CAT34WC02PA-1.8TE13

CAT34WC02 2K-Bit I2C Serial EEPROM, Serial Presence Detect FEATURES s 400 KHz (5V) and 100 KHz (1.8V) I2C bus s Self-timed write cycle with auto-clear s Software write protection for lower 128 bytes s 1,000,000 program/erase cycles s 100 year data retention s 8-pin DIP, 8-pin SOIC and 8-pin TSSOP packages s 256 x 8 memory organization s Hardware write protect compatible s 1.8 to 6.0 volt operation s Low power CMOS technology – zero standby current s 16-byte page write buffer s Commercial, industrial and automotive temperature ranges DESCRIPTION The CAT34WC02 is a 2K-bit Serial CMOS EEPROM internally organized as 256 words of 8 bits each. Catalyst’s advanced CMOS technology substantially reduces device power requirements. The CAT34WC02 features a 16-byte page write buffer. The device operates via the I2C bus serial interface and is available in 8-pin DIP, 8pin SOIC or 8-pin TSSOP packages. PIN CONFIGURATION DIP Package (P) A0 A1 A2 VSS 1 2 3 4 8 7 6 5 VCC WP SCL SDA A0 A1 A2 VSS BLOCK DIAGRAM SOIC Package (J) 1 2 3 4 8 7 6 5 VCC WP SCL SDA EXTERNAL LOAD DOUT ACK VCC VSS WORD ADDRESS BUFFERS COLUMN DECODERS SENSE AMPS SHIFT REGISTERS TSSOP Package (U) A0 A1 A2 VSS 1 2 3 4 8 7 6 5 VCC WP SCL SDA SDA START/STOP LOGIC XDEC WP CONTROL LOGIC E2PROM PIN FUNCTIONS Pin Name A0, A1, A2 SDA SCL WP VCC VSS Function Device Address Inputs Serial Data/Address Serial Clock Write Protect +1.8V to +6.0V Power Supply Ground SCL A0 A1 A2 STATE COUNTERS SLAVE ADDRESS COMPARATORS HIGH VOLTAGE/ TIMING CONTROL DATA IN STORAGE 24CXX F03 * Catalyst Semiconductor is licensed by Philips Corporation to carry the I2C Bus Protocol. © 2001 by Catalyst Semiconductor, Inc. Characteristics subject to change without notice 1 Doc No. 1003, Rev. A CAT34WC02 ABSOLUTE MAXIMUM RATINGS* Temperature Under Bias –55°C to +125°C Storage Temperature ....................... –65°C to +150°C Voltage on Any Pin with Respect to Ground(1) ........... –2.0V to +VCC + 2.0V VCC with Respect to Ground ............... –2.0V to +7.0V Package Power Dissipation Capability (Ta = 25°C) ................................... 1.0W Lead Soldering Temperature (10 secs) ............ 300°C Output Short Circuit Current(2) ........................ 100mA RELIABILITY CHARACTERISTICS Symbol NEND (3) *COMMENT Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions outside of those listed in the operational sections of this specification is not implied. Exposure to any absolute maximum rating for extended periods may affect device performance and reliability. Parameter Endurance Data Retention ESD Susceptibility Latch-up Min. 1,000,000 100 2000 100 Max. Units Cycles/Byte Years Volts mA Reference Test Method MIL-STD-883, Test Method 1033 MIL-STD-883, Test Method 1008 MIL-STD-883, Test Method 3015 JEDEC Standard 17 TDR(3) VZAP(3) ILTH (3)(4) D.C. OPERATING CHARACTERISTICS VCC = +1.8V to +6.0V, unless otherwise specified. Limits Symbol ICC ICC ISB(5) ILI ILO VIL VIH VOL1 VOL2 Parameter Power Supply Current (Read) Power Supply Current (Write) Standby Current (VCC = 5.0V) Input Leakage Current Output Leakage Current Input Low Voltage Input High Voltage Output Low Voltage (VCC = 3.0V) Output Low Voltage (VCC = 1.8V) –1 VCC x 0.7 Min. Typ. Max. 1 3 0 1 1 VCC x 0.3 VCC + 1.0 0.4 0.5 Units mA mA µA µA µA V V V V IOL = 3 mA IOL = 1.5 mA Test Conditions fSCL = 100 KHz fSCL = 100 KHz VIN = GND or VCC VIN = GND to VCC VOUT = GND to VCC CAPACITANCE TA = 25°C, f = 1.0 MHz, VCC = 5V Symbol CI/O CIN (3) (3) Test Input/Output Capacitance (SDA) Input Capacitance (A0, A1, A2, SCL) Max. 8 6 Units pF pF Conditions VI/O = 0V VIN = 0V Note: (1) The minimum DC input voltage is –0.5V. During transitions, inputs may undershoot to –2.0V for periods of less than 20 ns. Maximum DC voltage on output pins is VCC +0.5V, which may overshoot to VCC + 2.0V for periods of less than 20ns. (2) Output shorted for no more than one second. No more than one output shorted at a time. (3) This parameter is tested initially and after a design or process change that affects the parameter. (4) Latch-up protection is provided for stresses up to 100 mA on address and data pins from –1V to VCC +1V. (5) Standby Current (ISB) = 0µA (