MeshConnect™ B1010SP0 Mini Modules
B1010SP0-1x
BLE Transceiver Based Modules
Integrated Transceiver Modules for Bluetooth® Smart Applications
DESCRIPTION
CEL’s MeshConnect Bluetooth® Smart Modules eliminate design
risk and significantly reduce time-to-market for Bluetooth Low
Energy wireless solutions, including the innovative CSRmesh™
protocol.
These devices are footprint-compatible with CEL’s existing line of
ZigBee and Thread-based Modules, allowing designers to easily
transition between multiple wireless networking standards via
drop-in compatible module hardware.
KEY FEATURES
•
•
•
•
•
•
Best-in-Class RF Range of 50m to 100m
+8dBm Transmit Power
Supports CSRMeshTM
Available with Avi-onTM Software
15 Analog/Digital I/O Pins
Supports UART, I2C & SPI
BLOCK DIAGRAM
External
EEPROM
32 kHz
XTAL
16 MHz
XTAL
ANT
APPLICATIONS
Connected Home
Building Automation
Sports & Fitness Sensors
Health Sensors
Mobile Accessories
General Bluetooth Wireless Sensor Networking
Castellation Edge
Connector
•
•
•
•
•
•
CSR1010
Micro
processor
Radio
ORDERING INFORMATION
Part Number
MeshConnect
B1010SP0 Mini
Modules
Order Number
Description
B1010SP0-1-R
CSR1010 IC, +8dBm Output Power, PCB Trace Antenna, 512kbit flash
600/600
CSR1010 IC, +8dBm Output Power, Castellation Pin for External Antenna,
512kbit flash
600/600
CSR1010 IC, +8dBm Output Power, PCB Trace Antenna, 1Mbit flash
600/600
CSR1010 IC, +8dBm Output Power, Castellation Pin for External Antenna,
1Mbit flash
600/600
B1010SP0-1C-R
B1010SP0-2-R
B1010SP0-2C-R
This document is subject to change without notice.
Document No: 0019-00-07-00-000 (Issue D)
Date Published: March 29, 2016
Min/Multiple
1
B1010SP0 Mini Modules
DEVELOPMENT KIT
MeshConnect µEnergy Starter Development Kit
CSR's µEnergy platform provides a complete Bluetooth qualified
solution for products using the Bluetooth Low Energy standard.
CEL's µEnergy Starter Development Kit is a simple yet
comprehensive way for designers to develop Bluetooth Smart
applications using CSR's µEnergy solution.
Each kit contains:
Evaluation board with B1010SP0 Mini Module
•
CSR µEnergy Platform Software
•
o Software Development Kit (SDK) application
examples and development tools
o xIDE for µEnergy (includes compiler)
o Production test and configuration tools
Mini-USB Cable
•
Setup & Quick Start Guides
•
Visit http://meshconnect.cel.com/B1010 for more information.
KIT ORDERING INFORMATION
Kit Family
Order Number
Description
Min/Multiple
B1010SP0-EVB-1
µEnergy Starter Development Kit, with license for CSR µEnergy SDK, 512kbit
flash memory module
1/1
B1010SP0-EVB-2
µEnergy Starter Development Kit, with license for CSR µEnergy SDK, 1Mbit
flash memory module
1/1
MeshConnect
µEnergy Starter
Development Kit
This document is subject to change without notice.
