HIGH CTR,
AC INPUT RESPONSE TYPE
4 PIN ULTRA SMALL PACKAGE
FLAT LEAD OPTOCOUPLER
PS2915-1
FEATURES
DESCRIPTION
• ULTRA SMALL FLAT-LEAD PACKAGE:
4.6 (L) x 2.5 (W) x 2.1 (H) mm
The PS2915-1 is an optically coupled isolator containing a
GaAs light emitting diode and an NPN silicon phototransistor
in one package for high density mounting applications. An ultra
small flat lead package has been provided which realizes a
reduction in mounting area of about 30% compared with the
PS28XX series.
• HIGH CURRENT TRANSFER RATIO:
CTR = 200% TYP @ IF = ±1 mA, VCE = 5 V
• HIGH ISOLATION VOLTAGE
BV: 2500 Vr.m.s.
• TAPE AND REEL AVAILABLE:
PS2915-F3, F4: 3500 pcs/reel
APPLICATIONS
• DC/DC CONVERTER
• MODEM/PC CARD
ELECTRICAL CHARACTERISTICS (TA = 25°C)
PART NUMBER
Coupled
Transistor Diode
SYMBOLS
PS2915-1
PARAMETERS
UNITS
MIN
TYP
MAX
0.9
1.1
1.3
VF
Forward Voltage, IF = ±1 mA
V
CT
Terminal Capacitance, V = 0, f = 1.0 MHz
pF
ICEO
Collector to Emitter Dark Current, IF = 0 mA, VCE = 40 V
nA
CTR
Current Transfer Ratio (IC/IF)1, IF = ±1 mA, VCE = 5 V
%
VCE(sat)
Collector Saturation Voltage, IF = ±1 mA, IC = 0.2 mA
V
30
100
100
200
400
0.13
0.3
11
RI-O
Isolation Resistance, VI-O = 1.0 kVDC
Ω
CI-O
Isolation Capacitance, V = 0 V, f = 1.0 MHz
pF
0.4
tr
Rise Time2, VCC = 5 V, IC = 2 mA, RL = 1 kΩ
µs
5
2
10
tf
Fall Time , VCC = 5 V, IC = 2 mA, RL = 1 kΩ
µs
10
ton
On Time, VCC = 5 V, IF = ±1 mA, RL = 5 kΩ
µs
40
ts
Storage Time2, VCC = 5 V, IF = ±1 mA, RL = 5 kΩ
µs
10
µs
120
toff
Off
Time2,
VCC = 5 V, IF = ±1 mA, RL = 5 kΩ
Notes:
1. CTR RANK:
N: 100 to 400 (%)
2. Test Circuit for Switching Time
PS2915-1
VCC
PULSE INPUT
4
3
1
2
PW = 100 µs
Duty Cycle = 1/10
In monitor
IF
50 Ω
VOUT
RL = 1 kΩ or 5 kΩ
California Eastern Laboratories
PS2915-1
mA
mW/°C
A
mW
±50
0.5
±0.5
60
Collector to Emitter Voltage
Emitter to Collector Voltage
Collector Current
Power Dissipation Derating
Power Dissipation
V
V
mA
mW/ûC
mW
40
5
40
1.2
120
Vr.m.s.
mW
°C
°C
2500
160
-55 to +100
-55 to +150
Notes:
1. Operation in excess of any one of these parameters may result
in permanent damage.
2. PW = 100 µs, Duty Cycle = 1%.
3. AC voltage for 1 minute at TA = 25 °C, RH = 60 % between input
and output.
CAUTIONS REGARDING NOISE:
Be aware that when voltage is applied suddenly between the
optocoupler's input and outout or between collector-emitters at
startup, the output side may enter the on state, even if the voltage
is within the absolute maximum ratings.
