UPC2762TB

3 V, SUPER MINIMOLD UPC2762TB MEDIUM POWER SI MMIC AMPLIFIER FEATURES Insertion Power Gain, GP (dB) INSERTION POWER GAIN vs. FREQUENCY AND TEMPERATURE 18 • HIGH P1dB: 7 dBm TYP at 1.9 GHz • LOW VOLTAGE: 3.0 V TYP, 2.7 V MIN • WIDE BANDWIDTH: 2.9 GHz at -3 dB • SUPER SMALL PACKAGE: SOT-363 package • TAPE AND REEL PACKAGING OPTION AVAILABLE 16 TA = +85°C 14 TA = +25°C 12 TA = -40°C 10 DESCRIPTION NEC's UPC2762TB is a Silicon Monolithic integrated circuit which is manufactured using the NESAT™ III process. The NESAT™ III process produces transistors with fT approaching 20 GHz. The UPC2762TB is pin compatible and has comparable performance to the larger UPC2762T, so it is suitable for use as a replacement to help reduce system size. The IC is housed in a 6 pin super minimold or SOT-363 package. Operating on a 3 volt supply, this IC is ideally suited for handheld, portable designs. NEC's stringent quality assurance and test procedures ensure the highest reliability and performance. 8 0.1 0.3 1.0 VCC = 3.0 V 3.0 Frequency, f (MHz) ELECTRICAL CHARACTERISTICS (TA = 25°C, ZL = ZS = 50Ω, VCC = 3.0 V) PART NUMBER PACKAGE OUTLINE SYMBOLS ICC GS fU P1dB PSAT NF RLIN RLOUT ISOL OIP3 PADJ PARAMETERS AND CONDITIONS Circuit Current (no signal) Small Signal Gain, f = 900 MHz f = 1900 MHz UNITS mA dB dB GHz dBm dBm dBm dBm dB dB dB dB dB dB dB dB dBm dBm dBc dBc 6 5.5 8 9 22 20 11 11.5 2.7 +5.5 +4.5 MIN UPC2762TB S06 TYP 27 13 15.5 2.9 +8 +7 9 8.5 6.5 7 9 8.5 11 12 27 25 +12 +9 -64 -64 8.0 9.0 MAX 35 16 17.5 Upper Limit Operating Frequency (The gain at fu is 3 dB down from the gain at 0.1 GHz) Output Power at 1 dB Compression Point, f = 900 MHz f = 1900 MHz Saturated Output Power, f = 900 MHz f = 1900 MHz Noise Figure, Input Return Loss, Output Return Loss, Isolation, f = 900 MHz f = 1900 MHz f = 900 MHz f = 1900 MHz f = 900 MHz f = 1900 MHz f = 900 MHz f = 1900 MHz f = 900, 902 MHz f = 1900, 1902 MHz ∆f = ±50 KHz ∆f = ±100 KHz SSB Output Third Order Intercept Point POUT = +4 dBm Adjacent Channel Power, f = 900 MHz, π/4 QPSK wave1, PO = +4 dBm Note: 1. π/4 QPSK modulated wave input, data rate 42 kbps. California Eastern Laboratories UPC2762TB ABSOLUTE MAXIMUM RATINGS1 (TA = 25°C) SYMBOLS VCC ICC PIN PT TOP TSTG PARAMETERS Supply Voltage Total Supply Current Input Power Total Power Dissipation2 Operating Temperature Storage Temperature UNITS V mA dBm mW °C °C RATINGS 3.6 70 +10 200 -40 to +85 -55 to +150 VCC 1000 pF RECOMMENDED OPERATING CONDITIONS SYMBOLS VCC TOP PARAMETERS Supply Voltage Operating Temperature UNITS MIN V °C 2.7 -40 TYP MAX 3 25 3.3 85 TEST CIRCUIT Notes: 1. Operation in excess of any one of these parameters may result in permanent damage. 2. Mounted on a 50 x 50 x 1.6 mm epoxy glass PWB (TA = 85°C). 