Data Sheet
PS2565-1, PS2565L-1, PS2565L1-1, PS2565L2-1
HIGH ISOLATION VOLTAGE AC INPUT RESPONSE TYPE
R08DS0201EJ0100
Rev.1.00
Dec 25, 2020
DESCRIPTION
The PS2565-1 is optically coupled isolators containing GaAs light emitting diodes and an NPN silicon
phototransistor.
The PS2565-1 is in a plastic DIP (Dual In-line Package) and the PS2565L-1 is lead bending type (Gull-wing)
for surface mount.
The PS2565L1-1 is wide lead bending type.
The PS2565L2-1 is wide lead bending type for surface mount.
FEATURES
AC input response
High isolation voltage (BV = 5 000 Vr.m.s.)
High collector to emitter voltage (VCEO = 80 V)
High current transfer ratio (CTR = 200 % TYP.)
High-speed switching (tr = 3 μs TYP., tf = 5 μs TYP.)
Ordering number of taping product: PS2565L-1-F3 : 2 000 pcs/reel
: PS2565L2-1-F3 : 2 000 pcs/reel
Pb-Free product
Safety standards
UL approved: UL1577, Double protection
CSA approved: CAN/CSA-C22.2 No. 62368-1, Reinforced insulation
BSI approved: BS EN 62368-1, Reinforced insulation
SEMKO approved: EN 62368-1, IEC 62368-1, Reinforced insulation
NEMKO approved: EN 62368-1, Reinforced insulation
FIMKO approved: EN 62368-1, Reinforced insulation
DEMKO approved: EN 62368-1, Reinforced insulation
VDE approved: DIN EN 60747-5-5 (Option)
PIN CONNECTION
(Top View)
4
3
1
2
1. Anode,
Cathode
2. Cathode,
Anode
3. Emitter
4. Collector
APPLICATIONS
Telephone/FAX.
FA/OA equipment
Programmable logic controller
R08DS0201EJ0100 Rev.1.00
Dec 25, 2020
Page 1 of 16
PS2565-1, PS2565L-1 PS2565L1-1 PS2565L2-1
PACKAGE DIMENSIONS (UNIT: mm)
DIP Type
Wide Lead Bending Type
PS2565L1-1
PS2565-1
4.6±0.35
4.6±0.35
1 2
3
1
2
3.85
±0.4
1.25±0.15
0.50±0.1
0.25 M
3.15
±0.35
0 to 15°
0.25
10.16
3.5±0.3
7.62
3.5±0.3
3.2±0.4 4.15±0.4
4
6.5±0.5
6.5±0.5
4 3
+0.1
–0.05
1.25±0.15
0.50±0.10
0.25 M
+0.1
0.25–0.05
2.54
0 to 15°
2.54
Lead Bending Type For Surface Mount
Wide Lead Bending Type For Surface Mount
PS2565L-1
PS2565L2-1
4.6±0.35
4.6±0.35
3
1
2
4
3
1
2
0.25 M
2.54
0.25
1.25±0.15
0.25 M
0.9±0.25
9.60±0.4
1.25±0.15
2.54
+0.1
0.25–0.05
0.25±0.2
3.5±0.3
+0.1
0.1 –0.05
3.5±0.3
+0.1
0.25 –0.05
6.5±0.5
6.5±0.5
4
0.9±0.25
10.16
+0.2
11.8–0.5
0.15
Weight ( 4-pin DIP)：0.26 g (typ.)
PHOTOCOUPLER CONSTRUCTION
Parameter
Unit (mm)
Air Distance (MIN.)
7
Creepage Distance (MIN.)
7
Isolation Distance (MIN.)
