UPC8178TB

SILICON RFIC LOW CURRENT AMPLIFIER FOR MOBILE COMMUNICATIONS FEATURES • LOW CURRENT CONSUMPTION ICC = 1.9 mA TYP @ VCC = 3.0 V • SUPPLY VOLTAGE: VCC = 2.4 to 3.3 V • EXCELLENT ISOLATION: ISOL = 39 dB TYP @ f = 1.0 GHz ISOL = 40 dB TYP @ f = 1.9 GHz ISOL = 38 dB TYP @ f = 2.4 GHz • POWER GAIN: GP = 11.0 dB TYP @ f = 1.0 GHz GP = 11.5 dB TYP @ f = 1.9 GHz GP = 11.5 dB TYP @ f = 2.4 GHz • OPERATING FREQUENCY: 0.1 to 2.4 GHz (Output port LC matching) • 1 dB GAIN COMPRESSION OUTPUT POWER: PO(1 dB) = -4.0 dBm TYP @ f = 1.0 GHz PO(1 dB) = -7.0 dBm TYP @ f = 1.9 GHz PO(1 dB) = -7.5 dBm TYP @ f = 2.4 GHz • HIGH-DENSITY SURFACE MOUNTING: 6-pin super minimold package (2.0 x 1.25 x 0.9 mm) • LOW WEIGHT: 7 mg (Standard Value) +20 UPC8178TB POWER GAIN vs. FREQUENCY VCC = 3.0 V 1.0 GHz +10 TA = -40°C TA = +25°C TA = +85°C 0 2.4 GHz -10 -20 1.9 GHz -30 -40 0.1 0.3 1.0 3.0 DESCRIPTION The UPC8178TB is a silicon monolithic integrated circuit designed as an amplifier for mobile communications. This IC can realize low current consumption with an external chip inductor which cannot be realized on an internal 50 Ω wideband matched IC. This low current amplifier operates on 3.0 V. This device is manufactured using NEC's 30 GHz fmax UHS0 (Ultra High Speed Process) silicon bipolar process which uses direct silicon nitride passivation film and gold electrodes. These materials can protect the chip surface from pollution and prevent corrosion/migration. Thus, this IC has excellent performance, uniformity and reliability. NEC's stringent quality assurance and test procedures ensure the highest reliability and performance. UPC8178TB S06 UNITS mA dB dB dB dB dB dB dBm dBm dBm dB dB dB dB dB dB MIN 1.4 9.0 9.0 9.0 34 35 33 -8.0 -11.0 -11.5 – – – 4 5 6.5 TYP 1.9 11.0 11.5 11.5 39 40 38 -4.0 -7.0 -7.5 5.5 5.5 5.5 7 8 9.5 MAX 2.4 13.0 13.5 13.5 – – – – – – 7.0 7.0 7.0 – – – APPLICATIONS • Buffer Amplifiers on 0.1 to 2.4 GHz mobile communications system ELECTRICAL CHARACTERISTICS PART NUMBER PACKAGE OUTLINE SYMBOLS ICC GP Power Gain ISOL Isolation PO(1dB) 1 dB Gain Compression Output Power NF Noise Figure RLin Input Return Loss f = 1.0 GHz f = 1.9 GHz f = 2.4 GHz f = 1.0 GHz f = 1.9 GHz f = 2.4 GHz PARAMETERS AND CONDITIONS1 Circuit Current (no signal) f = 1.0 GHz f = 1.9 GHz f = 2.4 GHz f = 1.0 GHz f = 1.9 GHz f = 2.4 GHz (TA = 25°C, VCC = VOUT = 3.0 V, ZS = ZL = 50 Ω, at LC matched frequency unless otherwise specified)) f = 1.0 GHz f = 1.9 GHz f = 2.4 GHz California Eastern Laboratories UPC8178TB ABSOLUTE MAXIMUM RATINGS1 (TA = +25°C unless otherwise specified) SYMBOLS VCC ICC PD TA TSTG PIN PARAMETERS Supply Voltage2 UNITS V mA mW °C °C dBm RATINGS 3.6 15 270 -40 to +85 -55 to +150 +5 RECOMMENDED OPERATING CONDITIONS SYMBOLS VCC TA PARAMETERS Supply Voltage1 Operating Ambient Temperature UNITS MIN V ˚C 2.4 -40 TYP MAX 3.0 +25 3.3 +85 Circuit Current Power Dissipation3 Operating Ambient Temperature Storage Temperature Input Power Note: 1. Same voltage applied to pins 4 and 6. Notes: 1. Operation in excess of any one of these conditions may result in permanent damage. 2. Pins 4 and 6. 3. Mounted on a double-sided copper clad 50x50x1.6 mm epoxy glass PWB, TA = +85°C. SERIES PRODUCTS1 (TA = +25°C, VCC = Vout = 3.0 V, ZS = ZL = 50 Ω) Parameter ICC (mA) 1.9 4.0 2.8 4.2 5.6 1.0 GHz output port matching frequency GP ISOL PO(1 dB) (dB) (dB) (dBm) 11 39 -4.0 13.5 44 +3.0 12.5 12.5 23 39 38 40 -4.0 +2.5 -4.5 1.66 GHz output port matching frequency GP ISOL PO(1 dB) (dB) (dB) (dBm) – – – – – – 13 15 19.5 39 36 38 -4.0 +1.5 -8.5 1.9 GHz output port matching frequency GP ISOL PO(1 dB) (dB) (dB) (dBm) 11.5 40 -7.0 15.5 42 +1.5 13 15 17.5 37 34 35 -4.0 +0.5 -8.5 2.4 GHz output port matching frequency GP ISOL PO(1 dB) (dB) (dB) (dBm) 11.5 38 -7.5 15.5 41 +1.0 – – – – – – – – – Marking Part No. UPC8178TB UPC8179TB UPC8128TB UPC8151TB UPC8152TB Note: 1. Typical performance. C3B C3C C2P C2U C2V PIN FUNCTIONS (Pin Voltage is measured at VCC = 3.0 V) Pin No. 1 Pin Name Input