transmits more than 16 data bytes, then earlier bytes will be overwritten by later bytes in a ‘wrap-around’ fashion within the selected page. The internal write cycle is started following the STOP condition created by the Master. Acknowledge Polling acknowledge the Slave address, as long as internal write is in progress. WRITE PROTECTION Hardware Write Protection With the WP pin held HIGH, the entire memory, as well as the SWP flags are protected against WRITE operations (Fig. 9). If the WP pin is left floating or is grounded. then it has no impact on the operation of the CAT34RC02. Software Write Protection Acknowledge polling can be used to determine if the CAT34RC02 is busy writing or is ready to accept commands. Polling is implemented by sending a ‘Selective Read’ command (described under READ OPERATIONS) to the device. The CAT34RC02 will not Figure 6. Byte Write Timing Figure 7. Page Write Timing BUS ACTIVITY: MASTER SDA LINE S T A R T S A C K SLAVE ADDRESS * A C K A C K A C K A C K BYTE ADDRESS (n) S T O P P D is BUS ACTIVITY: MASTER SDA LINE o c S T A R T S i t n SLAVE ADDRESS A C K u n BYTE ADDRESS A C K The lower half of memory (first 128 bytes) can be protected against WRITE operations by setting one of two Software Write Protection (SWP) flags/switches. The PSWP (Permanent Software Write Protection) flag can be set but not cleared by the user. The RSWP (Reversible Software Write Protection) flag can be set and cleared by the user. Whereas the PSWP flag can be set ‘in-system’, the RSWP flag is meant to be used during testing. RSWP commands require the presence of a very high voltage (higher than VCC) on address pin A0 and fixed logic levels for the other two address pins. The CAT34RC02 is shipped ‘unprotected’. The state of the SWP flags can be read by issuing an ‘Immediate Address Read’ command, with the Slave address ‘preamble’ set to 0110 (6h) instead of the ‘normal’ 1010 (Ah). A SWP READ will return the complemented versions of the two flags in the last two slots of the resulting data byte; the other six more significant bits in the data byte have no meaning to the user (Fig. 11). d e DATA a P t r S T O P P A C K DATA n DATA n+1 DATA n+P NOTE: IN THIS EXAMPLE n = XXXX 0000(B); X = 1 or 0 Doc. No. 1052, Rev. O 6 © 2005 by Catalyst Semiconductor, Inc. Characteristics subject to change without notice CAT34RC02 The PSWP flag can be set (forever) by issuing a ‘Byte Write’ command, with the Slave address preamble set to ‘6h’, followed by a ‘don’t care’ address, followed by ‘don’t care’ data and a STOP condition. The CAT34RC02 will acknowledge the Slave address, dummy byte address and dummy data (Fig. 10). The PSWP flag will be permanently set (after the internal write cycle is completed). The SWP commands are shown in Table 1. Table 1. SWP Commands command attempts to ‘reaffirm’ one of the two switches, then the CAT34RC02 will not acknowledge the command itself. In addition, the CAT34RC02 will not acknowledge a ‘reaffirming’ SWP command, even if the WP pin is LOW. Power-On Reset (POR) The CAT34RC02 incorporates Power-On Reset (POR) circuitry which protects the device against malfunctioning while VCC is lower than the recommended operating voltage. The device will power up into a read-only state and will power-down into a reset state when VCC crosses the POR level of ~1.3V. Slave Address PIN Command SWP READ RSWP SET RSWP CLEAR PSWP SET A2 A2 0 0 A2 A1 A1 0 1 A1 A0 A0 VHV VHV A0 B7 0 0 0 0 Preamble B6 1 1 1 1 B5 1 1 1 1 B4 0 0 0 0 Device Address B3 A2 0 0 A2 B2 A1 0 1 A1 B1 A0 1 1 A0 R/W B0 1 0 0 0 READ OPERATIONS Immediate Address Read The CAT34RC02 will not acknowledge RSWP or PSWP commands, once the PSWP flag is set. If the PSWP flag is not set, but the WP pin is HIGH, then the CAT34RC02 will react to RSWP or PSWP commands as follows: if the command attempts to ‘flip’ one of the two SWP switches, then the CAT34RC02 will respond the same way the regular memory would, i.e. the command and address (in this case dummy) are acknowledged, but the data (in this case dummy) will not be acknowledged; if the Figure 8. Immediate Address Read Timing D is o c i t n S T A R T S 8 8th Bit u n A C K In standby mode, the