R08DS0201EJ0100 Rev.1.00
Dec 25, 2020
0.4
Page 2 of 16
PS2565-1, PS2565L-1 PS2565L1-1 PS2565L2-1
MARKING EXAMPLE
No. 1 pin
Mark
N
R
Company Initial
2565
NJ931
Type Number
Assembly Lot
J
9
31
Week Assembled
Year Assembled
(Last 1 Digit)
In-house Code
CTR Rank Code
Made in Japan
Made in Taiwan
Pb-Free
J
K
Pb-Free and
R
Y
Halogen Free *1
*1 Special version
R08DS0201EJ0100 Rev.1.00
Dec 25, 2020
Page 3 of 16
PS2565-1, PS2565L-1 PS2565L1-1 PS2565L2-1
ORDERING INFORMATION
Part Number
Order Number
Solder Plating
Packing Style
Specification
Pb-Free
Magazine case 100 pcs
Safety Standard
Application Part
Approval
Number *1
Standard products
(UL, CSA, BSI,
SEMKO, NEMKO,
DEMKO, FIMKO
approved)
PS2565-1
PS2565-1-A
PS2565L-1
PS2565L-1-A
PS2565L1-1
PS2565L1-1-A
PS2565L2-1
PS2565L2-1-A
PS2565L-1-F3
PS2565L-1-F3-A
Embossed Tape 2 000 pcs/reel
PS2565L-1
PS2565L2-1-F3
PS2565L2-1-F3-A
Embossed Tape 2 000 pcs/reel
PS2565L2-1
PS2565-1-V
PS2565-1-V-A
Magazine case 100 pcs
UL, CSA, BSI,
SEMKO, NEMKO,
PS2565-1
PS2565L-1
PS2565L1-1
PS2565L2-1
PS2565-1
PS2565L-1-V
PS2565L-1-V-A
PS2565L1-1-V
PS2565L1-1-V-A
DIN EN 60747-5-5
PS2565L1-1
PS2565L2-1-V
PS2565L2-1-V-A
approved
PS2565L2-1
PS2565L-1-V-F3
PS2565L-1-V-F3-A
Embossed Tape 2 000 pcs/reel
PS2565L-1
PS2565L2-1-V-F3
PS2565L2-1-V-F3-A
Embossed Tape 2 000 pcs/reel
PS2565L2-1
PS2565-1
PS2565-1Y-A
Special version
PS2565L-1
PS2565L-1Y-A
(Pb-Free and
PS2565L1-1
PS2565L1-1Y-A
Halogen Free)
PS2565L2-1
PS2565L2-1Y-A
PS2565L-1-F3
PS2565L-1Y-F3-A
Embossed Tape 2 000 pcs/reel
PS2565L2-1-F3
PS2565L2-1Y-F3-A
Embossed Tape 2 000 pcs/reel
PS2565-1-V
PS2565-1Y-V-A
FIMKO, DEMKO,
Magazine case 100 pcs
Magazine case 100 pcs
Standard products
(UL, CSA, BSI,
SEMKO, NEMKO,
DEMKO, FIMKO
approved)
PS2565L-1
PS2565-1
PS2565L-1
PS2565L1-1
PS2565L2-1
PS2565L-1
PS2565L2-1
UL, CSA, BSI,
SEMKO, NEMKO,
PS2565-1
PS2565L-1-V
PS2565L-1Y-V-A
PS2565L1-1-V
PS2565L1-1Y-V-A
DIN EN 60747-5-5
PS2565L1-1
PS2565L2-1-V
PS2565L2-1Y-V-A
approved
PS2565L2-1
PS2565L-1-V-F3
PS2565L-1Y-V-F3-A
Embossed Tape 2 000 pcs/reel
PS2565L-1
PS2565L2-1-V-F3
PS2565L2-1Y-V-F3-A
Embossed Tape 2 000 pcs/reel
PS2565L2-1
FIMKO, DEMKO,
PS2565L-1
Notes: *1. For the application of the Safety Standard, following part number should be used.