50 Ω IN 1000 pF L = 300 nH 6 1 2, 3, 5 4 1000 pF 50 Ω OUT TYPICAL PERFORMANCE CURVES (TA = 25°C) CIRCUIT CURRENT vs. SUPPLY VOLTAGE 50 50 No signal VCC = 3.0 V CIRCUIT CURRENT vs. OPERATING TEMPERATURE 40 Circuit Current, ICC (mA) 30 Circuit Current, ICC (mA) 40 30 20 20 10 10 0 0 1 2 3 4 0 -60 -40 -20 0 20 40 60 80 100 Supply Voltage, VCC (V) NOISE FIGURE AND INSERTION POWER GAIN vs. FREQUENCY AND VOLTAGE 20 18 16 VCC = 3.3 V VCC = 3.0 V GS 0 Operating Temperature, TOP (°C) INPUT AND OUTPUT RETURN LOSS vs. FREQUENCY VCC = 3.0V RLin -10 Gain, GS (dB) 14 12 10 8 Return Loss (dB) VCC = 2.7 V RLout -20 10 VCC = 3.3 V NF 8 6 VCC = 3.0 V VCC = 2.7 V 4 2 0.1 0.3 1.0 3.0 Noise Figure, NF (dB) 6 4 2 -30 -40 0.1 0.3 1.0 3.0 Frequency, f (GHz) Frequency, f (GHz) UPC2762TB TYPICAL PERFORMANCE CURVES (TA = 25°C) OUTPUT POWER vs. INPUT POWER AND VOLTAGE 15 f = 0.9 GHZ VCC = 3.0V ISOLATION vs. FREQUENCY 10 VCC = 3.0V 0 Output Power, POUT (dBm) 10 VCC = 3.3V 5 VCC = 2.7V Isolation, ISOL (dB) -10 -20 0 -30 -5 -40 0.1 0.3 1.0 3.0 -10 -20 -15 -10 -5 0 +5 Frequency, f (GHz) Input Power, PIN (dBm) OUTPUT POWER vs. INPUT POWER AND TEMPERATURE 15 f = 0.9 GHz VCC = 3.0 V VCC = 3.3 V VCC = 3.0 V +15 OUTPUT POWER vs. INPUT POWER AND VOLTAGE f = 1.9 GHz VCC = 3.0 V Output Power, POUT (dBm) Output Power, POUT (dBm) 10 +10 VCC = 3.3 V +5 VCC = 2.7 V 0 5 VCC = 2.7 V 0 -5 -5 -10 -20 -15 -10 -5 0 +5 -10 -20 -15 -10 -5 0 +5 Input Power, PIN (dBm) Input Power, PIN (dBm) OUTPUT POWER vs. INPUT POWER AND TEMPERATURE +15 SATURATED OUTPUT POWER vs. FREQUENCY +13 Saturated Output Power, PO(SAT) (dBm) f = 1.9 GHz VCC = 3.0 V TA = +85°C TA = +25°C VCC = 3.3 V +11 VCC = 3.0 V +9 PIN = +3 dBm Output Power, POUT (dBm) +10 +5 TA = -40°C 0 VCC = 2.7 V +7 -5 +5 -10 -20 -15 -10 -5 0 +5 +3 0.1 0.3 1.0 3.0 Input Power, PIN (dBm) Frequency, f (GHz) UPC2762TB TYPICAL PERFORMANCE CURVES (TA = 25°C) SATURATED OUTPUT POWER vs. FREQUENCY AND TEMPERATURE 13 PIN = +3 dBm Third Order Intermodulation Distortion, IM3 (dBc) THIRD ORDER INTERMODULATION DISTORTION vs. OUTPUT POWER OF EACH TONE AND VOLTAGE -60 f1 = 0.900 GHz f2 = 0.902 GHz -50 VCC = 3.3 V -40 VCC = 3.3 V -30 VCC = 3.3 V Output Power, PO (SAT) (dBm) 11 TA = +25°C TA = +85°C 9 TA = -40°C 7 -20 5 -10 3 0.1 0.3 1.0 3.0 0 -15 -10 -5 0 +5 +10 Frequency, f (GHz) Output Power of Each Tone, PO (EACH) (dBm) THIRD ORDER INTERMODULATION DISTORTION vs. OUTPUT POWER OF EACH TONE AND VOLTAGE Third Order Intermodulation Distortion, IM3 (dBc) -60 f1 = 1.900 GHz f2 = 1.902 GHz VCC = 3.3 V -50 -40 VCC = 3.3 V -30 VCC = 3.3 V -20 -10 0 -15 -10 -5 0 +5 10 Output Power of Each Tone, PO (EACH) (dBm) UPC2762TB TYPICAL SCATTERING PARAMETERS (TA = +25°C, VCC = VOUT = 3.0 V) 3.0 GHz 0.1 GHz 3.0 GHz 2.0 GHz 0.1 GHz 2.0 GHz 1.0 GHz S11 S22 VCC = VOUT = 3.0 V, ICC = 29 mA FREQUENCY GHz 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 MAG 0.338 0.346 0.348 0.340 0.329 0.324 0.341 0.359 0.378 0.375 0.363 0.353 0.357 0.377 0.402 