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UPC8179TB

UPC8179TB

  • 厂商:

    CEL

  • 封装:

  • 描述:

    UPC8179TB - SILICON RFIC LOW CURRENT AMPLIFIER FOR MOBILE COMMUNICATIONS - California Eastern Labs

  • 数据手册
  • 价格&库存
UPC8179TB 数据手册
SILICON RFIC LOW CURRENT AMPLIFIER UPC8179TB FOR MOBILE COMMUNICATIONS FEATURES • HIGH DENSITY SURFACE MOUNTING: 6 Pin Super Minimold Package (2.0 x 1.25 x 0.9 mm) • SUPPLY VOLTAGE: VCC = 2.4 to 3.3 V • HIGH EFFICIENCY: PO(1dB) = +3.0 dBm TYP at f = 1.0 GHz PO(1dB) = +1.5 dBm TYP at f = 1.9 GHz PO(1dB) = +1.0 dBm TYP at f = 2.4 GHz • POWER GAIN: GP = 13.5 dB TYP at f = 1.0 GHz GP = 15.5 dB TYP at f = 1.9 GHz GP = 15.5 dB TYP at f = 2.4 GHz • EXCELLENT ISOLATION: ISL = 44 dB TYP at f = 1.0 GHz ISL = 42 dB TYP at f = 1.9 GHz ISL = 41 dB TYP at f = 2.4 GHz • LOW CURRENT CONSUMPTION: ICC = 4.0 mA TYP AT VCC = 3.0 V • OPERATING FREQUENCY: ICC = 4.0 mA TYP AT VCC = 3.0 V • LIGHT WEIGHT: 7 mg (standard Value) POWER GAIN vs. FREQUENCY +20 VCC = 3.0 V +10 TA = -40°C TA = +25°C TA = +85°C 0 2.4 GHz –10 –20 1.0 GHz –30 1.9 GHz –40 0.1 0.3 1.0 3.0 Output match for best performance at each frequency DESCRIPTION NEC's UPC8179TB is a silicon monolithic integrated circuit designed as amplifier for mobile communications. This IC can realize low current consumption with external chip inductor which can be realized on internal 50Ω wideband matched IC. This low current amplifier uns on 3.0 V. This IC is manufactured using NEC's 30 GHz fMAX UHS0 (Ultra High Speed Process) silicon bipolar process. This process uses direct silicon nitride passivation film and gold electrodes. These materials can protect the chip surface from pollution and prevent corrosion/ migration. Thus this IC has exellent performance uniformity and reliability. APPLICATIOIN • Buffer amplifiers for 0.1 to 2.4 GHz mobile communications systems. ELECTRICAL CHARACTERISTICS, PART NUMBER PACKAGE OUTLINE SYMBOLS ICC GP Power Gain, PARAMETERS AND CONDITIONS Circuit Current (no input signal) f = 1.0 GHz, PIN = -30 dBm f = 1.9 GHz, PIN = -30 dBm f = 2.4 GHz, PIN = -30 dBm f = 1.0 GHz, PIN = -30 dBm f = 1.9 GHz, PIN = -30 dBm f = 2.4 GHz, PIN = -30 dBm f = 1.0 GHz f = 1.9 GHz f = 2.4 GHz f = 1.0 GHz f = 1.9 GHz f = 2.4 GHz f = 1.0 GHz, PIN = -30 dBm f = 1.9 GHz, PIN = -30 dBm f = 2.4 GHz, PIN = -30 dBm (Unless otherwise specified, TA = +25°C, VCC = VOUT = 3.0 V, ZS = ZL = 50Ω, at LC matched Frequency) UPC8179TB S06 UNITS mA dB MIN 2.9 11.0 13.0 13.0 39.0 37.0 36.0 -0.5 -2.0 -3.0 – – – 4.0 4.0 6.0 TYP 4.0 13.5 15.5 15.5 44.0 42.0 41.0 3.0 1.5 1.0 5.0 5.0 5.0 7.0 7.0 9.0 MAX 5.4 15.5 17.5 17.5 – – – – – – 6.5 6.5 6.5 – – – ISOL Isolation, dB P1dB Output Power at 1 dB gain compression, Noise Figure, dB NF dB RLIN Input Return Loss, (without matching circuit) dB California Eastern Laboratories UPC8179TB ABSOLUTE MAXIMUM RATINGS1 (TA = 25°C) SYMBOLS VCC ICC PD TOP TSTG PIN PARAMETERS Supply Voltage, Pins 4 & 6 Circuit Current Power Dissipation2 UNITS V mA mW °C °C dBm RATINGS 3.6 15 270 -40 to +85 -55 to +150 +5 RECOMMENDED OPERATING CONDITIONS SYMBOLS VCC TA PARAMETERS Supply Voltage Operating Ambient Temperature UNITS MIN V °C 2.7 -40 TYP MAX 3.0 +25 3.3 +85 Operating Temperature Storage Temperature Input Power Notes: 1. Operation in excess of any one of these parameters may result in permanent damage. 