PHOTOCOUPLER
PS2932-1,PS2933-1
HIGH COLLECTOR TO EMITTER VOLTAGE
4-PIN ULTRA SMALL FLAT-LEAD
PHOTOCOUPLER
−NEPOC Series−
DESCRIPTION
The PS2932-1, PS2933-1 are optically coupled isolator containing a GaAs light emitting diode and an NPN silicon
phototransistor in one package for high density mounting applications.
An ultra small flat-lead package has been provided which realizes a reduction in mounting area of about 30%
compared with the PS28xx series.
FEATURES
• Small and thin package (4.6 (L) × 2.5 (W) × 2.1 (H) mm)
• Isolation distance (0.4 mm MIN.)
• High collector to emitter voltage (VCEO = 300 V: PS2932-1)
(VCEO = 350 V: PS2933-1)
• High isolation voltage (BV = 2 500 Vr.m.s.)
• Ordering number of taping product: PS2932-1-F3, F4: 3 500 pcs/reel
PS2933-1-F3, F4: 3 500 pcs/reel
• Safety standards
• UL approved: File No. E72422
• BSI approved: No. 8657, 8658
• DIN EN60747-5-2 (VDE0884 Part2) approved (Option)
APPLICATIONS
• Hybrid IC
• Telephone, Exchange equipment, FAX
Document No. PN10050EJ02V0DS (2nd edition)
Date Published May 2006 NS CP(K)
The mark shows major revised points.
The revised points can be easily searched by copying an "" in the PDF file and specifying it in the "Find what:" field.
2000, 2006
PS2932-1,PS2933-1
PACKAGE DIMENSIONS (UNIT: mm)
TOP VIEW
2.5±0.3
3
4
4.6±0.2
N
2
5.0±0.2
0.15 +0.1
–0.05
2.1 MAX.
1
4.1 MIN.
4
0.4±0.1
0.2±0.1
1.27
MARKING EXAMPLE
Last number of
type No. : 32/33
*1
32
N
An initial of "NEC"
601
No. 1 pin
mark
(Nicked
corner)
Assembly lot
6 01
Week assembled
Year assembled
*1 Bar : Pb-Free
PHOTOCOUPLER CONSTRUCTION
Parameter
Unit (MIN.)
Air Distance
4 mm
Creepage Distance
4 mm
Isolation Distance
2
0.4 mm
Data Sheet PN10050EJ02V0DS
3
1. Anode
2. Cathode
3. Emitter
4. Collector
1
2
PS2932-1,PS2933-1
ORDERING INFORMATION
Part Number
Order Number
PS2932-1
PS2932-1-A
PS2932-1-F3
PS2932-1-F3-A
PS2932-1-F4
PS2932-1-F4-A
PS2932-1-V
Solder Plating
Safety Standard
Packing Style
Specification
Pb-Free
Approval
50 pcs (Tape 50 pcs cut)
Standard products
Embossed Tape 3 500 pcs/reel
(UL, BSI approved)
PS2932-1-V-A
50 pcs (Tape 50 pcs cut)
DIN EN60747-5-2
PS2932-1-V-F3
PS2932-1-V-F3-A
Embossed Tape 3 500 pcs/reel
(VDE0884 Part2)
PS2932-1-V-F4
PS2932-1-V-F4-A
PS2933-1
PS2933-1-A
50 pcs (Tape 50 pcs cut)
Standard products
PS2933-1-F3
PS2933-1-F3-A
Embossed Tape 3 500 pcs/reel
(UL, BSI approved)
PS2933-1-F4
PS2933-1-F4-A
PS2933-1-V
PS2933-1-V-A
50 pcs (Tape 50 pcs cut)
DIN EN60747-5-2
PS2933-1-V-F3
PS2933-1-V-F3-A
Embossed Tape 3 500 pcs/reel
(VDE0884 Part2)
PS2933-1-V-F4
PS2933-1-V-F4-A
Application
*1
Part Number
PS2932-1
Approved (Option)
PS2933-1
Approved (Option)
*1 For the application of the Safety Standard, following part number should be used.
ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified)
Parameter
Symbol
Ratings
PS2932-1
Diode
Forward Current
PS2933-1
IF
50
mA
∆IF/°C
0.5
mA/°C
IFP
0.5
A
Power Dissipation
PD
60
mW
Reverse Voltage
VR
6
V
Forward Current Derating
Peak Forward Current
Transistor
Unit
*1
Collector to Emitter Voltage
VCEO
Emitter to Collector Voltage
VECO
0.3
V
IC
60
mA
∆PC/°C
1.2
mW/°C
PC
120
mW
BV
2 500
Vr.m.s.
Total Power Dissipation
PT
160
mW
Operating Ambient Temperature
TA
−55 to +100
°C
Storage Temperature
Tstg
−55 to +150
°C
Collector Current
Power Dissipation Derating
Power Dissipation
Isolation Voltage
*2
300
350
V
*1 PW = 100 µs, Duty Cycle = 1%
*2 AC voltage for 1 minute at TA = 25°C, RH = 60% between input and output
Pins 1-2 shorted together, 3-4 shorted together.
Data Sheet PN10050EJ02V0DS
3
PS2932-1,PS2933-1
ELECTRICAL CHARACTERISTICS (TA = 25°C)
Parameter
Diode
Symbol
Conditions
Forward Voltage
VF
IF = 1 mA
Reverse Current
IR
VR = 5 V
Terminal Capacitance
Ct
V = 0 V, f = 1 MHz
Transistor
Collector to Emitter Current
ICEO
VCE = 300 V (350 V)
Coupled
Current Transfer Ratio (IC/IF)
CTR
IF = 1 mA, VCE = 2 V
Collector Saturation Voltage
VCE (sat)
IF = 1 mA, IC = 2 mA
TYP.
MAX.
Unit
0.9
1.1
1.3
V
5
µA
15
*1
400
400
nA
2 000
4 500
%
0.8
1
V
Ω
11
RI-O
VI-O = 1 kVDC
Isolation Capacitance
CI-O
V = 0 V, f = 1 MHz
0.4
pF
VCC = 5 V, IC = 10 mA, RL = 100 Ω
20
µs
*2
*2
Fall Time
tr
tf
5
*1 ICEO condition; PS2932-1: VCE = 300 V, PS2933-1: VCE = 350 V
*2 Test circuit for switching time
Pulse Input
VCC
PW = 1 ms
Duty cycle = 1/10
IF
VOUT
50 Ω
10
pF
Isolation Resistance
Rise Time
4
MIN.
RL = 100 Ω
Data Sheet PN10050EJ02V0DS
PS2932-1,PS2933-1
TYPICAL CHARACTERISTICS (TA = 25°C, unless otherwise specified)
TRANSISTOR POWER DISSIPATION
vs. AMBIENT TEMPERATURE
MAXIMUM FORWARD CURRENT vs.
AMBIENT TEMPERATURE
Transistor Power Dissipation PC (mW)
Maximum Forward Current IF (mA)
80
60
40
0.5 mA/˚C
20
50
25
0
100
75
140
120
100
80
60
1.2 mW/˚C
40
20
125
0
25
50
75
100
125
Ambient Temperature TA (˚C)
Ambient Temperature TA (˚C)
FORWARD CURRENT vs.
FORWARD VOLTAGE
COLLECTOR CURRENT vs.
COLLECTOR TO EMITTER VOLTAGE
100
60
10
Collector Current IC (mA)
Forward Current IF (mA)
IF = 5 mA
TA = +100˚C
+60˚C
+25˚C
1
0˚C
–25˚C
–50˚C
0.1
50
2 mA
40
1 mA
30
20
10
0.5 mA
0.5
1.0
1.5
0
2.0
1
2
3
4
5
Forward Voltage VF (V)
Collector to Emitter Voltage VCE (V)
COLLECTOR TO EMITTER DARK
CURRENT vs. AMBIENT TEMPERATURE
COLLECTOR CURRENT vs.
COLLECTOR SATURATION VOLTAGE
100
100 000
VCEO = 300 V
10 000
Collector Current IC (mA)
Collector to Emitter Dark Current ICEO (nA)
0.01
0.0
CTR = 1 068%
2 290%
4 360%
1 000
100
10
10
IF = 5 mA
2 mA
1 mA
0.5 mA
1
–50
–25
0
25
50
75
100
1
0.7
0.8
0.9
1.0
Collector Saturation Voltage VCE(sat) (V)
Ambient Temperature TA (˚C)
Remark The graphs indicate nominal characteristics.
