A Business Partner of Renesas Electronics Corporation.
Preliminary
PS9505,PS9505L1,
PS9505L2,PS9505L3
Data Sheet
R08DS0015EJ0100
Rev.1.00
Jan 06, 2012
2.5 A OUTPUT CURRENT, HIGH CMR, IGBT GATE DRIVE, 8-PIN DIP PHOTOCOUPLER
DESCRIPTION
The PS9505, PS9505L1, PS9505L2 and PS9505L3 are optically coupled isolators containing a GaAlAs LED on the
input side and a photo diode, a signal processing circuit and a power output transistor on the output side on one chip.
The PS9505 Series is designed specifically for high common mode transient immunity (CMR), high output current and
high switching speed.
The PS9505 Series is suitable for driving IGBTs and MOS FETs.
The PS9505 Series is in a plastic DIP (Dual In-line Package).
The PS9505L1 is lead bending type for long creepage distance.
The PS9505L2 is lead bending type for long creepage distance (Gull-wing) for surface mount.
The PS9505L3 is lead bending type (Gull-wing) for surface mounting.
FEATURES
PIN CONNECTION
• Long creepage distance (8 mm MIN.: PS9505L1, PS9505L2)
(Top View)
• Large peak output current (2.5 A MAX., 2.0 A MIN.)
• High speed switching (tPLH, tPHL = 0.25 μs MAX.)
• UVLO (Under Voltage Lock Out) protection with hysteresis
8
7
6
5
1
2
3
4
• High common mode transient immunity (CMH, CML = ±25 kV/μs MIN.)
SHIELD
• Embossed tape product: PS9505L2-E3: 1 000 pcs/reel
: PS9505L3-E3: 1 000 pcs/reel
• Pb-Free product
• Safety standards
1. NC
2. Anode
3. Cathode
4. NC
5. VEE
6. VO
7. VO
8. VCC
• UL approved: No. E72422
• CSA approved: No. CA 101391 (CA5A, CAN/CSA-C22.2 60065, 60950)
• SEMKO approved: No. 1115598
• DIN EN60747-5-2 (VDE0884 Part2) approved: No. 40024069 (Option)
APPLICATIONS
• IGBT, Power MOS FET Gate Driver
• Industrial inverter
• IH (Induction Heating)
R08DS0015EJ0100 Rev.1.00
Jan 06, 2012
Page 1 of 20
A Business Partner of Renesas Electronics Corporation.
PS9505,PS9505L1,PS9505L2,PS9505L3
Chapter Title
PACKAGE DIMENSIONS (UNIT: mm)
DIP Type
PS9505
9.25
+0.5
–0.25
7.62
+0.4
+0.5
6.5–0.1
3.5±0.2
2.8 MIN. 4.15±0.3
1.01–0.2
0.5±0.15
0.25 M
0 to 15°
2.54
0.84±0.15
Lead Bending Type (Gull-wing) For Surface Mount
PS9505L3
+0.5
8
9.25–0.25
5
1
4
3.5±0.2
1.01
0.5±0.15
0.25 M
R08DS0015EJ0100 Rev.1.00
Jan 06, 2012
2.54
0.635±0.15
9.65±0.4
+0.4
–0.2
+0.5
6.5–0.1
0.74±0.25
Page 2 of 20
A Business Partner of Renesas Electronics Corporation.
PS9505,PS9505L1,PS9505L2,PS9505L3
Chapter Title
Lead Bending Type For Long Creepage Distance
PS9505L1
+0.5
9.25–0.25
10.16
+0.4
+0.5
6.5–0.1
3.5±0.2
2.8 MIN. 3.87±0.4
1.01–0.2
0.5±0.15
0.25 M
0 to 15°
2.54
0.84±0.15
Lead Bending Type (Gull-wing) For Long Creepage Distance (Surface Mount)
PS9505L2
+0.5
9.25–0.25
8
5
1
4
3.5±0.2
0.5±0.15
0.25 M
R08DS0015EJ0100 Rev.1.00
Jan 06, 2012
+0.5
6.5–0.1
0.25±0.2
1.01
11.8±0.4
+0.4
–0.2
2.54
0.9±0.25
Page 3 of 20
A Business Partner of Renesas Electronics Corporation.
PS9505,PS9505L1,PS9505L2,PS9505L3
Chapter Title
PHOTOCOUPLER CONSTRUCTION
Parameter
PS9505, PS9505L3
PS9505L1, PS9505L2
Air Distance (MIN.)
7 mm
8 mm
Outer Creepage Distance (MIN.)
7 mm
8 mm
0.4 mm
0.4 mm
Isolation Distance (MIN.)
