NE3509M04-EVNF24-A

NEC's C TO Ku BAND SUPER LOW NOISE AND NE3503M04 HIGH-GAIN AMPLIFIER N-CHANNEL HJ-FET FEATURES • SUPER LOW NOISE FIGURE AND HIGH ASSOCIATED GAIN: NF = 0.55 dB TYP., Ga = 11.5 dB TYP. @ VDS = 2 V, ID = 10 mA, f = 12 GHz • FLAT-LEAD 4-PIN THIN-TYPE SUPER MINIMOLD (M04) PACKAGE: • GATE WIDTH: Wg = 160 μm M04 PACKAGE APPLICATIONS • DBS LNB gain-stage, Mix-stage • Low noise amplifier for microwave communication system ORDERING INFORMATION QUANTITY PACKAGE MARKING NE3503M04-A PART NUMBER 50 pcs (Non reel) V75 NE3503M04-T2-A 3 kpcs/reel 4-Pin thin-type super minimold (Pb-Free) SUPPLYING FORM • 8 mm wide embossed taping • Pin 1 (Source), Pin 2 (Drain) face the perforation side of the tape Remark To order evaluation samples, contact your nearby sales office. Part number for sample order: NE3503M04-A ABSOLUTE MAXIMUM RATINGS (TA = +25°C) SYMBOL RATINGS UNIT Drain to Source Voltage PARAMETER VDS 4.0 V Gate to Source Voltage VGS −3.0 V Drain Current ID IDSS mA Gate Current IG 80 μA Total Power Dissipation Ptot 125 mW Channel Temperature Tch +125 °C Storage Temperature Tstg −65 to +125 °C Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge. California Eastern Laboratories NE3503M04 RECOMMENDED OPERATING CONDITIONS (TA = +25°C) PARAMETER Drain to Source Voltage SYMBOL MIN. TYP. MAX. UNIT VDS − 2 3 V Drain Current ID − 10 15 mA Input Power Pin − − 0 dBm ELECTRICAL CHARACTERISTICS (TA = +25°C, unless otherwise specified) PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT Gate to Source Leak Current IGSO VGS = −3.0 V − 0.5 10 μA Saturated Drain Current IDSS VDS = 2 V, VGS = 0 V 15 40 70 mA Gate to Source Cutoff Voltage VGS (off) VDS = 2 V, ID = 100 μA −0.2 −0.7 −2.0 V Transconductance gm VDS = 2 V, ID = 10 mA 40 55 − mS Noise Figure NF VDS = 2 V, ID = 10 mA, f = 12 GHz − 0.55 0.75 dB Associated Gain Ga 10.5 11.5 − dB NE3503M04 TYPICAL CHARACTERISTICS (TA = +25°C, unless otherwise specified) DRAIN CURRENT vs. DRAIN TO SOURCE VOLTAGE 250 100 200 80 Drain Current ID (mA) Total Power Dissipation Ptot (mW) TOTAL POWER DISSIPATION vs. AMBIENT TEMPERATURE 150 125 100 50 60 VGS = 0 V 40 -0.2 V 20 -0.4 V -0.6 V 0 50 100 125 150 200 250 1.0 0 Ambient Temperature TA (ºC) 2.0 Drain to Source Voltage VDS (V) DRAIN CURRENT vs. GATE TO SOURCE VOLTAGE 80 Drain Current ID (mA) VDS = 2 V 60 40 20 0 -2.0 -1.0 0 Gate to Source Voltage VGS (V) 1.4 Ga 1.2 16 2.0 14 1.8 12 1.0 10 0.8 8 0.6 NFmin 0.4 0.2 0.0 6 4 2 0 5 10 15 20 Drain Current ID (mA) 25 0 30 Minimum Noise Figure NFmin (dB) f = 12 GHz VDS = 2 V Associated Gain Ga (dB) Minimum Noise Figure NFmin (dB) 1.6 MINIMUM NOISE FIGURE, ASSOCIATED GAIN vs. FREQUENCY VDS = 2 V ID = 10 mA 1.6 25 20 1.4 1.2 15 Ga 1.0 10 0.8 0.6 0.4 0.0 5 NFmin 0.2 0 2 4 6 8 10 12 14 Frequency f (GHz) 0 16 18 20 Associated Gain Ga (dB) MINIMUM NOISE FIGURE, ASSOCIATED GAIN vs. DRAIN CURRENT NE3503M04 PACKAGE DIMENSIONS 1. 2. 3. 