UPC8172TB

SILICON RFIC 2.5 GHz FREQUENCY UP-CONVERTER FOR WIRELESS TRANSCEIVER FEATURES • RECOMMENDED OPERATING FREQUENCY: fRFout = 0.8 to 2.5 GHz • SUPPLY VOLTAGE: VCC = 2.7 to 3.3 V • HIGHER IP3 AND CONVERSION GAIN: CG = 9.5 dB TYP OIP3 = +7.5 dBm TYP @ fRFout = 0.9 GHz • HIGH-DENSITY SURFACE MOUNTING: 6-pin super minimold package UPC8172TB BLOCK DIAGRAM (Top View) LO input PS GND VCC IF input RF output DESCRIPTION NEC's UPC8172TB is a silicon monolithic integrated circuit designed as a frequency up-converter for a wireless transceiver transmitter stage. This IC is manufactured using NEC's 30 GHz fmax UHS0 (Ultra High Speed Process) silicon bipolar process. This IC has the same circuit current as the conventional UPC8106TB, but operates at higher frequency, higher gain and lower distortion. Such performance and operation from a 3 volts supply makes this device ideal for mobile communications and wireless LAN applications. NEC's stringent quality assurance and test procedures ensure the highest reliability and performance. APPLICATIONS • PCS1900 MHz • 2.4 GHz band transmitter/receiver system (wireless LAN, etc.) ELECTRICAL CHARACTERISTICS (TA = 25°C, VCC = VRFOUT = 3.0 V, fIFin = 240 MHz, PLOin = -5 dBm, and VPS ≥2.7 V unless otherwise specified)) PART NUMBER PACKAGE OUTLINE SYMBOLS ICC ICC(PS) CG1 CG2 CG3 PO(SAT)1 PO(SAT)2 PO(SAT)3 OIP31 OIP32 OIP33 IIP31 IIP32 IIP33 SSB•NF1 SSB•NF2 SSB•NF3 TPS(rise) TPS(fall) PARAMETERS AND CONDITIONS1 Circuit Current (no signal) Circuit Current in Power Save Mode, VPS = 0 V fRFout = 0.9 GHz, PIFin = -30 dBm Conversion Gain, fRFout = 1.9 GHz, PIFin = -30 dBm fRFout = 2.4 GHz, PIFin = -30 dBm fRFout = 0.9 GHz, PIFin = 0 dBm Saturated RF Output Power, fRFout = 1.9 GHz, PIFin = 0 dBm fRFout = 2.4 GHz, PIFin = 0 dBm Output Third-Order Distortion Intercept Point, fRFout = 0.9 GHz fIFin1 = 240 MHz fRFout = 1.9 GHz fIFin2 = 241 MHz fRFout = 2.4 GHz Input Third-Order Distortion Intercept Point, fRFout = 0.9 GHz fIFin1 = 240 MHz fRFout = 1.9 GHz fIFin2 = 241 MHz fRFout = 2.4 GHz fRFout = 0.9 GHz, fIFin1 = 240 MHz SSB Noise Figure, fRFout = 1.9 GHz, fIFin1 = 240 MHz fRFout = 2.4 GHz, fIFin1 = 240 MHz Power Save Response Time Rise Time, VPS: GND’VCC Fall Time, VPS: VCC’GND UNITS mA µA dB dB dB dBm dBm dBm dBm dBm dBm dBm dBm dBm dB dB dB µs µs MIN 5.5 – 6.5 5.5 5.0 -2.5 -3.5 -4.0 – – – – – – – – – – – UPC8172TB S06 TYP 9.0 – 9.5 8.5 8.0 0.5 0 -0.5 7.5 6.0 4.0 -2.0 -2.5 -4.0 9.5 10.4 10.6 1 1.5 MAX 13.0 2 12.5 11.5 11.0 – – – – – – – – – – – – – – Note: 1. fRFout < fLOin @ fRFout = 0.9 GHz fLOin < fRFout @ fRFout = 1.9 GHz/2.4 GHz California Eastern Laboratories UPC8172TB ABSOLUTE MAXIMUM RATINGS1 (TA = +25°C unless otherwise specified) SYMBOLS VCC VPS PD TA TSTG PIN PARAMETERS Supply Voltage PS Pin Input Voltage Power Dissipation2 Operating Ambient