R08DS0201EJ0100 Rev.1.00
Dec 25, 2020
Page 4 of 16
PS2565-1, PS2565L-1 PS2565L1-1 PS2565L2-1
ABSOLUTE MAXIMUM RATINGS (TA = 25 C, unless otherwise specified)
Parameter
Symbol
Ratings
Unit
IF
80
mA
PD/C
1.5
mW/C
Power Dissipation
PD
150
mW
Peak Forward Current*1
IFP
1
A
Collector to Emitter Voltage
VCEO
80
V
Emitter to Collector Voltage
VECO
7
V
IC
50
mA
PC/C
1.5
mW/C
PC
150
mW
BV
5 000
Vr.m.s.
Operating Ambient Temperature
TA
–55 to +100
C
Storage Temperature
Tstg
–55 to +150
C
Forward Current (DC)
Diode
Power Dissipation Derating
Transistor
Collector Current
Power Dissipation Derating
Power Dissipation
Isolation
Note:
Voltage*2
*1. PW = 100 s, Duty Cycle = 1 %
*2. AC voltage for 1 minute at TA = 25 C, RH = 60 % between input and output.
Pins 1-2 shorted together, 3-4 shorted together.
R08DS0201EJ0100 Rev.1.00
Dec 25, 2020
Page 5 of 16
PS2565-1, PS2565L-1 PS2565L1-1 PS2565L2-1
ELECTRICAL CHARACTERISTICS (TA = 25 C)
Parameter
Diode
Symbol
Conditions
MIN.
TYP.
MAX.
Unit
1.4
V
Forward Voltage
VF
IF = ±10 mA
1.17
Terminal Capacitance
Ct
V = 0 V, f = 1.0 MHz
100
Transistor
Collector to Emitter
Dark Current
ICEO
VCE = 80 V, IF = 0 mA
Coupled
Current Transfer Ratio
(IC/IF)
CTR
IF = ±5 mA, VCE = 5 V
80
CTR1/
IF = 5 mA, VCE = 5 V
0.3
CTR Ratio*1
pF
100
nA
200
400
%
1.0
3.0
CTR2
Collector Saturation
Voltage
VCE (sat)
Isolation Resistance
RI-O
VI-O = 1.0 kVDC
Isolation Capacitance
CI-O
V = 0 V, f = 1.0 MHz
Rise Time*2
Fall
0.3
tf
V
1011
VCC = 10 V, IC = 2 mA, RL = 100
tr
Time*2
IF = ±10 mA, IC = 2 mA
0.5
pF
3
s
5
Note: *1. CTR1 = IC1/IF1, CTR2 = IC2/IF2
IC1
IF1
VCE
IC2
IF2
*2. Test Circuit for Switching Time
Pulse Input
IF
VCC
PW = 100 μs
Duty Cycle = 1/10
Input
ton
VOUT
50 Ω
td
toff
ts
RL = 100 Ω
90 %
Output
10 %
tr
R08DS0201EJ0100 Rev.1.00
Dec 25, 2020
tf
Page 6 of 16
PS2565-1, PS2565L-1 PS2565L1-1 PS2565L2-1
TYPICAL CHARACTERISTICS (TA = 25 C, unless otherwise specified)
DIODE POWER DISSIPATION vs.
AMBIENT TEMPERATURE
TRANSISTOR POWER DISSIPATION
vs. AMBIENT TEMPERATURE
150
Transistor Power Dissipation PC (mW)
Diode Power Dissipation PD (mW)
150
100
1.5 mW/°C
50
0
25
50
75
100
125
150
100
1.5 mW/°C
50
0
25
100
150
80
50
60
TA = +100 °C
+60 °C
+25 °C
Forward Current I F (mA)
Forward Current I F (mA)
125
FORWARD CURRENT vs.
FORWARD VOLTAGE
FORWARD CURRENT vs.
FORWARD VOLTAGE
10
5
0 °C
–25 °C
–55 °C
1
0.5
40
20
0
–20
–40
–60
0.1
0.8
0.9
1.0
1.1
1.2
1.3
1.4
–80
1.5
–1.5
–1.0
Forward Voltage V F (V)
–0.5
0
0.5
1.0
COLLECTOR CURRENT vs.
