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UPC8179TK

UPC8179TK

  • 厂商:

    CEL

  • 封装:

  • 描述:

    UPC8179TK - SILICON MMIC LOW CURRENT AMPLIFIER FOR MOBILE COMMUNICATIONS - California Eastern Labs

  • 数据手册
  • 价格&库存
UPC8179TK 数据手册
NEC's SILICON MMIC LOW CURRENT AMPLIFIER UPC8179TK FOR MOBILE COMMUNICATIONS FEATURES • HIGH DENSITY SURFACE MOUNTING: 6 Pin Leadless Minimold Package (1.5 x 1.1 x 0.55 mm) • SUPPLY VOLTAGE: VCC = 2.4 to 3.3 V • HIGH EFFICIENCY: PO(1dB) = +2.0 dBm TYP at f = 1.0 GHz PO(1dB) = +0.5 dBm TYP at f = 1.9 GHz PO(1dB) = +0.5 dBm TYP at f = 2.4 GHz • POWER GAIN: GP = 13.5 dB TYP at f = 1.0 GHz GP = 15.5 dB TYP at f = 1.9 GHz GP = 16.0 dB TYP at f = 2.4 GHz • EXCELLENT ISOLATION: ISL = 43 dB TYP at f = 1.0 GHz ISL = 42 dB TYP at f = 1.9 GHz ISL = 42 dB TYP at f = 2.4 GHz • LOW CURRENT CONSUMPTION: ICC = 4.0 mA TYP AT VCC = 3.0 V • OPERATING FREQUENCY: 0.1 to 2.4 GHz (Output port LC matching) • LIGHT WEIGHT: 3 mg 2.0 ± 0.2 0.48 0.48 1 OUTLINE DIMENSIONS (Units in mm) PACKAGE OUTLINE TK 1.3 ± 0.05 1.1 ± 0.1 0.16 ± 0.05 BOTTOM 6 2 5 3 4 0.2 ± 0.1 0.9 0.55 ± 0.03 0.11 +0.10 -0.05 DESCRIPTION NEC's UPC8179TK is a silicon monolithic integrated circuit designed as an amplifier for mobile communications. This IC can realize low current consumption with external chip inductor. The incorporation of a chip identical to the conventional 6pin super minimold package (2.0 x 1.25 x 0.9 mm) μPC8179TB in a 6-pin leadless minimold package (1.5 x 1.1 x 0.55 mm) has enabled a reduction in mounting area of 50 %. The μPC8179TK is ideally suited to replace the μPC8179TB for footprint reduction and increased design density. This IC is manufactured using NEC's 30 GHz fMAX UHS0 (Ultra High Speed Process) silicon bipolar process. This process uses direct silicon nitride passivation film and gold electrodes. These materials can protect the chip surface from pollution and prevent corrosion/ migration. Thus this IC has excellent performance uniformity and reliability. NEC's stringent quality assurance and test procedures assure the highest performance. consistency and reliability. UPC8179TK TK UNITS mA dB MIN 2.9 11.0 13.0 14.0 39.0 37.0 37.0 -0.5 -2.0 -3.0 – – – 4.0 4.0 6.0 TYP 4.0 13.5 15.5 16.0 43.0 42.0 42.0 2.0 0.5 0.5 5.0 5.0 5.0 7.0 7.0 9.0 MAX 5.4 15.5 17.5 18.5 – – – – – – 6.5 6.5 6.5 – – – APPLICATION • Buffer amplifiers for 0.1 to 2.4 GHz mobile communications systems. ELECTRICAL CHARACTERISTICS, PART NUMBER PACKAGE OUTLINE SYMBOLS ICC GP Power Gain, PARAMETERS AND CONDITIONS Circuit Current (no input signal) f = 1.0 GHz, PIN = -30 dBm f = 1.9 GHz, PIN = -30 dBm f = 2.4 GHz, PIN = -30 dBm f = 1.0 GHz, PIN = -30 dBm f = 1.9 GHz, PIN = -30 dBm f = 2.4 GHz, PIN = -30 dBm f = 1.0 GHz f = 1.9 GHz f = 2.4 GHz f = 1.0 GHz f = 1.9 GHz f = 2.4 GHz f = 1.0 GHz, PIN = -30 dBm f = 1.9 GHz, PIN = -30 dBm f = 2.4 GHz, PIN = -30 dBm (Unless otherwise specified, TA = +25°C, VCC = VOUT = 3.0 V, ZS = ZL = 50Ω, at LC matched Frequency) ISOL Isolation, dB P1dB Output Power at 1 dB gain compression, Noise Figure, dBm NF dB RLIN Input Return Loss, (without matching circuit) dB UPC8179TK ABSOLUTE MAXIMUM RATINGS1 (TA = 25°C) SYMBOLS VCC ICC PD TOP TSTG PIN PARAMETERS Supply Voltage Circuit Current Power Dissipation2 UNITS V mA mW °C °C dBm RATINGS 3.6 15 232 -40 to +85 -55 to +150 +5 RECOMMENDED OPERATING CONDITIONS SYMBOLS VCC TA PARAMETERS Supply Voltage Operating Ambient Temperature UNITS MIN V °C 2.4 -40 TYP MAX 3.0 +25 3.3 +85 Operating Temperature Storage Temperature Input Power Notes: 1. Operation in excess of any one of these parameters may result in permanent damage. 2. Mounted on a 50 x 50 x 1.6 mm epoxy glass PWB (TA = +85°C). PIN CONNECTIONS (Top View) (Bottom View) 6 5 4 6 5 4 1 2 3 PIN NO. 1 2 3 4 5 6 PIN NAME INPUT GND GND OUTPUT GND VCC 6C Parameter ICC (mA) 1.9 1.9 4.0 4.0 2.8 4.2 5.6 1 2 3 Caution: pin arrangement differs from the conventional 6 pin super minimold type UPC8179TB – SERIES PRODUCTS1 (TA = +25°C, VCC = Vout = 3.0 V, ZS = ZL = 50 Ω) 1.0 GHz output port matching frequency GP ISOL PO(1 dB) (dB) (dB) (dBm) 11 39 -4.0 11 40 -5.5 13.5 13.5 12.5 12.5 23 44 43 39 38 40 +3.0 +2.0 -4.0 +2.5 -4.5 1.9 GHz output port matching frequency GP ISOL PO(1 dB) (dB) (dB) (dBm) 11.5 40 -7.0 11.0 41 -8.0 15.5 15.5 13 15 17.5 42 42 37 34 35 +1.5 +0.5 -4.0 +0.5 -8.5 2.4 GHz output port matching frequency GP ISOL PO(1 dB) (dB) (dB) (dBm) 11.5 38 -7.5 11.0 42 -8.0 15.5 16.0 – – – 41 42 – – – +1.0 +0.5 – – – Package Part No. UPC8178TB UPC8178TK UPC8179TB UPC8179TK UPC8128TB UPC8151TB UPC8152TB Note: 1. Typical performance. 6 pin super minimold 6 pin leadless minimold 6 pin super minimold 6 pin leadless minimold 6 pin super minimold 6 pin super minimold 6 pin super minimold SYSTEM APPLICATION EXAMPLE Location examples in digital cellular Low Noise Tr. RX DEMOD I Q .N . SW PLL PLL I 0° TX PA φ 90° Q UPC8179TK EVALUATION BOARD, 0.9 GHz Vcc P1 GND P2 VCC C2 C3 C4 C5 J2 C3C PIN 1 Vcc J1 IFin C2 C3 C4 DEVICE ORIENTATION RFout C1 U1 C3C C5 L1 C6 C1 IN 50Ω 1 6 4 2,3,5 L1 OUT C6 50Ω UPC8179TK GETEK H=.028 Er=4.2 ADD TAB COMPONENT LIST FORM Chip Capacitor SYMBOL C6 C1, C5 C2, C3, C4 Chip Inductor L1 VALUE 1 pF 51 pF 1800 pF 10 nH 1. 1.5 x 1.5 x 0.028", Getek laminate, double sided copper 2. Ground pattern on rear board 3. Solder plated patterns 4. Through holes EVALUATION BOARD, 1.9 GHz Vcc P1 GND P2 PIN 1 VCC C3C Vcc DEVICE ORIENTATION C2 C3 C4 C3 C2 C4 C5 C7 C8 J1 IFin RFout C1 U1 C3C C7 C8 C5 L2 L1 C6 J2 C1 IN 50Ω UPC8179TK GETEK H=.028 Er=4.2 ADD TAB 6 1 4 2,3,5 L1 L2 C6 OUT 50Ω COMPONENT LIST FORM Chip Capacitor SYMBOL C7, C8 C6 C1, C5 C2, C3, C4 Chip Inductor L2 L1 VALUE 10 pF .4 pF 51 pF 1000 pF 22 nH 2.7 nH 1. 