UPG158TB-E3

NEC's ½W UPG158TB L, S-BAND SPDT SWITCH FEATURES • SWITCH CONTROL VOLTAGE: Vcont (H) = 2.5 to 5.3 V (3.0 V TYP.) Vcont (L) = −0.2 to +0.2 V (0 V TYP.) • LOW INSERTION LOSS: LINS1 = 0.30 dB TYP. @ f = 0.5 to 1.0 GHz, Vcont = 3.0 V/0 V LINS2 = 0.40 dB TYP. @ f = 2.0 GHz, Vcont = 3.0 V/0 V LINS3 = 0.90 dB MAX. @ f = 2.0 to 2.5 GHz, Vcont = 3.0 V/0 V • HIGH ISOLATION: ISL1 = 27 dB TYP. @ f = 0.5 to 2.0 GHz, Vcont = 3.0 V/0 V ISL2 = 18 dB MIN. @ f = 2.0 to 2.5 GHz, Vcont = 3.0 V/0 V • POWER HANDLING: Pin (1 dB) = +26.5 dBm TYP. @ f = 1.0 GHz, Vcont = 3.0 V/0 V • HIGH-DENSITY SURFACE MOUNTING: 6-pin super minimold package (2.0 × 1.25 × 0.9 mm) DESCRIPTION NEC's UPG158TB is a GaAs MMIC L, S-band SPDT (Single Pole Double Throw) switch developed for mobile phone and L, S-band applications. This device can operate from 0.5 to 2.5 GHz, with low insertion loss and high isolation. This device is housed in a 6-pin super minimold package. And this package is able to high-density surface mounting. APPLICATIONS • L-band digital cellular or cordless telephone • PCS, W-LAN, WLL and BluetoothTM • Short Range Wireless ORDERING INFORMATION Part Number UPG158TB-E3 Package 6-pin super minimold Marking G1M Supplying Form • Embossed tape 8 mm wide • Pin 1, 2, 3 face the perforation side of the tape • Qty 3 kpcs/reel Remark To order evaluation samples, contact your nearby sales ofÞce. Part number for sample order: UPG158TB Caution Observe precautions when handling, because these devices are sensitive to electrostatic discharge. California Eastern Laboratories UPG158TB PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM (Top View) 3 2 1 43 52 61 (Top View) 44 55 66 (Bottom View) 3 2 1 Pin No. 1 Pin Name OUTPUT1 GND OUTPUT2 Vcont2 INPUT Vcont1 G1M 2 3 4 5 6 TRUTH TABLE Vcont1 Low High Vcont2 High Low INPUT−OUTPUT1 ON OFF INPUT−OUTPUT2 OFF ON ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise speciÞed) Parameter Switch Control Voltage Input Power Power Dissipation Operating Ambient Temperature Storage Temperature Symbol Vcont Pin PD TA Tstg Ratings −6.0 to +6.0 Note 1 +28 150 Note 2 −45 to +85 −55 to +150 Unit V dBm mW °C °C Notes 1. | Vcont1 − Vcont2 | ≤ 6.0 V 2. Mounted on double-sided copper-clad 50 × 50 × 1.6 mm epoxy glass PWB, TA = +85°C RECOMMENDED OPERATING RANGE (TA = 25°C, unless otherwise speciÞed) Parameter Switch Control Voltage (H) Switch Control Voltage (L) Symbol Vcont (H) Vcont (L) MIN. 2.5 −0.2 TYP. 3.0 0 MAX. 5.3 0.2 Unit V V UPG158TB ELECTRICAL CHARACTERISTICS (TA = +25°C, Vcont = 3.0 V/0 V, DC blocking capacitors = 51 pF, unless otherwise speciÞed) Parameter Insertion Loss 1 Insertion Loss 2 Insertion Loss 3 Isolation 1 Isolation 2 Input Return Loss 1 Input Return Loss 2 Output Return Loss 1 Output Return Loss 2 1 dB Loss Compression Input Power Note Switch Control Speed Switch Control Current Symbol LINS1 LINS2 LINS3 ISL1 ISL2 RLin1 RLin2 RLout1 RLout2 Pin (1 dB) tSW Icont Test Conditions f = 0.5 to 1.0 GHz f = 2.0 GHz f = 2.0 to 2.5 GHz f = 0.5 to 2.0 GHz f = 2.0 to 2.5 GHz f = 0.5 to 2.0 GHz f = 2.0 to 2.5 GHz f = 0.5 to 2.0 GHz f = 2.0 to 2.5 GHz f = 1.0 GHz MIN. − − − 22 18 13 11 13 11 +22.0 − − TYP. 0.30 0.40 − 27 − 19 − 19 − +26.5 50 0.5 MAX. 0.55 0.65 0.90 − − − − − − − 200 10 Unit dB dB dB dB dB dB dB dB dB dBm ns A Note Pin (1 dB) is measured the input power level when the insertion loss increases 1 dB more than that of linear range. STANDARD CHARACTERISTICS FOR REFERENCE (TA = +25°C, Vcont = 3.0 V/0 V, DC blocking capacitors = 51 pF, unless otherwise speciÞed) Parameter 0.1 dB Loss Compression Input Power Note Symbol Pin (0.1 dB) Test Conditions f = 1.0 GHz MIN. − TYP. +23.0 MAX. − Unit dBm Note Pin (0.1 dB) is measured the input power level when the insertion loss increases 0.1 dB more than that of linear range. Caution It is necessary to use DC blocking capacitors with this device. The