FUNCTIONAL DIAGRAM
8
(Tr. 1)
2
7
6
(Tr. 2)
3
5
SHIELD
Input
LED
Tr. 1
Tr. 2
Output
H
ON
ON
OFF
H
L
OFF
OFF
ON
L
MARKING EXAMPLE
No. 1 pin
Mark
R
9505
NT131
Company Initial
Type Number
Assembly Lot
N T 1 31
Week Assembled
Year Assembled
(Last 1 Digit)
In-house Code
Rank Code
R08DS0015EJ0100 Rev.1.00
Jan 06, 2012
Page 4 of 20
A Business Partner of Renesas Electronics Corporation.
PS9505,PS9505L1,PS9505L2,PS9505L3
Chapter Title
ORDERING INFORMATION
Part Number
Order Number
Packing Style
Solder Plating
Specification
PS9505
PS9505-AX
Pb-Free
PS9505L1
PS9505L1-AX
(Ni/Pd/Au)
50 Magazine Cases
Safety Standard
Approval
Application Part
*1
Number
Standard
PS9505
products
PS9505L1
PS9505L2
PS9505L2
PS9505L2-AX
(UL, CSA, SEMK O
PS9505L3
PS9505L3-AX
approved)
PS9505L2-E3
PS9505L2-E3-A X
PS9505L3-E3
PS9505L3-E3-A X
1 000 pcs/reel
PS9505-V
PS9505-V-AX
50 Magazine Cases
PS9505L1-V
PS9505L1-V-AX
(VDE0884 Pa rt2)
PS9505L1
PS9505L2-V
PS9505L2-V-AX
approved
PS9505L2
PS9505L3-V
PS9505L3-V-AX
(Option)
PS9505L3
PS9505L2-V-E3
PS9505L2-V-E3 - AX
Embossed Tape
PS9505L2
PS9505L3-V-E3
PS9505L3-V-E3 - AX
1 000 pcs/reel
PS9505L3
Embossed Tape
PS9505L3
PS9505L2
PS9505L3
DIN EN60747-5-2
PS9505
*1 For the application of the Safety Standard, following part number should be used.
ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified)
Parameter
Symbol
Ratings
Unit
Forward Current
IF
25
mA
IF (TRAN)
1.0
A
VR
5
V
IOH (PEAK)
2.5
A
IOL (PEAK)
2.5
A
(VCC - VEE)
0 to 35
V
VO
0 to VCC
V
PC
250
mW
BV
5 000
Vr.m.s.
PT
300
mW
f
50
kHz
Operating Ambient Temperature
TA
−40 to +110
°C
Storage Temperature
Tstg
−55 to +125
°C
Diode
Peak Transient Forward
Current (Pulse Width < 1 μs)
Reverse Voltage
Detector
High Level Peak Output
Current
*1
Low Level Peak Output
Current
*1
Supply Voltage
Output Voltage
Power Dissipation
Isolation Voltage
*2
*3
Total Power Dissipation
Operating Frequency
*4
*5
*1 Maximum pulse width = 10 μs, Maximum duty cycle = 0.2%
*2 Reduced to 4.8 mW/°C at TA = 70°C or more.
*3 AC voltage for 1 minute at TA = 25°C, RH = 60% between input and output.
Pins 1-4 shorted together, 5-8 shorted together.
*4 Reduced to 5.4 mW/°C at TA = 70°C or more.
*5 IOH (PEAK) ≤ 2.0 A (≤ 0.3 μs), IOL (PEAK) ≤ 2.0 A (≤ 0.3 μs)
R08DS0015EJ0100 Rev.1.00
Jan 06, 2012
Page 5 of 20
A Business Partner of Renesas Electronics Corporation.
PS9505,PS9505L1,PS9505L2,PS9505L3
Chapter Title
RECOMMENDED OPERATING CONDITIONS
Parameter
Symbol
MIN.
(VCC - VEE)
15
Forward Current (ON)
IF (ON)
7
Forward Voltage (OFF)
VF (OFF)
TA
Supply Voltage
Operating Ambient Temperature
TYP.
MAX.
Unit
30
V
16
mA
−2
0.8
V
−40
110
°C
10
ELECTRICAL CHARACTERISTICS
(VEE = GND, unless otherwise specified and refer to RECOMMENDED OPERATING CONDITIONS)
Parameter
Diode
Symbol
Conditions
Forward Voltage
VF
IF = 10 mA, TA = 25°C
Reverse Current
IR
VR = 3 V, TA = 25°C
Input Capacitance
Detector High Level Output Current
CIN
IOH
IOL
1.2
f = 1 MHz, VF = 0 V, TA = 25°C
VO = (VCC − 4 V)
*2
VO = (VCC − 15 V)
Low Level Output Current
MIN.
VO = (VEE + 2.5 V)
VO = (VEE + 15 V)
0.5
*3
*2
*3
*4
TYP.