2. Mounted on a 50 x 50 x 1.6 mm epoxy glass PWB (TA = +85°C). PIN FUNCTIONS Pin No. 1 Symbol INPUT Pin Voltage 1.09 V Description Signal Input Pin. A internal matching circuit, configured with resistors, enable 50 W connection over a wide band. This pin must be coupled to signal source with capacitor for DC cut. Ground pin. This pin should be connected to the system ground with minimum inductance. Ground pattern on the board should be formed as wide as possible. All the ground pins must be connected together with wide ground pattern to decrease impedance difference. Signal output pin. This pin is designed as collector output. Due to the high impedance output, this pin should be externally equipped with matching LC matching circuit to next stage. For L, a size 1005 chip inductor can be chosen. Power supply pin. This pin should be externally equipped with bypass capacitor to minimize its impedance. Internal Equivalent Circuit 6 4 2 3 5 GND through external inductor 4 OUTPUT Same as VCC voltage 2 3 1 5 6 VCC 2.4 to 3.3 TYPICAL PERFORMANCE CURVES (Unless otherwise specified, TA = 25˚C) CIRCUIT CURRENT vs. VOLTAGE 5 No signals CIRCUIT CURRENT vs. TEMPERATURE 5 No signals Vcc = 3.0 V Circuit Current, ICC (mA) 3 Circuit Current, ICC (mA) 0 2 3 4 4 4 3 2 2 1 1 0 1 0 –60 –40 –20 0 +20 +40 +60 +80 +100 Voltage, VCC (V) Temperature, TA (°C) TYPICAL PERFORMANCE CURVES (Unless otherwise specified, TA = 25˚C) 1.0 GHz Output Port Matching GAIN vs. FREQUENCY +20 Vcc = 3.0 V +10 TA = –40 ºC –20 – 10 ISOLATION vs. FREQUENCY VCC = 3.0 V Isolation, ISOL (dB) Gain, GP (dB) 0 TA = +25 ºC –10 TA = +85ºC –30 TA = –40 ºC –40 TA = +25ºC –20 –50 –30 –60 TA = +85 ºC –40 0.1 0.3 1.0 3.0 –70 0.1 0.3 1.0 3.0 Frequency, f (GHz) Frequency, f (GHz) INPUT RETURN LOSS vs. FREQUENCY 0 Vcc = 3.0 V OUTPUT RETURN LOSS vs. FREQUENCY +5 VCC = 3.0 V Output Return Loss, RLOUT (dBm) Input Return Loss, RLIN (dB) –5 TA = +85 ºC 0 TA = –40ºC TA = +25ºC –10 TA = +85ºC –15 –10 TA = +25 ºC –15 TA = –40 ºC –5 –20 –25 –20 –30 0.1 0.3 1.0 3.0 –25 0.1 0.3 1.0 3.0 Frequency, f (GHz) Frequency, f (GHz) OUTPUT POWER vs. INPUT POWER +10 +5 VCC = 3.0 V TA = –40ºC 0 TA = +85ºC –5 TA = +25ºC –10 –15 –20 –25 –30 –40 –35 –30 –25 –20 –15 –10 –5 0 +5 THIRD ORDER INTERMODULATION DISTORTION vs. OUTPUT POWER OF EACH TONE 0 Thirf Order Intermodulation Distortion, IM3 (dBc) f1 = 1 000 MHz -10 f2 = 1 001 MHz Output Power, POUT (dBm) -20 Vcc = 2.4 V Vcc = 3.0 V -30 -40 Vcc = 3.3 V -50 -60 –20 –15 –10 –5 0 +5 Input Power, PIN (dBm) Output Power of Each Tone, POUT (dBm) TYPICAL PERFORMANCE