1.5 x 1.5 x 0.028", Getek laminate, double sided copper 2. Ground pattern on rear board 3. Solder plated patterns 4. Through holes UPC8179TK EVALUATION BOARD, 2.4 GHz Vcc P1 GND P2 VCC Vcc C3C PIN 1 C3 C2 C4 C8 C5 C7 L2 4 C6 2,3,5 50Ω L1 OUT J1 IFin C2 C3 C4 DEVICE ORIENTATION C8 C1 U1 C3C RFout C5 J2 C7 L2 L1 C6 C1 IN 50Ω 1 6 UPC8179TK GETEK H=.028 Er=4.2 ADD TAB COMPONENT LIST FORM Chip Capacitor SYMBOL C7 C6 C1, C5 C2, C3, C4, C8 Chip Inductor L2 L1 VALUE 5.6 pF 0.5 pF 51 pF 1000 pF 3.9 nH 2.7 nH 1. 1.5 x 1.5 x 0.028", Getek laminate, double sided copper 2. Ground pattern on rear board 3. Solder plated patterns 4. Through holes UPC8179TK TYPICAL SCATTERING PARAMETERS (TA = 25˚C) +90° +135° +45° +135° S21 +90° +45° +180° 2 4 6 S11 8 10 +0° +180° 1 2 3 4 +0° S22 -135° -90° VCC = VOUT = 3.0 V FREQUENCY S11 GHz 0.100 0.200 0.300 0.400 0.500 0.600 0.700 0.800 0.900 1.000 1.100 1.200 1.300 1.400 1.500 1.600 1.700 1.800 1.900 2.000 2.100 2.200 2.300 2.400 2.500 2.600 2.700 2.800 2.900 3.000 MAG (lin) 0.84 0.71 0.62 0.57 0.53 0.51 0.50 0.49 0.48 0.48 0.48 0.48 0.48 0.48 0.47 0.47 0.46 0.46 0.45 0.44 0.43 0.42 0.41 0.40 0.39 0.39 0.38 0.37 0.37 0.36 ANG (deg) -15.44 -23.58 -26.85 -27.79 -28.46 -29.20 -30.41 -31.91 -33.73 -35.99 -38.71 -41.75 -45.45 -49.58 -54.02 -58.93 -64.06 -69.22 -74.64 -80.15 -85.84 -91.30 -97.01 -102.52 -107.66 -112.50 -117.21 -121.34 -125.50 -129.41 MAG (lin) 0.000 0.001 0.003 0.004 0.004 0.005 0.005 0.006 0.006 0.006 0.007 0.007 0.006 0.006 0.006 0.006 0.005 0.006 0.005 0.005 0.005 0.004 0.004 0.004 0.005 0.005 0.005 0.005 0.005 0.006 S21 ANG (deg) 144.28 74.92 79.88 74.10 69.27 64.73 57.60 55.38 52.35 50.82 46.83 44.54 43.45 40.78 41.20 41.10 46.39 41.00 41.04 46.54 48.59 58.65 70.83 78.30 83.94 86.81 91.39 100.87 108.40 110.47 MAG (lin) 1.10 1.11 1.18 1.29 1.43 1.58 1.76 1.94 2.14 2.34 2.54 2.74 2.94 3.14 3.32 3.48 3.63 3.75 3.85 3.92 3.95 3.98 3.97 3.95 3.90 3.86 3.79 3.73 3.64 3.57 S12 ANG (deg) -177.39 -172.09 -167.46 -163.89 -162.03 -161.77 -162.65 -164.38 -167.03 -170.16 -174.19 -178.44 176.74 171.66 166.25 160.62 154.76 148.78 142.70 136.64 130.61 124.75 119.03 113.51 108.09 103.05 97.97 93.14 88.56 84.13 MAG (lin) 1.00 0.99 0.98 0.97 0.97 0.96 0.95 0.94 0.94 0.93 0.92 0.92 0.91 0.90 0.90 0.89 0.88 0.88 0.87 0.87 0.86 0.86 0.86 0.86 0.85 0.85 0.85 0.85 0.85 0.85 S22 ANG (deg) -1.76 -3.33 -4.59 -5.92 -7.05 -8.16 -9.33 -10.38 -11.45 -12.51 -13.62 -14.78 -15.97 -17.28 -18.52 -19.81 -21.15 -22.35 -23.73 -25.15 -26.53 -27.99 -29.67 -31.15 -32.65 -34.43 -35.87 -37.50 -39.28 -40.88 K MAG Unitless dB 0.21 3.26 2.99 3.20 3.64 3.83 3.87 3.64 3.54 3.41 3.29 3.28 3.53 3.56 3.67 4.05 4.19 4.06 4.76 4.90 5.61 6.26 7.20 6.49 5.82 5.48 6.19 6.53 5.80 5.16 33.63 20.89 18.84 17.29 16.66 16.34 16.49 16.74 17.08 17.48 17.79 18.12 18.29 18.55 18.71 18.93 19.03 19.12 19.06 19.06 18.93 18.88 18.71 18.60 18.38 18.33 18.08 17.91 17.71 17.50 -45° -135° -45° -90° Coordinates in Ohms Frequency in