Document No: 0019-00-07-00-000 (Issue D)
Date Published: March 29, 2016
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B1010SP0 Mini Modules
TABLE OF CONTENTS
DESCRIPTION ...................................................................................................................................... 1
KEY FEATURES ..................................................................................................................................... 1
APPLICATIONS..................................................................................................................................... 1
BLOCK DIAGRAM................................................................................................................................. 1
ORDERING INFORMATION................................................................................................................... 1
DEVELOPMENT KIT .............................................................................................................................. 2
KIT ORDERING INFORMATION ............................................................................................................. 2
TABLE OF CONTENTS ........................................................................................................................... 3
TRANSCEIVER IC .................................................................................................................................. 4
ANTENNA............................................................................................................................................ 4
EXTERNAL EEPROM ............................................................................................................................. 4
SOFTWARE / FIRMWARE ..................................................................................................................... 5
CRYSTAL FREQUENCY TRIM AND BLUETOOTH DEVICE ADDRESS........................................................... 5
ABSOLUTE MAXIMUM RATINGS .......................................................................................................... 7
RECOMMENDED OPERATING CONDITIONS .......................................................................................... 7
DC CHARACTERISTICS .......................................................................................................................... 7
RF CHARACTERISTICS........................................................................................................................... 8
I/O PIN ASSIGNMENTS ........................................................................................................................ 9
ZICM35x ZIGBEE/THREAD MODULE COMPATIBILITY ............................................................................ 9
ERRATA ..............................................................................................................................................10
MODULE DIMENSIONS .......................................................................................................................10
MODULE LAND FOOTPRINT ................................................................................................................11
AGENCY CERTIFICATIONS (PCB ANTENNA ONLY).................................................................................14
SHIPMENT, HANDLING AND STORAGE ................................................................................................15
QUALITY ............................................................................................................................................15
REFERENCES .......................................................................................................................................16
REVISION HISTORY .............................................................................................................................16
DISCLAIMER .......................................................................................................................................16
This document is subject to change without notice.
Document No: 0019-00-07-00-000 (Issue D)
Date Published: March 29, 2016
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B1010SP0 Mini Modules
TRANSCEIVER IC
CEL’s MeshConnect B1010SP0 Mini Module, utilizing the CSR1010 transceiver IC, is a single-mode Bluetooth Low Energy
(BLE) device that is part of CSR's µEnergy platform. This transceiver incorporates a baseband modem, RF circuitry, and 16-bit
XAP microprocessor. Together with CSR's qualified Bluetooth v4.x specification stack, it is an excellent low cost, low power
consumption and high performance solution ideally suited for all BLE applications. For more information about the CSR1010 IC,
please visit www.csr.com.
ANTENNA
CEL’s B1010SP0 Mini Modules include an integrated Printed Circuit Board (PCB) trace antenna. An optional configuration which
uses a castellation pin on the module allows the user to connect an external antenna. The B1010SP0 has been certified with the
PCB trace antenna only.
The PCB antenna employs a topology that is compact and highly efficient. To maximize range, an adequate ground plane must
be provided on the host PCB. Correctly positioned, the ground plane on the host PCB will contribute significantly to the antenna
performance (it should not be directly under the module PCB antenna). The position of the module on the host board and overall
design of the product enclosure contribute to antenna performance. Poor design affects radiation patterns and can result in
reflection, diffraction and/or scattering of the transmitted signal.
For optimum antenna performance, the MeshConnect Mini Modules should be mounted with the PCB trace antenna overhanging
the edge of the host board. To further improve performance, a ground plane may be placed on the host board under the module;
up to the antenna (a minimum of 1.5" x 1.5" is recommended). The installation of an uninterrupted ground plane on a layer
directly beneath the module will also allow you to run traces under this layer. CEL can provide assistance with your PCB layout.
The following are some design guidelines to help ensure antenna performance:
• Never place the ground plane or route copper traces directly underneath the antenna portion of the module
• Never place the antenna close to metallic objects
• In the overall design, ensure that wiring and other components are not placed near the antenna
• Do not place the antenna in a metallic or metalized plastic enclosure
• Keep plastic enclosures 1cm or more away from the antenna in any direction
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and
its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication.
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante.
EXTERNAL EEPROM
The B1010SP0 Mini Module incorporates an additional 512kbit or 1Mbit external EEPROM for storing program code and OverThe-Air code updates. The EEPROM is connected to the master I2C interface using I2C_SCL, I2C_SDA, and PIO[2] as detailed
in the CSR1010 reference design.
The instruction set for the 512kbit EEPROM is similar to the Fudan FM24C512D. See the Fudan Microelectronics Group website
for more details.
The instruction set for the Atmel AT24CM01-SSHD-T 1Mbit EEPROM is available on website.
This document is subject to change without notice.