COLLECTOR SATURATION VOLTAGE
40
10 000
Collector Current I C (mA)
VCE = 80 V
40 V
24 V
10 V
5V
1 000
100
10
1
– 50
–25
0
25
50
1.5
Forward Voltage V F (V)
COLLECTOR TO EMITTER DARK
CURRENT vs. AMBIENT TEMPERATURE
Collector to Emitter Dark Current I CEO (nA)
100
Ambient Temperature TA (°C)
Ambient Temperature TA (°C)
0.7
75
50
75
100
Ambient Temperature TA (°C)
50 mA
20 mA
10 mA
10
5 mA
5
2 mA
IF = 1 mA
1
0.5
0.1
0
0.2
0.4
0.6
0.8
1.0
Collector Saturation Voltage V CE (sat) (V)
Remark The graphs indicate nominal characteristics.
R08DS0201EJ0100 Rev.1.00
Dec 25, 2020
Page 7 of 16
PS2565-1, PS2565L-1 PS2565L1-1 PS2565L2-1
NORMALIZED CURRENT TRANSFER
RATIO vs. AMBIENT TEMPERATURE
COLLECTOR CURRENT vs.
COLLECTOR TO EMITTER VOLTAGE
1.2
Normalized Current Transfer Ratio CTR
70
Collector Current I C (mA)
60
50
40
mA
50
mA
2 0 mA
10
30
20
IF = 5 mA
10
0
4
2
8
6
1.0
0.8
0.6
0.4
0
10
Normalized to 1.0
at TA = 25 °C,
IF = 5 mA, VCE = 5 V
0.2
–50
–25
1 000
350
Switching Time t ( μ s)
Current Transfer Ratio CTR (%)
VCE = 5 V
300
Sample A
B
C
250
200
50
150
100
100
tf
I F = 5 mA,
VCC = 5 V,
CTR = 290 %
ts
100
10
tr
50
0
75
SWITCHING TIME vs.
LOAD RESISTANCE
CURRENT TRANSFER RATIO vs.
FORWARD CURRENT
400
25
Ambient Temperature TA (°C)
Collector to Emitter Voltage V CE (V)
450
0
0.05 0.1
0.5
1
5
10
td
1
100
50
500 1 k
Forward Current I F (mA)
5 k 10 k
50 k 100 k
Load Resistance R L (Ω)
SWITCHING TIME vs.
LOAD RESISTANCE
FREQUENCY RESPONSE
10
I C = 2 mA,
VCC = 10 V,
CTR = 290 %
tf
tr
IF = 5 mA,
VCE = 5 V
0
Normalized Gain GV
Switching Time t (μ s)
50
td
ts
1
–5
–10
100 Ω
–15
RL = 1 kΩ
–20
0.1
10
300 Ω
50 100
500 1 k
5 k 10 k
Load Resistance R L (Ω)
0.5
1
2
5
10 20
50 100 200 500
Frequency f (kHz)
Remark The graphs indicate nominal characteristics.
R08DS0201EJ0100 Rev.1.00
Dec 25, 2020
Page 8 of 16
PS2565-1, PS2565L-1 PS2565L1-1 PS2565L2-1
TAPING SPECIFICATIONS (UNIT: mm)
Taping Direction
PS2561DL-1-F3
PS2565L-1-F3
Direction of feed
1.55±0.1
4.5 MAX.
10.3±0.1
+0.1
–0
7.5±0.1
1.5
16.0±0.3
2.0±0.1
4.0±0.1
1.75±0.1
Outline and Dimensions ( Tape)
4.0±0.1
5.3±0.1
8.0±0.1
0.4
Outline and Dimensions (Reel)
R 1.0
100±1.0
2.0±0.5
13.0±0.2
330±2.0
2.0±0.5
21.0±0.8
17.5±1.0
21.5±1.0
Packing: 2 000 pcs/reel
R08DS0201EJ0100 Rev.1.00
Dec 25, 2020
Page 9 of 16
PS2565-1, PS2565L-1 PS2565L1-1 PS2565L2-1
TAPING SPECIFICATIONS (UNIT: mm)
Taping Direction
PS2565L2-1-F3
Direction of feed
2.05±0.1
5.3
4.6 max.
