CAT93HC46PA-1.8TE13

CAT93HC46 1-kb High Speed Microwire Serial EEPROM FEATURES s High speed operation: 4 MHz @ 5.0 V s 1.8 to 5.5 volt operation s Selectable x8 or x16 word organization s Sequential Read s Software write protection s Power-up inadvertent write protection s Low power CMOS technology s 1,000,000 program/erase cycles s 100 year data retention H GEN FR ALO EE LE A D F R E ETM s Industrial and extended temperature ranges s 8-Lead PDIP, SOIC, MSOP and TSSOP packages DESCRIPTION The CAT93HC46 is a 1-kb Serial EEPROM memory device which is configured as registers of either 16 bits (ORG pin at VCC) or 8 bits (ORG pin at GND). Each register can be written (or read) serially by using the DI (or DO) pin. The CAT93HC46 is manufactured using Catalyst’s advanced CMOS EEPROM floating gate PIN CONFIGURATION DIP Package (P, L) CS SK DI DO 1 2 3 4 8 7 6 5 VCC NC ORG GND SOIC Package (J, W) NC VCC CS SK SOIC Package (S, V) MSOP Package (R, Z) CS SK DI DO 1 2 3 4 8 7 6 5 VCC NC ORG GND CS SK DI DO 1 2 3 4 8 7 6 5 VCC NC ORG GND CS SK DI DO D 1 2 3 4 TSSOP Package (U, Y) 8 7 6 5 VCC NC ORG GND is o c 1 2 3 4 8 7 6 5 ORG GND DO DI i t n u n CS SK DI DO VCC technology. The device is designed to endure 1,000,000 program/erase cycles and has a data retention of 100 years. The CAT93HC46 is available in 8-pin DIP, SOIC, MSOP or TSSOP packages. FUNCTIONAL SYMBOL VCC d e a P t r ORG DI CAT93HC46 SK CS DO VSS PIN FUNCTIONS Pin Name Function Chip Select Clock Input Serial Data Input Serial Data Output 1.8 to 5.5 V Power Supply Ground Memory Organization No Connection Note: When the ORG pin is connected to VCC, the X16 organization is selected. When it is connected to ground, the X8 pin is selected. If the ORG pin is left unconnected, then an internal pullup device will select the X16 organization. GND ORG NC © 2005 by Catalyst Semiconductor, Inc. Characteristics subject to change without notice 1 Doc. No. 1008,Rev. H CAT93HC46 ABSOLUTE MAXIMUM RATINGS* Temperature Under Bias .................. -55°C to +125°C Storage Temperature ........................ -65°C to +150°C Pin with Respect to Ground(1) .... -2.0 V to VCC + 2.0 V VCC with Respect to Ground ................ -2.0 V to 7.0 V Lead Soldering Temperature (10 secs) ............ 300°C Output Short Circuit Current(2) ........................ 100 mA RELIABILITY CHARACTERISTICS Symbol NEND(3) TDR(3) VZAP(3) ILTH(3)(4) Parameter Endurance Data Retention ESD Susceptibility Latch-Up Reference Test Method MIL-STD-883, Test Method 1033 MIL-STD-883, Test Method 1008 MIL-STD-883, Test Method 3015 JEDEC Standard 17 Min 1,000,000 100 Typ *COMMENT Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions outside of those listed in the operational sections of this specification is not implied. Exposure to any absolute maximum rating for extended periods may affect device performance and reliability. D.C. OPERATING CHARACTERISTICS Industrial Temperature Range (-40°C to 85°C) Symbol ICC1 ICC2 ISB1 ISB2(5) ILI ILO VIL1 VIH1 VIL2 VIH2 VOL1 VOH1 VOL2 VOH2 Parameter Power Supply Current (Write) Power Supply Current (Read) Standby Supply Current (x8) Standby Supply Current (x16) Input Leakage Current Output Leakage Current Note: (1) The minimum DC input voltage is -0.5 V. During transitions, inputs may undershoot to -2.0 V for periods of less than 20 ns. Maximum DC voltage on output pins is VCC + 0.5 V, which may overshoot to VCC + 2.0 V for periods of less than 20 ns. (2) Output shorted for no more than one second. (3) This parameter is tested initially and after a design or process change that affects the parameter. (4) Latch-up protection is provided for stresses up to 100 mA on I/O pins from -1 V to VCC + 1 V. (5) Standby Current (ISB2) = 0 µA (