BIPOLAR ANALOG INTEGRATED CIRCUIT
UPC3224TB
5 V, SILICON MMIC WIDEBAND AMPLIFIER
DESCRIPTION
The µPC3224TB is a silicon monolithic IC designed as IF amplifier for DBS tuners. This IC is manufactured using our 30 GHz fmax UHS0 (Ultra High Speed Process) silicon bipolar process.
FEATURES
• Wideband response : fu = 3.2 GHz TYP. @ 3 dB bandwidth • Low current • Power gain • Supply voltage • Port impedance : ICC = 9.0 mA TYP. : GP = 21.5 dB TYP. @ f = 1.0 GHz : GP = 21.5 dB TYP. @ f = 2.2 GHz : VCC = 4.5 to 5.5 V : input/output 50 Ω
APPLICATION
• IF amplifiers in DBS converters etc.
ORDERING INFORMATION (Solder Contains Lead)
Part Number Package 6-pin super minimold Marking C3K Supplying Form • Embossed tape 8 mm wide • 1, 2, 3 pins face the perforation side of tape • Qty 3 kpcs/reel
µPC3224TB-E3
ORDERING INFORMATION (Pb-Free)
Part Number Package 6-pin super minimold Marking C3K Supplying Form • Embossed tape 8 mm wide • 1, 2, 3 pins face the perforation side of tape • Qty 3 kpcs/reel
µPC3224TB-E3-A
Remark To order evaluation samples, contact your nearby sales office. Part number for sample order: µPC3224TB
Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge.
Document No. PU10490EJ01V0DS (1st edition) Date Published May 2004 CP(K)
© NEC Compound Semiconductor Devices 2004
UPC3224TB
PIN CONNECTIONS
Pin No. Pin Name INPUT GND GND OUTPUT GND
VCC
(Top View)
(Bottom View)
1
C3K
3 2 1
4
5 6
4 5 6
3
2 1
2 3 4 5
6
PRODUCT LINE-UP OF 5 V-BIAS SILICON MMIC MEDIUM WIDEBAND AMPLIFIER (TA = +25°C, f = 1 GHz, VCC = Vout = 5.0 V, ZS = ZL = 50 Ω)
fu (GHz) 2.9 2.6
Note
Part No.
PO (sat) (dBm) +1.0 +3.0 +3.5 +4.0
GP (dB) 13 20 20.5 21.5
NF (dB) 5.0 4.5 2.3 4.3
ICC (mA) 12 12 14 9.0
Package 6-pin super minimold
Marking C1G C1H C3H C3K
µPC2711TB µ PC2712TB µPC3215TB µ PC3224TB
2.9 3.2
Note µPC3215TB is f = 1.5 GHz Remark Typical performance. Please refer to ELECTRICAL CHARACTERISTICS in detail.
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Data Sheet PU10490EJ01V0DS
UPC3224TB
PIN EXPLANATIONS
PIN No. 1 Pin Name INPUT Applied Voltage (V) – Pin Voltage Note (V) 0.91 Signal input pin. A internal matching circuit, configured with resistors, enables 50 Ω connection over a wide band. A multi-feedback circuits is designed to cancel the deviations of hFE and resistance. This pin must be coupled to signal source with capacitor for DC cut. 4 OUTPUT – 4.42 Signal output pin. A internal matching circuit, configured with resistors, enables 50 Ω connection over a wide band. This pin must be coupled to next stage with capacitor for DC cut. 6 VCC 4.5 to 5.5 – Power suplly pin. This pin should be externally equipped with bypass capacitor to minimize its impedance. 2 3 5 GND 0 – Ground pin. This pin should be connected to system ground with minimum inductance. Ground pattern on the board should be formed as wide as possible. All the ground pins must be connected together with wide ground pattern to decrease impedance difference. Function and Applications
Note Pin Voltage is measured at VCC = 5.0 V
Data Sheet PU10490EJ01V0DS