12.5
11.5±0.1
f 1.5+0.1
–0
24.0±0.3
2.0±0.1
4.0±0.1
1.75±0.1
Outline and Dimensions (Tape)
0.4
8.0±0.1
Outline and Dimensions (Reel)
2.0±0.5
f 21.0±0.8
f 100±1.0
R 1.0
f 330±2.0
f 13.0±0.2
25.5±1.0
29.5±1.0
Packing: 2 000 pcs/reel
R08DS0201EJ0100 Rev.1.00
Dec 25, 2020
Page 10 of 16
PS2565-1, PS2565L-1 PS2565L1-1 PS2565L2-1
RECOMMENDED MOUNT PAD DIMENSIONS (UNIT: mm)
B
C
D
A
Part Number
Lead Bending
A
B
C
D
PS2565L
Lead Bending Type For Surface Mount
8.2
2.54
1.7
2.2
PS2565L2
Wide Lead Bending Type For Surface Mount
10.2
2.54
1.7
2.2
Remark All dimensions in this figure must be evaluated before use.
R08DS0201EJ0100 Rev.1.00
Dec 25, 2020
Page 11 of 16
PS2565-1, PS2565L-1 PS2565L1-1 PS2565L2-1
NOTES ON HANDLING
1. Recommended soldering conditions
(1) Infrared reflow soldering
• Peak reflow temperature
260 C or below (package surface temperature)
• Time of peak reflow temperature
10 seconds or less
• Time of temperature higher than 220C
60 seconds or less
• Time to preheat temperature from 120 to 180C 120 30 s
• Number of reflows
Three
• Flux
Rosin flux containing small amount of chlorine
(The flux with a maximum chlorine content of
0.2 Wt% is recommended.)
Package Surface Temperature T (°C)
Recommended Temperature Profile of Infrared Reflow
(heating)
to 10 s
260 °C MAX.
220 °C
to 60 s
180 °C
120 °C
120 ± 30 s
(preheating)
Time (s)
(2) Wave soldering
• Temperature
• Time
• Preheating conditions
• Number of times
• Flux
260 C or below (molten solder temperature)
10 seconds or less
120 C or below (package surface temperature)
One (Allowed to be dipped in solder including plastic mold portion.)
Rosin flux containing small amount of chlorine (The flux with a maximum
chlorine content of 0.2 Wt% is recommended.)
(3) Soldering by Soldering Iron
• Peak Temperature (lead part temperature) 350 C or below
• Time (each pins)
3 seconds or less
• Flux
Rosin flux containing small amount of chlorine
(The flux with a maximum chlorine content of 0.2 Wt% is recommended.)
(a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead
(b) Please be sure that the temperature of the package would not be heated over 100 C
(4) Cautions
• Flux Cleaning
Avoid cleaning with Freon based or halogen-based (chlorinated etc.) solvents.
• Do not use fixing agents or coatings containing halogen-based substances.
R08DS0201EJ0100 Rev.1.00
Dec 25, 2020
Page 12 of 16
PS2565-1, PS2565L-1 PS2565L1-1 PS2565L2-1
2. Cautions regarding noise
Be aware that when voltage is applied suddenly between the photocoupler’s input and output or between
collector-emitters at startup, the output transistor may enter the on state, even if the voltage is within the
absolute maximum ratings.
3. Measurement conditions of current transfer ratios (CTR), which differ according to photocoupler
Check the setting values before use, since the forward current conditions at CTR measurement differ
according to product.