*1
1.56
MAX.
Unit
1.8
V
10
μA
30
pF
2.0
A
2.0
A
2.0
0.5
2.0
High Level Output Voltage
VOH
IO = −100 mA
Low Level Output Voltage
VOL
IO = 100 mA
0.1
0.5
V
High Level Supply Current
ICCH
VO = open, IF = 10 mA
1.4
3.0
mA
Low Level Supply Current
ICCL
VO = open, VF = 0 to +0.8 V
1.3
3.0
mA
10.8
12.3
13.4
V
9.5
11.0
12.5
0.4
1.3
UVLO Threshold
VUVLO+
VO > 5 V, IF = 10 mA
VUVLO−
UVLO Hysteresis
Coupled Threshold Input Current
UVLOHYS VO > 5 V, IF = 10 mA
IFLH
IO = 0 mA, VO > 5 V
VFHL
IO = 0 mA, VO < 5 V
VCC − 3.0 VCC − 1.5
2.0
V
V
5.0
mA
(L → H)
Threshold Input Voltage
0.8
V
(H → L)
*1 Typical values at TA = 25°C.
*2 Maximum pulse width = 50 μs, Maximum duty cycle = 0.5%.
*3 Maximum pulse width = 10 μs, Maximum duty cycle = 0.2%
*4 VOH is measured with the DC load current in this testing (Maximum pulse width = 2 ms, Maximum duty cycle =
20%).
R08DS0015EJ0100 Rev.1.00
Jan 06, 2012
Page 6 of 20
A Business Partner of Renesas Electronics Corporation.
PS9505,PS9505L1,PS9505L2,PS9505L3
Chapter Title
SWITCHING CHARACTERISTICS
(VEE = GND, unless otherwise specified and refer to RECOMMENDED OPERATING CONDITIONS)
Parameter
Propagation Delay Time (L → H)
Propagation Delay Time (H → L)
Symbol
tPLH
tPHL
Pulse Width Distortion (PWD)
|tPHL−tPLH|
Propagation Delay Time (Difference
tPHL−tPLH
Conditions
MIN.
Rg = 10 Ω, Cg = 10 nF, f = 10 kHz,
*2
Duty Cycle = 50% , IF = 10 mA
TYP.
*1
MAX.
Unit
0.07
0.25
μs
0.10
0.25
μs
0.03
0.1
μs
0.1
μs
−0.1
Between Any Two Products)
Rise Time
tr
50
ns
Fall Time
tf
50
ns
UVLO (Turn On Delay)
tUVLO ON
VO > 5 V, IF = 10 mA
0.8
μs
UVLO (Turn Off Delay)
tUVLO OFF VO < 5 V, IF = 10 mA
0.6
μs
Common Mode Transient Immunity at
|CMH|
Common Mode Transient Immunity at
Low Level Output
TA = 25°C, IF = 10 to 16 mA, VCC = 30 V,
25
kV/μs
25
kV/μs
VO (MIN.) = 26 V, VCM = 1.5 kV
High Level Output
|CML|
TA = 25°C, IF = 0 mA, VCC = 30 V,
VO (MAX.) = 1 V, VCM = 1.5 kV
*1 Typical values at TA = 25°C.
*2 This load condition is equivalent to the IGBT load at 1 200 V/75 A.
R08DS0015EJ0100 Rev.1.00
Jan 06, 2012
Page 7 of 20
A Business Partner of Renesas Electronics Corporation.
PS9505,PS9505L1,PS9505L2,PS9505L3
Chapter Title
TEST CIRCUIT
Fig. 1 IOH Test Circuit
1
8
2
7 0.1 μF
3
6
IF =
7 to 16 mA 4
5
Fig. 2 IOL Test Circuit
4V
IOH
VCC =
15 to 30 V
1
8
2
7 0.1 μF
3
6
4
5
SHIELD
1
8
2
7 0.1 μF
3
6
4
5
Fig. 4 VOL Test Circuit
VOH
100 mA
VCC =
15 to 30 V
1
8
2
7
0.1 μF
3
6
VOL
4
5
VCC = 15 to 30 V
100 mA
SHIELD
SHIELD
Fig. 5 IFLH Test Circuit
IF
VCC = 15 to 30 V
2.5 V
SHIELD
Fig. 3 VOH Test Circuit
IF =
7 to 16 mA
IOL
1
8
2
7
3
6
4
5
SHIELD
R08DS0015EJ0100 Rev.1.00
Jan 06, 2012
Fig. 6 UVLO Test Circuit
0.1 μF
VO > 5 V
VCC =
15 to 30 V
1
8
IF = 10 mA 2
7
3
6
4
5
0.1 μF
VCC
VO > 5 V
SHIELD
Page 8 of 20
A Business Partner of Renesas Electronics Corporation.