3
UPC3224TB
ABSOLUTE MAXIMUM RATINGS
Parameter Supply Voltage Total Circuit Current Power Dissipation Operating Ambient Temperature Storage Temperature Input Power Symbol VCC ICC PD TA Tstg Pin TA = +25°C TA = +25°C TA = +25°C TA = +85°C Note Conditions Ratings 6.0 25 270 −40 to +85 −55 to +150 +10 Unit V mA mW °C °C dBm
Note Mounted on double-sided copper-clad 50 × 50 × 1.6 mm epoxy glass PWB
RECOMMENDED OPERATING RANGE
Parameter Supply Voltage Operating Ambient Temperature Symbol VCC TA Conditions MIN. 4.5 −40 TYP. 5.0 +25 MAX. 5.5 +85 Unit V °C
ELECTRICAL CHARACTERISTICS (TA = +25°C, VCC = 5.0 V, ZS = ZL = 50 Ω)
Parameter Circuit Current Power Gain Symbol ICC GP Test Conditions No input signal f = 1.0 GHz, Pin = −30 dBm f = 2.2 GHz, Pin = −30 dBm Saturated Output Power PO (sat) f = 1.0 GHz, Pin = −5 dBm f = 2.2 GHz, Pin = −5 dBm Gain 1 dB Compression Output Power Noise Figure NF PO (1 dB) f = 1.0 GHz f = 2.2 GHz f = 1.0 GHz f = 2.2 GHz Upper Limit Operating Frequency Isolation fu ISL 3 dB down below flat gain at f = 0.1 GHz f = 1.0 GHz, Pin = −30 dBm f = 2.2 GHz, Pin = −30 dBm Input Return Loss RLin f = 1.0 GHz, Pin = −30 dBm f = 2.2 GHz, Pin = −30 dBm Output Return Loss RLout f = 1.0 GHz, Pin = −30 dBm f = 2.2 GHz, Pin = −30 dBm Gain Flatness MIN. 7.0 19.0 18.5 +1.5 −1.5 −6.5 −8.5 − − 2.8 35.0 37.0 9.0 10.0 11.0 8.0 − TYP. 9.0 21.5 21.5 +4.0 +1.5 −3.5 −5.5 4.3 4.3 3.2 40.0 42.0 12.0 14.0 17.0 12.0 ±0.8 MAX. 12.0 24.0 24.5 − − − − 5.8 5.8 − − − − − − − − dB dB dB GHz dB dB dBm dBm Unit mA dB
∆GP
f = 0.1 to 2.2 GHz
4
Data Sheet PU10490EJ01V0DS
UPC3224TB
OTHER CHARACTERISTICS, FOR REFERENCE PURPOSES ONLY (TA = +25°C, VCC = 5.0 V, ZS = ZL = 50 Ω)
Parameter Output Intercept Point Symbol OIP3 Test Conditions f = 1.0 GHz f = 2.2 GHz Reference Value +7.0 +5.5 Unit dBm
Data Sheet PU10490EJ01V0DS
5
UPC3224TB
TEST CIRCUIT
VCC C4 1 000 pF
1 000 pF C3 6 50 Ω IN 100 pF C1 1 4 C2 100 pF 50 Ω OUT
2, 3, 5
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
COMPONENTS OF TEST CIRCUIT FOR MEASURING ELECTRICAL CHARACTERISTICS
Type C1, C2 C3 C4 Chip Capacitor Chip Capacitor Feed-through Capacitor Value 100 pF 1 000 pF 1 000 pF
CAPACITORS FOR THE VCC, INPUT AND OUTPUT PINS
Capacitors of 1000 pF are recommendable as the bypass capacitor for the VCC pin and the coupling capacitors for the input and output pins. The bypass capacitor connected to the VCC pin is used to minimize ground impedance of VCC pin. So, stable bias can be supplied against VCC fluctuation. The coupling capacitors, connected to the input and output pins, are used to cut the DC and minimize RF serial impedance. Their capacitances are therefore selected as lower impedance against a 50 Ω load. The capacitors thus perform as high pass filters, suppressing low frequencies to DC. To obtain a flat gain from 100 MHz upwards, 1 000 pF capacitors are used in the test circuit. In the case of under 10 MHz operation, increase the value of coupling capacitor such as 10 000 pF. Because the coupling capacitors are determined by equation, C = 1/(2 πRfc).
