RF SWITCH
CG2214M6
L, S-band
Power SPDT
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DESCRIPTION
PACKAGE
The CG2214M6 is a pHEMT GaAs SPDT (Single
Pole Double Throw) switch. This device can operate
from 0.05 to 3.0 GHz, having low insertion loss and
high isolation.
6-pin lead-less mini mold package
(1.5mm x 1.1mm x 0.55mm)
FEATURES
Control voltage :
VC(H) = 1.8 to 5.0 V (3.0 V TYP.)
VC(L) = -0.2 to 0.2 V (0 V TYP.)
Low insertion loss :
Lins1 = 0.30 dB TYP. @ f = 0.05 to 0.5 GHz
Lins2 = 0.30 dB TYP. @ f = 0.5 to 1.0 GHz
Lins3 = 0.30 dB TYP. @ f = 1.0 to 2.0 GHz
Lins4 = 0.35 dB TYP. @ f = 2.0 to 2.5 GHz
Lins5 = 0.35 dB TYP. @ f = 2.5 to 3.0 GHz
High isolation :
ISL1 = 38 dB TYP. @ f = 0.05 to 0.5 GHz
ISL2 = 32 dB TYP. @ f = 0.5 to 1.0 GHz
ISL3 = 27 dB TYP. @ f = 1.0 to 2.0 GHz
ISL4 = 25 dB TYP. @ f = 2.0 to 2.5 GHz
ISL5 = 23 dB TYP. @ f = 2.5 to 3.0 GHz
Power handling :
Pin(0.5dB) = +32 dBm TYP. @ f = 3.0 GHz
VC(H) = 3.0 V, VC(L) = 0 V
APPLICATIONS
Wireless LAN (IEEE 802.11 b/g/n/ac)
ORDERING INFORMATION
Part Number
Order Number
CG2214M6
CG2214M6-C2
CG2214M6-EVAL
CG2214M6-EVAL
This document is subject to change without notice.
Date Published: September 2017
CDS-0025-04 (Issue C)
Package
6-pin lead-less
mini mold
package
(Pb-Free)
Marking
C07
Description
• Embossed tape 8 mm wide
• Pin 1, 6 face the perforation
side of the tape
• MOQ 9 kpcs/reel
• Evaluation Board with DC
block capacitors, power
supply bypass capacitors,
and RF and DC connectors
• MOQ 1
1
CG2214M6
PIN CONFIGURATION AND
INTERNAL BLOCK DIAGRAM
TRUTH TABLE
VC1
VC2
RFC-RF1
RFC-RF2
Low
High
ON
OFF
High
Low
OFF
ON
ABSOLUTE MAXIMUM RATINGS
(TA = +25˚C, unless otherwise specified)
Parameter
Symbol
Rating
Unit
VC
6.0Note 1
V
Control Voltage
Input Power
Note 2
dBm
Note 3
dBm
+33
Pin1
Pin2
+29
Operating Ambient Temperature
TA
-45~+85
˚C
Storage Temperature
Tstg
-55~+150
˚C
Note
1. |VC1 - VC2| ≦ 6.0 V
2. 3.0V ≦ |VC1 – VC2| ≦ 5.0 V, f ≧ 0.4 GHz
3. 3.0V ≦ |VC1 – VC2| ≦ 5.0 V, 0.4GHz ≧ f ≧ 0.05GHz
RECOMMENDED OPERATING RANGE
(TA = +25˚C, unless otherwise specified)
Parameter
Symbol
MIN.
TYP.
MAX.
Unit
f
0.05
-
3.0
GHz
Switch Control Voltage (H)
VC(H)
+1.8
+3.0
+5.3
V
Switch Control Voltage (L)
VC(L)
-0.2
0
+0.2
V
Operating Frequency
This document is subject to change without notice.
2
CG2214M6
ELECTRICAL CHARACTERISTICS 1
(TA = +25˚C, VC(H) = 3.0 V, VC(L) = 0 V, Zo = 50 Ω, DC Block Capacitance = 56 pF, unless otherwise specified)
Parameter
Insertion Loss
Symbol
Condition
MIN.
TYP.
MAX.