Data Sheet PN10050EJ02V0DS
5
;
;
CURRENT TRANSFER RATIO vs.
FORWARD CURRENT
1.4
4 000
Current Transfer Ratio CTR (%)
Normalized Current Transfer Ratio CTR
NORMALIZED CURRENT TRANSFER
RATIO vs. AMBIENT TEMPERATURE
1.2
1.0
0.8
0.6
0.4
Normalized to 1.0
at TA = 25˚C,
IF = 1 mA, VCE = 2 V
0.2
0.0
–50
–25
0
25
50
75
VCE = 2 V
3 500
2 500
2 000
1 500
1 000
500
0
0.1
100
1
10
100
Ambient Temperature TA (˚C)
Forward Current IF (mA)
SWITCHING TIME vs.
LOAD RESISTANCE
LONG TERM CTR DEGRADATION
1.2
VCC = 5 V,
IC = 10 mA,
CTR = 2 840%
IF = 1 mA
tr
tf
ts
td
10
TA = 25˚C
1.0
1
CTR (Relative Value)
Switching Time t (µs)
Sample A
B
C
3 000
1 000
100
PS2932-1,PS2933-1
0.8
60˚C
0.6
0.4
0.2
0.1
100
1 000
0.0
10
Load Resistance RL (Ω)
Remark The graphs indicate nominal characteristics.
6
Data Sheet PN10050EJ02V0DS
102
103
104
Time (Hr)
105
106
PS2932-1,PS2933-1
TAPING SPECIFICATIONS (UNIT: mm)
1.5+0.1
–0
2.9 MAX.
12.0±0.2
5.5±0.05
4.0±0.1
5.3±0.1
2.0±0.05
1.75±0.1
Outline and Dimensions (Tape)
0.3
1.55±0.05
2.4±0.1
2.9±0.1
4.0±0.1
Tape Direction
PS2932-1-F4
PS2933-1-F4
PS2932-1-F3
PS2933-1-F3
N
N
N
N
N
N
N
N
Outline and Dimensions (Reel)
330±2.0
2.0±0.5
13.0±0.2
Packing: 3 500 pcs/reel
Data Sheet PN10050EJ02V0DS
100±1.0
21.0±0.8
2.0±0.5
13.5±1.0
11.9 to 15.4
Outer edge of
flange
7
PS2932-1,PS2933-1
RECOMMENDED MOUNT PAD DIMENSIONS (UNIT: mm)
1.27
5.7
4.14
0.6
4.7
(0.35)
0.8
( ) : Reference value
24-R0.1
Remark This drawing is considered to meet air and outer creepage distance 4.0 mm minimum. All dimensions in
this figure must be evaluated before use.
8
Data Sheet PN10050EJ02V0DS
PS2932-1,PS2933-1
NOTES ON HANDLING
1. Recommended soldering conditions
(1) Infrared reflow soldering
• Peak reflow temperature
260°C or below (package surface temperature)
• Time of peak reflow temperature
10 seconds or less
• Time of temperature higher than 220°C
60 seconds or less
• Time to preheat temperature from 120 to 180°C
120±30 s
• Number of reflows
Three
• Flux
Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
Package Surface Temperature T (˚C)
Recommended Temperature Profile of Infrared Reflow
(heating)
to 10 s
260˚C MAX.
220˚C
to 60 s
180˚C
120˚C
120±30 s
(preheating)
Time (s)
(2) Wave soldering
• Temperature
260°C or below (molten solder temperature)
• Time
10 seconds or less
• Preheating conditions
120°C or below (package surface temperature)
• Number of times
One (Allowed to be dipped in solder including plastic mold portion.)
• Flux
Rosin flux containing small amount of chlorine (The flux with a maximum chlorine
content of 0.2 Wt% is recommended.)
(3) Soldering by soldering iron
• Peak temperature (lead part temperature)
350°C or below
• Time (each pins)
3 seconds or less
• Flux
Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
(a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead.
(b) Please be sure that the temperature of the package would not be heated over 100°C.
Data Sheet PN10050EJ02V0DS
9
PS2932-1,PS2933-1
(4) Cautions
• Fluxes
Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.
