Data Sheet
PS2501A-1, PS2501AL-1
R08DS0209EJ0100
Rev.1.00
Dec 25, 2020
HIGH ISOLATION VOLTAGE SINGLE TRANSISTOR TYPE
DESCRIPTION
The PS2501A-1 and PS2501AL-1 are optically coupled isolators containing a GaAs light emitting diode and
an NPN silicon phototransistor to realize an excellent cost performance.
The PS2501A-1 is in a plastic DIP (Dual In-line Package) and the PS2501AL-1 is lead bending type (Gullwing) for surface mount.
FEATURES
High isolation voltage (BV = 5 000 Vr.m.s.)
Ordering number of taping product: PS2501AL-1-F3 : 2 000 pcs/reel
Pb-Free product
Safety standards
UL approved: UL1577, Double protection
PIN CONNECTION
(Top View)
4
3
1. Anode
2. Cathode
3. Emitter
4. Collector
1
2
APPLICATIONS
Power supply
Telephone/FAX.
FA/OA equipment
Programmable logic controller
R08DS0209EJ0100 Rev.1.00
Dec 25, 2020
Page 1 of 12
PS2501A-1, PS2501AL-1
PACKAGE DIMENSIONS (UNIT: mm)
DIP Type
PS2501A-1
4.6±0.35
3
1
2
7.62
3.5±0.3
3.2±0.4 4.15±0.4
6.5±0.5
4
0 to 15°
0.25
1.25±0.15
+0.1
–0.05
0.50±0.10
0.25 M
2.54
Lead Bending Type For Surface Mount
PS2501AL-1
4.6±0.35
3
1
2
1.25±0.15
+0.1
0.1 –0.05
+0.1
0.25 –0.05
3.5±0.3
6.5±0.5
4
0.9±0.25
9.60±0.4
0.25 M
2.54
0.15
Weight (4-pin DIP)：0.26 g (typ.)
PHOTOCOUPLER CONSTRUCTION
Parameter
PS2501A-1, PS2501AL-1
Air Distance (MIN.)
7 mm
Creepage Distance (MIN.)
7 mm
Isolation Distance (MIN.)
R08DS0209EJ0100 Rev.1.00
Dec 25, 2020
0.3 mm
Page 2 of 12
PS2501A-1, PS2501AL-1
MARKING EXAMPLE
No. 1 pin
Mark
R
2501A
NJ031
Company Initial
Type Number
Assembly Lot
Assembly Lot
N
J
0
31
Week Assembled
Year Assembled
(Last 1 Digit)
In-house Code
CTR Rank Code
Pb-Free
Made in Japan
Made in Taiwan
J
K
ORDERING INFORMATION
Order Number *1
Part Number
Solder Plating
Packing Style
Specification
PS2501A-1
PS2501A-1-A
PS2501AL-1
PS2501AL-1-A
PS2501AL-1-F3
PS2501AL-1-F3-A
Pb-Free
Magazine case 100 pcs
Safety Standard
Application Part
Approval
Number *2
Standard products
PS2501A-1
(UL Approved)
PS2501AL-1
Embossed Tape 2 000 pcs/reel
PS2501AL-1
Notes: *1. When specifying CTR rank, please add “/CTR rank” after Order Number.
ex. L rank : PS2501A-1-A/L
Notes: *2. For the application of the Safety Standard, following part number should be used.
R08DS0209EJ0100 Rev.1.00
Dec 25, 2020
Page 3 of 12
PS2501A-1, PS2501AL-1
ABSOLUTE MAXIMUM RATINGS (TA = 25 C, unless otherwise specified)
Parameter
Symbol
Ratings
Unit
Reverse Voltage
VR
6
V
Forward Current (DC)
IF
30
mA
PD/C
1.5
mW/C
PD
150
mW
IFP
0.5
A
Collector to Emitter Voltage
VCEO
70
V
Emitter to Collector Voltage
VECO
5
V
IC
30
mA
PC/C
1.5
mW/C
PC
150
mW
Isolation Voltage*2
BV
5 000
Vr.m.s.
Operating Ambient Temperature
TA
55 to +100
C
Storage Temperature
Tstg
55 to +150
C
Diode
Power Dissipation Derating
Power Dissipation
Peak Forward Current
Transistor
*1
Collector Current
Power Dissipation Delay
Power Dissipation
Note:
*1. PW = 100 s, Duty Cycle = 1 %
*2. AC voltage for 1 minute at TA = 25 C, RH = 60 % between input and output.
Pins 1-2 shorted together, 3-4 shorted together.
R08DS0209EJ0100 Rev.1.00
Dec 25, 2020
Page 4 of 12
PS2501A-1, PS2501AL-1
ELECTRICAL CHARACTERISTICS (TA = 25 C)
Parameter
Diode
Symbol
Conditions
Forward Voltage
VF
IF = 10 mA
Reverse Current
IR
VR = 5 V
Terminal Capacitance
Ct
V = 0 V, f = 1.0 MHz
Transistor
Collector to Emitter
Dark Current
ICEO
VCE = 70 V, IF = 0 mA
Coupled
Current Transfer Ratio
(IC/IF) *1
CTR
IF = 5 mA, VCE = 5 V
Collector Saturation
Voltage
VCE (sat)
IF = 10 mA, IC = 2 mA
Isolation Resistance
RI-O
VI-O = 1.0 kVDC
Isolation Capacitance
CI-O
V = 0 V, f = 1.0 MHz
Rise Time*2
Fall
tr
Time*2
MIN.