PS9505,PS9505L1,PS9505L2,PS9505L3
Chapter Title
Fig. 7 tPLH, tPHL, tr, tf Test Circuit and Wave Forms
IF = 10 mA
10 kHz
50% DUTY
CYCLE
1
8
2
7
500 Ω 3
6
4
5
0.1 μF
VO
10 Ω
10 nF
VCC = 15 to 30 V
IF
VOUT
SHIELD
tr
tf
90%
50%
10%
tPLH
tPHL
Fig. 8 CMR Test Circuit and Wave Forms
IF
A
B
1
8
2
7
0.1 μF
3
6
VO
4
5
SHIELD
VCM = 1.5 kV
R08DS0015EJ0100 Rev.1.00
Jan 06, 2012
VCM
VCC = 30 V
0V
VO
(Switch A: IF = 10 to 16 mA)
VO
(Switch B: IF = 0 mA)
Δt
VCM
δV
=
Δt
δt
VOH
26 V
1V
VOL
Page 9 of 20
A Business Partner of Renesas Electronics Corporation.
PS9505,PS9505L1,PS9505L2,PS9505L3
TYPICAL CHARACTERISTICS (TA = 25°C, unless otherwise specified)
DETECTOR POWER DISSIPATION
vs. AMBIENT TEMPERATURE
250
200
150
100
50
20
100
40
60
100
80
Forward Current IF (mA)
100
50
20
40
60
80
100
120
THRESHOLD INPUT CURRENT vs.
AMBIENT TEMPERATURE
5.0
TA = +100°C
+85°C
+50°C
+25°C
0°C
−40°C
1.2
1.4
1.6
1.8
2.0
2.2
VCC = 30 V,
VEE = GND,
VO > 5 V
4.0
3.0
2.0
1.0
0
−40
2.4
0
−20
20
40
60
80
100
Forward Voltage VF (V)
Ambient Temperature TA (°C)
OUTPUT VOLTAGE vs.
FORWARD CURRENT
HIGH LEVEL OUTPUT VOLTAGE – SUPPLY
VOLTAGE vs. HIGH LEVEL OUTPUT CURRENT
0
High Level Output Voltage – Supply
Voltage VOH – VCC (V)
VCC = 30 V,
VEE = GND
25
20
15
10
5
0
150
FORWARD CURRENT vs.
FORWARD VOLTAGE
0.1
30
200
Ambient Temperature TA (°C)
1.0
35
250
Ambient Temperature TA (°C)
10
0.01
1.0
300
0
120
Threshold Input Current IFLH (mA)
0
TOTAL POWER DISSIPATION
vs. AMBIENT TEMPERATURE
350
Total Power Dissipation PT (mW)
Detector Power Dissipation PC (mW)
300
Output Voltage VO (V)
Chapter Title
1
2
3
4
5
Forward Current IF (mA)
VCC = 30 V,
VEE = GND,
IF = 10 mA
−40°C
−2
−4
TA = +110°C
−6
−8
0
+25°C
0.5
1.0
1.5
2.0
2.5
High Level Output Current IOH (A)
Remark The graphs indicate nominal characteristics.
R08DS0015EJ0100 Rev.1.00
Jan 06, 2012
Page 10 of 20
A Business Partner of Renesas Electronics Corporation.
6
LOW LEVEL OUTPUT VOLTAGE vs.