When using products other than at the specified forward current, the characteristics curves may differ
from the standard curves due to CTR value variations or the like. Therefore, check the characteristics
under the actual operating conditions and thoroughly take variations or the like into consideration before
use.
USAGE CAUTIONS
1.
2.
3.
4.
Protect against static electricity when handling.
Avoid storage at a high temperature and high humidity.
Avoid cleaning with Freon based or halogen-based (chlorinated etc.) solvents.
Do not use fixing agents or coatings containing halogen-based substances.
R08DS0201EJ0100 Rev.1.00
Dec 25, 2020
Page 13 of 16
PS2565-1, PS2565L-1 PS2565L1-1 PS2565L2-1
SPECIFICATION OF VDE MARKS LICENSE DOCUMENT
Parameter
Symbol
Climatic test class (IEC 60068-1/DIN EN 60068-1)
Rating
Unit
55/100/21
Dielectric strength
maximum operating isolation voltage
Test voltage (partial discharge test, procedure a for type test and
random test)
Upr = 1.6 UIORM, Pd 5 pC
Test voltage (partial discharge test, procedure b for all devices)
Upr = 1.875 UIORM, Pd 5 pC
Highest permissible overvoltage
UIORM
Upr
890
1 424
Vpeak
Vpeak
Upr
1 669
Vpeak
UIOTM
8 000
Vpeak
Degree of pollution (IEC 60664-1/DIN EN 60664-1 (VDE 0110-1)
Comparative tracking index (IEC 60112/DIN EN 60112 (VDE 0303-11))
2
CTI
Material group (IEC 60664-1/DIN EN 60664-1 (VDE 0110-1))
175
III a
Storage temperature range
Tstg
–55 to +150
C
Operating temperature range
TA
–55 to +100
C
Ris MIN.
Ris MIN.
1012
1011
Tsi
Isi
Psi
175
400
700
C
mA
mW
Ris MIN.
109
Isolation resistance, minimum value
VIO = 500 V dc at TA = 25C
VIO = 500 V dc at TA MAX. at least 100C
Safety maximum ratings (maximum permissible in case of fault, see
thermal derating curve)
Package temperature
Current (input current IF, Psi = 0)
Power (output or total power dissipation)
Isolation resistance
VIO = 500 V dc at TA = Tsi
Total Power Dissipation Psi (mW)
Input Current Isi (mA)
Dependence of maximum safety ratings with package temperature
1000
900
800
700
600
Psi: Total Power Dissipation
500
400
300
Isi: Input Current
200
100
0
0
25
50
75
100
125
150
175
200
Package temp Tsi (°C)
R08DS0201EJ0100 Rev.1.00
Dec 25, 2020
Page 14 of 16
PS2565-1, PS2565L-1 PS2565L1-1 PS2565L2-1
Method a) Destructive Test, Type and Sample Test
UIOTM = 8000 V
V
Upr = 1424 V
UIORM = 890 V
t3
t1
tini
t2
tm
t4
t
ttest
t1,t2 = 1 to 10 sec
t3,t4 = 1 sec
tm(PARTIAL DISCHARGE) = 10 sec
ttest = 12 sec
tini = 60 sec
Method b) Non-destructive Test, 100 % Production Test
Upr = 1669 V
V
UIORM = 890 V
ttest
t3
tm
t
t4
t3,t4 = 0.1 sec
tm(PARTIAL DISCHARGE) = 1.0 sec
ttest = 1.2 sec
R08DS0201EJ0100 Rev.1.00
Dec 25, 2020
Page 15 of 16
PS2565-1, PS2565L-1 PS2565L1-1 PS2565L2-1
Caution
GaAs Products
This product uses gallium arsenide (GaAs).
GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe
the following points.
• Follow related laws and ordinances when disposing of the product. If there are no applicable laws
and/or ordinances, dispose of the product as recommended below.