TYP.
MAX.
Unit
1.2
1.4
V
5
A
10
pF
50
0.13
100
nA
400
%
0.3
V
1011
VCC = 10 V, IC = 2 mA, RL = 100
tf
0.4
pF
3
s
5
Note：*1. CTR rank
N： 50 to 400 (%)
H： 80 to 160 (%)
W：130 to 260 (%)
Q：100 to 200 (%)
L：200 to 400 (%)
*2. Test Circuit for Switching Time
Pulse Input
IF
VCC
PW = 100 μ s
Duty Cycle = 1/10
Input
ton
50 Ω
VOUT
R L = 100 Ω
td
toff
ts
90 %
Output
10 %
tr
R08DS0209EJ0100 Rev.1.00
Dec 25, 2020
tf
Page 5 of 12
PS2501A-1, PS2501AL-1
TYPICAL CHARACTERISTICS (TA = 25 C, unless otherwise specified)
TRANSISTOR POWER DISSIPATION
vs. AMBIENT TEMPERATURE
DIODE POWER DISSIPATION vs.
AMBIENT TEMPERATURE
200
1.5 mW/°C
Transistor Power Dissipation PC (mW)
Diode Power Dissipation PD (mW)
200
150
100
50
0
25
50
75
100
1.5 mW/°C
150
100
50
0
125
Ambient Temperature TA (°C)
75
T A = +100 °C
+60 °C
+25 °C
Collector Current I C (mA)
IF = 10 mA
5
0 °C
–25 °C
–55 °C
1
0.5
20
15
IF = 5 mA
10
5
IF = 2 mA
IF = 1 mA
0.1
0.8
0.9
1.0
1.1
1.2
1.3
1.4
0
1.5
2
4
6
8
10
Collector to Emitter Voltage V CE (V)
Forward Voltage V F (V)
COLLECTOR TO EMITTER DARK
CURRENT vs. AMBIENT TEMPERATURE
COLLECTOR CURRENT vs.
COLLECTOR SATURATION VOLTAGE
10
10 000
IF = 10 mA
IF = 5 mA
Collector Current I C (mA)
Collector to Emitter Dark Current I CEO (nA)
125
25
10
0.05
0.7
100
COLLECTOR CURRENT vs.
COLLECTOR TO EMITTER VOLTAGE
100
Forward Current I F (mA)
50
Ambient Temperature TA (°C)
FORWARD CURRENT vs.
FORWARD VOLTAGE
50
25
1 000
VCE = 70 V
100
VCE = 24 V
10
1
0
25
50
75
100
Ambient Temperature TA (°C)
IF = 2 mA
1
0.1
0
IF = 1 mA
0.2
0.4
0.6
0. 8
1.0
Collector Saturation Voltage V CE (sat) (V)
Remark The graphs indicate nominal characteristics.
R08DS0209EJ0100 Rev.1.00
Dec 25, 2020
Page 6 of 12
PS2501A-1, PS2501AL-1
NORMALIZED CURRENT TRANSFER
RATIO vs. AMBIENT TEMPERATURE
CURRENT TRANSFER RATIO vs.
FORWARD CURRENT
300
1.2
Current Transfer Ratio CTR (%)
Normalized Current Transfer Ratio CTR
1.4
1.0
0.8
0.6
Normalized to 1.0
at TA = 25 °C,
IF = 5 mA, VCE = 5 V
CTR:130 %
0.4
0.2
250
200
Sample A
B
C
150
100
50
CTR:270 %
0
–50
–25
0
25
50
75
0
0.01
100
Ambient Temperature TA (°C)
100
0.1
1
10
100
Forward Current I F (mA)
SWITCHING TIME vs.
LOAD RESISTANCE
SWITCHING TIME vs.
LOAD RESISTANCE
1 000
IC = 2 mA, VCC = 10 V,
CTR = 216 %
IF = 5 mA, VCC = 5 V,
CTR = 216 %
tf
tr
Switching Time t ( μ s)
Switching Time t ( μ s)
VCE = 5 V,
n=3
10
td
ts
1
tf
100
ts
10
tr
0.1
10
100
1 000
10 000
Load Resistance R L (Ω)
1
1
td
10
100
Load Resistance R L (kΩ)
FREQUENCY RESPONSE
5
Normalized Gain GV
0
–5
100 Ω
–10
300 Ω
–15
–20
RL = 1 kΩ
IF = 5 mA,
VCE = 5 V
–25
0.1
1
10
100
1 000
Frequency f (kHz)
Remark The graphs indicate nominal characteristics.