LOW LEVEL OUTPUT CURRENT
VCC = 30 V,
VEE = GND,
IF = 0 mA
+25°C
4
2
0
Propagation Delay Time tPHL, tPLH (ns),
Pulse Width Distortion (PWD) tPHL – tPLH (ns)
TA = +110°C
−40°C
0.5
1
1.5
2
2.5
PROPAGATION DELAY TIME,
PULSE WIDTH DISTORTION
vs. FORWARD CURRENT
250
VCC = 30 V, VEE = GND,
Rg = 10 Ω, Cg = 10 nF,
f = 10 kHz, Duty cycle = 50%
200
150
tPHL
100
tPLH
50
0
6
PWD
8
16
18
PROPAGATION DELAY TIME,
PULSE WIDTH DISTORTION
vs. LOAD CAPACITANCE
200
150
tPHL
100
tPLH
50
PWD
0
15
20
25
30
250
VCC = 30 V, VEE = GND,
IF = 10 mA, Rg = 10 Ω,
f = 10 kHz, Duty cycle = 50%
200
150
tPHL
100
tPLH
50
PWD
0
10
150
tPHL
100
tPLH
50
PWD
10
20
30
40
50
Load Resistance Rg (Ω)
Propagation Delay Time tPHL, tPLH (ns),
Pulse Width Distortion (PWD) tPHL – tPLH (ns)
VCC = 30 V, VEE = GND,
IF = 10 mA, Cg = 10 nF,
f = 10 kHz, Duty cycle = 50%
200
40
50
Load Capacitance Cg (nF)
PROPAGATION DELAY TIME,
PULSE WIDTH DISTORTION
vs. LOAD RESISTANCE
250
30
20
Supply Voltage VCC (V)
Propagation Delay Time tPHL, tPLH (ns),
Pulse Width Distortion (PWD) tPHL – tPLH (ns)
14
PROPAGATION DELAY TIME,
PULSE WIDTH DISTORTION
vs. SUPPLY VOLTAGE
VEE = GND, IF = 10 mA,
Rg = 10 Ω, Cg = 10 nF,
f = 10 kHz, Duty cycle = 50%
0
12
Forward Current IF (mA)
250
0
10
Low Level Output Current IOL (A)
Propagation Delay Time tPHL, tPLH (ns),
Pulse Width Distortion (PWD) tPHL – tPLH (ns)
Low Level Output Voltage VOL (V)
8
Chapter Title
Propagation Delay Time tPHL, tPLH (ns),
Pulse Width Distortion (PWD) tPHL – tPLH (ns)
PS9505,PS9505L1,PS9505L2,PS9505L3
PROPAGATION DELAY TIME,
PULSE WIDTH DISTORTION
vs. AMBIENT TEMPERATURE
250
VCC = 30 V, VEE = GND,
IF = 10 mA,
Rg = 10 Ω, Cg = 10 nF,
f = 10 kHz, Duty cycle = 50%
200
150
tPHL
100
tPLH
50
0
−40
PWD
−20
0
20
40
60
80
100
Ambient Temperature TA (°C)
Remark The graphs indicate nominal characteristics.
R08DS0015EJ0100 Rev.1.00
Jan 06, 2012
Page 11 of 20
A Business Partner of Renesas Electronics Corporation.
PS9505,PS9505L1,PS9505L2,PS9505L3
VCC = 30 V,
VEE = GND,
VO = OPEN
1.5
ICCH (IF = 10 mA)
ICCL (IF = 0 mA)
1.0
0.5
−40
20
0
20
40
60
80
100
SUPPLY CURRENT vs.
SUPPLY VOLTAGE
2.0
VEE = GND,
VO = OPEN
1.5
ICCH (IF = 10 mA)
ICCL (IF = 0 mA)
1.0
0.5
15
25
30
Supply Voltage VCC (V)
HIGH LEVEL OUTPUT VOLTAGE – SUPPLY
VOLTAGE vs. AMBIENT TEMPERATURE
LOW LEVEL OUTPUT VOLTAGE vs.
AMBIENT TEMPERATURE
VCC = 30 V, VEE = GND,
IF = 10 mA, IO = –100 mA
−0.5
−1.0
−1.5
−2.0
−2.5
−3.0
−40 −20
0
20
40
60
80
0.30
VCC = 30 V, VEE = GND,
IF = 10 mA, IO = 100 mA
0.25
0.20
0.15
0.10
0.05
0.00
−40 −20
100
2.0
1.5
1.0
0.5
0.0
−40 −20
0
20
40
60
80
100
Ambient Temperature TA (°C)
3.0
Low Level Output Current IOL (A)
VCC = 30 V, VEE = GND,
IF = 10 mA, VCC–VO = 4 V
2.5
20
40
60
80
100
LOW LEVEL OUTPUT CURRENT vs.
AMBIENT TEMPERATURE
HIGH LEVEL OUTPUT CURRENT vs.
AMBIENT TEMPERATURE
3.0
0
Ambient Temperature TA (°C)
Ambient Temperature TA (°C)
High Level Output Current IOH (A)
20
Ambient Temperature TA (°C)
Low Level Output Voltage VOL (V)
High Level Supply Current ICCH (mA),
Low Level Supply Current ICCL (mA)
2.0
High Level Supply Current ICCH (mA),
Low Level Supply Current ICCL (mA)
SUPPLY CURRENT vs.
AMBIENT TEMPERATURE
0.0
High Level Output Voltage – Supply
Voltage VOH – VCC (V)
Chapter Title
VCC = 30 V, VEE = GND,
IF = 10 mA, VO = 2.5 V
2.5
2.0
1.5
1.0
0.5
0.0
−40 −20
0
20
40
60
80
100
Ambient Temperature TA (°C)
Remark The graphs indicate nominal characteristics.
R08DS0015EJ0100 Rev.1.00
Jan 06, 2012
Page 12 of 20
A Business Partner of Renesas Electronics Corporation.