Temperature Storage Temperature Input Power UNITS V V mW °C °C dBm RATINGS 3.6 3.6 270 -40 to +85 -55 to +150 +10 PLOin fRFout fIFin RECOMMENDED OPERATING CONDITIONS SYMBOLS VCC TA PARAMETERS Supply Voltage1 Operating Ambient Temperature Local Input Level2 RF Output Frequency3 IF Input Frequency UNITS MIN V ˚C dBm GHz MHz 2.7 -40 -10 0.8 50 TYP MAX 3.0 +25 -5 – – 3.3 +85 0 2.5 400 Notes: 1. Operation in excess of any one of these conditions may result in permanent damage. 2. Mounted on a double-sided copper clad 50x50x1.6 mm epoxy glass PWB, TA = +85°C. Note: 1. Same voltage applied to pins 5 and 6. 2. ZS = 50 Ω (without matching). 3. With external matching circuit. SERIES PRODUCTS1 (TA = +25°C, VCC = VRFout = 3.0 V, ZS = ZL = 50 Ω) Part Number UPC8172TB UPC8106TB UPC8109TB UPC8163TB ICC (mA) 9 9 5 16.5 fRFout (GHz) 0.8 to 2.5 0.4 to 2.0 0.4 to 2.0 0.8 to 2.0 @RF 0.9 GHz2 9.5 9 6 9 CG (dB @RF 1.9 GHz 8.5 7 4 5.5 @RF 2.4 GHz 8.0 – – – @RF 0.9 GHz2 +7.5 +5.5 +1.5 +9.5 OIP3 (dBm) @RF 1.9 GHz +6.0 -1.0 +2.0 +6.0 @RF 2.4 GHz +4.0 – – – Notes: 1. Typical performance. 2. fRFout = 0.83 GHz @ UPC8163TB PIN FUNCTIONS (Voltage is measured at VCC = VPS = VRFOUT = 3.0 V) Pin No. 1 Pin Name IFinput Applied Voltage (V) — Pin Voltage (V) 1.4 Function and Explanation Equivalent Circuit This pin is the IF input pin to the double balanced mixer (DBM). The input is designed as a high impedance. The circuit helps suppress spurious signals. Also this symmetrical circuit can keep specified performance insensitive to processcondition distribution. For that reason, a double balanced mixer is adopted. GND pin. Ground pattern on the board should be formed as wide as possible. Track length should be kept as short as possible to minimize ground inductance. Local input pin. Recommendable input level is -10 to 0 dBm. Supply voltage pin. This pin is the RF output from the double balanced mixer. This pin is designed as an open collector. Due to the high impedance output, this pin should be externally equipped with an LC matching circuit to the next stage. Power save control pin. Bias controls operate as follows: Pin Bias VCC GND Control Operation Power Save 5 6 3 2 GND GND — 1 3 5 6 LOinput VCC – 2.7 to 3.3 2.3 — — 2 RFoutput Same bias as VCC through external inductor PS VCC/GND 4 VCC 5 4 GND 2 UPC8172TB TYPICAL PERFORMANCE CURVES (TA = 25°C) CIRCUIT CURRENT vs. SUPPLY VOLTAGE 12 10 12 CIRCUIT CURRENT vs. PS PIN INPUT VOLTAGE 10 Circuit Current, ICC (mA) 8 TA = +85°C Circuit Current, ICC (mA) no signal VCC = VPS 8 6 TA = +25°C 4 TA = -40°C 2 6 4 2 VCC = 3.0 V 0 0 0 1 2 3 4 0 1 2 3 4 Supply Voltage, VCC (V) PS Pin Input Voltage, VPS (V) PS PIN CONTROL RESPONSE TIME 15 CONVERSION GAIN vs. LOCAL INPUT LEVEL REF LVL = 0 dBm Conversion Gain, CG (dB) ATT = 10 dB 10 dB/DIV (Vertical axis) CENTER = 0.9 GHz SPAN = 0 Hz RBW = 3 MHz VBW = 3 MHz SWP = 50 µsec 5 µsec/DIV (Horizontal axis) 10 VCC = 3.0 V 5 0 -5 fRFout = 900 MHz fLOin = 1140 MHz PIFin = -30 dBm VCC = VPS -25 -20 -15 -10 -5 0 5 10 -10 -15 -30 Local Input Level, PLOin (dBm) RF OUTPUT LEVEL vs. IF INPUT LEVEL 5 15 CONVERSION GAIN vs. LOCAL INPUT LEVEL RF Output Level, PRFout (dBm) VCC = 3.0 V -5 Conversion Gain, CG (dB) 0 10 VCC = 3.0 V 5 -10 0 -15 fRFout = 900 MHz fLOin = 1140 MHz PLOin = -5 dBm VCC = VPS -30 -25 -20 -15 -10 -5 0 5 10 -5 fRFout = 1.9 GHz fLOin = 1660 MHz PLOin = -30 dBm VCC = VPS -20 -10 -25 -15 -30 -25 -20 -15 -10 -5 0 5 10 IF Input Level, PIFin (dBm) Local Input Level, PLOin (dBm) UPC8172TB TYPICAL PERFORMANCE CURVES (TA = 25°C) RF OUTPUT LEVEL vs. IF INPUT LEVEL 5 CONVERSION GAIN vs. LOCAL INPUT LEVEL 15 RF Output Level, PRFout (dBm) VCC = 3.0 V -5 Conversion Gain, CG (dB) 0 10 VCC = 3.0 V 5 -10 0 -15 fRFout = 1.9 GHz fLOin = 1660 MHz PLOin = -5 dBm VCC = VPS –5 fRFout = 2.4 GHz fLOin = 2160 MHz PIFin = –30 dBm VCC = VPS –25 –20 –15 –10 –5 0 5 10 -20 –10 -25 -30 -25 -20 -15 -10 -5 0 5 10 –15 –30 IF Input Level, PIFin (dBm) Local Input Level, PLOin (dBm) 5 3rd Order Intermodulation Distortion, IM3 (dBm) RF Output Level of Each Tone, PRFout (dBm) RF OUTPUT LEVEL vs. IF INPUT LEVEL IM3, RF OUTPUT LEVEL vs. IF INPUT LEVEL 10 0 –10 –20 –30 –40 –50 –60 –70 –80 –30 TA = +25ºC Vcc = VPS = 3.0 V fRFout = 900 MHz fIFin1 = 240 MHz fIFin2 = 241 MHz fLOin = 1140 MHz PLOin = –5 dBm RF Output Level, PRFout (dBm) 0 VCC = 3.0 V –5 –10 –15 fRFout = 2.4 GHz fLOin = 2160 MHz PLOin = –5 dBm VCC = VPS –20 –25 –30 –25 –20 –15 –10 –5 0 5 10 –25 –20 –15 –10 –5 0 5 IF Input Level, PIFin (dBm) IF Input Level, PIFin (dBm) 3rd Order Intermodulation Distortion, IM3 (dBm) RF Output Level of Each Tone, PRFout (dBm) 10 0 –10 –20 –30 –40 –50 –60 –70 –80 –30 TA = +25ºC Vcc = VPS = 3.0 V fRFout = 1.9 GHz fIFin1 = 240 MHz fIFin2 = 241 MHz fLOin = 1660 MHz PLOin = –5 dBm –25 –20 –15 –10 –5 0 5 3rd Order Intermodulation Distortion, IM3 (dBm) RF Output Level of Each Tone, PRFout (dBm) IM3, RF OUTPUT LEVEL vs. IF INPUT LEVEL IM3, RF OUTPUT LEVEL vs. IF INPUT LEVEL 10 0 –10 –20 –30 –40 –50 –60 –70 –80 –30 TA = +25ºC Vcc = VPS = 3.0 V fRFout = 2.4 GHz fIFin1 = 240 MHz fIFin2 = 241 MHz fLOin = 2160 MHz PLOin = –5 dBm –25 –20 –15 –10 –5 0 5 IF Input Level, PIFin (dBm) IF Input Level, PIFin (dBm) UPC8172TB TYPICAL PERFORMANCE CURVES (TA = 25°C) LOCAL LEAKAGE AT IF PIN vs. LOCAL INPUT FREQUENCY 0 0 LOCAL LEAKAGE AT IF PIN vs. LOCAL INPUT FREQUENCY Local Leakage at IF Pin, LOif (dBm) –10 Local Leakage at IF Pin LOif (dBm) –10 –20 –20 –30 –30 –40 fRFout = 900 MHz PLOin = –5 dBm Vcc = VPS = 3.0 V 0 0.5 1 1.5 2 2.5 3 –40 fRFout = 1.9 GHz PLOin = –5 dBm Vcc = VPS = 3.0 V 0 0.5 1 1.5 2 2.5 3 –50 –50 Local Input Frequency, fLOin (GHz) Local Input Frequency, fLOin (GHz) LOCAL LEAKAGE AT RF PIN vs. LOCAL INPUT FREQUENCY 0 0 LOCAL LEAKAGE AT RF PIN vs. LOCAL INPUT FREQUENCY Local Leakage at RF Pin, LOrf (dBm) Local Leakage at RF Pin LOrf, (dBm) –10 –10 –20 –20 –30 –30 –40 –40 fRFout = 900 MHz PLOin = –5 dBm Vcc = VPS = 3.0 V 0 0.5 1 1.5 2 2.5 3 fRFout = 1.9 GHz PLOin = –5 dBm Vcc = VPS = 3.0 V 0 0.5 1 1.5 2 2.5 3 –50 –50 Local Input Frequency, fLOin (GHz) Local Input Frequency, fLOin (GHz) LOCAL LEAKAGE AT IF PIN vs. LOCAL INPUT FREQUENCY 0 LOCAL LEAKAGE AT RF PIN vs. LOCAL INPUT FREQUENCY 0 –10 Local Leakage at RF Pin LOrf, (dBm) Local Leakage at IF Pin LOrf, (dBm) –10 –20 –20 –30 –30 –40 fRFout = 2.4 GHz PLOin = –5 dBm Vcc = VPS = 3.0 V 0 0.5 1 1.5 2 2.5 3 –40 fRFout = 2.4 GHz PLOin = –5 dBm Vcc = VPS = 3.0 V 0 0.5 1 1.5 2 2.5 3 –50 –50 Local Input Frequency, fLOin (GHz) Local Input Frequency, fLOin (GHz) UPC8172TB SYSTEM APPLICATION EXAMPLE Wireless Transceiver LNA RX DEMO I Q VCO SW ÷N PLL PLL I 0˚ TX PA Phase Shifter 90˚ UPC8172TB Q UPC8172TB S-PARAMETERS FOR EACH PORT (VCC (The paramters are monitored at DUT pins) = VPS = VRFout = 3.0 V) LO port RF port (without matching) S11 Z REF 1.0 Units 1 200.0 mUnits/ 21.625 Ω -91.148 Ω hp MARKER 1 1.15 GHz MARKER 2 1.65 GHz MARKER 3 2.15 GHz Z S22 REF 1.0 Units 1 200.0 mUnits/ 71.5 Ω -240.34 Ω hp MARKER 1 900 MHz MARKER 2 1.9 GHz MARKER 3 2.5 GHz 1 3 3 2 START STOP 0.400000000 GHz 2.500000000 GHz IF port S11 Z REF 1.0 Units 1 200.0 mUnits/ 332.63 Ω -601.34 Ω hp MARKER 1 240.0 MHz 1 START STOP 0.100000000 GHz 1.000000000 GHz ∆ ∆ ∆ 1 2 START STOP 0.400000000 GHz 2.500000000 GHz UPC8172TB TEST CIRCUIT 1 (fRFout = 900 MHz) Strip Line Spectrum Analyzer 50 Ω 100 pF 1 pF 6 C3 C8 L 10 nH 5 VCC 100 pF VCC C5 C7 C6 C4 1000 pF 4 PS GND LOinput 2 100 pF 3 C2 50 Ω Signal Generator RFoutput IFinput 1 C1 50 Ω 100 pF Signal Generator 1 µF 68 pF 1 µF EXAMPLE OF TEST CIRCUIT 1 ASSEMBLED ON EVALUATION BOARD LOinput C2 C4 PS PS Bias GND VCC C5 C7 C6 Voltage Supply L C8 IFinput C1 C3 RFoutput UPC8172TB COMPONENT LIST FORM Chip Capacitor SYMBOL C1, C2, C3 C4 C5, C6 C7 C8 Chip Inductor Note: 1. 10 nH: LL1608-FH10N (TOKO Co., Ltd.) L VALUE 100 pF 1000 pF 1 µF 68 pF 1 pF 10 nH1 (*1) 35x42x0.4 mm polymide board, double-sided copper clad (*2) Ground pattern on rear of the board (*3) Solder plated patterns (*4) mmm : Through holes UPC8172TB TEST CIRCUIT 2 (fRFout = 1.9 GHz) Strip Line Spectrum Analyzer 50 Ω 100 pF C3 2.75 pF C8 L 470 nH 5 VCC 100 pF VCC C5 C7 C6 C4 1000 pF 4 PS GND LOinput 2 100 pF 3 C2 50 Ω Signal Generator 100 pF 6 RFoutput IFinput 1 C1 50 Ω Signal Generator 1 µF 30 pF 1 µF EXAMPLE OF TEST CIRCUIT 2 ASSEMBLED ON EVALUATION BOARD LOinput C2 C4 PS PS Bias GND VCC C5 C7 C6 Voltage Supply L IFinput C1 C3 RFoutput UPC8172TB COMPONENT LIST FORM Chip Capacitor SYMBOL C1, C2, C3 C4 C5, C6 C7 C8 Chip Inductor Note: 1. 