Document No: 0019-00-07-00-000 (Issue D)
Date Published: March 29, 2016
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B1010SP0 Mini Modules
SOFTWARE / FIRMWARE
CEL’s B1010SP0 Mini Modules run CSR's µEnergy platform, which is a fully qualified Bluetooth Low Energy solution. In addition
to supporting standard BLE 4.x devices, the B1010SP0 Mini Modules also support CSRmesh, which is a protocol layer that runs
on top of the Bluetooth Smart standard that enables messages to be relayed over multiple Bluetooth Smart devices. By
expanding the network range through a mesh, comprehensive lighting, home automation, and building automation solutions can
easily be developed which can be controlled through a smartphone, tablet, or any other BLE 4.x device.
The CSR µEnergy platform is a feature-rich Bluetooth Smart development environment and contains everything required to
create an interoperable BLE 4.x solution. This includes a fully licensed xIDE software development environment (with compiler),
example applications for popular Bluetooth Smart and CSRmesh profiles, example host applications for iOS and Android
platforms, and production test and configuration tools. For more information, visit www.csr.com.
CRYSTAL FREQUENCY TRIM AND BLUETOOTH DEVICE ADDRESS
During the manufacturing process, all B1010SP0 Mini Modules are tested for full RF and DC functionality. This includes
measuring crystal frequency error and setting the crystal frequency trim token so the frequency error for an unmodulated RF
tone is as close as possible to zero. At this time a unique Bluetooth Device Address is assigned to each module.
Note: CEL recommends saving the Crystal Frequency Trim value and the Bluetooth Device Address, which is stored in
the external EEPROM, before reflashing the B1010SP0 Mini Module with different software. If you accidently overwrite
this information please submit a request to recover them at www.cel.com/MeshConnectHelp.
In order to manually save the crystal frequency trim values or the BDA, install CSR's µEnergy development kit and
launch the CSR CsConfig tool while the evaluation board is connected to your PC. This is located under All Programs > CSR uEnergy -> CSR Tools folder in the Windows start menu. The keys can be exported using CsConfig tool to a
.keyr file using Keys -> Export to file and included them into your xIDE project during your application development.
During production, it is recommended to export the keys to a file using the command line version of this tool
(csconfigcmd.exe) also present within the development kit. Then flash the application firmware. Finally, merge the key
file that was exported previously into the module using the csconfigcmd.exe tool again. For usage information for the
command line tool, type csconfigcmd –help located at C:\CSR_uEnergy_SDK-x.x.x.xx\tools\bin at the command prompt.
When the CsConfig tool is first launched, the Connection Options
dialog box is displayed. The evaluation board uses the USB SPI
transport to communicate with the module. This option should
appear if the appropriate drivers were installed during the
development kit installation procedure. Once it is selected, click
OK.
This document is subject to change without notice.
Document No: 0019-00-07-00-000 (Issue D)
Date Published: March 29, 2016
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B1010SP0 Mini Modules
All the key names are now displayed in the left list and their
corresponding values are in the right list. The crystal trim value is
named “Crystal frequency trim”. In the example shown to the right,
the value is 0x0015 (21 decimal).
The bluetooth device address (BDA) can also be found the same
way. In the example shown to the right, the BDA is
0022A30000AC (read 4 bytes at a time from bottom to top).
This document is subject to change without notice.
Document No: 0019-00-07-00-000 (Issue D)
Date Published: March 29, 2016
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B1010SP0 Mini Modules
ABSOLUTE MAXIMUM RATINGS
Description
Min
Max
Unit
Storage temperature range
-40
85
⁰C
Power supply voltage (VDD)
1.8
4.4
V
I/O supply voltage
-0.4
4.4
V
VSS - 0.4
VDD + 0.4
V
Other terminal voltage*
* VDD = Terminal Supply Domain
RECOMMENDED OPERATING CONDITIONS
Description
Min
Typ
Max
Unit
Operating temperature range
-30
-
85
⁰C
Power supply voltage (VDD)
1.8
-
3.6
V
Conditions
Min
Typ
Max
Unit
@ 2.7V
-
35
-
mA
@ 1.8V
-
54
-
mA
@ 3.6V
-
25
-
mA
@ 2.7V
-
23
-
mA
@ 1.8V
-
39
-
mA
@ 3.6V
-
17
-
mA
@ 2.7V
-
24
-
mA
@ 1.8V
-
39
-
mA
@ 3.6V
-
17
-
mA
@ 3.3V
-
0.9
-
µA
DC CHARACTERISTICS
(@25⁰C unless otherwise specified)
Description
Transmitter Current Draw, max output power
Transmitter Current Draw @ 0dBm
Receiver Current Draw
Sleep mode current (Dormant mode)
This document is subject to change without notice.