PS9505,PS9505L1,PS9505L2,PS9505L3
Chapter Title
OUTPUT VOLTAGE vs. SUPPLY VOLTAGE
14
Output Voltage VO (V)
12
10
8
UVLOHYS
6
4
2
0
0
VUVLO+
(12.3 V)
VUVLO−
(11.0 V)
5
10
15
20
Supply Voltage VCC – VEE (V)
Remark The graph indicates nominal characteristics.
R08DS0015EJ0100 Rev.1.00
Jan 06, 2012
Page 13 of 20
A Business Partner of Renesas Electronics Corporation.
PS9505,PS9505L1,PS9505L2,PS9505L3
Chapter Title
TAPING SPECIFICATIONS (UNIT: mm)
4.5 MAX.
12.8±0.1
11.5±0.1
1.5 +0.1
–0
24.0±0.3
2.0±0.1
4.0±0.1
1.75±0.1
Outline and Dimensions (Tape)
4.1±0.1
10.7±0.1
2.05±0.05
12.0±0.1
0.3±0.05
Tape Direction
PS9505L2-E3
Outline and Dimensions (Reel)
R 1.0
21.0±0.8
100±1.0
2.0±0.5
13.0±0.2
330±2.0
2.0±0.5
25.5±1.0
29.5±1.0
Packing: 1 000 pcs/reel
R08DS0015EJ0100 Rev.1.00
Jan 06, 2012
23.9 to 27.4
Outer edge of
flange
Page 14 of 20
A Business Partner of Renesas Electronics Corporation.
Chapter Title
7.5±0.1
1.5 +0.1
–0
5.3 MAX.
10.4±0.1
2.0±0.1
4.0±0.1
16.0±0.3
Outline and Dimensions (Tape)
1.75±0.1
PS9505,PS9505L1,PS9505L2,PS9505L3
4.75±0.1
10.3±0.1
1.55±0.1
12.0±0.1
0.35±0.05
Tape Direction
PS9505L3-E3
Outline and Dimensions (Reel)
2.0±0.5
21.0±0.8
100±1.0
R 1.0
330±2.0
2.0±0.5
13.0±0.2
17.5±1.0
21.5±1.0
Packing: 1 000 pcs/reel
R08DS0015EJ0100 Rev.1.00
Jan 06, 2012
15.9 to 19.4
Outer edge of
flange
Page 15 of 20
A Business Partner of Renesas Electronics Corporation.
PS9505,PS9505L1,PS9505L2,PS9505L3
RECOMMENDED MOUNT PAD DIMENSIONS (UNIT: mm)
C
D
B
Chapter Title
A
Part Number
Lead Bending
PS9505L2
lead bending type (Gull-wing)
for long creepage distance (surface mount)
PS9505L3
lead bending type (Gull-wing)
for surface mount
R08DS0015EJ0100 Rev.1.00
Jan 06, 2012
A
B
C
D
10.2
2.54
1.7
2.2
9.0
2.54
1.7
2.0
Page 16 of 20
A Business Partner of Renesas Electronics Corporation.
PS9505,PS9505L1,PS9505L2,PS9505L3
Chapter Title
NOTES ON HANDLING
1. Recommended soldering conditions
(1) Infrared reflow soldering
• Peak reflow temperature
260°C or below (package surface temperature)
• Time of peak reflow temperature
10 seconds or less
• Time of temperature higher than 220°C
60 seconds or less
• Time to preheat temperature from 120 to 180°C
120±30 s
• Number of reflows
Three
• Flux
Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
Package Surface Temperature T (°C)
Recommended Temperature Profile of Infrared Reflow
(heating)
to 10 s
260°C MAX.
220°C
to 60 s
180°C
120°C
120±30 s
(preheating)
Time (s)
(2) Wave soldering
• Temperature
260°C or below (molten solder temperature)
• Time
10 seconds or less
• Preheating conditions
120°C or below (package surface temperature)
• Number of times
One (Allowed to be dipped in solder including plastic mold portion.)
• Flux
Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content
of 0.2 Wt% is recommended.)
(3) Soldering by Soldering Iron
• Peak Temperature (lead part temperature)
350°C or below
• Time (each pins)
3 seconds or less
• Flux
Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
(a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead
R08DS0015EJ0100 Rev.1.00
Jan 06, 2012
Page 17 of 20
A Business Partner of Renesas Electronics Corporation.
PS9505,PS9505L1,PS9505L2,PS9505L3
Chapter Title
(4) Cautions
• Fluxes
Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.
2. Cautions regarding noise
Be aware that when voltage is applied suddenly between the photocoupler’s input and output at startup, the output
transistor may enter the on state, even if the voltage is within the absolute maximum ratings.
USAGE CAUTIONS
1. This product is weak for static electricity by designed with high-speed integrated circuit so protect against static
electricity when handling.