CAT34RC02 internal address counter points to the data byte immediately following the last byte accessed by a previous operation. If the ‘previous’ byte was the last byte in memory, then the address counter will point to the first memory byte, etc. If the CAT34RC02 decodes a Slave address with a ‘1’ in the R/W bit position (Fig. 8), it will issue an ACK in the 9th clock cycle, and will then transmit the data byte being pointed at by the address counter. The Master can then stop further transmission by issuing a NoACK, followed by a STOP condition. Selective Read The READ operation can also be started at an address different from the one stored in the address counter. The d e S T O P P N O A C K a P t r BUS ACTIVITY: MASTER SDA LINE SLAVE ADDRESS DATA SCL 9 SDA DATA OUT NO ACK STOP © 2005 by Catalyst Semiconductor, Inc. Characteristics subject to change without notice 7 Doc No. 1052, Rev. O CAT34RC02 address counter can be ‘initialized’ by performing a ‘dummy’ WRITE operation (Fig. 12). The START condition is followed by the Slave address (with the R/W bit set to ‘0’) and the desired byte address. Instead of following up with data, the Master then issues a 2nd START, followed by the ‘Immediate Address Read’ sequence, as described earlier. Sequential Read If the Master acknowledges the 1st data byte transmitted by the CAT34RC02, then the device will continue transmitting as long as each data byte is acknowledged by the Master (Fig. 13). If the end of memory is reached during sequential READ, the address counter will ‘wraparound’ to the beginning of memory, etc. Sequential READ works with either ‘Immediate Address Read’ or ‘Selective Read’, the only difference being the starting byte address. Figure 9. Memory Array FFH 7FH Hardware Write Protectable (by connecting WP pin to Vcc) 00H Figure 10. Software Write Protect (Write) S T A R T BUS ACTIVITY: MASTER * For PSWP A0 is at normal CMOS levels and for RSWP, A0 is at VHV which must be held high beyond the end of the STOP condition (approximately 1µs of “overlap” is sufficient). is D o c SDA LINE S i t n SLAVE ADDRESS A C K u n BYTE ADDRESS A C K X = Don't Care Software Write Protectable (by setting the write protect flags) d e DATA XXXXXXXX A C K S T O P P a P t r XXXXXXXX Doc. No. 1052, Rev. O 8 © 2005 by Catalyst Semiconductor, Inc. Characteristics subject to change without notice CAT34RC02 Figure 11. Software Write Protect (Read) RSWP S T O P P N O A C K BUS ACTIVITY: MASTER SDA LINE S T A R T S SLAVE ADDRESS PSWP 000000 A C K DATA Figure 12. Selective Read Timing S T A R T S A C K A C K S T A R T S BUS ACTIVITY: MASTER SDA LINE SLAVE ADDRESS BYTE ADDRESS (n) SLAVE ADDRESS Figure 13. Sequential Read Timing BUS ACTIVITY: MASTER SDA LINE SLAVE ADDRESS D is o c A C K DATA n i t n A C K u n A C K d e A C K A C K a P S T O P P DATA n N O A C K DATA n+x t r DATA n+1 DATA n+2 S T O P P N O A C K © 2005 by Catalyst Semiconductor, Inc. Characteristics subject to change without notice 9 Doc No. 1052, Rev. O CAT34RC02 8-PAD TDFN 2X3 PACKAGE (VP2, SP2) A E PIN 1 INDEX AREA D A2 SYMBOL A A1 A2 A3 b D D2 E E2 e K L MIN 0.70 0.00 0.45 NOTE: 1. ALL DIMENSIONS IN MM. ANGLES IN DEGREES. 2. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMNALS. COPLANARITY SHALL NOT EXCEED 0.08 MM. 3. WARPAGE SHALL NOT EXCEED 0.10 MM. 4. PACKAGE LENGTH / PACKAGE WIDTH ARE NOT CONSIDERED AS SPECIAL CHARACTERISTIC. TDFN2X3_(02).eps D is 0.18 1.90 1.27 2.90 1.23 0.20 0.30 o c NOM 0.75 0.02 0.55 0.20 REF 0.25 2.00 3.00 0.50 TYP 0.40 MAX 0.80 0.05 0.65 0.30 2.10 1.75 3.10 1.90 i t n A3 u n E2 b d e D2 a P A1 K t r PIN 1 ID L 0.50 3xe e Doc. No. 1052, Rev. O 10 © 2005 by Catalyst Semiconductor, Inc. Characteristics subject to change without notice CAT34RC02 8-LEAD TSSOP (U, Y, GY) 3.0 + 0.1 -A8 5 7.72 TYP 6.4 4.4 + 0.1 -B(1.78 TYP) 3.2 4.16 TYP 0.42 TYP 0.2 C B A 1 PIN #1 IDENT. 