GHz 0.100 to 3.000 GHz by 0.100 Note: 1. Data taken at Device Under Test pins UPC8179TK OUTLINE DIMENSIONS (Units in mm) PACKAGE OUTLINE TK 1.3 ± 0.05 1.1 ± 0.1 0.16 ± 0.05 BOTTOM 2.0 ± 0.2 0.48 0.48 1 6 2 5 3 4 0.2 ± 0.1 0.9 0.55 ± 0.03 0.11 +0.10 -0.05 ORDERING INFORMATION PART NUMBER UPC8179TK-E2-A Note: Embossed tape, 8 mm wide. Pins 1, 2, 3 are in tape pull-out direction. QTY 3K/Reel Life Support Applications These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and agree to fully indemnify CEL for all damages resulting from such improper use or sale. 4/04/2006 4590 Patrick Henry Drive Santa Clara, CA 95054-1817 Telephone: (408) 919-2500 Facsimile: (408) 988-0279 Subject: Compliance with EU Directives CEL certifies, to its knowledge, that semiconductor and laser products detailed below are compliant with the requirements of European Union (EU) Directive 2002/95/EC Restriction on Use of Hazardous Substances in electrical and electronic equipment (RoHS) and the requirements of EU Directive 2003/11/EC Restriction on Penta and Octa BDE. CEL Pb-free products have the same base part number with a suffix added. The suffix –A indicates that the device is Pb-free. The –AZ suffix is used to designate devices containing Pb which are exempted from the requirement of RoHS directive (*). In all cases the devices have Pb-free terminals. All devices with these suffixes meet the requirements of the RoHS directive. This status is based on CEL’s understanding of the EU Directives and knowledge of the materials that go into its products as of the date of disclosure of this information. Restricted Substance per RoHS Lead (Pb) Mercury Cadmium Hexavalent Chromium PBB PBDE Concentration Limit per RoHS (values are not yet fixed) < 1000 PPM < 1000 PPM < 100 PPM < 1000 PPM < 1000 PPM < 1000 PPM Concentration contained in CEL devices -A Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected -AZ (*) If you should have any additional questions regarding our devices and compliance to environmental standards, please do not hesitate to contact your local representative. Important Information and Disclaimer: Information provided by CEL on its website or in other communications concerting the substance content of its products represents knowledge and belief as of the date that it is provided. CEL bases its knowledge and belief on information provided by third parties and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. CEL has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. CEL and CEL suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall CEL’s liability arising out of such information exceed the total purchase price of the CEL part(s) at issue sold by CEL to customer on an annual basis. See CEL Terms and Conditions for additional clarification of warranties and liability.
UPC8179TK 价格&库存

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