CURVES (Unless otherwise specified, TA = 25˚C) 1.0 GHz Output Port Matching NOISE FIGURE vs. VOLTAGE 6.0 TA = +85 ºC 5.5 Noise Figure, NF (dB) 5.0 TA = +25 ºC 4.5 4.0 TA = –40 ºC 3.5 3.0 2.0 2.5 3.0 3.5 Voltage, VCC (V) 1.9 GHz Output Port Matching ISOLATION vs. FREQUENCY –10 Vcc = 3.0 V +10 TA = +25ºC TA = –40ºC GAIN vs. FREQUENCY +20 Vcc = 3.0 V –20 Isolation, ISOL (dB) Gain, GP (dB) 0 TA = +85ºC –10 –30 TA = +25ºC –40 TA = –40ºC –20 –50 TA = +85ºC –60 –30 –40 0.1 0.3 1.0 3.0 –70 0.1 0.3 1.0 3.0 Frequency, f (GHz) Frequency, f (GHz) INPUT RETURN LOSS vs. FREQUENCY 0 TA = +85ºC OUTPUT RETURN LOSS vs. FREQUENCY +5 VCC = 3.0 V Output Return Loss, RLOUT (dBm) Input Return Loss, RLIN (dB) –5 TA = +25ºC –10 TA = –40ºC 0 –5 –15 –10 –15 TA = +85ºC TA = +25ºC –20 –20 TA = –40ºC –25 0.1 0.3 1.0 3.0 –25 Vcc = 3.0 V 0.1 0.3 1.0 3.0 –30 Frequency, f (GHz) Frequency, f (GHz) TYPICAL PERFORMANCE CURVES (Unless otherwise specified, TA = 25˚C) 1.9 GHz Output Port Matching OUTPUT POWER vs. INPUT POWER +10 0 Thirf Order Intermodulation Distortion, IM3 (dBc) TA = –40ºC +5 Output Power, POUT (dBm) -10 f1 = 1 900 MHz f2 = 1 901 MHz 0 TA = +25ºC –5 –10 TA = +85ºC –15 –20 –25 VCC = 3.0 V –30 –40 –35 –30 –25 –20 –15 –10 –5 0 +5 -20 Vcc = 3.3 V -30 Vcc = 2.4 V -40 Vcc = 3.0 V -50 -60 –20 –15 –10 –5 0 +5 Input Power, PIN (dBm) Output Power of Each Tone, POUT (dBm) NOISE FIGURE vs. VOLTAGE 5.5 TA = +85 ºC Noise Figure, NF (dB) 5.0 4.5 TA = +25 ºC 4.0 3.5 TA = –40 ºC 3.0 2.0 2.5 3.0 3.5 Voltage, VCC (V) 2.4 GHz Output Port Matching GAIN vs. FREQUENCY +20 VCC = 3.0 V +10 TA = –40ºC ISOLATION vs. FREQUENCY –10 VCC = 3.0 V –20 Isolation, ISOL (dB) TA = +25ºC Gain, GP (dB) 0 –30 TA = +25ºC –10 –40 TA = –40ºC –50 –20 TA = +85ºC –30 –60 TA = +85ºC –40 0.1 0.3 1.0 3.0 –70 0.1 0.3 1.0 3.0 Frequency, f (GHz) Frequency, f (GHz) TYPICAL PERFORMANCE CURVES (Unless otherwise specified, TA = 25˚C) 2.4 GHz Output Port Matching INPUT RETURN LOSS vs. FREQUENCY 0 TA = +85ºC OUTPUT RETURN LOSS vs. FREQUENCY +5 VCC = 3.0 V Output Return Loss, RLOUT (dBm) Input Return Loss, RLIN (dB) –5 0 –10 TA = +25ºC –15 TA = –40ºC –20 –5 –10 TA = +85ºC –15 TA = +25ºC –20 –25 VCC = 3.0 V 0.1 0.3 1.0 3.0 TA = –40ºC –30 –25 0.1 0.3 1.0 3.0 Frequency, f (GHz) Frequency, f (GHz) OUTPUT POWER vs. INPUT POWER +10 VCC = 3.0 V +5 THIRD ORDER INTERMODULATION DISTORTION vs. OUTPUT POWER OF EACH TONE 0 Thirf Order Intermodulation Distortion, IM3 (dBc ) f1 = 2 400 MHz f2 = 2 401 MHz -10 Vcc = 2.4 V Output Power, POUT (dBm) 0 TA = +25ºC –5 –10 TA = –40ºC –15 –20 –25 –30 –40 –35 –30 –25 –20 –15 –10 –5 0 +5 -20 -30 Vcc = 3.0 V -40 Vcc = 3.3 V TA = +85ºC -50 -60 –20 –15 –10 –5 0 +5 Input Power, PIN (dBm) Output Power of Each Tone, POUT (dBm) NOISE FIGURE vs. VOLTAGE 5.5 TA = +85ºC Noise Figure, NF (dB) 5.0 4.5 TA = +25 4.0 3.5 TA = –40ºC 3.0 2.0 2.5 3.0 3.5 Voltage, VCC (V) UPC8179TB TYPICAL SCATTERING PARAMETERS (TA = 25˚C) 0.1 G 0.1 G 3.0 G 1.0 G 2.0 G 1.0 G 2.0 G 3.0 G S11 