R08DS0209EJ0100 Rev.1.00
Dec 25, 2020
Page 7 of 12
PS2501A-1, PS2501AL-1
TAPING SPECIFICATIONS (UNIT: mm)
Taping Direction
PS2561DL-1-F3
PS2501AL-1-F3
Direction of feed
1.55±0.1
4.5 MAX.
10.3±0.1
+0.1
–0
7.5±0.1
1.5
16.0±0.3
2.0±0.1
4.0±0.1
1.75±0.1
Outline and Dimensions ( Tape)
4.0±0.1
5.3±0.1
8.0±0.1
0.4
Outline and Dimensions (Reel)
R 1.0
100±1.0
2.0±0.5
13.0±0.2
330±2.0
2.0±0.5
21.0±0.8
17.5±1.0
21.5±1.0
Packing: 2 000 pcs/reel
R08DS0209EJ0100 Rev.1.00
Dec 25, 2020
Page 8 of 12
PS2501A-1, PS2501AL-1
RECOMMENDED MOUNT PAD DIMENSIONS (UNIT: mm)
B
C
D
A
Part Number
PS2501AL
Lead Bending
Lead Bending Type For Surface Mount
A
B
C
D
8.2
2.54
1.7
2.2
Remark All dimensions in this figure must be evaluated before use.
R08DS0209EJ0100 Rev.1.00
Dec 25, 2020
Page 9 of 12
PS2501A-1, PS2501AL-1
NOTES ON HANDLING
1. Recommended soldering conditions
(1) Infrared reflow soldering
• Peak reflow temperature
260 C or below (package surface temperature)
• Time of peak reflow temperature
10 seconds or less
• Time of temperature higher than 220C
60 seconds or less
• Time to preheat temperature from 120 to 180C 120 30 s
• Number of reflows
Three
• Flux
Rosin flux containing small amount of chlorine
(The flux with a maximum chlorine content of
0.2 Wt% is recommended.)
Package Surface Temperature T (°C)
Recommended Temperature Profile of Infrared Reflow
(heating)
to 10 s
260 °C MAX.
220 °C
to 60 s
180 °C
120 °C
120 ± 30 s
(preheating)
Time (s)
(2) Wave soldering
• Temperature
• Time
• Preheating conditions
• Number of times
• Flux
260 C or below (molten solder temperature)
10 seconds or less
120 C or below (package surface temperature)
One (Allowed to be dipped in solder including plastic mold portion.)
Rosin flux containing small amount of chlorine (The flux with a maximum
chlorine content of 0.2 Wt% is recommended.)
(3) Soldering by Soldering Iron
• Peak Temperature (lead part temperature) 350 C or below
• Time (each pins)
3 seconds or less
• Flux
Rosin flux containing small amount of chlorine
(The flux with a maximum chlorine content of 0.2 Wt% is recommended.)
(a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead
(b) Please be sure that the temperature of the package would not be heated over 100 C
(4) Cautions
• Flux Cleaning
Avoid cleaning with Freon based or halogen-based (chlorinated etc.) solvents.
• Do not use fixing agents or coatings containing halogen-based substances.
R08DS0209EJ0100 Rev.1.00
Dec 25, 2020
Page 10 of 12
PS2501A-1, PS2501AL-1
2. Cautions regarding noise
Be aware that when voltage is applied suddenly between the photocoupler’s input and output or between
collector-emitters at startup, the output transistor may enter the on state, even if the voltage is within the
absolute maximum ratings.
3. Measurement conditions of current transfer ratios (CTR), which differ according to photocoupler
Check the setting values before use, since the forward current conditions at CTR measurement differ
according to product.
When using products other than at the specified forward current, the characteristics curves may differ
from the standard curves due to CTR value variations or the like. This tendency may sometimes be
obvious, especially below IF = 1 mA.
Therefore, check the characteristics under the actual operating conditions and thoroughly take variations
or the like into consideration before use.
USAGE CAUTIONS
1.
2.
3.
4.
Protect against static electricity when handling.
Avoid storage at a high temperature and high humidity.
Avoid cleaning with Freon based or halogen-based (chlorinated etc.) solvents.
Do not use fixing agents or coatings containing halogen-based substances.
R08DS0209EJ0100 Rev.1.00
Dec 25, 2020
Page 11 of 12
PS2501A-1, PS2501AL-1
Caution
GaAs Products
This product uses gallium arsenide (GaAs).
GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe
the following points.
• Follow related laws and ordinances when disposing of the product. If there are no applicable laws
and/or ordinances, dispose of the product as recommended below.
1. Commission a disposal company able to (with a license to) collect, transport and dispose of
materials that contain arsenic and other such industrial waste materials.
2. Exclude the product from general industrial waste and household garbage, and ensure that the
product is controlled (as industrial waste subject to special control) up until final disposal.
• Do not burn, destroy, cut, crush, or chemically dissolve the product.
• Do not lick the product or i any way allow it to enter the mouth.
All trademarks and registered trademarks are the property of their respective owners.
R08DS0209EJ0100 Rev.1.00
Dec 25, 2020
Page 12 of 12
Notice
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