value of DC blocking capacitors should be chosen to accommodate the frequency of operation, bandwidth, switching speed and the condition with the actual board of your system. The range of recommended DC blocking capacitor value is less than 100 pF. UPG158TB EVALUATION CIRCUIT (Vcont = 3.0 V/0 V, DC blocking capacitors = 51 pF) Vcont2 INPUT Vcont1 1 000 pF 51 pF 1 000 pF 4 5 6 3 2 1 51 pF 51 pF OUTPUT2 OUTPUT1 The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. UPG158TB ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD Vcont1 6pin SMM SPDT SW Vc1 OUTPUT1 OUT 1 C2 C 2 C 4 C1 G1M INPUT C1 IN C3 C1 C C 5 1 C2 OUT 2 OUTPUT2 Vc2 Vcont2 USING THE NEC EVALUATION BOARD Symbol C1, C2, C3 C4, C5 Values 51 pF 1 000 pF 5-144 UPG158TB TYPICAL CHARACTERISTICS (TA = +25°C, Vcont = 3.0 V/0 V, Pin = 0 dBm, unless otherwise speciÞed) OUT1 IN OUT2 50 Ω IN-OUT1 INPUT RETURN LOSS vs. FREQUENCY CH1 S11 log MAG 10 dB/ REF 0 dB 1: -23.433 dB 1 GHz 2: -30.102 dB 1.5 GHz 3: -25.504 dB 2 GHz 4: -16.018 dB 2.5 GHz CH1 S21 MARKER 1 1 GHz IN-OUT1 ISOLATION vs. FREQUENCY log MAG 10 dB/ REF 0 dB 1: -28.047 dB 1 GHz 2: -28.565 dB 1.5 GHz 3: -25.835 dB 2 GHz 4: -22.507 dB 2.5 GHz MARKER 1 1 GHz Input Return Loss RLin (dB) 0 -10 -20 -30 -40 2 1 3 4 Isolation ISL (dB) 0 -10 -20 -30 -40 2 1 3 4 START 0.300 000 000 GHz STOP 3.300 000 000 GHz START 0.300 000 000 GHz STOP 3.300 000 000 GHz Frequency f (GHz) Frequency f (GHz) IN-OUT1 INSERTION LOSS vs. FREQUENCY CH1 S21 log MAG 1 dB/ REF 0 dB 1: -0.574 dB 1 GHz 2: -0.662 dB 1.5 GHz 3: -0.795 dB 2 GHz 4: -1.111 dB 2.5 GHz MARKER 1 1 GHz IN-OUT1 OUTPUT RETURN LOSS vs. FREQUENCY CH1 S22 log MAG 10 dB/ REF 0 dB 1: -22.502 dB 1 GHz 2: -28.139 dB 1.5 GHz 3: -25.867 dB 2 GHz 4: -15.601 dB 2.5 GHz MARKER 1 1 GHz 0 -1 -2 -3 -4 1 2 3 Output Return Loss RLout (dB) Insertion Loss LINS (dB) 0 -10 -20 -30 -40 START 0.300 000 000 GHz STOP 3.300 000 000 GHz 1 4 2 3 4 START 0.300 000 000 GHz STOP 3.300 000 000 GHz Frequency f (GHz) Frequency f (GHz) Caution Data includes loss of the test fixture. Remark The graphs indicate nominal characteristics. 5-145 UPG158TB PACKAGE DIMENSIONS 6-PIN SUPER MINIMOLD (UNIT: mm) 2.1±0.1 1.25±0.1 2.0±0.2 1.3 0.65 0.65 0.1 MIN. 0.9±0.1 0.7 5-146 0 to 0.1 0.15+0.1 –0.05 0.2+0.1 –0.05 UPG158TB RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales ofÞce. Soldering Method Infrared Reßow Soldering Conditions Peak temperature (package surface temperature) Time at peak temperature Time at temperature of 220°C or higher Preheating time at 120 to 180°C Maximum number of reßow processes Maximum chlorine content of rosin ßux (% mass) Peak temperature (package surface temperature) Time at temperature of 200°C or higher Preheating time at 120 to 150°C Maximum number of reßow processes Maximum chlorine content of rosin ßux (% mass) Peak temperature (molten solder temperature) Time at peak temperature : 260°C or below : 10 seconds or less : 60 seconds or less : 120±30 seconds : 3 times : 0.2%(Wt.) or below : 215°C or below : 25 to 40 seconds : 30 to 60 seconds : 3 times : 0.2%(Wt.) or below : 260°C or below : 10 seconds or less Condition Symbol IR260 VPS VP215 Wave Soldering WS260 Preheating temperature (package surface temperature) : 120°C or below Maximum number of ßow processes : 1 time Maximum chlorine content of rosin ßux (% mass) : 0.2%(Wt.) or below Partial Heating Peak temperature (pin temperature) Soldering time (per side of device) Maximum chlorine content of rosin ßux (% mass) : 350°C or below : 3 seconds or less : 0.2%(Wt.) or below HS350 Caution Do not use different soldering methods together (except for partial heating). Life Support Applications These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and agree to fully indemnify CEL for all damages resulting from such improper use or sale. 03/08/2004 A Business Partner of NEC Compound Semiconductor Devices, Ltd. 5-147