0.414 0.426 0.434 0.448 0.463 0.483 0.492 0.492 0.486 0.489 0.500 0.511 0.511 0.494 0.465 0.441 S11 ANG -1.3 -2.0 -1.2 -1.9 -3.1 -6.2 -8.1 -7.6 -6.5 -5.1 -5.2 -6.7 -8.8 -11.7 -12.7 -13.2 -13.6 -16.1 -19.0 -21.7 -23.9 -25.8 -29.7 -34.6 -40.4 -44.6 -48.5 -50.4 -52.9 -55.9 -60.6 MAG 4.560 4.581 4.616 4.661 4.689 4.726 4.844 4.927 5.057 5.179 5.306 5.400 5.567 5.706 5.820 5.987 6.081 6.182 6.229 6.328 6.382 6.431 6.424 6.329 6.146 5.997 5.822 5.693 5.553 5.334 5.157 S21 ANG -3.4 -7.6 -11.3 -15.8 -19.5 -23.6 -27.4 -31.5 -35.8 -41.0 -45.9 -51.0 -56.5 -61.7 -68.0 -73.7 -80.1 -86.7 -93.2 -99.7 -106.7 -113.8 -121.2 -128.8 -136.1 -143.1 -149.9 -157.0 -163.0 -169.5 -175.5 MAG 0.039 0.039 0.039 0.040 0.040 0.041 0.042 0.043 0.044 0.045 0.047 0.047 0.048 0.049 0.052 0.052 0.055 0.056 0.057 0.057 0.058 0.058 0.060 0.060 0.062 0.061 0.064 0.066 0.065 0.065 0.066 S12 ANG 1.0 2.7 6.8 8.1 11.6 13.7 15.8 18.1 19.3 20.3 22.1 23.7 26.1 24.5 26.7 26.8 29.0 28.2 28.5 28.0 28.5 29.0 30.1 30.2 31.1 32.1 31.4 34.0 33.8 35.5 35.5 MAG 0.310 0.311 0.302 0.296 0.290 0.292 0.291 0.292 0.284 0.280 0.285 0.288 0.288 0.285 0.282 0.285 0.288 0.291 0.286 0.282 0.282 0.282 0.278 0.268 0.260 0.251 0.248 0.237 0.222 0.203 0.189 S22 ANG -5.5 -9.5 -12.3 -16.2 -20.2 -24.1 -26.2 -28.3 -30.9 -35.3 -40.0 -43.4 -45.7 -47.9 -52.8 -58.1 -62.0 -66.1 -70.4 -76.2 -81.5 -86.9 -91.7 -98.4 -104.5 -111.3 -116.7 -121.5 -128.3 -134.5 -141.1 2.23 2.20 2.20 2.18 2.20 2.12 2.01 1.90 1.77 1.72 1.64 1.62 1.54 1.44 1.32 1.27 1.18 1.14 1.09 1.07 1.01 0.99 0.99 1.01 1.02 1.05 1.03 1.04 1.11 1.20 1.27 K UPC2762TB OUTLINE DIMENSIONS (Units in mm) PACKAGE OUTLINE S06 LEAD CONNECTIONS (Top View) (Bottom View) 2.1±0.1 3 C1Z 4 1.25±0.1 2.0±0.2 0.65 3 1.3 0.65 2 4 3 4 0.2 +0.1 -0 2 5 5 2 1 6 6 1 5 1 6 DOT ON BACK SIDE 0.9 ± 0.1 0.7 1. 2. 3. 4. 5. 6. INPUT GND GND OUTPUT GND VCC 0 ~0.1 +0.1 0.15 -0.5 PIN DESCRIPTIONS Pin No. 1 Pin Name Input Applied Voltage (V) – Description Signal input pin. An internal matching circuit, configured with resistors, enables 50 Ω connection over a wide bandwidth. A multi-feedback circuit is designed to cancel the deviations of hFE and resistance. This pin must be coupled to the signal source with a blocking capacitor. Signal output pin. Connect an inductor between this pin and VCC to supply current to the internal output transistors. 2.7 to 3.3 0 Power supply pin. This pin should be externally equipped with a bypass capacitor to minimize ground impedance. Ground pins. These pins should be connected to system ground with minimum inductance. Ground pattern on the board should be formed as wide as possible. All the ground pins must be connected together with wide ground pattern to minimize impedance difference. 