Document No: 0019-00-07-00-000 (Issue D)
Date Published: March 29, 2016
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B1010SP0 Mini Modules
RF CHARACTERISTICS
(@25⁰C unless otherwise specified)
Path
Description
Conditions
Min
Operating Frequency
Typ
2402
Max
Unit
2480
MHz
Maximum output power
-
8
-
dBm
2nd Harmonic
-
-
54
dBuV
3rd Harmonic
-
-
54
dBuV
F = Fo ± 2MHz
-
-38
-
dBm
F = Fo ± 3MHz
-
-38
-
dBm
F = Fo ± > 3MHz
-
-38
-
dBm
Modulation delta F1 average
225
255
275
kHz
Modulation delta F1 / F2
0.8
-
-
-
Modulation delta F2 max
-
100
-
%
Frequency accuracy
-100
25
100
kHz
Frequency offset
-100
25
100
kHz
Maximum Drift Rate (kHz/50µs)
-20
8
20
kHz / 50uS
In-band emissions
TX
RX
Receiver Sensitivity
-94
dBm
Receiver Sensitivity (with dirty transmitter)
-93
dBm
Maximum received signal at 30.8% PER
-10
This document is subject to change without notice.
Document No: 0019-00-07-00-000 (Issue D)
Date Published: March 29, 2016
8
≥ -10
dBm
B1010SP0 Mini Modules
I/O PIN ASSIGNMENTS
Refer to the CSR1010 datasheet for pin functionality details.
Module Pin
Number
CSR1010 IC
Pin Number
Pin Name
1, 2, 12, 31,
33
33 to 48
GND
NC
NC
4
WAKE
3, 4, 5, 6,
16, 17, 18,
26
7
Notes
8
23
PIO[9]
9
24
PIO[10]
10
16
PIO[3]
11
29
I2C_SDA
Connects internally to SDA on the onboard serial flash.
13
1, 21, 32
VDD
Input power to the module.
14
28
I2C_SCL
Connects internally to SCL on the onboard serial flash.
15
17
PIO[4]
19
14
PIO[0] / UART_TX
Programmable I/O line or UART TX
20
15
PIO[1] / UART_RX
Programmable I/O line or UART RX
21
26
SPI_PIO#
22
19
PIO[6]
Selects SPI debug on PIO[8:5]
Programmable I/O line or debug SPI chip select
23
20
PIO[7]
Programmable I/O line or debug SPI MOSI
24
22
PIO[8]
Programmable I/O line or debug SPI MISO
25
13
AIO[0]
27
18
PIO[5]
28
12
AIO[1]
29
25
PIO[11]
Programmable I/O line or debug SPI CLK
30
11
AIO[2]
32
NC
RF OUT
Castellation Pin for External Antenna
ZICM35x ZIGBEE/THREAD MODULE COMPATIBILITY
The geometry of the land pattern and location of the RF castellation is identical to the ZICM35x family of ZigBee/Thread
modules. The compatible digital and analog I/O are described below:
Description
ZICM35x
B1010SP0
Serial
Controller 1
UART / SPI / I2C
Serial
Controller 2
SPI/I2C
I2C
GPIO
PC2
PIO[6]
GPIO
PC3
PIO[7]
GPIO
PC4
PIO[8]
GPIO
PC0
PIO[5]
GPIO
PB6
PIO[11]
GPIO
PA7
WAKE
Programming
JTCK
SPI_PIO#
Driving this line high on B1010SP0 converts
PIO[5,6,7,8] to the SPI programming port.
ADC
PB0, PB5, PB7
AIO[0], AIO[2],
AIO[1]
B1010SP0 lines can also be configured as a
DAC.
UART / SPI / I2C
This document is subject to change without notice.