PARAMETER
UNITS (MIN)
Air Distance
4 mm
Creepage Distance
4 mm
Isolation Distance
0.4 mm
OUTLINE DIMENSIONS (Units in mm)
2.5±0.3
4
3
N
1
4.1 MIN
Forward Current
Forward Current Derating
Peak Forward Current2
Power Dissipation
Isolation Voltage3
Total Power Dissipation
Operating Ambient Temp.
Storage Temperature
OPTOCOUPLER CONSTRUCTION
RATINGS
2
5.0±0.2
+0.1
UNITS
0.15 -0.05
PARAMETERS
2.1 MAX
SYMBOLS
Diode
IF
∆IF/ûC
IF (Peak)
PD
Transistor
VCEO
VECO
IC
∆PC/ûC
PC
Coupled
BV
PT
TA
TSTG
4.6±0.2
ABSOLUTE MAXIMUM RATINGS1 (TA = 25°C)
0.4±0.1
0.2±0.1
1.27
ORDERING INFORMATION
TOP VIEW
PART NUMBER
PACKING STYLE
PS2915-1-F3
Embossed Tape 3500 pcs/reel
1. Anode, Cathode
2. Cathode, Anode
3. Emitter
4. Collector
PS2915-1-F4
RECOMMENDED MOUNT PAD
DIMENSIONS (Units in mm)
MARKING
(0.35)
1.27
0.8
0.6
15
–Last number of
Type No: 15
–An initial of "NEC"
N
No. 1 pin mark
(nicked corner)
5.7
4.7
4.14
111
1
–Assembly lot
11
Week assembled
Year assembled
( ): Reference value
24-R0.1
PS2915-1
TYPICAL CHARACTERISTICS (TA = 25°C, unless otherwise specified)
MAXIMUM FORWARD CURRENT
vs. AMBIENT TEMPERATURE
TRANSISTOR POWER DISSIPATION
vs. AMBIENT TEMPERATURE
140
Transistor Power Dissipation, PC (mW)
Maximum Forward Current, IF (mA)
80
60
40
0.5 mA/°C
20
120
100
80
60
40
20
0
25
0
50
75
25
50
75
100
125
100
Ambient Temperature, TA (°C)
Ambient Temperature, TA (°C)
COLLECTOR CURRENT vs.
COLLECTOR TO EMITTER VOLTAGE
FORWARD CURRENTvs.
FORWARD VOLTAGE
20
100
CTR = 200 %
Collector Current, IC (mA)
Forward Current, IF (mA)
18
TA = +100°C
+60°C
+25°C
10
0°C
-25°C
-50°C
1
0.1
IF = 5 mA
16
14
12
10
8
6
2 mA
4
1 mA
2
0.01
0.0
0.5
1.0
1.5
0.5 mA
0
2.0
2
Collector Current, IC (mA)
Collector to Emitter Dark Current, ICEO (nA)
10
10000
1000
VCE = 20 V
40 V
100
10
25
50
8
10
COLLECTOR CURRENT vs.
COLLECTOR SATURATION VOLTAGE
COLLECTOR TO EMITTER DARK CURRENT
vs. AMBIENT TEMPERATURE
0
6
Collector to Emitter Voltage, VCE (V)
Forward Voltage, VF (V)
1
-25
4
75
Ambient Temperature, TA (°C)
100
CTR = 200%
5 mA
2 mA
1 mA
1
IF = 0.5 mA
0.1
0.0
0.2
0.4
0.6
0.8
1.0
Collector Saturation Voltage, VCE(sat) (V)
PS2915-1
TYPICAL CHARACTERISTICS (TA = 25°C, unless otherwise specified)
CURRENT TRANSFER RATIO
vs. FORWARD CURRENT
500
1.4
VCE = 5 V,
n=3
Current Transfer Ratio, CTR (%)
Normalized Current Transfer Ratio, CTR
NORMALIZED CURRENT TRANSFER RATIO
vs. AMBIENT TEMPERATURE
1.2
1.0
0.8
0.6
0.4
Normalized to 1.0
at TA = 25°C,
IF = 1 mA, VCE = 5 V
0.2
0.0
-50
-25
0
25
50
75
400
Sample A
B
C
300
200
100
0
0.1
100
1
10
100
Forward Current, IF (mA)
Ambient Temperature, TA (°C)
SWITCHING TIME
vs. LOAD RESISTANCE
FREQUENCY RESPONSE
10000
0
toff
1000
100
Normalized Gain, GV
Switching Time, t (µs)
IF = 1 mA,
VCC = 5 V,
CTR = 200 %
ts
ton
10
-5
100 Ω
RL = 1 kΩ
-10
300 Ω
-15
-20
1
1k
10k
1000k
100k
LONG TERM CTR DEGRADATION
1.2
IF = 1 mA
TA = 25°C
CTR (relative Value)
0.8
60°C
0.6
0.4
0.2
0.0
10
10 2
10 3
10 4
1
10
100
Frequency, f (kHz)
Load Resistance, RL (Ω)
1.0
-25
0.1
10 5
Time (Hr)
Remark: The graphs indicate nominal characteristics.