4. Source Drain Source Gate 2.0±0.1 1.25 2 1 1.30 0.65 0.11+0.1 -0.05 0.30+0.1 -0.05 4 1 0.30 1.30 0.65 0.60 0.65 +0.1 -0.05 0.59±0.05 1.25 2.0±0.1 V75 PIN CONNECTIONS 3 (1.05) 4 1.25±0.1 0.30+0.1 -0.05 (Bottom View) 3 2.05±0.1 2 0.40+0.1 -0.05 FLAT-LEAD 4-PIN THIN-TYPE SUPER MINIMOLD (M04) (UNIT:mm) NE3503M04 MOUNTING PAD DIMENSIONS FLAT-LEAD 4-PIN THIN-TYPE SUPER MINIMOLD (M04) PACKAGE (UNIT:mm) Reference 1 0.8 9 0. 1. 0 1 0.74 4 0 1. 1. 0 2 3 φ 0.3 TH Reference 2 3 4 0.5 1 1.3 1.25 0.6 2 1.6 0.6 NE3503M04 RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Soldering Conditions Condition Symbol Infrared Reflow Peak temperature (package surface temperature) Time at peak temperature Time at temperature of 220°C or higher Preheating time at 120 to 180°C Maximum number of reflow processes Maximum chlorine content of rosin flux (% mass) : 260°C or below : 10 seconds or less : 60 seconds or less : 120±30 seconds : 3 times : 0.2%(Wt.) or below IR260 Partial Heating Peak temperature (pin temperature) Soldering time (per side of device) Maximum chlorine content of rosin flux (% mass) : 350°C or below : 3 seconds or less : 0.2%(Wt.) or below HS350 Caution Do not use different soldering methods together (except for partial heating). Life Support Applications These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and agree to fully indemnify CEL for all damages resulting from such improper use or sale. 03/04/2005 A Business Partner of NEC Compound Semiconductor Devices, Ltd. 4590 Patrick Henry Drive Santa Clara, CA 95054-1817 Telephone: (408) 919-2500 Facsimile: (408) 988-0279 Subject: Compliance with EU Directives CEL certifies, to its knowledge, that semiconductor and laser products detailed below are compliant with the requirements of European Union (EU) Directive 2002/95/EC Restriction on Use of Hazardous Substances in electrical and electronic equipment (RoHS) and the requirements of EU Directive 2003/11/EC Restriction on Penta and Octa BDE. CEL Pb-free products have the same base part number with a suffix added. The suffix –A indicates that the device is Pb-free. The –AZ suffix is used to designate devices containing Pb which are exempted from the requirement of RoHS directive (*). In all cases the devices have Pb-free terminals. All devices with these suffixes meet the requirements of the RoHS directive. This status is based on CEL’s understanding of the EU Directives and knowledge of the materials that go into its products as of the date of disclosure of this information. Restricted Substance per RoHS Concentration Limit per RoHS (values are not yet fixed) Concentration contained in CEL devices -A Not Detected Lead (Pb) < 1000 PPM Mercury < 1000 PPM Not Detected Cadmium < 100 PPM Not Detected Hexavalent Chromium < 1000 PPM Not Detected PBB < 1000 PPM Not Detected PBDE < 1000 PPM Not Detected -AZ (*) If you should have any additional questions regarding our devices and compliance to environmental standards, please do not hesitate to contact your local representative. 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