Document No: 0019-00-07-00-000 (Issue D)
Date Published: March 29, 2016
Notes
Castellation pins 8,9,19,20
Castellation pins 10,11,14,15
This line can only be used to wake the
B1010SP0 from sleep.
9
B1010SP0 Mini Modules
ERRATA
Modules with lot codes earlier than 1530x had different I/O assignments on some of the castellations. The following table
summarizes the differences:
Signal Name
Module Pin Number
Before 1530x
Module Pin Number
After 1530x
SPI_PIO#
3
21
PIO[9]
18
8
PIO[10]
21
9
The changes were made to improve compatibility with the ZICM35x series of ZigBee®/Thread modules.
MODULE DIMENSIONS
This document is subject to change without notice.
Document No: 0019-00-07-00-000 (Issue D)
Date Published: March 29, 2016
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B1010SP0 Mini Modules
MODULE LAND FOOTPRINT
Dimensions are shown in inches, with millimeter conversion in brackets
Note: Refer to the Antenna section in this document for layout recommendations which will yield optimal antenna performance.
PROCESSING
Recommended Reflow Profile
Parameter Values
Ramp Up Rate (from Tsoakmax to Tpeak)
3º/sec max
Minimum Soak Temperature
150ºC
Maximum Soak Temperature
200ºC
Soak Time
TLiquidus
Time above TL
Tpeak
60-120 sec
217ºC
60-150 sec
250ºC
Time within 5º of Tpeak
20-30 sec
Time from 25º to Tpeak
8 min max
Ramp Down Rate
6ºC/sec max
This document is subject to change without notice.
Document No: 0019-00-07-00-000 (Issue D)
Date Published: March 29, 2016
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B1010SP0 Mini Modules
Pb-Free Solder Paste
Use of “No Clean” soldering paste is strongly recommended, as it does not require cleaning after the soldering process.
Note: The quality of solder joints on the castellations ("half vias") where they contact the host board should meet the
appropriate IPC Specification. See the Castellated Terminations Section in the latest IPC-A-610 Acceptability of
Electronic Assemblies document.
Cleaning
In general, cleaning the populated module is strongly discouraged. Residuals under the module cannot be easily removed with
any cleaning process.
• Cleaning with water can lead to capillary effects where water is absorbed into the gap between the host
board and the module. The combination of soldering flux residuals and encapsulated water could lead to short circuits
between neighboring pads. Water could also damage any stickers or labels.
• Cleaning with alcohol or a similar organic solvent will likely flood soldering flux residuals into the two
housings, which is not accessible for post-washing inspection. The solvent could also damage any stickers or labels.
• Ultrasonic cleaning could damage the module permanently.
The best approach is to consider using a “No Clean” solder paste and eliminate the post-soldering cleaning step.
Optical Inspection
After soldering the module to the host board, consider optical inspection to check the following:
• Proper alignment and centering of the module over the pads
• Proper solder joints on all pads
• Excessive solder or contacts to neighboring pads or vias
Repeating Reflow Soldering
Only a single reflow soldering process is encouraged for host boards.
Wave Soldering
If a wave soldering process is required on the host boards due to the presence of leaded components, only a single wave
soldering process is encouraged.
Hand Soldering
Hand soldering is possible. When using a soldering iron, follow IPC recommendations.(reference document IPC-7711).
Rework
The MeshConnect Module can be unsoldered from the host board. Use of a hot air rework tool should be programmable and the
solder joint and module should not exceed the maximum peak reflow temperature of 250ºC.
This document is subject to change without notice.
Document No: 0019-00-07-00-000 (Issue D)
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B1010SP0 Mini Modules
Caution
If temperature ramps exceed the reflow temperature profile, module and component damage may occur due to thermal shock.
Avoid overheating.
Warning
Never attempt a rework on the module itself (i.e., replacing individual components); such actions will terminate warranty
coverage.
Additional Grounding
Attempts to improve the module or the system grounding by soldering braids, wires or cables onto the module RF shield cover is
done at the customer's own risk. The ground pins at the module perimeter should be sufficient for optimum immunity to external
RF interference.
This document is subject to change without notice.