Unit
LINS1
f=0.05 to 0.5GHz Note 1
-
0.30
0.50
dB
LINS2
f=0.5 to 1.0GHz
-
0.30
0.50
dB
LINS3
f=1.0 to 2.0GHz
-
0.30
0.50
dB
LINS4
f=2.0 to 2.5GHz
-
0.35
0.55
dB
LINS5
f=2.5 to 3.0GHz
-
0.35
0.55
dB
ISL1
f=0.05 to 0.5GHz Note 1
35
38
-
dB
ISL2
f=0.5 to 1.0GHz
29
32
-
dB
ISL3
f=1.0 to 2.0GHz
24
27
-
dB
ISL4
f=2.0 to 2.5GHz
22
25
-
dB
ISL5
f=2.5 to 3.0GHz
20
23
-
dB
RL
f=0.05 to 3.0GHz Note 1
15
20
-
dB
0.1dB Loss Compression Input
Power
Note 2
Pin(0.1dB)
f=0.05 ~ 0.5GHz Note 1
-
+26
-
dBm
f=0.5 ~ 3.0GHz
-
+30
-
dBm
0.5dB Loss Compression Input
Power
Note 3
Pin(0.5dB)
f=0.05 ~ 0.5GHz Note 1
-
+28
-
dBm
f=0.5 ~ 3.0GHz
-
+32
-
dBm
Isolation
Return Loss
2nd Harmonics
2f0
f=3.0GHz, Pin=+20dBm
-
-85
-
dBc
3rd Harmonics
3f0
f=3.0GHz, Pin=+20dBm
-
-85
-
dBc
3rd Order Input Intercept Point
IIP3
f=2.5GHz, 2-tone
1MHz Spacing
-
+58
-
dBm
Error Vector Magnitude
EVM
802.11g, 64QAM, 54Mbps
Pin≦+25dBm
-
2.5
-
%
Switch Control Current
ICONT
RF none
-
1
10
uA
50% CTL to 90/10% RF
-
50
-
ns
Switching Speed
tSW
Note 1. DC block capacitance = 1000 pF at f = 0.05 to 0.5 GHz
Note 2. Pin(0.1dB) is the measured input power level when the insertion loss increases 0.1dB more than that of
the linear range.
Note 3. Pin(0.5dB) is the measured input power level when the insertion loss increases 0.5dB more than that of the linear
range
This document is subject to change without notice.
3
CG2214M6
ELECTRICAL CHARACTERISTICS 2
(TA=+25℃, VC(H)=1.8V, VC(L)=0V,
Parameter
Insertion Loss
Isolation
Return Loss
0.1dB Loss Compression
Input Power Note 2
0.5dB Loss Compression
Input Power Note 3
Switch Control Current
Zo=50Ω,
Symbol
DC Block Capacitance=56pF, unless otherwise specified)
Condition
MIN.
TYP.
MAX.
Unit
LINS1
f=0.05 to 0.5GHz Note 1
---
0.30
0.50
dB
LINS2
f=0.5 to 1.0GHz
---
0.30
0.50
dB
LINS3
f=1.0 to 2.0GHz
---
0.30
0.50
dB
LINS4
f=2.0 to 2.5GHz
---
0.35
0.55
dB
LINS5
f=2.5 to 3.0GHz
---
0.35
0.55
dB
ISL1
f=0.05 to 0.5GHz Note 1
35
38
---
dB
ISL2
f=0.5 to 1.0GHz
29
32
---
dB
ISL3
f=1.0 to 2.0GHz
24
27
---
dB
ISL4
f=2.0 to 2.5GHz
22
25
---
dB
ISL5
f=2.5 to 3.0GHz
20
23
---
dB
RL
f=0.05 to 3.0GHz Note 1
15
20
---
dB
Pin(0.1dB)
f=0.05~0.5GHz Note 1
---
+19
---
dBm
f=0.5~3.0GHz
---
+23
---
dBm
f=0.05~0.5GHz Note 1
---
+22
---
dBm
f=0.5~3.0GHz
---
+26
---
dBm
RF none
---
1
10
uA
Pin(0.5dB)
ICONT
Switching Speed
TSW
50% CTL to 90/10% RF
--50
--ns
Note 1. DC block capacitance = 1000pF at f=0.05 to 0.5GHz
Note 2. Pin(0.1dB) is the measured input power level when the insertion loss increases 0.1dB more than that of
the linear range.
Note 3. Pin(0.5dB) is the measured input power level when the insertion loss increases 0.5dB more than that of the
linear range.
This document is subject to change without notice.
4
CG2214M6
TYPICAL CHARACTERISTICS
(Vc(H)=3V, Vc(L)=0V, TA=+25℃, DC Block Capacitance=56pF, through board loss is subtracted in insertion loss data)
Typical Isolation vs. Frequency
Typical Insertion Loss vs. Frequency
Typical Insertion Loss vs.