1. Commission a disposal company able to (with a license to) collect, transport and dispose of
materials that contain arsenic and other such industrial waste materials.
2. Exclude the product from general industrial waste and household garbage, and ensure that the
product is controlled (as industrial waste subject to special control) up until final disposal.
• Do not burn, destroy, cut, crush, or chemically dissolve the product.
• Do not lick the product or i any way allow it to enter the mouth.
All trademarks and registered trademarks are the property of their respective owners.
R08DS0201EJ0100 Rev.1.00
Dec 25, 2020
Page 16 of 16
Notice
1.
Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples. You are fully responsible for
the incorporation or any other use of the circuits, software, and information in the design of your product or system. Renesas Electronics disclaims any and all liability for any losses and damages incurred by
you or third parties arising from the use of these circuits, software, or information.
2.
Renesas Electronics hereby expressly disclaims any warranties against and liability for infringement or any other claims involving patents, copyrights, or other intellectual property rights of third parties, by or
arising from the use of Renesas Electronics products or technical information described in this document, including but not limited to, the product data, drawings, charts, programs, algorithms, and application
examples.
3.
No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of Renesas Electronics or others.
4.
You shall not alter, modify, copy, or reverse engineer any Renesas Electronics product, whether in whole or in part. Renesas Electronics disclaims any and all liability for any losses or damages incurred by
5.
Renesas Electronics products are classified according to the following two quality grades: “Standard” and “High Quality”. The intended applications for each Renesas Electronics product depends on the
you or third parties arising from such alteration, modification, copying or reverse engineering.
product’s quality grade, as indicated below.
"Standard":
Computers; office equipment; communications equipment; test and measurement equipment; audio and visual equipment; home electronic appliances; machine tools; personal electronic
equipment; industrial robots; etc.
"High Quality": Transportation equipment (automobiles, trains, ships, etc.); traffic control (traffic lights); large-scale communication equipment; key financial terminal systems; safety control equipment; etc.
Unless expressly designated as a high reliability product or a product for harsh environments in a Renesas Electronics data sheet or other Renesas Electronics document, Renesas Electronics products are
not intended or authorized for use in products or systems that may pose a direct threat to human life or bodily injury (artificial life support devices or systems; surgical implantations; etc.), or may cause
serious property damage (space system; undersea repeaters; nuclear power control systems; aircraft control systems; key plant systems; military equipment; etc.). Renesas Electronics disclaims any and all
liability for any damages or losses incurred by you or any third parties arising from the use of any Renesas Electronics product that is inconsistent with any Renesas Electronics data sheet, user’s manual or
other Renesas Electronics document.
6.
When using Renesas Electronics products, refer to the latest product information (data sheets, user’s manuals, application notes, “General Notes for Handling and Using Semiconductor Devices” in the
reliability handbook, etc.), and ensure that usage conditions are within the ranges specified by Renesas Electronics with respect to maximum ratings, operating power supply voltage range, heat dissipation
characteristics, installation, etc. Renesas Electronics disclaims any and all liability for any malfunctions, failure or accident arising out of the use of Renesas Electronics products outside of such specified
ranges.
7.
Although Renesas Electronics endeavors to improve the quality and reliability of Renesas Electronics products, semiconductor products have specific characteristics, such as the occurrence of failure at a
certain rate and malfunctions under certain use conditions. Unless designated as a high reliability product or a product for harsh environments in a Renesas Electronics data sheet or other Renesas
Electronics document, Renesas Electronics products are not subject to radiation resistance design. You are responsible for implementing safety measures to guard against the possibility of bodily injury, injury
or damage caused by fire, and/or danger to the public in the event of a failure or malfunction of Renesas Electronics products, such as safety design for hardware and software, including but not limited to
redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because the evaluation of microcomputer software alone is very difficult
and impractical, you are responsible for evaluating the safety of the final products or systems manufactured by you.
8.
Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental compatibility of each Renesas Electronics product. You are responsible for carefully and
sufficiently investigating applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive, and using Renesas Electronics
products in compliance with all these applicable laws and regulations. Renesas Electronics disclaims any and all liability for damages or losses occurring as a result of your noncompliance with applicable
laws and regulations.
9.
Renesas Electronics products and technologies shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable domestic or foreign laws
or regulations. You shall comply with any applicable export control laws and regulations promulgated and administered by the governments of any countries asserting jurisdiction over the parties or
transactions.
10. It is the responsibility of the buyer or distributor of Renesas Electronics products, or any other party who distributes, disposes of, or otherwise sells or transfers the product to a third party, to notify such third
party in advance of the contents and conditions set forth in this document.
11. This document shall not be reprinted, reproduced or duplicated in any form, in whole or in part, without prior written consent of Renesas Electronics.
12. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas Electronics products.
(Note 1)
“Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its directly or indirectly controlled subsidiaries.
(Note 2)
“Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics.
(Rev.4.0-1 November 2017)
http://www.renesas.com
SALES OFFICES
Refer to "http://www.renesas.com/" for the latest and detailed information.
Renesas Electronics Corporation
TOYOSU FORESIA, 3-2-24 Toyosu, Koto-ku, Tokyo 135-0061, Japan
Renesas Electronics America Inc.
1001 Murphy Ranch Road, Milpitas, CA 95035, U.S.A.
Tel: +1-408-432-8888, Fax: +1-408-434-5351
Renesas Electronics Canada Limited
9251 Yonge Street, Suite 8309 Richmond Hill, Ontario Canada L4C 9T3
Tel: +1-905-237-2004
Renesas Electronics Europe GmbH
Arcadiastrasse 10, 40472 Düsseldorf, Germany
Tel: +49-211-6503-0, Fax: +49-211-6503-1327
Renesas Electronics (China) Co., Ltd.
Room 101-T01, Floor 1, Building 7, Yard No. 7, 8th Street, Shangdi, Haidian District, Beijing 100085, China
Tel: +86-10-8235-1155, Fax: +86-10-8235-7679
Renesas Electronics (Shanghai) Co., Ltd.
Unit 301, Tower A, Central Towers, 555 Langao Road, Putuo District, Shanghai 200333, China
Tel: +86-21-2226-0888, Fax: +86-21-2226-0999
Renesas Electronics Hong Kong Limited
Unit 1601-1611, 16/F., Tower 2, Grand Century Place, 193 Prince Edward Road West, Mongkok, Kowloon, Hong Kong
Tel: +852-2265-6688, Fax: +852 2886-9022
Renesas Electronics Taiwan Co., Ltd.
13F, No. 363, Fu Shing North Road, Taipei 10543, Taiwan
Tel: +886-2-8175-9600, Fax: +886 2-8175-9670
Renesas Electronics Singapore Pte. Ltd.
80 Bendemeer Road, Unit #06-02 Hyflux Innovation Centre, Singapore 339949
Tel: +65-6213-0200, Fax: +65-6213-0300
Renesas Electronics Malaysia Sdn.Bhd.
Unit No 3A-1 Level 3A Tower 8 UOA Business Park, No 1 Jalan Pengaturcara U1/51A, Seksyen U1, 40150 Shah Alam, Selangor, Malaysia
Tel: +60-3-5022-1288, Fax: +60-3-5022-1290
Renesas Electronics India Pvt. Ltd.
No.777C, 100 Feet Road, HAL 2nd Stage, Indiranagar, Bangalore 560 038, India
Tel: +91-80-67208700
Renesas Electronics Korea Co., Ltd.
17F, KAMCO Yangjae Tower, 262, Gangnam-daero, Gangnam-gu, Seoul, 06265 Korea
Tel: +82-2-558-3737, Fax: +82-2-558-5338
© 2019 Renesas Electronics Corporation. All rights reserved.
Colophon 8.0
工商网监
湘ICP备2023018690号