470 nH: LL2012-FR47 (TOKO Co., Ltd.) L VALUE 100 pF 1000 pF 1 µF 30 pF 2.75 pF 470 nH1 (*1) 35 x 42 x 0.4 mm polymide board, double-sided copper clad (*2) Ground pattern on rear of the board (*3) Solder plated patterns (*4) m m m: Through holes UPC8172TB TEST CIRCUIT 3 (fRFout = 2.4 GHz) Strip Line Spectrum Analyzer 50 Ω 100 pF C3 1.75 pF C8 L 470 nH 5 VCC 100 pF VCC C5 C7 C6 C4 1000 pF 4 PS GND LOinput 2 100 pF 3 C2 50 Ω Signal Generator 100 pF 6 RFoutput IFinput 1 C1 50 Ω Signal Generator 1 µF 10 pF 1 µF EXAMPLE OF TEST CIRCUIT 3 ASSEMBLED ON EVALUATION BOARD LOinput C2 C4 PS Bias PS GND L VCC C5 C7 C6 Voltage Supply IFinput C1 C8 C3 RFoutput UPC8172TB COMPONENT LIST FORM Chip Capacitor SYMBOL C1, C2, C3 C4 C5, C6 C7 C8 Chip Inductor Note: 1. 470 nH: LL2012-FR47 (TOKO Co., Ltd.) L VALUE 100 pF 1000 pF 1 µF 10 pF 1.75 pF 470 nH1 (*1) 35 x 42 x 0.4 mm polymide board, double-sided copper clad (*2) Ground pattern on rear of the board (*3) Solder plated patterns (*4) m m m: Through holes UPC8172TB OUTLINE DIMENSIONS (Units in mm) PACKAGE OUTLINE S06 2.1 ±0.1 BLOCK DIAGRAM (Top View) LO input 1.25 ±0.1 PS 0.2 -0.05 2.0 ±0.2 1.3 0.65 0.65 +0.10 GND VCC IF input RF output 0.1 MIN 0.9 ± 0.1 0.7 0 to 0.1 0.15 +0.10 -0.05 Note: All dimensions are typical unless otherwise specified. PIN CONNECTIONS (Top View) (Bottom View) 4 5 6 4 5 6 3 2 1 PIN NO. 1 2 3 4 5 6 PIN NAME IFinput GND LOinput PS VCC RFoutput 3 2 1 ORDERING INFORMATION Part Number UPC8172TB-E3-A Quantity 3 K pcs/reel Note: Embossed tape, 8 mm wide. Pins 1, 2 and 3 face the tape perforation side. Life Support Applications These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably be expected to result in personal injury. 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C3A EXCLUSIVE NORTH AMERICAN AGENT FOR RF, MICROWAVE & OPTOELECTRONIC SEMICONDUCTORS CALIFORNIA EASTERN LABORATORIES • Headquarters • 4590 Patrick Henry Drive • Santa Clara, CA 95054-1817 • (408) 988-3500 • Telex 34-6393 • FAX (408) 988-0279 24-Hour Fax-On-Demand: 800-390-3232 (U.S. and Canada only) • Internet: http://WWW.CEL.COM 06/14/2001 DATA SUBJECT TO CHANGE WITHOUT NOTICE 5-150 4590 Patrick Henry Drive Santa Clara, CA 95054-1817 Telephone: (408) 919-2500 Facsimile: (408) 988-0279 Subject: Compliance with EU Directives CEL certifies, to its knowledge, that semiconductor and laser products detailed below are compliant with the requirements of European Union (EU) Directive 2002/95/EC Restriction on Use of Hazardous Substances in electrical and electronic equipment (RoHS) and the requirements of EU Directive 2003/11/EC Restriction on Penta and Octa BDE. CEL Pb-free products have the same base part number with a suffix added. The suffix –A indicates that the device is Pb-free. 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