Document No: 0019-00-07-00-000 (Issue D)
Date Published: March 29, 2016
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B1010SP0 Mini Modules
AGENCY CERTIFICATIONS (PCB ANTENNA ONLY)
The following certifications are in effect:
• B1010SP0: FCC and IC
FCC Compliance Statement Part 15.19, Section 7.15 of RSS-GEN
This device complies with Part 15 of the FCC Rules and with Industry Canada license-exempt RSS Standards. Operation is
subject to the following two conditions:
1. This device may not cause harmful interference.
2. This device must accept any interference received, including interference that may cause undesired operation.
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes:
1. l'appareil ne doit pas produire de brouillage, et
2. l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est
susceptible d'en compromettre le fonctionnement.
Warning (Part 15.21)
Changes or modifications not expressly approved by CEL could void the user's authority to operate the equipment.
20 cm Separation Distance
To comply with FCC/IC RF exposure limits for general population/uncontrolled exposure, the antenna(s) used for this
transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or
operating in conjunction with any other antenna or transmitter.
OEM Responsibility to the FCC and IC Rules and Regulations
The MeshConnect Mini Module has been certified per FCC Part 15 Rules and to Industry Canada license-exempt RSS
Standards for integration into products without further testing or certification. To fulfill the FCC and IC Certification requirements,
the OEM of the MeshConnect Module must ensure that the information provided on the MeshConnect label is placed on the
outside of the final product. The MeshConnect Mini Module is labeled with its own FCC ID Number and IC ID Number. If the FCC
ID and the IC ID are not visible when the module is installed inside another device, then the outside of the device into which the
module is installed must also display a label referring to the enclosed module. The exterior label can use wording such as the
following:
“Contains Transmitter Module FCC ID: W7Z-B1010SP0” or “Contains FCC ID: W7Z-B1010SP0”
“Contains Transmitter Module IC: 8254A-B1010SP0" or "Contains IC: 8254A-B1010SP0”
The OEM of the MeshConnect Mini Module may only use the approved antenna (PCB trace antenna) that has been certified with
this module. The OEM of the MeshConnect Mini Module must test their final product configuration to comply with Unintentional
Radiator Limits before declaring FCC Compliance per Part 15 of the FCC Rules.
IC Certification — Industry Canada Statement
The term "IC" before the certification/registration number only signifies that the Industry Canada technical specifications were
met.
Certification IC - Déclaration d'Industrie Canada
Le terme "IC" devant le numéro de certification/d'enregistrement signifie seulement que les spécifications techniques
Industrie Canada ont été respectées.
Section 14 of RSS-210
The installer of this radio equipment must ensure that the antenna is located or pointed such that it does not emit RF field in
excess of Health Canada limits for the general population. Consult Safety Code 6, obtainable from Health Canada's website:
http://www.hc-sc.gc.ca/ewh-semt/pubs/radiation/99ehd-dhm237/index-eng.php
This document is subject to change without notice.
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B1010SP0 Mini Modules
L'article 14 du CNR-210
Le programme d'installation de cet équipement radio doit s'assurer que l'antenne est située ou orientée de telle sorte qu'il ne pas
émettre de champ RF au-delà des limites de Santé Canada pour la population générale. Consulter le Code de sécurité 6,
disponible sur le site Web de Santé Canada: http://www.hc-sc.gc.ca/ewh-semt/pubs/radiation/99ehd-dhm237/index-eng.php
SHIPMENT, HANDLING AND STORAGE
Shipment
The MeshConnect Modules are delivered in tape and reel. The reel diameter is 12.992" (330mm) and contains 600 modules.
Handling
The MeshConnect Modules are designed and packaged to be processed in an automated assembly line.
Warning
The MeshConnect Modules contain highly sensitive electronic circuitry. Handling without proper ESD protection may destroy or
damage the module permanently.
Warning
The MeshConnect Modules are moisture-sensitive devices. Appropriate handling instructions and precautions are summarized in
J-STD-033. Read carefully to prevent permanent damage due to moisture intake.
Moisture Sensitivity Level (MSL)
MSL 3, per J-STD-033
Storage
Storage/shelf life in sealed bags is 12 months at