10 6
1000
PS2915-1
TAPING SPECIFICATIONS (Units in mm)
+0.1
5.3 ± 0.1
1.55 -0
1.55 ± 0.05
2.9 MAX
12.0 ± 0.2
2.0 ± 0.5
4.0 ± 0.1
1.75 ± 0.1
Tape Outline and Dimensions
5.3 ± 0.1
2.4±0.1
2.9 ± 0.1
4.0 ± 0.1
Tape Direction
N
N
N
N
N
N
N
PS2915-1-F4
N
PS2915-1-F3
Reel Outline and Dimensions
2.0±0.5
2.0 ± 0.5
R1.0
φ100 ± 1.0
φ330±2.0
φ13.0 ± 0.2
φ21.0 ± 0.8
13.5±1.0
Packing: 3500 pcs/reel
11.9 to 15.4
Outer edge of
flange
PS2915-1
RECOMMENDED SOLDERING CONDITIONS
(1) Infrared reflow soldering
• Peak reflow temperature
260 ûC or below (package surface temperature)
• Time of peak reflow temperature
10 seconds or less
• Time of temperature higher than 220 ûC
60 seconds or less
• Time to preheat temperature from 120 to 180°C
120±30 s
• Number of reflows
Three
• Flux
Rosin flux containing small amount of chlorine (The flux
with a maximum chlorine content of 0.2 Wt % is
recommended).
Package Surface Temperature T (˚C)
Recommended Temperature Profile of Infrared Reflow
(heating)
to 10 s
260 ˚C (peak temperature)
220 ˚C
to 60 s
180 ˚C
120˚C
120±30 s
(preheating)
Time (s)
(2) Wave soldering
• Temperature
260 ûC or below (molten solder temperature)
• Time
10 seconds or less
• Preheating conditions
120°C or below (package surface temperature)
• Number of times
One (Allowed to be dipped in solder including plastic mold portion.)
• Flux
Rosin flux containing small amount of chlorine (The flux
with a maximum chlorine content of 0.2 Wt % is recommended).
(3) Cautions
• Fluxes
Avoid removing the residual flux with chlorine-based cleaning solvent after a reflow process.
USAGE CAUTIONS
1. Protect against static electricity when handling.
2. Avoid storage at a high temperature and high humidity.
Life Support Applications
These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably be expected
to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and agree to fully indemnify
CEL for all damages resulting from such improper use or sale.
EXCLUSIVE NORTH AMERICAN AGENT FOR NEC RF, MICROWAVE & OPTOELECTRONIC SEMICONDUCTORS
CALIFORNIA EASTERN LABORATORIES • Headquarters • 4590 Patrick Henry Drive • Santa Clara, CA 95054-1817 • (408) 988-3500 • Telex 34-6393 • FAX (408) 988-0279
Internet: http://WWW.CEL.COM
DATA SUBJECT TO CHANGE WITHOUT NOTICE
02/06/2002