Input Power
Typical Return Loss vs. Frequency
This document is subject to change without notice.
5
CG2214M6
EVALUATION CIRCUIT
Note
C0 :0.05 to 0.5 GHz 1000pF
: 0.5 to 3.0 GHz 56pF
The application circuits and their parameters are for reference only and are not intended for use in actual designs.
DC Blocking Capacitors are required at all RF ports.
PACKAGE DIMENSIONS
6-pin lead-less mini mold package (Unit: mm)
This document is subject to change without notice.
6
CG2214M6
RECOMMENDED SOLDERING CONDITIONS
Recommended Soldering Conditions are available on CEL’s Part Summary page under Associated Documents
This document is subject to change without notice.
7
CG2214M6
REVISION HISTORY
Version
Change to current version
Page(s)
CDS-0021-01 (Issue A)
February 17, 2016
CDS-0021-02 (Issue B)
March 29, 2016
Initial datasheet
N/A
Added Eval Board ordering information
Updated marking information
1, 2
CDS-0021-03 (Issue C)
April 20, 2016
Updated Features section
1
CDS-0021-03 (Issue D)
August 11, 2016
Removed “preliminary”
All
CDS-0025-01 (Issue A)
September 14, 2016
Revise CDS No. CDS-0021-03 to CDS-0025-01
N/A
CDS-0025-01 (Issue B)
January 11, 2017
Revised Electrical Characteristics table
Added “Recommended Soldering Conditions” section
3, 5
CDS-0025-04 (Issue C)
September 11, 2017
Updated Applications section
Added Error Vector Magnitude parameter to Electrical
Characteristics table 1,
Added a second Electrical Characteristics table
Added Typical Characteristics graphs section
1, 2, 3, 4, 5
This document is subject to change without notice.
8
CG2214M6
[CAUTION]
・ All information included in this document is current as of the date this document is issued. Such information,
however, is subject to change without any prior notice.
・ You should not alter, modify, copy, or otherwise misappropriate any CEL product, whether in whole or in part.
・ CEL does not assume any liability for infringement of patents, copyrights, or other intellectual property rights of
third parties by or arising from the use of CEL products or technical information described in this document. No
license, expressed, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual
property rights of CEL or others.
・ Descriptions of circuits, software and other related information in this document are provided only to illustrate the
operation of semiconductor products and application examples. You are fully responsible for the incorporation of
these circuits, software, and information in the design of your equipment. CEL assumes no responsibility for any
losses incurred by you or third parties arising from the use of these circuits, software, or information.
・ CEL has used reasonable care in preparing the information included in this document, but CEL does not warrant
that such information is error free. CEL assumes no liability whatsoever for any damages incurred by you resulting
from errors in or omissions from the information included herein.
・ Although CEL endeavors to improve the quality and reliability of its products, semiconductor products have specific
characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions.
Please be sure to implement safety measures to guard them against the possibility of physical injury, and injury or
damage caused by fire in the event of the failure of a CEL product, such as safety design for hardware and software
including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for aging
degradation or any other appropriate measures
Because the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final
products or system manufactured by you.
・ Please use CEL products in compliance with all applicable laws and regulations that regulate the inclusion or use of
controlled substances, including without limitation, the EU RoHS Directive.
CEL assumes no liability for damages or losses occurring as a result of your noncompliance with applicable laws and
regulations.
・ This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written consent
of CEL.
・ Please contact CEL if you have any questions regarding the information contained in this document or CEL
products, or if you have any other inquiries.
This document is subject to change without notice.
9
CG2214M6
[CAUTION]
This product uses gallium arsenide (GaAs) of the toxic substance appointed in laws and ordinances.
GaAs vapor and powder are hazardous to human health if inhaled or ingested.
・ Do not dispose in fire or break up this product.
・ Do not chemically make gas or powder with this product.
・ When discarding this product, please obey the laws of your country.
・ Do not lick the product or in any way allow it to enter the mouth.
[CAUTION]
Although this device is designed to be as robust as possible, ESD (Electrostatic Discharge) can
damage this device. This device must be protected at all times from ESD. Static charges may easily
produce potentials of several kilovolts on the human body or equipment, which can discharge
without detection. Industry-standard ESD precautions should be used at all times.
CEL Headquarters • 4590 Patrick Henry Drive • Santa Clara, CA 95054 • Tel: (408) 919-2500 • www.cel.com
For a complete list of sales offices, representatives and distributors,
Please visit our website: www.cel.com/contactus
For inquiries email us at rfw@cel.com
This document is subject to change without notice.
10