2. Cautions regarding noise
Be aware that when voltage is applied suddenly between the photocoupler’s input and output or between
collector-emitters at startup, the output transistor may enter the on state, even if the voltage is within the absolute
maximum ratings.
3. Measurement conditions of current transfer ratios (CTR), which differ according to photocoupler
Check the setting values before use, since the forward current conditions at CTR measurement differ according
to product.
When using products other than at the specified forward current, the characteristics curves may differ from the
standard curves due to CTR value variations or the like. Therefore, check the characteristics under the actual
operating conditions and thoroughly take variations or the like into consideration before use.
USAGE CAUTIONS
1. Protect against static electricity when handling.
2. Avoid storage at a high temperature and high humidity.
10
Data Sheet PN10050EJ02V0DS
PS2932-1,PS2933-1
• The information in this document is current as of May, 2006. The information is subject to change
without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or
data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all
products and/or types are available in every country. Please check with an NEC Electronics sales
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• Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
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responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by
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The "Specific" quality grade applies only to NEC Electronics products developed based on a customerdesignated "quality assurance program" for a specific application. The recommended applications of an NEC
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The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC
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(Note)
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(2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as
defined above).
M8E 02. 11-1
Data Sheet PN10050EJ02V0DS
11
PS2932-1,PS2933-1
Caution
GaAs Products
This product uses gallium arsenide (GaAs).
GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe
the following points.
• Follow related laws and ordinances when disposing of the product. If there are no applicable laws
and/or ordinances, dispose of the product as recommended below.
1. Commission a disposal company able to (with a license to) collect, transport and dispose of
materials that contain arsenic and other such industrial waste materials.
2. Exclude the product from general industrial waste and household garbage, and ensure that the
product is controlled (as industrial waste subject to special control) up until final disposal.
• Do not burn, destroy, cut, crush, or chemically dissolve the product.
• Do not lick the product or in any way allow it to enter the mouth.
For further information, please contact
NEC Compound Semiconductor Devices Hong Kong Limited
E-mail: contact@ncsd-hk.necel.com
Hong Kong Head Office TEL: +852-3107-7303
FAX: +852-3107-7309
Taipei Branch Office
TEL: +886-2-8712-0478 FAX: +886-2-2545-3859
Korea Branch Office
TEL: +82-2-558-2120
FAX: +82-2-558-5209
NEC Electronics (Europe) GmbH
http://www.eu.necel.com/
TEL: +49-211-6503-0
FAX: +49-211-6503-1327
California Eastern Laboratories, Inc.
http://www.cel.com/
TEL: +1-408-988-3500
FAX: +1-408-988-0279
Compound Semiconductor Devices Division
NEC Electronics Corporation
URL: http://www.ncsd.necel.com/
0604
4590 Patrick Henry Drive
Santa Clara, CA 95054-1817
Telephone: (408) 919-2500
Facsimile: (408) 988-0279
Subject: Compliance with EU Directives
CEL certifies, to its knowledge, that semiconductor and laser products detailed below are compliant
with the requirements of European Union (EU) Directive 2002/95/EC Restriction on Use of Hazardous
Substances in electrical and electronic equipment (RoHS) and the requirements of EU Directive
2003/11/EC Restriction on Penta and Octa BDE.
CEL Pb-free products have the same base part number with a suffix added. The suffix –A indicates
that the device is Pb-free. The –AZ suffix is used to designate devices containing Pb which are
exempted from the requirement of RoHS directive (*). In all cases the devices have Pb-free terminals.
All devices with these suffixes meet the requirements of the RoHS directive.
This status is based on CEL’s understanding of the EU Directives and knowledge of the materials that
go into its products as of the date of disclosure of this information.
Restricted Substance
per RoHS
Concentration Limit per RoHS
(values are not yet fixed)
Concentration contained
in CEL devices
-A
Not Detected
Lead (Pb)
< 1000 PPM
Mercury
< 1000 PPM
Not Detected
Cadmium
< 100 PPM
Not Detected
Hexavalent Chromium
< 1000 PPM
Not Detected
PBB
< 1000 PPM
Not Detected
PBDE
< 1000 PPM
Not Detected
-AZ
(*)
If you should have any additional questions regarding our devices and compliance to environmental
standards, please do not hesitate to contact your local representative.
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