2. Board designing
(1) By-pass capacitor of more than 0.1 μF is used between VCC and GND near device. Also, ensure that the
distance between the leads of the photocoupler and capacitor is no more than 10 mm.
(2) When designing the printed wiring board, ensure that the pattern of the IGBT collectors/emitters is not too close
to the input block pattern of the photocoupler.
If the pattern is too close to the input block and coupling occurs, a sudden fluctuation in the voltage on the IGBT
output side might affect the photocoupler’s LED input, leading to malfunction or degradation of characteristics.
(If the pattern needs to be close to the input block, to prevent the LED from lighting during the off state due to
the abovementioned coupling, design the input-side circuit so that the bias of the LED is reversed, within the
range of the recommended operating conditions, and be sure to thoroughly evaluate operation.)
(3) Pins 1, 4 (which is an NC*1 pin) can either be connected directly to the GND pin on the LED side or left open.
Unconnected pins should not be used as a bypass for signals or for any other similar purpose because this may
degrade the internal noise environment of the device.
*1 NC: Non-Connection (No Connection)
3. Make sure the rise/fall time of the forward current is 0.5 μs or less.
4. In order to avoid malfunctions, make sure the rise/fall slope of the supply voltage is 3 V/μs or less.
5. Avoid storage at a high temperature and high humidity.
R08DS0015EJ0100 Rev.1.00
Jan 06, 2012
Page 18 of 20
A Business Partner of Renesas Electronics Corporation.
PS9505,PS9505L1,PS9505L2,PS9505L3
Chapter Title
SPECIFICATION OF VDE MARKS LICENSE DOCUMENT
Parameter
Symbol
Climatic test class (IEC 60068-1/DIN EN 60068-1)
Spec.
Unit
40/110/21
Dielectric strength
maximum operating isolation voltage
Test voltage (partial discharge test, procedure a for type test and random test)
Upr = 1.6 × UIORM, Pd < 5 pC
Test voltage (partial discharge test, procedure b for all devices)
UIORM
Upr
1 130
1 808
Vpeak
Vpeak
Upr
2 119
Vpeak
UTR
8 000
Vpeak
Upr = 1.875 × UIORM, Pd < 5 pC
Highest permissible overvoltage
Degree of pollution (DIN EN 60664-1 VDE0110 Part 1)
Comparative tracking index (IEC 60112/DIN EN 60112 (VDE 0303 Part 11))
2
CTI
Material group (DIN EN 60664-1 VDE0110 Part 1)
175
III a
Storage temperature range
Tstg
–55 to +125
°C
Operating temperature range
TA
–40 to +110
°C
Ris MIN.
Ris MIN.
10
11
10
Package temperature
Tsi
175
°C
Current (input current IF, Psi = 0)
Isi
400
mA
Power (output or total power dissipation)
Psi
700
mW
Ris MIN.
10
Isolation resistance, minimum value
VIO = 500 V dc at TA = 25°C
VIO = 500 V dc at TA MAX. at least 100°C
12
Ω
Ω
Safety maximum ratings (maximum permissible in case of fault, see thermal
derating curve)
Isolation resistance
VIO = 500 V dc at TA = Tsi
R08DS0015EJ0100 Rev.1.00
Jan 06, 2012
9
Ω
Page 19 of 20
A Business Partner of Renesas Electronics Corporation.
PS9505,PS9505L1,PS9505L2,PS9505L3
Caution
GaAs Products
Chapter Title
This product uses gallium arsenide (GaAs).
GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe
the following points.
• Follow related laws and ordinances when disposing of the product. If there are no applicable laws
and/or ordinances, dispose of the product as recommended below.
1. Commission a disposal company able to (with a license to) collect, transport and dispose of
materials that contain arsenic and other such industrial waste materials.
2. Exclude the product from general industrial waste and household garbage, and ensure that the
product is controlled (as industrial waste subject to special control) up until final disposal.
• Do not burn, destroy, cut, crush, or chemically dissolve the product.
• Do not lick the product or in any way allow it to enter the mouth.
R08DS0015EJ0100 Rev.1.00
Jan 06, 2012
Page 20 of 20
Revision History
PS9505,PS9505L1,PS9505L2,PS9505L3 Data Sheet
Rev.
Date
Page
Description
Summary
0.01
1.00
May 12, 2010
Jan 06, 2012
−
Throughout
Throughout
p.1
p.4
p.5
p.6
p.7
p.9
pp.10 to 13
p.16
p.18
p.19
First Edition issued
Preliminary Data Sheet -> Data Sheet
Safety standards approved
Addition of Pb-Free product
Modification of MARKING EXAMPLE
Addition of ORDERING INFORMATION
Modification of ELECTRICAL CHARACTERISTICS
Modification of SWITCHING CHARACTERISTICS
Modification of TEST CIRCUIT
Addition of TYPICAL CHARACTERISTICS
Modification of RECOMMENDED MOUNT PAD DIMENSIONS
Modification of USAGE CAUTIONS 2. (2)
Addition of SPECIFICATION OF VDE MARKS LICENSE DOCUMENT
All trademarks and registered trademarks are the property of their respective owners.