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Data Sheet PU10490EJ01V0DS
UPC3224TB
ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD
AMP-2
IN C1 C2
OUT
C3 VCC
C4
COMPONENT LIST
Value C1, C2 C3, C4 100 pF 1 000 pF
Notes 1. 2. 3. 4. 30 × 30 × 0.4 mm double sided copper clad polyimide board. Back side: GND pattern Solder plated on pattern : Through holes
Data Sheet PU10490EJ01V0DS
7
UPC3224TB
TYPICAL CHARACTERISTICS (TA = +25°C , unless otherw ise specified)
CIRCUIT CURRENT vs. OPERATING AMBIENT TEMPERATURE
12 11
Circuit Current ICC (mA)
CIRCUIT CURRENT vs. SUPPLY VOLTAGE
16 14
Circuit Current ICC (mA)
No input signal
No input signal VCC = 5.0 V
12 10 8 6 4 2 0 0 1 2 3 4 TA = − 40˚C 5 6 TA = +25˚C TA = +85˚C
10 9 8 7 6 − 60 − 40 − 20
0
+20 +40
+60 +80 +100
Supply Voltage VCC (V)
Operating Ambient Temperature TA (°C)
POWER GAIN vs. FREQUENCY
25 TA = +25˚C
Input Return Loss RLin (dB)
INPUT RETURN LOSS vs. FREQUENCY
10 TA = +25˚C
23
Power Gain GP (dB)
VCC = 5.5 V 21 VCC = 5.0 V 19 VCC = 4.5 V 17
0 − 10 − 20 − 30 VCC = 5.0 V
VCC = 5.5 V
VCC = 4.5 V 1.1 2.1 3.1 4.1 5.1
15 0.1
1.1
2.1
3.1
4.1
5.1
0.1
Frequency f (GHz)
Frequency f (GHz)
ISOLATION vs. FREQUENCY
0 − 20
Isolation ISL (dB)
OUTPUT RETURN LOSS vs. FREQUENCY
10 TA = +25˚C
TA = +25˚C
Output Return Loss RLout (dB)
0 − 10 VCC = 4.5 V − 20 − 30 0.1 1.1 VCC = 5.0 to 5.5 V 2.1 3.1 4.1 5.1
− 40 − 60 VCC = 4.5 to 5.5 V − 80
− 100 0.1
1.1
2.1
3.1
4.1
5.1
Frequency f (GHz)
Frequency f (GHz)
Remark The graphs indicate nominal characteristics.
8
Data Sheet PU10490EJ01V0DS
UPC3224TB
POWER GAIN vs. FREQUENCY
25 VCC = 5.0 V 23 10 VCC = 5.0 V
INPUT RETURN LOSS vs. FREQUENCY
Input Return Loss RLin (dB)
Power Gain GP (dB)
21
TA = − 40˚C
0 TA = +25 to +85˚C − 10 − 20 − 30
19
TA = +85˚C
TA = − 40˚C
17 TA = +25˚C 1.1 2.1 3.1 4.1 5.1
15 0.1
0.1
1.1
2.1
3.1
4.1
5.1
Frequency f (GHz)
Frequency f (GHz)
ISOLATION vs. FREQUENCY
0 − 20 VCC = 5.0 V
OUTPUT RETURN LOSS vs. FREQUENCY
10 VCC = 5.0 V
Output Return Loss RLout (dB)
Isolation ISL (dB)
0 − 10 − 20 TA = +25˚C − 30 0.1 1.1 2.1 TA = − 40˚C 3.1 4.1 5.1
− 40 − 60 − 80
TA = +85˚C
TA = − 40 to +85˚C
− 100 0.1
1.1
2.1
3.1
4.1
5.1
Frequency f (GHz)
Frequency f (GHz)
Remark The graphs indicate nominal characteristics.
Data Sheet PU10490EJ01V0DS
9
UPC3224TB
OUTPUT POWER vs. INPUT POWER
10 5 0 −5 − 10 − 15 − 20 − 40 − 35 − 30 − 25 − 20 − 15 − 10 − 5 Input Power Pin (dBm) f = 1.0 GHz TA = +25˚C VCC = 5.5 V VCC = 5.0 V VCC = 4.5 V
Output Power Pout (dBm)
OUTPUT POWER vs. INPUT POWER
10 5 0 TA = − 40˚C −5 − 10 − 15 − 20 − 40 − 35 − 30 − 25 − 20 − 15 − 10 − 5 Input Power Pin (dBm) f = 1.0 GHz VCC = 5.0 V TA = +25 to +85˚C
Output Power Pout (dBm)
0
5
10
0
5
10
OUTPUT POWER vs. INPUT POWER
10 5 0 −5 − 10 − 15 − 20 − 40 − 35 − 30 − 25 − 20 − 15 − 10 − 5 Input Power Pin (dBm) f = 2.2 GHz TA = +25˚C
Output Power Pout (dBm)
OUTPUT POWER vs. INPUT POWER
10 5 0 −5 − 10 − 15 − 20 − 40 − 35 − 30 − 25 − 20 − 15 − 10 − 5 Input Power Pin (dBm) TA = − 40˚C f = 2.2 GHz VCC = 5.0 V TA = +25 to +85˚C
Output Power Pout (dBm)
VCC = 5.5 V VCC = 5.0 V VCC = 4.5 V
0
5
10
0
5
10
Output Power (2 tones) Pout (dBm) 3rd Order Intermodulation Distortion IM3 (dBm)
10
Output Power (2 tones) Pout (dBm) 3rd Order Intermodulation Distortion IM3 (dBm)
OUTPUT POWER (2 tones), IM3 vs. INPUT POWER
f1 = 1 000 MHz 0 f2 = 1 001 MHz Pout 5.5 V VCC = 5.5 V 5.0 V 4.5 V 5.0 V 4.5 V
OUTPUT POWER (2 tones), IM3 vs. INPUT POWER
10 f1 = 2 200 MHz 0 f2 = 2 201 MHz Pout VCC = 5.5 V 5.0 V 4.5 V 5.5 V 5.0 V 4.5 V
− 10 − 20 − 30 − 40 − 50 VCC = 4.5 V − 60 − 70
− 10 − 20 − 30 − 40 − 50 − 60 − 70 IM3
IM3
VCC = 5.5 V 0
VCC = 5.0 V − 80 − 50 − 45 − 40 − 35 − 30 − 25 − 20 − 15 − 10 − 5 Input Power Pin (dBm)
− 80 − 50 − 45 − 40 − 35 − 30 − 25 − 20 − 15 − 10 − 5 Input Power Pin (dBm)
0
Remark The graphs indicate nominal characteristics.