Coordinates in Ohms Frequency in GHz VCC = VOUT = 3.0 V, ICC = 4.0 mA S22 VCC = VOUT = 3.0 V, ICC = 4.0 mA FREQUENCY GHz 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 MAG 0.824 0.692 0.594 0.533 0.499 0.474 0.460 0.450 0.441 0.438 0.431 0.426 0.427 0.417 0.413 0.408 0.398 0.387 0.380 0.366 0.352 0.341 0.330 0.320 0.304 0.296 0.285 0.272 0.267 0.256 0.248 S11 ANG -17.1 -25.9 -29.2 -30.7 -31.1 -32.0 -32.7 -34.0 -35.6 -37.7 -39.8 -42.0 -44.8 -48.1 -50.6 -54.6 -57.6 -61.6 -64.9 -69.1 -72.1 -75.6 -79.4 -82.4 -85.6 -88.2 -91.7 -94.3 -96.9 -99.5 -101.9 MAG 1.181 1.181 1.247 1.370 1.514 1.677 1.885 2.050 2.237 2.460 2.627 2.772 2.965 3.123 3.199 3.351 3.345 3.103 3.361 3.375 3.350 3.304 3.347 3.325 3.275 3.284 3.283 3.224 3.333 3.251 3.381 S21 ANG -177.7 -172.4 -167.4 -164.1 -162.4 -162.9 -163.8 -166.3 -169.2 -173.1 -177.3 178.4 173.2 168.0 161.8 156.8 151.2 145.5 140.9 136.3 132.3 127.9 124.8 121.2 117.3 113.7 111.0 106.5 104.3 101.1 96.0 MAG 0.002 0.003 0.004 0.005 0.005 0.006 0.006 0.006 0.005 0.007 0.007 0.005 0.005 0.004 0.006 0.005 0.003 0.005 0.005 0.004 0.003 0.003 0.006 0.006 0.006 0.004 0.005 0.005 0.008 0.009 0.008 S12 ANG 108.8 64.7 51.3 55.8 60.6 46.6 42.9 45.9 42.1 34.0 46.9 27.7 40.2 24.4 45.5 44.6 42.4 44.6 59.5 45.4 58.3 73.9 81.1 98.3 100.5 114.6 104.8 114.1 127.8 126.3 134.1 MAG 0.996 0.986 0.980 0.965 0.958 0.950 0.941 0.935 0.929 0.918 0.914 0.903 0.895 0.891 0.884 0.877 0.867 0.877 0.859 0.852 0.846 0.847 0.839 0.839 0.838 0.834 0.830 0.831 0.837 0.831 0.833 S22 ANG -2.4 -4.0 -5.8 -7.5 -8.6 -10.1 -11.2 -12.4 -13.8 -14.9 -16.0 -17.0 -18.3 -19.5 -20.4 -21.1 -22.1 -21.1 -24.4 -25.1 -25.9 -26.4 -27.4 -28.2 -29.1 -29.7 -30.6 -31.4 -32.0 -33.4 -34.0 UPC8179TB ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD COMPONENT LIST AMP-4 OUT IN C1 Mounting Direction C1 C2 C3 L1 1.0 GHz Output Port Matching 1000 pF 0.75 pF 10 pF 12 nH C2 L1 C3C Top View C3 COMPONENT LIST C1, C3, C5, C6 C2 C4 L1 1.9GHz Output Port Matching 1000 pF 0.75 pF 10 pF 3.3 nH OUT IN C1 C4 C6 L2 C2 C3 COMPONENT LIST C1, C2, C4, C5 C3 L1 L2 2.4 GHz Output Port Matching 1000 pF 10 pF 1.8 nH 2.7 nH IN C1 C3 C5 L2 C2 L1 AMP-4 L1 C5 AMP-4 OUT C4 UPC8179TB TEST CIRCUITS f = 1.0 GHz Vcc C3 Output port matching circuit 6 50 Ω IN C1 1 4 L1 C2 50 Ω OUT 2, 3, 5 f = 1.9 GHz Vcc C4 C5 C6 Output port matching circuit 6 50 Ω IN C1 1 4 L1 C2 C3 50 Ω OUT 2, 3, 5 f = 2.4 GHz Vcc C3 C4 C5 Output port matching circuit 6 50 Ω IN C1 1 4 L2 L1 50 Ω OUT C2 2, 3, 5 UPC8179TB SYSTEM APPLICATION EXAMPLE Low Noise Tr. RX DEMOD I Q .N . SW PLL PLL I 0° TX PA φ 90° Q OUTLINE DIMENSIONS (Units in mm) PACKAGE OUTLINE S06 2.1±0.1 LEAD CONNECTIONS (Top View) (Bottom View) 2.0±0.2 0.65 3 1.3 0.65 2 4 0.2 +0.1 -0 C3C 1.25±0.1 3 4 4 3 2 5 5 2 5 1 6 6 1 1 6 DOT ON BOTTOM SIDE 0.9 ± 0.1 0.7 1. INPUT 2. GND 3. GND 4. OUTPUT 5. GND 6. VCC 0 ~0.1 +0.1 0.15 -0.5 RECOMMENDED P.C.B. LAYOUT (Units in mm) Note: All dimensions are typical unless otherwise specified. ORDERING INFORMATION PART NUMBER UPC8179TB-E3-A QTY 3K/Reel 0.4 0.8 Note: Embossed tape, 8 mm wide. Pins 1, 2, 3 are in tape pull-out direction. 