3 2 5 1 Internal Equivalent Circuit 6 4 4 6 2 3 5 Output VCC GND ORDERING INFORMATION PART NUMBER UPC2762TB-E3-A QTY 3K/Reel Note: Embossed Tape, 8 mm wide. Pins 1, 2 and 3 face perforated side of tape. Life Support Applications These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and agree to fully indemnify CEL for all damages resulting from such improper use or sale. EXCLUSIVE NORTH AMERICAN AGENT FOR RF, MICROWAVE & OPTOELECTRONIC SEMICONDUCTORS CALIFORNIA EASTERN LABORATORIES • Headquarters • 4590 Patrick Henry Drive • Santa Clara, CA 95054-1817 • (408) 988-3500 • Telex 34-6393 • FAX (408) 988-0279 24-Hour Fax-On-Demand: 800-390-3232 (U.S. and Canada only) • Internet: http://WWW.CEL.COM 06/12/2000 DATA SUBJECT TO CHANGE WITHOUT NOTICE 4590 Patrick Henry Drive Santa Clara, CA 95054-1817 Telephone: (408) 919-2500 Facsimile: (408) 988-0279 Subject: Compliance with EU Directives CEL certifies, to its knowledge, that semiconductor and laser products detailed below are compliant with the requirements of European Union (EU) Directive 2002/95/EC Restriction on Use of Hazardous Substances in electrical and electronic equipment (RoHS) and the requirements of EU Directive 2003/11/EC Restriction on Penta and Octa BDE. CEL Pb-free products have the same base part number with a suffix added. The suffix –A indicates that the device is Pb-free. The –AZ suffix is used to designate devices containing Pb which are exempted from the requirement of RoHS directive (*). In all cases the devices have Pb-free terminals. All devices with these suffixes meet the requirements of the RoHS directive. This status is based on CEL’s understanding of the EU Directives and knowledge of the materials that go into its products as of the date of disclosure of this information. Restricted Substance per RoHS Lead (Pb) Mercury Cadmium Hexavalent Chromium PBB PBDE Concentration Limit per RoHS (values are not yet fixed) < 1000 PPM < 1000 PPM < 100 PPM < 1000 PPM < 1000 PPM < 1000 PPM Concentration contained in CEL devices -A Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected -AZ (*) If you should have any additional questions regarding our devices and compliance to environmental standards, please do not hesitate to contact your local representative. Important Information and Disclaimer: Information provided by CEL on its website or in other communications concerting the substance content of its products represents knowledge and belief as of the date that it is provided. CEL bases its knowledge and belief on information provided by third parties and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. CEL has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. CEL and CEL suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall CEL’s liability arising out of such information exceed the total purchase price of the CEL part(s) at issue sold by CEL to customer on an annual basis. See CEL Terms and Conditions for additional clarification of warranties and liability. 5-198