Applied Voltage (V) — Pin Voltage (V) 0.91 Function and Applications Internal Equivalent Circuit Signal input pin. An internal matching circuit, configured with resistors, enables a 50 Ω connection over a wide band. This pin must be coupled to the signal source with the capacitor for DC out. Ground pin. This pin should be connected to the system ground with minimum inductance. Ground pattern on the board should be formed as wide as possible. All the ground pins must be connected together with a wide ground pattern to decrease impedance difference. Signal output pin. This pin is designed as the collector output. Due to the high impedance output, this pin should be externally equipped with LC matching circuit to next stage. For L, a size 1005 chip inductor can be used. Power supply pin. This pin should be externally equipped with a bypass capacitor to minimize it's impedance. 3 1 6 4 2 3 5 GND 0 — 4 Output Voltage same as VCC through external inductor 2.4 to 3.3 – 2 6 VCC 5 UPC8178TB TEST CIRCUIT 1 (f = 1.0 GHz) VCC C3 C4 Output port matching circuit 6 50Ω IN C1 1 4 L1 C2 C3 50 Ω OUT 2, 3, 5 EXAMPLE OF TEST CIRCUIT 1 ASSEMBLED ON EVALUATION BOARD f = 1.0 GHz Top View C3B IN Connector C1 C4 Mounting direction COMPONENT LIST 1.0 GHz Output Port Matching C1, C3, C5 C2 C4 L1 1000 pF 0.75 pF 10 pF 12 nH AMP. 4 C2 C5 C3 OUT Connector L1 UPC8178TB TEST CIRCUIT 2 (f = 1.9 GHz) VCC C4 C5 C6 Output port matching circuit 6 50Ω IN C1 1 4 L1 C2 C3 50 Ω OUT 2, 3, 5 EXAMPLE OF TEST CIRCUIT 2 ASSEMBLED ON EVALUATION BOARD f = 1.9 GHz Top View C3B IN Connector C1 C4 C5 Mounting direction COMPONENT LIST 1.9 GHz Output Port Matching C1, C3, C5, C6 C2 C4 L1 1000 pF 0.5 pF 10 pF 3.9 nH AMP. 4 C2 C6 C3 OUT Connector L1 UPC8178TB TEST CIRCUIT 3 (f = 2.4 GHz) VCC C3 C4 C5 Output port matching circuit 6 50Ω IN C1 1 4 L1 50 Ω OUT L2 C2 2, 3, 5 EXAMPLE OF TEST CIRCUIT 3 ASSEMBLED ON EVALUATION BOARD f = 2.4 GHz Top View C3B IN Connector C1 Mounting direction C3 C4 COMPONENT LIST 2.4 GHz Output Port Matching C1, C3, C4, C5 C3 L1 L2 1000 pF 10 pF 1.8 nH 2.7 nH NOTES: 1. 42 x 35 x 0.4 mm double sided copper clad polyimide board. 2. Solder plated on pattern. 3. Back side: GND pattern. 4. Through holes. AMP. 4 L2 C2 OUT Connector L1 C5 UPC8178TB OUTLINE DIMENSIONS (Units in mm) PACKAGE OUTLINE S06 PIN CONNECTIONS (Top View) (Bottom View) 4 5 6 4 5 6 3 2 1 2.1 ±0.1 1.25 ±0.1 3 +0.10 0.2 -0.05 2.0 ±0.2 1.3 0.65 0.65 2 1 0.1 MIN PIN NO. 1 2 3 4 C3B PIN NAME Input GND GND Output GND VCC 5 6 DEMOD PLL 0.9 ± 0.1 0.7 0 to 0.1 0.15 +0.10 -0.05 Note: All dimensions are typical unless otherwise specified. SYSTEM APPLICATION EXAMPLE Location examples in digital cellular LNA RX I Q SW ÷N PLL I 0˚ TX PA φ 90˚ Q ORDERING INFORMATION Part Number UPC8178TB-E3-A Quantity 3 K pcs/reel Life Support Applications perforation side. These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably be expected to result in personal injury. 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Pins 1, 2 and 3 face the tape EXCLUSIVE NORTH AMERICAN AGENT FOR RF, MICROWAVE & OPTOELECTRONIC SEMICONDUCTORS CALIFORNIA EASTERN LABORATORIES • Headquarters • 4590 Patrick Henry Drive • Santa Clara, CA 95054-1817 • (408) 988-3500 • Telex 34-6393 • FAX (408) 988-0279 24-Hour Fax-On-Demand: 800-390-3232 (U.S. and Canada only) • Internet: http://WWW.CEL.COM 06/20/2001 DATA SUBJECT TO CHANGE WITHOUT NOTICE 4590 Patrick Henry Drive Santa Clara, CA 95054-1817 Telephone: (408) 919-2500 Facsimile: (408) 988-0279 Subject: Compliance with EU Directives CEL certifies, to its knowledge, that semiconductor and laser products detailed below are compliant with the requirements of European Union (EU) Directive 2002/95/EC Restriction on Use of Hazardous Substances in electrical and electronic equipment (RoHS) and the requirements of EU Directive 2003/11/EC Restriction on Penta and Octa BDE. CEL Pb-free products have the same base part number with a suffix added. 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