C-1
1.
Notice
All information included in this document is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas
Electronics products listed herein, please confirm the latest product information with a Renesas Electronics sales office. Also, please pay regular and careful attention to additional and different information to
be disclosed by Renesas Electronics such as that disclosed through our website.
2.
Renesas Electronics does not assume any liability for infringement of patents, copyrights, or other intellectual property rights of third parties by or arising from the use of Renesas Electronics products or
technical information described in this document. No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of Renesas Electronics or
others.
3.
You should not alter, modify, copy, or otherwise misappropriate any Renesas Electronics product, whether in whole or in part.
4.
Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples. You are fully responsible for
the incorporation of these circuits, software, and information in the design of your equipment. Renesas Electronics assumes no responsibility for any losses incurred by you or third parties arising from the
use of these circuits, software, or information.
5.
When exporting the products or technology described in this document, you should comply with the applicable export control laws and regulations and follow the procedures required by such laws and
regulations. You should not use Renesas Electronics products or the technology described in this document for any purpose relating to military applications or use by the military, including but not limited to
the development of weapons of mass destruction. Renesas Electronics products and technology may not be used for or incorporated into any products or systems whose manufacture, use, or sale is
prohibited under any applicable domestic or foreign laws or regulations.
6.
Renesas Electronics has used reasonable care in preparing the information included in this document, but Renesas Electronics does not warrant that such information is error free. Renesas Electronics
7.
Renesas Electronics products are classified according to the following three quality grades: "Standard", "High Quality", and "Specific". The recommended applications for each Renesas Electronics product
assumes no liability whatsoever for any damages incurred by you resulting from errors in or omissions from the information included herein.
depends on the product's quality grade, as indicated below. You must check the quality grade of each Renesas Electronics product before using it in a particular application. You may not use any Renesas
Electronics product for any application categorized as "Specific" without the prior written consent of Renesas Electronics. Further, you may not use any Renesas Electronics product for any application for
which it is not intended without the prior written consent of Renesas Electronics. Renesas Electronics shall not be in any way liable for any damages or losses incurred by you or third parties arising from the
use of any Renesas Electronics product for an application categorized as "Specific" or for which the product is not intended where you have failed to obtain the prior written consent of Renesas Electronics.
The quality grade of each Renesas Electronics product is "Standard" unless otherwise expressly specified in a Renesas Electronics data sheets or data books, etc.
"Standard":
Computers; office equipment; communications equipment; test and measurement equipment; audio and visual equipment; home electronic appliances; machine tools;
personal electronic equipment; and industrial robots.
"High Quality": Transportation equipment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; anti-crime systems; safety equipment; and medical equipment not specifically
designed for life support.
"Specific":
Aircraft; aerospace equipment; submersible repeaters; nuclear reactor control systems; medical equipment or systems for life support (e.g. artificial life support devices or systems), surgical
implantations, or healthcare intervention (e.g. excision, etc.), and any other applications or purposes that pose a direct threat to human life.
8.
You should use the Renesas Electronics products described in this document within the range specified by Renesas Electronics, especially with respect to the maximum rating, operating supply voltage
range, movement power voltage range, heat radiation characteristics, installation and other product characteristics. Renesas Electronics shall have no liability for malfunctions or damages arising out of the
use of Renesas Electronics products beyond such specified ranges.
9.
Although Renesas Electronics endeavors to improve the quality and reliability of its products, semiconductor products have specific characteristics such as the occurrence of failure at a certain rate and
malfunctions under certain use conditions. Further, Renesas Electronics products are not subject to radiation resistance design. Please be sure to implement safety measures to guard them against the
possibility of physical injury, and injury or damage caused by fire in the event of the failure of a Renesas Electronics product, such as safety design for hardware and software including but not limited to
redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because the evaluation of microcomputer software alone is very difficult,
please evaluate the safety of the final products or system manufactured by you.
10. Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental compatibility of each Renesas Electronics product. Please use Renesas Electronics
products in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. Renesas Electronics assumes
no liability for damages or losses occurring as a result of your noncompliance with applicable laws and regulations.
11. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written consent of Renesas Electronics.
12. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas Electronics products, or if you have any other inquiries.
(Note 1)
"Renesas Electronics" as used in this document means Renesas Electronics Corporation and also includes its majority-owned subsidiaries.
(Note 2)
"Renesas Electronics product(s)" means any product developed or manufactured by or for Renesas Electronics.
工商网监
湘ICP备2023018690号