0.65 0.65 Life Support Applications These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and agree to fully indemnify CEL for all damages resulting from such improper use or sale. EXCLUSIVE NORTH AMERICAN AGENT FOR NEC RF, MICROWAVE & OPTOELECTRONIC SEMICONDUCTORS CALIFORNIA EASTERN LABORATORIES • Headquarters • 4590 Patrick Henry Drive • Santa Clara, CA 95054-1817 • (408) 919-2500 • Telex 34-6393 • FAX (408) 988-0279 Internet: http://WWW.CEL.COM DATA SUBJECT TO CHANGE WITHOUT NOTICE 05/03/2006 1.9 5-10 4590 Patrick Henry Drive Santa Clara, CA 95054-1817 Telephone: (408) 919-2500 Facsimile: (408) 988-0279 Subject: Compliance with EU Directives CEL certifies, to its knowledge, that semiconductor and laser products detailed below are compliant with the requirements of European Union (EU) Directive 2002/95/EC Restriction on Use of Hazardous Substances in electrical and electronic equipment (RoHS) and the requirements of EU Directive 2003/11/EC Restriction on Penta and Octa BDE. CEL Pb-free products have the same base part number with a suffix added. The suffix –A indicates that the device is Pb-free. The –AZ suffix is used to designate devices containing Pb which are exempted from the requirement of RoHS directive (*). In all cases the devices have Pb-free terminals. All devices with these suffixes meet the requirements of the RoHS directive. This status is based on CEL’s understanding of the EU Directives and knowledge of the materials that go into its products as of the date of disclosure of this information. Restricted Substance per RoHS Lead (Pb) Mercury Cadmium Hexavalent Chromium PBB PBDE Concentration Limit per RoHS (values are not yet fixed) < 1000 PPM < 1000 PPM < 100 PPM < 1000 PPM < 1000 PPM < 1000 PPM Concentration contained in CEL devices -A Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected -AZ (*) If you should have any additional questions regarding our devices and compliance to environmental standards, please do not hesitate to contact your local representative. Important Information and Disclaimer: Information provided by CEL on its website or in other communications concerting the substance content of its products represents knowledge and belief as of the date that it is provided. CEL bases its knowledge and belief on information provided by third parties and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. CEL has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. CEL and CEL suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall CEL’s liability arising out of such information exceed the total purchase price of the CEL part(s) at issue sold by CEL to customer on an annual basis. See CEL Terms and Conditions for additional clarification of warranties and liability. 5-11
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