4 ALL LEAD TIPS LAND PATTERN RECOMMENDATION 1.1 MAX TYP 0.1 C ALL LEAD TIPS -C- 0.65 TYP is D o c 0.19 - 0.30 TYP 0.3 M A B S C S i t n (0.9) 0.10 + 0.05 TYP u n 0-8 o o d e 0.6+0.1 0.65 TYP SEE DETAIL A a P t r 0.09 - 0.20 TYP GAGE PLANE 0.25 SEATING PLANE DETAIL A Notes: 1. Lead coplanarity is 0.004" (0.102mm) maximum. © 2005 by Catalyst Semiconductor, Inc. Characteristics subject to change without notice 11 Doc No. 1052, Rev. O CAT34RC02 ORDERING INFORMATION Prefix CAT Device # 34RC02 J Suffix I TE13 REV-E Company ID Product Number Temperature Range I = Industrial (-40°C to +85°C) Die Revision 34RC02: E Package U: TSSOP Y: TSSOP (Lead-free, Halogen-free) SP2: TDFN VP2: TDFN (Lead-free, Halogen-free) GY: TSSOP (Lead-free, Halogen-free, NiPdAu lead plating) Tape & Reel Notes: (1) The device used in the above example is a CAT34RC02UI-TE13 REV E (TSSOP, Industrial Temperature, 1.7 Volt to 5.5 Volt Operating Voltage, Tape & Reel) is D Doc. No. 1052, Rev. O o c i t n u n d e a P t r 12 © 2005 by Catalyst Semiconductor, Inc. Characteristics subject to change without notice CAT34RC02 REVISION HISTORY Date 09/22/03 12/09/03 01/12/04 Revision Comments A B C Initial Issue Removed Automotive temperature range Changed Industrial Temp to “ I” from “ Blank” in ordering information Updated Features Replaced Block Diagram with Functional Symbol Updated Notes for Reliability Characteristics, D.C. Operating Characteristics and Capacitance Updated TDFN package Updated packaging information to reflect new TDFN package Re-labeled TDFN package to A0, A1, A2 instead of A1, A2, A3 Updated Absolute Max. Ratings Updated DC Operating Characteristics Updated Table 1 (SWP Commands) Updated Fig 11 Added mechanical package drawings Corrected TDFN drawing Corrected table 1 SWP Commands Update Update Update Update D.C. Operating Characteristics Write Cycle Limits Revision History Rev Number 02/20/04 03/22/04 D E 03/31/04 05/16/04 F G 06/03/04 H Update Die Revision in Ordering Information Eliminate data sheet designation Updated DC Operating Characteristics Updated Write Cycle Limits 06/07/04 9/27/04 10/18/04 1/11/05 2/17/05 07/19/05 I J K L M N Added Power-On Reset (POR) description Added VHV and deleted ∆VHV in DC Operating Characteristics Updated DC Operating Characteristics & notes (removed Note 5) Deleted DIP and SOIC packages in all areas Deleted Extended temperature range in all areas Update Reliability Characteristics table and notes Update Ordering Information 08/05/05 is D O Update 8-Pad TDFN 2X3 Package (VP2, SP2) o c i t n u n d e a P t r © 2005 by Catalyst Semiconductor, Inc. Characteristics subject to change without notice 13 Doc No. 1052, Rev. O Copyrights, Trademarks and Patents Trademarks and registered trademarks of Catalyst Semiconductor include each of the following: DPP ™ AE2 ™ MiniPot™ Catalyst Semiconductor has been issued U.S. and foreign patents and has patent applications pending that protect its products. For a complete list of patents issued to Catalyst Semiconductor contact the Company’s corporate office at 408.542.1000. CATALYST SEMICONDUCTOR MAKES NO WARRANTY, REPRESENTATION OR GUARANTEE, EXPRESS OR IMPLIED, REGARDING THE SUITABILITY OF ITS PRODUCTS FOR ANY PARTICULAR PURPOSE, NOR THAT THE USE OF ITS PRODUCTS WILL NOT INFRINGE ITS INTELLECTUAL PROPERTY RIGHTS OR THE RIGHTS OF THIRD PARTIES WITH RESPECT TO ANY PARTICULAR USE OR APPLICATION AND SPECIFICALLY DISCLAIMS ANY AND ALL LIABILITY ARISING OUT OF ANY SUCH USE OR APPLICATION, INCLUDING BUT NOT LIMITED TO, CONSEQUENTIAL OR INCIDENTAL DAMAGES. Catalyst Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Catalyst Semiconductor product could create a situation where personal injury or death may occur. Catalyst Semiconductor reserves the right to make changes to or discontinue any product or service described herein without notice. Products with data sheets labeled "Advance Information" or "Preliminary" and other products described herein may not be in production or offered for sale. Catalyst Semiconductor advises customers to obtain the current version of the relevant product information before placing orders. Circuit diagrams illustrate typical semiconductor applications and may not be complete. is D o c i t n u n d e a P t r Catalyst Semiconductor, Inc. Corporate Headquarters 1250 Borregas Avenue Sunnyvale, CA 94089 Phone: 408.542.1000 Fax: 408.542.1200 www.caalyst-semiconductor.com Publication #: Revison: Issue date: 1052 O 08/05/05
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