10
Data Sheet PU10490EJ01V0DS
UPC3224TB
S-PARAMETERS (TA = +25°C, VCC = 5.0 V)
S11−FREQUENCY
2.2 GHz 1.0 GHz
S22−FREQUENCY
1.0 GHz 2.2 GHz
Data Sheet PU10490EJ01V0DS
11
UPC3224TB
PACKAGE DIMENSIONS 6-PIN SUPER MINIMOLD (UNIT: mm)
2.1±0.1 1.25±0.1
2.0±0.2
1.3
0.65
0.65
0.1 MIN.
0.9±0.1
0.7
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Data Sheet PU10490EJ01V0DS
0 to 0.1
0.15+0.1 –0.05
0.2+0.1 –0.05
UPC3224TB
NOTES ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation). All the ground pins must be connected together with wide ground pattern to decrease impedance difference. (3) The bypass capacitor should be attached to VCC line. (4) The DC cut capacitor must be each attached to input and output pin.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions. methods and conditions other than those recommended below, contact your nearby sales office.
Soldering Method Infrared Reflow Soldering Conditions Peak temperature (package surface temperature) Time at peak temperature Time at temperature of 220°C or higher Preheating time at 120 to 180°C Maximum number of reflow processes Maximum chlorine content of rosin flux (% mass) Wave Soldering Peak temperature (molten solder temperature) Time at peak temperature Maximum number of flow processes Maximum chlorine content of rosin flux (% mass) Partial Heating Peak temperature (pin temperature) Soldering time (per side of device) Maximum chlorine content of rosin flux (% mass) : 260°C or below : 10 seconds or less : 60 seconds or less : 120±30 seconds : 3 times : 0.2%(Wt.) or below : 260°C or below : 10 seconds or less : 1 time : 0.2%(Wt.) or below : 350°C or below : 3 seconds or less : 0.2%(Wt.) or below HS350 WS260 Condition Symbol IR260
For soldering
Preheating temperature (package surface temperature) : 120°C or below
Caution Do not use different soldering methods together (except for partial heating).
Data Sheet PU10490EJ01V0DS
13
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CEL certifies, to its knowledge, that semiconductor and laser products detailed below are compliant with the requirements of European Union (EU) Directive 2002/95/EC Restriction on Use of Hazardous Substances in electrical and electronic equipment (RoHS) and the requirements of EU Directive 2003/11/EC Restriction on Penta and Octa BDE. CEL Pb-free products have the same base part number with a suffix added. The suffix –A indicates that the device is Pb-free. The –AZ suffix is used to designate devices containing Pb which are exempted from the requirement of RoHS directive (*). In all cases the devices have Pb-free terminals. All devices with these suffixes meet the requirements of the RoHS directive. This status is based on CEL’s understanding of the EU Directives and knowledge of the materials that go into its products as of the date of disclosure of this information.
Restricted Substance per RoHS Lead (Pb) Mercury Cadmium Hexavalent Chromium PBB PBDE Concentration Limit per RoHS (values are not yet fixed) < 1000 PPM < 1000 PPM < 100 PPM < 1000 PPM < 1000 PPM < 1000 PPM Concentration contained in CEL devices -A Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected -AZ (*)
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